JPH096018A - Cleaning method for photoconductor substrate - Google Patents

Abstract

PURPOSE: To obtain a washing method which is effective for both of degreasing and swarf removal and with which substrates having high cleanliness are surely obtainable by immersing the substrates for photoreceptors into a washing liquid and simultaneously or successively executing application of low-frequency vibration on the washing liquid and irradiation with ultrasonic waves. CONSTITUTION: The substrates 1 for photoreceptor are immersed into the washing liquid 44. The application of the low-frequency vibration on the washing liquid 4 and the irradiation of the washing liquid with the ultrasonic waves are simultaneously or successively executed by a vibration stirring machine 5 and an ultrasonic oscillator 9, by which the substrates 1 are washed. Namely, the low-frequency vibration is diffused over the entire part of the washing liquid 4 by this washing method and, therefore, the washing liquid 4 which comes into contact with the surfaces of the substrates 1 are replaced at all times. The partial high-concn. state of the oil-components desorbed from the substrate 1 surfaces is consequently rapidly eliminated and such elimination is effective mainly for degreasing. On the other hand, the irradiation with the ultrasonic waves is effective for heating down the deposits of the substrate 1 surfaces by a cavitation effect and is, therefore, effective for removing mainly the swarf and dust.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of cleaning a substrate for a photosensitive member which supports a photosensitive layer in a photosensitive member used in electrophotographic copying machines, printers, facsimiles and the like.

[0002]

2. Description of the Related Art A photoreceptor as described above is formed by coating a thin photosensitive layer such as OPC on a substrate such as an aluminum (including its alloy) tube. In order to apply such a thin photosensitive layer to a thin and uniform thickness, as the substrate, use a tube that has been processed into a mirror surface by cutting, drawing, ironing, polishing, etc. Further, it is necessary to sufficiently wash and remove the processing oil, cutting chips, dust, etc. adhering to the surface of the substrate.

On the other hand, halogenated hydrocarbons such as chlorofluorocarbon have been often used as a cleaning agent for substrates, but from the standpoint of protecting the global environment, hydrocarbon-based, water-based and semi-water-based cleaning that does not destroy the ozone layer. Agents are increasingly used.

However, since these cleaning agents have weaker cleaning power than the above-mentioned halogenated hydrocarbons, in order to enhance the cleaning power in addition to simply immersing the substrate in the cleaning liquid,
Various cleaning methods such as ultrasonic cleaning utilizing the cavitation effect, high-pressure injection of cleaning liquid with a jet nozzle, and cosmetic cleaning with a brush or blade have been adopted.

[0005]

However, none of the above-mentioned cleaning methods can reliably and uniformly remove both residual oil and cutting chips attached to the photoreceptor substrate. As a result, if the processing oil remains, the coating liquid is repelled during coating of the photosensitive layer and becomes uneven, and if the photoconductor is formed with cutting chips and dust remaining, the leakage of electric current will occur during uniform charging. This is a starting point, and in each case, there is a problem that the image quality is deteriorated.

The present invention has been made for the purpose of solving the above problems, and is a method for cleaning a substrate for a photoreceptor, which is effective for both degreasing and chip removal and which can surely obtain a highly clean substrate. Is to provide.

[0007]

In order to achieve the above-mentioned object, a method for cleaning a photoconductor substrate according to the present invention comprises immersing the photoconductor substrate (1) in a cleaning solution (4) and at the same time, the cleaning solution ( By applying low frequency vibration and ultrasonic irradiation to 4) simultaneously or sequentially, the photoreceptor substrate (1) is washed. Also,
In the cleaning method, the frequency of low frequency vibration is 1 to 100.
Hz is preferable, and the frequency of ultrasonic waves is 20 to 500 kHz.
Is preferred.

The photoconductor substrate (1) applicable to the cleaning method of the present invention includes various substrates such as an aluminum tube for a photoconductor drum, and its shape and material are not limited.

In the cleaning method of the present invention, two types of vibrations having different frequencies, low frequency and ultrasonic wave, are used because the frequencies effective for degreasing and chip removal are different.

That is, since the low frequency propagates while spreading over a wide angle without having strong directivity like ultrasonic waves, the vibration spreads from the vibration source to the entire cleaning liquid (4) and produces a three-dimensional turbulent flow. Raise and stir the entire washing liquid (4). for that reason,
The cleaning liquid that comes into contact with the surface of the substrate (1) is constantly replaced, and a high degreasing power is exerted by promptly eliminating the partial high-concentration state of the oil component due to the oil component separated from the surface of the substrate (1). Further, due to the stirring effect of the cleaning liquid (4), it is not necessary to move the substrate (1) and the vibration source relative to each other, and the plurality of substrates (1) vertically and horizontally arranged can be uniformly washed. . If the frequency of the low-frequency vibration is less than 1 Hz, the cleaning power is poor, and if it exceeds 100 Hz, the cleaning power is saturated and the cleaning efficiency deteriorates.
It is preferable to set in the range of -100 Hz. A particularly preferable frequency of low-frequency vibration is 10 to 60 Hz.

The ultrasonic waves are effective in removing the cutting chips and dust adhering to the surface of the substrate (1) mainly by knocking them off due to the cavitation effect. If the frequency of such an ultrasonic wave is less than 20 kHz, the cleaning power is poor, and if it exceeds 500 kHz, the cavitation effect is too strong to damage the surface of the substrate (1), so that it should be set in the range of 20 to 500 kHz. preferable. Particularly preferable ultrasonic frequency is 25 to 100.
kHz.

The above-mentioned application of low-frequency vibration and ultrasonic irradiation to the cleaning liquid (4) may be carried out simultaneously, or these may be carried out sequentially in the same tank or different tanks. Whichever is adopted, there is no difference in overall cleaning power,
Performing them at the same time has an advantage that the cleaning time can be reduced. Also, when performing sequentially, either may be performed first,
It is possible to reduce the contamination of the low-frequency vibration cleaning liquid and the reattachment of contaminants by performing the ultrasonic irradiation first to remove the cutting chips and dust in advance. Is preferably performed.

In carrying out the cleaning method of the present invention,
The method of applying low-frequency vibration and the method of irradiating ultrasonic waves are not limited, and various cleaning devices may be appropriately combined and used. For example, a method of using the vibration stirrer (5) shown in FIG. 1 as an apparatus for imparting low frequency vibration can be exemplified. The vibration stirrer (5) vibrates and stirs the cleaning liquid (4) by transmitting the vibration generated by the motor (6) to the vibrating blade (8) immersed in the cleaning liquid (4) through the support (7). It is a thing. In addition, this vibration stirrer (5)
In order to ensure the uniform stirring of the entire cleaning liquid (4), a plurality of vibrating blades (8), which are vibration sources, are connected in the depth direction. In addition, as the ultrasonic wave irradiation method, the throwing type shown in FIG. 2A, the adhesive type shown in FIG.
The vibration transmitter type of (c) can be exemplified. Note that FIG.
In (a), (b) and (c), (10) is a cleaning tank, and (2)
0) is the object to be cleaned, (30) is a vibrator, (40) is a vibration transmitter, and (50) is a cleaning liquid.

The type of cleaning agent used in this cleaning method is not particularly limited, and good cleaning is possible even if a hydrocarbon-based, water-based or semi-water-based cleaning agent having a weaker cleaning power than halogenated hydrocarbons is used. The effect can be obtained.

[0015]

In the cleaning method of the present invention, the low-frequency vibration agitates the entire cleaning liquid (4), so that the cleaning liquid contacting the surface of the substrate (1) is constantly replaced. Therefore, the partial high-concentration state of the oil component due to the oil component released from the surface of the photoconductor substrate (1) is promptly eliminated, which is mainly effective for degreasing. On the other hand, the ultrasonic irradiation is effective in knocking off the deposits on the surface of the substrate (1) due to the cavitation effect, and is therefore effective mainly in removing cutting chips and dust. Therefore, by combining vibrations of different frequencies,
Both residual oil and cutting chips and dust can be comprehensively washed and removed.

In the cleaning method, the highest cleaning effect is obtained when the frequency of the low frequency vibration is 1 to 100 Hz and when the frequency of the ultrasonic wave is 20 to 500 kHz.

[0017]

EXAMPLES Next, specific examples of the method for cleaning a substrate for a photoreceptor of the present invention will be described.

As the test piece, there was used a non-cutting tube (ED tube) which is a cylindrical tube used as a substrate for a photosensitive drum and which is made of JISA3003 aluminum alloy and has an outer diameter of 30 mm × an inner diameter of 28.5 mm × a length of 254 mm. This substrate is obtained by cutting a long tube formed by pulling out an extruded raw tube to the above length, and a large amount of processing oil and cutting chips are attached to the surface of the substrate.

The washing was carried out by the method described below using a washing liquid of either trichloroethane or an aqueous surfactant. Further, in any of the methods, as shown in FIG. 1, a plurality of photosensitive drum substrates (1) are inserted into a hollow portion through a supporting rod (not shown) which is erected on a mesh base (2). Multiple vertical and horizontal rows were vertically arranged, and in this state they were immersed in the cleaning liquid (4) and put into and out of the cleaning tank (3).

[Trichloroethane cleaning (Examples 1 to 3,
Comparative Examples 1, 3 to 5 and 9 to 11)] The cleaning was carried out in a total of 3 steps of two steps of immersion cleaning and subsequent steam cleaning.

In the first stage, the photosensitive drum substrate (1) was immersed in a warm bath at 40 ° C. for 60 seconds.

In the second stage, as shown in FIG. 1, the liquid is immersed in the cleaning liquid (4) at room temperature (25 ° C.), and only the immersion or the vibration stirrer (5) arranged in the cleaning tank (3) and The ultrasonic oscillator (9) was used for cleaning for 60 seconds by low-frequency vibration having a frequency shown in Table 1 and / or ultrasonic irradiation. The vibrating stirrer (5) uses the vibration generated by the vibrating motor (6) to form two columns (7).
Through the vibrating blades (8) connected in the depth direction of the cleaning tank (3) to generate a three-dimensional turbulent flow in the cleaning liquid (4), thereby stirring the cleaning liquid (4). It was placed near the side of the washing tank (3). The ultrasonic oscillator (9) used was a throw-in type, which was placed on the bottom of the cleaning tank (3), and a plurality of photosensitive drum substrates (1) were immersed right above it.

In the third step, steam cleaning with trichloroethane was carried out for 60 seconds, and the photosensitive drum substrate (1) was dried.

[Water-based cleaning (Examples 4 to 8, Comparative Example 2, Comparative Examples 6 to 8 and 12 to 14)] A 3% aqueous solution of the surfactant "Ellies K-1000" manufactured by Asahi Kasei Co., Ltd. was used as a cleaning liquid. The washing was performed in three stages of two-stage immersion washing and subsequent water washing.

In the first step, the photosensitive drum substrate (1) was immersed in a warm bath at 50 ° C. for 60 seconds and, under the conditions shown in Table 1, immersion only, low-frequency vibration or ultrasonic irradiation, or both. It was washed for 60 seconds. In addition, in Examples 7 and 8, the application of low-frequency vibration and the irradiation of ultrasonic waves were each performed 6 times.
Sequentially for 0 seconds. The cleaning device is the same as that used for the above-mentioned trichloroethane cleaning, and therefore its explanation is omitted.

In the second stage, following the first stage, it was immersed in the same 50 ° C. hot bath for 60 seconds.

In the third step, the washing liquid was removed by showering with ion-exchanged water for 30 seconds.

Next, the photosensitive drum substrate (1) washed by the above method was drained and then dried with hot air.

The degreasing rate and the removal state of the cutting chips were evaluated for each of the photosensitive drum substrates thus washed with trichloroethane and water. The degreasing rate was evaluated by the wetted area rate when the substrate was dipped in an aqueous solution of India ink and pulled up. The state of removal of cutting chips was evaluated by visually observing the amount of residual cutting chips. Table 1 shows these evaluation results.

[0030]

[Table 1]

As is clear from the results shown in Table 1, according to the method of the present invention, stirring by low frequency vibration and ultrasonic irradiation are performed simultaneously or sequentially, which is effective in both degreasing and chip removal. I was able to confirm that.

[0032]

As described above, the method for cleaning a substrate for a photoconductor according to the present invention comprises immersing the substrate for a photoconductor in a cleaning solution, applying low-frequency vibration to the cleaning solution, and irradiating ultrasonic waves to the cleaning solution. Since the substrate for the photoconductor is cleaned by performing it simultaneously or sequentially, the degreasing by low frequency vibration and the removal of cutting chips and dust by ultrasonic irradiation are combined to obtain a high cleaning power. As a result, a photosensitive drum substrate having a high degree of cleanliness can be obtained even when a cleaning agent having a relatively weak cleaning power is used, and a thin and uniform photosensitive layer can be formed on the substrate surface, thereby improving the image quality. be able to.

In the cleaning method, particularly high cleaning effect can be obtained when the low frequency vibration frequency is set to 1 to 100 Hz or the ultrasonic frequency is set to 20 to 500 kHz.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a cleaning method for a photoreceptor substrate according to the present invention.

2A is a sectional view showing an example of an ultrasonic wave irradiation method, FIG. 2B is a sectional view showing another example, and FIG. 2C is a partially cutaway perspective view showing another example. .

[Explanation of symbols]

 1 ... Substrate for photoconductor (photosensitive drum substrate) 4 ... Cleaning liquid

Claims (3)

[Claims] 1. A photosensitive body (1) is immersed in a cleaning liquid (4), and low-frequency vibration is applied to the cleaning liquid (4) and ultrasonic wave irradiation is performed simultaneously or sequentially to obtain the photosensitive material. A method for cleaning a photoconductor substrate, which comprises cleaning the body substrate (1). 2. The frequency of the low frequency vibration is 1 to 100H.
The method for cleaning a photoreceptor substrate according to claim 1, wherein cleaning is performed by setting z. 3. The frequency of the ultrasonic wave is 20 to 500 kHz.
The cleaning method for a photoreceptor substrate according to claim 1, wherein cleaning is performed by setting z.