JPH0968557A - Burn-in board - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To obtain a burn-in board with a small load required for manufacturing. A substrate (2) has connectors (3a, 3b) to which a power source supplied from an apparatus for performing a burn-in test and GND are respectively connected, and through holes (5a) electrically connected to the connectors (3a, 3b). , 5
b. When mounting the socket 4 on this board 2,
The pins 7a and 7b of the socket 4 and the through holes 5a and 5b are provided as separate parts so that the through holes 5a and 5b are electrically connected to the power supply pin 6a and the GND pin 6b of the semiconductor integrated circuit 1, respectively. Connection is made by connecting pin 8. Therefore, the burn-in board can be manufactured easily and can be reused, so that the burn-in board can be realized at low cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in board used for a burn-in test of a semiconductor integrated circuit, and more particularly to a burn-in board which can be easily manufactured.

[0002]

17 is a front view showing a conventional burn-in board, and FIG. 18 is a rear view thereof. 17 and 18
In the figure, 1 is a semiconductor integrated circuit which is a burn-in test target, 2 is a substrate which is a main body of the burn-in board, 3a,
Reference numeral 3b denotes a connector which is attached to an end of the substrate 2 and which is an interface for supplying power and GND (ground) from a burn-in device for performing a burn-in test to the burn-in board, and 4 fixes the semiconductor integrated circuit 1. When mounted on the substrate 2, the semiconductor integrated circuit 1, the power source from the burn-in device, and the GND are connected to the connector 3a, the connector 3b, and the wirings 10a and 1 of the substrate 2, respectively.
Sockets for electrical connection via 0b, 5 are through holes arranged on the substrate 2 at an interval equal to the pin interval of the socket 4, and 7a and 7b are through holes 5 on the substrate 2.
The pins 10a, 10b of the socket 4 which are inserted and fixed in the wiring are wirings which are provided on the back surface of the substrate 2 by a printed wiring or the like and electrically connected to the connectors 3a and 3b, respectively. When the semiconductor integrated circuit 1 is inserted in the socket 4, the pin 7a indicates a pin electrically connected to the power supply pin of the semiconductor integrated circuit 1, and the pin 7b is electrically connected to the GND pin of the semiconductor integrated circuit 1. Indicates a pin.

Next, the process of manufacturing the burn-in board will be described. First of all, the pins of the socket 4 are connected to the through holes 5
The socket 4 is attached to the surface of the substrate 2 by passing through. Next, the tips of the pins 7a and 7b projecting from the back surface of the board 2 are soldered to the wirings 10a and 10b, respectively, and electrically connected to the wirings 10a and 10b, and the socket 4 of the board 2 is attached. When fixed so that it cannot be removed from the surface, the burn-in board shown in FIGS. 17 and 18 is completed.

Next, the burn-in test will be described. As shown in FIG. 17, the semiconductor integrated circuit 1 is inserted into the socket 4, the power supply supplied by the burn-in device and the connector 3a are electrically connected, and the GND from the burn-in device and the connector 3b are electrically connected. In this state, the burn-in test of the semiconductor integrated circuit 1 is performed.

[0005]

However, since the conventional burn-in board is constructed as described above,
Each time a burn-in board corresponding to a semiconductor integrated circuit 1 of a different type is manufactured, for example, the pins 7a of the socket 4,
7b and the wirings 10a and 10b must be soldered, which is a heavy manufacturing burden, and thus there is a problem that the burden required to manufacture a burn-in board is large. The burden of production is increasing.

The present invention has been made in order to solve the above problems, and an object thereof is to obtain a burn-in board with a small load required for manufacturing.

[0007]

According to a first aspect of the present invention, there is provided a burn-in board used for a burn-in test of a semiconductor integrated circuit, the substrate being a main body of the burn-in board and the substrate. A plurality of through holes that are provided and that are electrically connected to the potential supplied from the device for performing the burn-in test, and pins that fix the semiconductor integrated circuit and that are electrically connected to the pins of the semiconductor integrated circuit. And a socket having one end electrically connected to the through hole by being inserted into the through hole of the substrate, and the other end being electrically connected to the pin by inserting the pin of the socket. And a connection pin to be connected.

[0008] The problem solving means according to claim 2 of the present invention is as follows.
A burn-in board used for a burn-in test of a semiconductor integrated circuit, the substrate being a main body of the burn-in board having a conductive layer electrically connected to a potential supplied from an apparatus for performing the burn-in test. ,
A plurality of through holes opened until the conductive layer is exposed from the surface of the substrate, fixing the semiconductor integrated circuit, and having a pin electrically connected to a pin of the semiconductor integrated circuit and having a tip extending and contracting, A socket electrically connected to the conductive layer by extending the pin and contacting the tip of the pin with the conductive layer on the bottom surface of the through hole in a state of being fixed to a predetermined position on the surface of the substrate. .

In the problem solving means according to claim 3 of the present invention, the socket fixes the semiconductor integrated circuit,
A socket body having a non-stretchable pin electrically connected to a pin of the semiconductor integrated circuit, and one end of which is electrically connected to the pin by inserting the non-stretchable pin of the socket body, and the other end of which is flexible. And a conductive connector that converts the pin that does not expand and contract into a pin that expands and contracts at the tip.

[0010] The problem solving means according to claim 4 of the present invention is:
A burn-in board used for a burn-in test of a semiconductor integrated circuit, the substrate being a main body of the burn-in board, a plurality of through holes provided in the substrate,
Branch wirings provided on the substrate and electrically connecting the through holes and the potential supplied from the device for performing the burn-in test, and the semiconductor integrated circuit are fixed, and the semiconductor integrated circuit is fixed. A socket having a pin electrically connected to a pin, the pin of the socket is inserted into the through hole to be electrically connected, and some of the plurality of branch wirings are electrically cut, The semiconductor integrated circuit is manufactured so that the desired potential can be supplied to the desired pin of the semiconductor integrated circuit.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. 1 is an oblique sectional configuration diagram of a burn-in board according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a semiconductor integrated circuit which is a target of a burn-in test,
Reference numeral 2 is a board which is the body of the burn-in board, and 3a and 3b are connectors which are attached to the ends of the board 2 and which are interfaces for supplying power and GND to the burn-in board from a burn-in device for performing a burn-in test, respectively. Is fixed and mounted on the substrate 2 to electrically connect the semiconductor integrated circuit 1 to the power supply from the burn-in device, GND through the connector 3a, the connector 3b, the connection pin 8 and the like, respectively. Sockets, 5a, 5b are through holes formed in the substrate 2 in advance, 6a is a power supply pin of the semiconductor integrated circuit 1, and 6a
b is a GND pin of the semiconductor integrated circuit 1, 7a is a power supply pin 6
pin of socket 4 electrically connected to a, 7b is GN
Pins of socket 4, which are electrically connected to D pin 6b, 8
Is a connection pin made of a conductor for electrically connecting the through holes 5a and 5b of the board 2 and the pins 7a and 7b of the socket 4, and 9 is a screw for fixing the socket 4 to the board 2.

FIG. 2 is a cross section taken along the line AA 'in FIG. In FIG. 2, 10a and 10b are inner layer wirings provided in advance in the substrate 2, 9a is a screw hole provided in the substrate 2,
Reference numeral 9b denotes a screw hole provided in the socket 4, and other reference numerals correspond to the reference numerals in FIG. The inner layer wiring 10a
Electrically connects the through hole 5a to the connector 3a. The inner layer wiring 10b electrically connects the through hole 5b and the connector 3b.

FIG. 3 is a sectional view showing an example of the connection pin 9. In FIG. 3, 8a is a through hole 5a of the substrate 2,
5b is a leading portion of a tapered shape which is an insertion portion to be contacted with and electrically connected to the through holes 5a and 5b, 8b is a through hole into which the pins 7a and 7b of the socket 4 are inserted, and 8c is a through hole 8b. The pin 7 of the socket 4 is provided on the inner wall and has elasticity to extend from the inner wall side in the through hole 8b to the center side.
When a and 7b are inserted into the through hole 8b, the elasticity of the a and 7b presses the pins 7a and 7b of the socket 4 to electrically connect them.

FIGS. 4 and 5 are views showing modifications of the connecting pin 9 shown in FIG. 3, respectively. The connection pin shown in FIGS. 4 and 5 has two through holes 8b. The connecting pin shown in FIG. 4 is formed by a straight line from the center of the leading portion 8a to the center of one through hole 8b and a straight line from the center of the leading portion 8a to the center of the other through hole 8b when viewed from above. 9 corners
0 degrees, the connection pin shown in FIG. 5 is 180 degrees.

FIG. 6 is a top view of the substrate 2, and FIG. 7 is a top perspective view of the substrate 2 with the socket 4 installed on the substrate 2. Referring to FIG. 6, by arranging every other through holes 5a and 5b on the entire surface of the substrate 2, all the pins 7a and 7b of the socket 4 are connected to the through holes 5a and the through holes via the connecting pins 8. 5b can be connected, and sockets 4 of any size can be supported. The distance between the pins 7a and 7b of the socket 4 and the distance between the through holes 5a and 5b of the substrate 2 are equal, and the positional relationship between the through holes 5a and 5b is so-called staggered, that is, at the intersection of the four through holes 5a. The through holes 5b are arranged, and conversely, the through holes 5a are arranged at the intersections of the four through holes 5b, so that the number of types of the connecting pins 8 can be reduced as much as possible and the board can be provided directly under the socket 4. 2 through holes 5a,
5b and the pins 7a, 7b of the socket 4 can be connected, the space of the substrate 2 can be used efficiently.

Next, the process of manufacturing the burn-in board will be described. First, the socket 4 corresponding to the pin arrangement of the semiconductor integrated circuit 1 is prepared. Next, the board 2 is provided with screw holes 9a and 9b according to the size of the socket 4. Next, referring to FIG. 6, the through holes 5a and 5b of the substrate 2 are selected so that the arrangement of the pins 7a and 7b of the socket 4 and the arrangement of the through holes 8b of the connection pins 8 are the same, The head portion 8a of the connection pin 8 is inserted therein. Next, referring to FIG. 7, the pins 7a and 7b of the socket 4 to which the power supply pin 6a and the GND pin 6b of the semiconductor integrated circuit 1 are connected are inserted into the through holes 8b of the connection pin 8 to insert the socket 4 into a board. Attach to 2. Next, the socket 4 is fixed to the substrate 2 by fastening the screw 9 to the screw hole 9a and the screw hole 9b, and the burn-in board is completed.

Next, the burn-in test will be described. By inserting the semiconductor integrated circuit 1 into the socket 4 as shown in FIG. 1 and electrically connecting the power supply supplied by the burn-in device and the connector 3a, the inner layer wiring 10a, the through hole 5a, the connecting pin 8, the pin 7a, Power is supplied to the semiconductor integrated circuit 1 via the power supply pin 6a. By electrically connecting the GND from the burn-in device and the connector 3b, the inner layer wiring 10b, the through hole 5b, the connection pin 8,
GND is supplied to the semiconductor integrated circuit 1 through the pin 7b and the GND pin 6b. In this state, the burn-in test of the semiconductor integrated circuit 1 is performed.

In this embodiment, the connection pin 8
Since the socket 4 and the board 2 of the burn-in board are electrically connected, if the arrangement of the connection pins 8 is changed, the semiconductor integrated circuits 1 of different types can be dealt with, and the wiring and the socket pins are soldered as in the conventional case. It is not necessary to do so, and the burden required to manufacture the burn-in board is small. Further, for example, when the socket 4 is damaged, the screw 9 may be removed, the socket 4 may be replaced, and the screw 9 may be tightened again. Alternatively, the burn-in board for another semiconductor integrated circuit 1 may be changed. Easy to do. Further, although the soldered-in burn-in board can hardly be reused as in the conventional case, since it can be reused in the present embodiment, the burn-in board can be realized at low cost.

Embodiment 2. FIG. 8 is a configuration diagram of a burn-in board according to the second embodiment of the present invention. In FIG. 8, 12 is a substrate which is the main body of the burn-in board, and 14
Is a socket, and other symbols correspond to the symbols in FIG.

FIG. 9 is a sectional view taken along line BB 'in FIG. In FIG. 9, 12 a is a conductive layer electrically connected to the connector 3 a, 12 b is a conductive layer electrically connected to the connector 3 b, 12 c, 12 d and 12 e are insulating layers, and 15 a is a surface of the substrate 12. Through holes 15b reaching the conductive layer 12a are formed from the surface of the substrate 12 to the conductive layer 1
A through hole reaching 2b, a pin 17 for expanding and contracting the socket 14, and other reference numerals correspond to the reference numerals in FIG.

The substrate 12 has an insulating layer 12 in order from the surface thereof.
c, the conductive layer 12a, the insulating layer 12d, the conductive layer 12b, and the insulating layer 12e have a laminated structure, and the conductive layer 12a and the conductive layer 12b are electrically insulated by the insulating layer 12d.

FIG. 10 shows a socket 1 according to this embodiment.
4 is an overall view of FIG. In FIG. 10, reference numeral 14 a denotes a through hole for inserting a pin of the semiconductor integrated circuit 1 and electrically connecting the pin and the pin 17 to each other, and 14 b denotes the semiconductor integrated circuit 1 in the socket 14. It is a lever for fixing and removing. Pin 17
The electrical connection method and structure between the semiconductor integrated circuit 1 and the pins of the semiconductor integrated circuit 1 are the same as those of general sockets (for example, described in catalogs of commercially available sockets).

FIG. 11 is a sectional view of the pin 17. FIG.
, 17a is the head of the pin and 17b is the head of the pin 17
Spring for pushing out a by elasticity, other symbols are shown in FIG.
It corresponds to each code inside.

Next, the process of manufacturing the burn-in board will be described. First, the socket 14 corresponding to the pin arrangement of the semiconductor integrated circuit 1 is prepared. Next, the semiconductor integrated circuit 1
Pin 1 of socket 14 electrically connected to the power pin of
7. The through holes 15a and 15b are formed in the substrate 12 so that the pin 17 of the socket 14 electrically connected to the GND pin of the semiconductor integrated circuit 1 and the through hole 8b have the same arrangement. This through hole 15
The formation of a and the through hole 15b is performed by forming the through hole 15a and the through hole 15b on the substrate 12 having a pre-configured laminated structure by using an NC board or the like used for the usual spot facing processing of the printed circuit board, or by insulating the single body. Alternatively, the layers and the conductive layer may be positioned and punched, and then they may be laminated. Next, the board 12 is provided with screw holes 9a and 9b according to the size of the socket 14. Next, the pin 17 of the socket 14 electrically connected to the power supply pin of the semiconductor integrated circuit 1 is inserted into the through hole 15a of the substrate 12, and the pin 17 of the socket 14 electrically connected to the GND pin of the semiconductor integrated circuit 1. Board 1
2 through hole 15b. At that time, pin 17
Since the leading portion 17a of the is pushed out by the spring 17b,
The leading portion 17a is the conductive layer 12 on the bottom surface of the through hole 15a.
a, the conductive layer 12b on the bottom surface of the through hole 15b is pressed and electrically connected. Next, screw 9 into screw hole 9a,
When the socket 4 is fixed to the substrate 12 by being fastened to the screw hole 9b, the burn-in board is completed.

In order to prevent the conductive layer 12a exposed on the side surface of the through hole 15b from being electrically connected to the pin 17 of the socket 14, for example, the through holes 15a and 15b of the substrate 12 are formed. The inner diameter may be increased, or the side surface of the pin 17 of the socket 14 may be covered with an insulator.

Next, the burn-in test will be described. As shown in FIG. 8, by inserting the semiconductor integrated circuit 1 into the socket 14 and electrically connecting the power supply supplied by the burn-in device and the connector 3a, the conductive layer 12a, the pins 17,
Semiconductor integrated circuit 1 via power supply pin of semiconductor integrated circuit 1
Supply power to By electrically connecting the GND from the burn-in device and the connector 3b, the conductive layer 12b,
GND is supplied to the semiconductor integrated circuit 1 through the pin 17 and the GND pin of the semiconductor integrated circuit 1. In this state, the burn-in test of the semiconductor integrated circuit 1 is performed.

In the present embodiment, the load required for manufacturing the burn-in board is reduced by electrically connecting the socket and the burn-in board with the through holes reaching the conductive layer and expanding and contracting to make contact with the conductive layer. I'm done. For example, if the socket 14 is damaged, the screw 9
Then, the socket 14 is replaced, the socket 14 is replaced, and the screw 9 is tightened again. Further, unlike the conventional case, it is not necessary to carry out soldering which is burdensome in manufacturing a burn-in board. Further, although the soldered-in burn-in board can hardly be reused as in the conventional case, since it can be reused in the present embodiment, the burn-in board can be realized at low cost.

Embodiment 3. FIG. 12 is a view showing a conventional general socket. In FIG. 12, 24 is a general socket as commercially available, 27 is a pin of the socket 24, and other reference numerals correspond to the reference numerals in FIG. FIG. 13 is a diagram showing a state in which the expandable connector in the third embodiment of the present invention is applied to the socket of FIG. In FIG. 13, 37 is the main body of the connector,
37a is a head portion provided at one end of the body 37, 37b is a spring for elastically pushing out the head portion 37a, 37c is a through hole provided at the other end of the body 37 for inserting the pin 27 of the socket 24, 37d Is provided on the inner wall of the main body 37 and has elasticity that extends from the inner wall side of the main body 37 to the center side, and when the pin 27 of the socket 24 is inserted into the through hole 37c, the pin 27 of the socket 24 is pressed by the elasticity and electrically. The contactor connected to and other symbols correspond to the symbols in FIG. Main body 37, head portion 37
The connector is constituted by a, the spring 37b, the through hole 37c, and the contactor 37d.

Next, the process of manufacturing the burn-in board will be described. The main burn-in board manufacturing process is the same as in the second embodiment. A socket 24 corresponding to the pin arrangement of the semiconductor integrated circuit 1 is prepared. Next, a pin 27 electrically connected to the power supply pin of the semiconductor integrated circuit 1
And a pin 27 electrically connected to the GND pin of the semiconductor integrated circuit 1 through the through holes 37c to attach the connector to the socket 24, so that a socket corresponding to the socket 14 shown in FIG. The connector to be used is provided only for the power supply and the GND pin 27). The subsequent steps are exactly the same as those in the second embodiment.

Next, the burn-in test will be described. As in the second embodiment, the semiconductor integrated circuit 1 is placed in the socket 24.
And the connector 3a is electrically connected to the power supply supplied by the burn-in device, so that power is supplied to the semiconductor integrated circuit 1 through the conductive layer 12a, the head portion 37a, the pin 27, and the power supply pin of the semiconductor integrated circuit 1. Supply. By electrically connecting the GND from the burn-in device and the connector 3b to the semiconductor integrated circuit 1 via the conductive layer 12b, the head portion 37a, the pin 27, and the GND pin of the semiconductor integrated circuit 1.
Supply ND. In this state, the burn-in test of the semiconductor integrated circuit 1 is performed.

In the present embodiment, a general socket can also be used by mounting a connector on a conventional general socket.

Embodiment 4 FIG. FIG. 14 is a front view showing an example of the burn-in board according to the fourth embodiment of the present invention, and FIG. 15 is a rear view thereof. In FIGS. 14 and 15, 4
Reference numeral 45 designates a board which is a main body of the burn-in board, and 3a and 3b which are attached to the ends of the board 42 and which are connectors which are interfaces for supplying power and GND from a burn-in device for performing a burn-in test to the burn-in board, respectively. Is a through hole formed in the substrate 42, 46a is a wiring provided on the front surface of the substrate 42 and electrically connected to the connector 3a, 46b is provided on the back surface of the substrate 2 and electrically connected to the connector 3b. The wiring 47a connected to the wiring 47a is provided on the surface of the substrate 2 and is formed by printed wiring or the like.
Reference numeral 47b is a branch wiring for electrically connecting a and 47b is a branch wiring provided on the back surface of the substrate 2 and formed by a printed wiring or the like for electrically connecting the through hole 45 and the wiring 46b. The through holes 45 are formed at the same intervals as the intervals of the pins of the socket 4 as shown in FIG.

Next, the process of manufacturing the burn-in board will be described. First, the socket 4 corresponding to the pin arrangement of the semiconductor integrated circuit 1 is prepared. Next, the semiconductor integrated circuit 1
The branch wiring 47a connected to the through-holes 45 other than the through-holes 45 corresponding to the pins of the socket 4 electrically connected to the power pins of the semiconductor integrated circuit 1 is cut off.
The branch wiring 47b connected to the through hole 45 other than the through hole 45 corresponding to the pin of the socket 4 electrically connected to the GND pin of is disconnected (FIGS. 14 and 15).
X indicates cutting.). Next, the power source of the socket 4, the pin to which the GND is supplied, and the remaining branch wiring 4
Through hole 4 to which 7a and branch wiring 47b are connected
5, the pins of the socket 4 are passed through the through holes 45, the socket 4 is attached to the surface of the substrate 42, and the pins of the socket 4 and the through holes 45 are electrically connected. Next, as in the first embodiment, the socket 4 is fixed to the substrate 2 by fastening with screws (not shown), and the burn-in board is completed.

FIG. 16 is a surface view showing another example of the burn-in board in the fourth embodiment of the present invention. As shown in FIG. 16, the wiring 46 a and the wiring 4 are formed only on the surface of the substrate 42.
6b, the branch wiring 47a, and the branch wiring 47b may be formed.

Next, the burn-in test will be described. By inserting the semiconductor integrated circuit 1 into the socket 4 and electrically connecting the power supply provided by the burn-in device and the connector 3a, the semiconductor is connected via the wiring 46a, the branch wiring 47a, the pin 7a, and the power supply pin of the semiconductor integrated circuit 1. Power is supplied to the integrated circuit 1. By electrically connecting the GND from the burn-in device and the connector 3b, the GND is supplied to the semiconductor integrated circuit 1 via the wiring 46b, the branch wiring 47b, the pin 7b, and the GND pin of the semiconductor integrated circuit 1. In this state, the burn-in test of the semiconductor integrated circuit 1 is performed.

In this embodiment, the socket and the burn-in board are electrically connected by cutting the branch wiring, so that the burden required for manufacturing the burn-in board can be reduced.

[Brief description of drawings]

FIG. 1 is a diagonal cross-sectional configuration diagram showing a burn-in board according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the burn-in board taken along the line AA ′ in FIG.

FIG. 3 is a sectional view showing an example of a connection pin according to the first embodiment of the present invention.

FIG. 4 is a diagram showing a modified example of the connection pin according to the first embodiment of the present invention.

FIG. 5 is a diagram showing a modification of the connection pin according to the first embodiment of the present invention.

FIG. 6 is a top view showing the substrate according to the first embodiment of the present invention.

FIG. 7 is a top perspective view of the board in the state where the socket is mounted on the board according to the first embodiment of the present invention.

FIG. 8 is a diagram showing a burn-in board according to a second embodiment of the present invention.

9 is a cross-sectional view of the burn-in board taken along line BB ′ of FIG.

FIG. 10 is an overall view of a socket according to a second embodiment of the present invention.

FIG. 11 is a sectional view showing a pin of a socket according to a second embodiment of the present invention.

FIG. 12 is a view showing a general socket.

FIG. 13 is a diagram showing a connector according to a third embodiment of the present invention.

FIG. 14 is a surface diagram showing an example of a burn-in board according to a fourth embodiment of the present invention.

FIG. 15 is a back view showing an example of a burn-in board according to a fourth embodiment of the present invention.

FIG. 16 is a surface view showing another example of the burn-in board in the fourth embodiment of the present invention.

FIG. 17 is a surface view showing a conventional burn-in board.

FIG. 18 is a back view showing a conventional burn-in board.

[Explanation of symbols]

1 semiconductor integrated circuit, 2 substrate, 3a, 3b connector, 4 socket, 5a, 5b through hole, 6a
Power supply pin, 6b GND pin, 7a, 7b pin, 8
Connection pin, 8a head part, 8b through hole, 8c contactor, 9 screw, 9a, 9b screw hole, 10a, 10b
Inner layer wiring, 12 substrate, 12a, 12b conductive layer, 12
c, 12d, 12e insulating layer, 14 socket, 14a
Through hole, 14b lever, 15a, 15b through hole, 17 pin, 17a head, 17b spring, 2
4 socket, 27 pin, 37 main body, 37a head part, 37b spring, 37c through hole, 37d contactor, 42 substrate, 45 through hole, 46a, 46b
Wiring, 47a, 47b Branch wiring.

Claims (4)

[Claims] 1. A burn-in board used for a burn-in test of a semiconductor integrated circuit, comprising: a substrate which is a main body of the burn-in board; and a potential which is provided on the substrate and is supplied from an apparatus for performing the burn-in test. A plurality of through holes electrically connected, a socket having the semiconductor integrated circuit fixed, and a pin having a pin electrically connected to the pin of the semiconductor integrated circuit; and one end inserted into the through hole of the substrate A burn-in board having a connecting pin electrically connected to the through hole, and the other end being electrically connected to the pin by inserting the pin of the socket. 2. A burn-in board used for a burn-in test of a semiconductor integrated circuit, the burn-in board having a conductive layer electrically connected to a potential supplied from an apparatus for performing the burn-in test. A substrate that is a main body, a plurality of through holes that are opened from the surface of the substrate until the conductive layer is exposed, the semiconductor integrated circuit is fixed, the pin is electrically connected to the semiconductor integrated circuit, and the tip extends and contracts. Has a pin to
A socket that is electrically connected to the conductive layer by fixing the pin in a predetermined position on the surface of the substrate so that the pin extends and the tip of the pin contacts the conductive layer on the bottom surface of the through hole. Burn-in board equipped. 3. The socket main body having a non-expandable pin that fixes the semiconductor integrated circuit and is electrically connected to a pin of the semiconductor integrated circuit; and one end of which inserts the non-expandable pin of the socket main body. And a conductive connector that is electrically connected to the pin by being configured to convert the pin that does not expand and contract to a pin that expands and contracts by the other end being configured to expand and contract.
The burn-in board according to claim 2, further comprising: 4. A burn-in board used for a burn-in test of a semiconductor integrated circuit, the substrate being a main body of the burn-in board; a plurality of through holes provided in the substrate; A branch wiring that electrically connects a through hole and a potential supplied from a device for performing the burn-in test, and a pin that fixes the semiconductor integrated circuit and is electrically connected to a pin of the semiconductor integrated circuit. A socket having a socket, the pins of the socket are inserted into the through holes to be electrically connected, and some of the plurality of branch wirings are electrically cut to obtain a desired semiconductor integrated circuit. A burn-in board manufactured so that the potential can be supplied to the pins.