JPH0959688A - Detergent composition for metal mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a detergent which has excellent detergency, dries rapidly, produces little adverse effect on a metal mask due to repeated cleaning, is excellent in freeness from environmental pollution and is lowly toxic to human being by using three specified compounds and water as the constituents. SOLUTION: 25-45wt.% of at least one compound selected from glycol ether compounds represented by formula I (wherein R<1> is a 1-4C alkyl; R2 is a 2-5C alkylene; R<3> is H, a 1-4C alkyl or acyl; and (n) is 1 or 2), having a boiling point under ordinary pressure of 100-200 deg.C and freely miscible with water at 20 deg.C is blended with 5-25wt.% of at least one compound selected from glycol ether compounds represented by formula II (wherein R<1> is a 1-4C alkyl; R<2> is a 2-5C alkylene; R<3> is H, a 1-4C alkyl or acyl; and (n) is 1 or 2) and having a boiling point under ordinary pressure of 100-200 deg.C and a solubility in water of at most 20wt.W%, 0.005-1.0wt.% nitrogenous compound of formula III (wherein R<4> is a 6-20C alkyl; and m+n is 2 to 20) and the balance of water, i.e., in an amount of 29-69.995wt.%.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning agent suitable for cleaning a metal mask used during solder paste printing.

[0002]

2. Description of the Related Art Soldering is the most common method of joining electronic circuits. A method of printing a paste that is a mixture of solder powder and flux through a metal plate (metal mask) with holes to be printed in order to supply an appropriate amount of solder for joining components to the board However, it is necessary to wash this metal mask for storage and reuse at the end of printing, or for ensuring printing accuracy. Conventionally, in order to remove the dirt adhering to this metal mask, since it has many characteristics such as non-combustibility, low toxicity, and excellent solubility, a solvent such as 1,1,1-trichloroethane is used. It has been widely used. However, it is internationally agreed that these solvents will be completely abolished in the near future due to the problem of ozone layer depletion.

Further, in recent years, various detergents mainly composed of glycol ether solvents have been used as substitute detergents for the above-mentioned halogen solvents. However, although these detergents have satisfactory detergency against dirt, they are difficult to dry. Also, since it affects the adhesive used for the metal mask, it cannot be used repeatedly after several cleanings.

[0004]

DISCLOSURE OF THE INVENTION The present invention has excellent cleaning power, quick drying, extremely little adverse effect on the metal mask even after repeated cleaning, excellent environmental non-polluting characteristics, and low for humans. The aim is to provide a cleaning agent that is toxic.

[0005]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventor has found that an aqueous solution of two or more specific glycol ether solvents having different water solubility has a specific amine type solvent. It was found that the above object can be achieved by forming an aqueous composition containing a certain amount of a compound, and the present invention has been completed.

That is, according to the present invention, among the compounds represented by (A) the following general formula (1), the boiling point at atmospheric pressure is 10:
25 to 45% by weight of one or two or more compounds selected from compounds which are 0 ° C. or more and 200 ° C. or less and are freely mixed with water at 20 ° C., R ¹ O— (R ² O) _n —R ³ (1) (In the formula, R ¹ is an alkyl group having 1 to 4 carbon atoms, R ² is an alkylene group having 2 to 5 carbon atoms and may be linear or branched, and R ³ is hydrogen or 1 carbon atom. To 4 are alkyl groups or acyl groups, and n is an integer of 1 to 2) (B) Among compounds represented by the following general formula (2), the boiling point at atmospheric pressure is 100 ° C. or higher and 200 ° C. or lower. And and 2
5 to 25% of one or two or more compounds selected from compounds having a solubility in water at 0 ° C. of 20% by weight or less
% By weight, R ¹ O— (R ² O) _n —R ³ (2) (wherein R ¹ is an alkyl group having 1 to 4 carbon atoms, R ² is an alkylene group having 2 to 5 carbon atoms, and is linear or branched. It may have a branch, R ³ represents hydrogen or an alkyl group having 1 to 4 carbon atoms or an acyl group, and n is an integer of 1 to 2) (C) represented by the following general formula (3) A nitrogen-containing compound, 0.
005-1.0% by weight (In the formula, R ⁴ is an alkyl group having 6 to 20 carbon atoms, and m + n is 2
-20) (D) Water, cleaning agent composition for metal mask, containing the remaining amount (29 to 69.995% by weight).

When the composition is used as a cleaning agent, it has excellent detergency, it dries quickly, there is no concern of environmental pollution that destroys the ozone layer, and it has low toxicity to humans. However, it is suitable for metal masks that require work under confidential conditions. Then, since the result that the metal mask is repeatedly washed was obtained, the present invention will be described in detail below.

The glycol ether compound represented by the component (A) of the present invention can be blended alone or in combination of two or more, and it is contained in the detergent composition of the present invention in an amount of 25 to 45% by weight. % Is compounded. If the amount is less than 25% by weight, it becomes difficult to make the glycol ether solvent as the component (B) into a uniform composition. Boiling range is 100-
Specific examples of the compound represented by the general formula (1) in the range of 200 ° C. and freely mixed with water at 20 ° C. include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and ethylene. Glycol monobutyl ether,
Diethylene glycol monomethyl ether, ethylene glycol monoallyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether,
Examples include dipropylene glycol monomethyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, 3-methyl-3-methoxybutanol, and ethylene glycol monomethyl ether acetate.

The component (B) represented by the general formula (2) of the present invention has a boiling point of 100 ° C. or higher and 200 ° C. or lower at atmospheric pressure, and has a solubility in water at 20 ° C. of 20% by weight or less. The glycol ether compound can be added singly or in combination of two or more kinds, and is added in an amount of 5 to 25% by weight in the cleaning composition of the present invention. 5% by weight
If the amount is less than 25% by weight, the detergency is not sufficient, and if it exceeds 25% by weight, the composition is difficult to be uniform, or if the flux in the cream solder is mixed with several% when the metal mask is washed, the cleaning agent is The problem of separation into two phases occurs.

Specific examples of such glycol ether compounds include 1,2-diethoxyethane, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, propylene glycol monobutyl ether and 2-ethoxyethyl acetate. , 2-butoxyethyl acetate and the like. The total amount of the component (A) and the component (B) used in the present invention is 30 to 70 in the composition.
If the total amount of the components (A) and (B) is less than 30% by weight, the cleaning and sustaining properties of the metal mask are not sufficient, and if it exceeds 70% by weight, the metal mask is more than conventional. Affects the rubber adhesive used and damages the metal mask. The use of special solvent resistant adhesives is required. The preferred total amount of the components (A) and (B) is 40 to 60% by weight.

Further, these glycol ether compounds can be dried at a relatively low temperature in a short time by selecting one having a boiling point of 200 ° C. or less under normal pressure, and an influence on a metal mask due to poor drying. Can be eliminated. Use of a glycol ether compound having a boiling point of more than 200 ° C. under normal pressure is not practical because it requires rinsing with another solvent or requires a relatively high temperature for drying, which requires a long time for drying.

If a glycol ether compound having a boiling point of less than 100 ° C. is used, the risk of ignition becomes extremely high and the water content management becomes complicated. The nitrogen-containing compound (C) component represented by the general formula (3) used in the present invention is added to the cleaning composition of the present invention in an amount of 0.005 to 1.0% by weight. If the addition amount is less than 0.005% by weight, a sufficient cleaning effect cannot be obtained, and if the addition amount is more than 1.0% by weight, the above components remain when the metal mask is washed and then dried. It causes problems such as loss of sex.

Specific examples of the nitrogen-containing compound used in the present invention include ethanolamines such as N, N-di (2-hydroxyethyl) cyclohexylamine and polyoxyethylene lauryl having an ethylene oxide addition mole number of 1 to 20. Examples include amines and ethylene oxide adducts of alkyl amines such as polyoxyethylene stearyl amine.

The cleaning composition of the present invention contains water (D) component in an amount of 29 to 69.995% by weight. Preferably,
It is 40 to 60% by weight. Further, the detergent composition of the present invention may contain a surfactant in order to enhance the cleaning effect. As the surfactant that can be used in the present invention, any of known anionic surfactants, cationic surfactants, nonionic surfactants and zwitterionic surfactants can be used. More specifically, fatty acid salts, higher alcohol sulfate ester salts, liquid fatty oil sulfate ester salts, sulfate salts of aliphatic amines and aliphatic amides, fatty alcohol phosphate ester salts, sulfonates of dibasic fatty acid salts, Anionic surfactants such as fatty acid amide sulfonates, alkylallyl sulfonates, formalin-condensed naphthalene sulfonates, etc., cationic amines such as aliphatic amine salts, quaternary ammonium salts, alkylpyridinium salts, poly Non-iodine such as oxyalkylene alkyl ethers, polyoxyalkylene alkylphenol ethers, polyoxyalkylene alkyl amines, polyoxyalkylene alkyl esters, sorbitan alkyl esters, polyoxyalkylene sorbitan alkyl esters, etc. Sex surfactants, or alkyl betaines, alkyl dimethyl amine oxides, although zwitterionic surfactants such as alkyl -alanine as was the main, but not limited thereto.

The cleaning composition of the present invention is prepared by an ultrasonic cleaning method,
Particularly preferable cleaning results can be obtained by using a physical force such as a spray cleaning method, a brush cleaning method, and a hand-wiping method together. As an example of using the cleaning agent of the present invention, for example,
The metal mask to which the cream solder is attached may be ultrasonically cleaned using an ultrasonic cleaning tank containing the cleaning composition of the present invention, and after cleaning, drained by air blow or centrifugation, and then directly dried. In some cases, it is possible to wash the metal mask with the cleaning agent of the present invention and then finish rinsing with water or another organic solvent.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in more detail with reference to Examples, but the scope of the present invention is not limited to these Examples. Using the cleaning agents of the respective compositions of the examples and comparative examples shown in Table 1, the evaluation items such as uniformity, cream solder detergency, flash point, drying property, and effect on adhesive (effect on metal mask) Was tested. The respective evaluation methods are shown below.

Uniformity: The composition shown in Table 1 was prepared, and when the composition was transparent and uniform, it was marked with ◯, and when turbidity or phase separation occurred, it was marked with x. Detergency: All pores were inspected with a microscope with a magnification of 50, and the pores with residual solder particles were regarded as defective pores. The defective rate of 2% or less was evaluated as ◯, and the defective rate exceeding 2% was evaluated as x. In this evaluation, cream solder is SPARKLE PA manufactured by Senju Metal Industry Co., Ltd.
STE OZ63-177F-50-9 was used.

Drying property: The drying property is evaluated by drying with warm air at 45 ° C. for 5 minutes, and after being visually inspected and touched, those that are completely dry are indicated by ○, stains on the solvent, and when touched. Those with stickiness were marked with x. Effect on metal mask: A test plate was prepared in a frame of 150 mm square (polyester gauze was used, the adhesive was a rubber adhesive, and the width of the adhesive surface was 30 mm). After soaking in each composition for 1 minute at room temperature, the plate was pulled up, and warmed at 45 ° C for 5 minutes.
Drying for minutes was performed. This immersion and drying operation was repeated 20 times and then left for 2 days. When peeling was observed in the bonded portion or the plate was damaged during this test, x was given when there was no effect.

[0019]

Example 1 Cream solder was filled in the openings of 0.5 mm pitch 200-pin QFP printed pattern pieces at 50 ° C.
Left for 1 hour. Using a tabletop type ultrasonic cleaning machine (tank volume 2 L, ultrasonic frequency 45 kHz, output 60 W) containing a preparation liquid composed of the composition of each component of Example 1 in Table 1,
Ultrasonic immersion cleaning was performed for 1 minute at the cleaning agent temperature of 30 ° C.
After washing, it was dried for 5 minutes in warm air at 45 ° C. Result is,
See Table 1.

[0020]

[Examples 2 to 6] 0.5 mm pitch 200-pin QFP The printed pattern section for QFP is filled with cream solder in the opening,
It was left at 50 ° C. for 1 hour. This is shown in Examples 2 to 6 in Table 1.
The same procedure as in Example 1 was carried out using a preparation liquid having the composition of each component up to. See Table 1 for results.

[0021]

Comparative Example 1 As shown in Table 1, a composition containing no glycol-based compound having a solubility of 20% by weight or less, which is the component (B) of the present invention, at 20 ° C. was washed in the same manner as in Example 1. went. The cleanability was poor. Result is,
See Table 1.

[0022]

COMPARATIVE EXAMPLE 2 As shown in Table 1, the composition in which the glycol compound, which is the component (B) of the present invention and has a solubility at 20 ° C. of 20% by weight or less, is not uniform. . (No further testing possible)

[0023]

Comparative Example 3 As shown in Table 1, the composition was not uniform when the content of the glycol ether compound as the component (A) of the present invention was small. (No further testing possible)

[0024]

[Comparative Example 4] As shown in Table 1, when the same composition as in Example 1 was used with a composition containing a small amount of water, the test plate for damage evaluation was washed 6 times, although the washability was good. At that time, the test plate was damaged. See Table 1 for results.

[0025]

[Comparative Example 5] As shown in Table 1, when the water content was excessive, and when the same operation as in Example 1 was performed, the cleaning performance was poor. See Table 1 for results.

[0026]

Comparative Examples 6 and 7 As shown in Table 1, diethylene glycol monobutyl ether (boiling point 230.6 ° C.) or diethylene glycol monohexyl ether (boiling point 259.1 ° C.) was used as the glycol ether solvent of the present invention. When carried out in the same manner as in Example 1, the solvent remained under the drying condition of 45 ° C. for 5 minutes, and after repeating washing 20 times, the test plate was damaged during storage. See Table 1 for results.

[0027]

[Comparative Example 8] As shown in Table 1, the same procedure as in Example 1 was carried out using a composition containing no amine compound as the component (C) of the present invention. The cleanability was poor.

[0028]

[Comparative Example 9] As shown in Table 1, when a composition containing an excess amount of the amine compound which is the component (C) of the present invention was used and carried out in the same manner as in Example 1, no problem was observed in detergency. However, there was stickiness when touching the test plate after drying.
See Table 1 for results. As shown in the evaluation results of Table 1, the examples not only have sufficient cleaning power for the metal mask, but also do not require rinsing with another solvent and can be directly dried after cleaning. Further, the influence on the adhesive forming the metal mask is extremely small. On the other hand, in the composition given in the comparative example, the uniformity of the composition, the cleaning property, the drying property,
The result was dissatisfaction with any of the effects on the adhesive.

[0029]

[Table 1]

[0030]

As is apparent from the examples, the composition of the present invention has sufficient cleaning power for metal masks, has good drying properties, and has very little damage to metal masks. Moreover, since it contains a large amount of water, the risk of ignition is low. Moreover, since it does not contain halogen atoms and there is no danger of ozone layer destruction, it is extremely useful as a substitute cleaning agent for 1,1,1-trichloroethane.

Claims (1)

[Claims] 1. A compound selected from the compounds represented by the following general formula (1), which has a boiling point at atmospheric pressure of 100 ° C. or higher and 200 ° C. or lower and is freely mixed with water at 20 ° C. 25 to 45% by weight of one or more compounds, R ¹ O— (R ² O) _n —R ³ (1) (wherein R ¹ is an alkyl group having 1 to 4 carbon atoms, R ² is A C2-C5 alkylene group which may be linear or branched, R ³ represents hydrogen or a C 1-4 alkyl group or an acyl group, and n is an integer of 1-2) (B) Among the compounds represented by the following general formula (2), the boiling point at normal pressure is 100 ° C. or higher and 200 ° C. or lower, and 2
One or two or more compounds selected from the compounds having a solubility in water at 0 ° C. of 20% by weight or less are added to 5 to 2
5% by weight, R ¹ O— (R ² O) _n —R ³ (2) (wherein R ¹ is an alkyl group having 1 to 4 carbon atoms, R ² is an alkylene group having 2 to 5 carbon atoms, and is linear or It may be branched, R ³ represents hydrogen or an alkyl group having 1 to 4 carbon atoms or an acyl group, and n is an integer of 1 to 2) (C) represented by the following general formula (3) Nitrogen-containing compounds, 0.
005-1.0% by weight (In the formula, R ⁴ is an alkyl group having 6 to 20 carbon atoms, and m + n is 2
To 20) (D) Water, and a residual amount (29 to 69.995% by weight), a cleaning composition for a metal mask.