JPH0969595A - Electronic equipment unit - Google Patents

Abstract

(57) [Summary] [Object] To provide an electronic device unit capable of increasing the number of stacks on a control panel by reducing the height dimension of a frame while maintaining cooling efficiency. [Structure] A rectangular parallelepiped frame 1 and a frame 1 housed in the frame 1,
In an electronic device unit including a heat sink 4 having a plurality of fins 41, a semiconductor element unit 5 attached to the heat sink 4, and a cooling fan 2 for cooling the heat sink 4, the heat sink 4 is oriented in the horizontal direction. , The fins 41 are provided on the upper surface of the heat sink 4, and the heat sink 4 is inclined with respect to the traveling direction of the cooling air generated by the cooling fan 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic equipment unit in which a control panel or the like is housed, and more particularly to a cooling structure for the electronic equipment unit.

[0002]

2. Description of the Related Art Conventionally, an electronic device unit such as an inverter unit housed in a control panel has a frame 1 having openings 13 and 14 in the vertical direction as shown in FIG.
The heat sink 4 with the fins 41 inside the fins 41
Of the semiconductor element unit 5 and the main circuit board 6 and other electronic components are fixed to the heat sink 4, and the frame 1 is made of a printed circuit board or the like. It is disclosed that the control part 7 is fixed, and the cooling fan 2 that sends cooling air from below the heat sink 4 toward the fins 41 is provided below the frame body 1 (for example, the actual opening 64-64). 2494
issue).

[0003]

However, in the above-mentioned prior art, since the cooling air flows along the fins from the bottom to the top, the frame of the electronic equipment unit becomes long in the up-down direction, and the electronic equipment unit is installed in the control panel. There was a problem that the number of stacks in the top and bottom was limited when storing inside. The present invention
An object of the present invention is to provide an electronic device unit capable of reducing the height dimension of the frame and increasing the number of stacks on the control panel while maintaining the cooling efficiency.

[0004]

In order to solve the above-mentioned problems, the present invention is directed to disposing the heat sink so that its longitudinal direction is oriented in the horizontal direction, providing the fins on the upper surface of the heat sink, and disposing the heat sink in the above-mentioned manner. It is inclined with respect to the traveling direction of the cooling air generated by the cooling fan.

[0005]

With the above-mentioned means, the longitudinal direction of the heat sink is oriented horizontally, the fins of the heat sink are arranged upward, and the heat sink is attached so as to be inclined with respect to the traveling direction of the cooling air blown by the cooling fan. The cooling efficiency can be kept high and the height of the frame of the electronic device unit can be reduced.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a first embodiment of the present invention, 2
Is a plan sectional view thereof. In the figure, 1 is a frame body made of a thin plate having a cubic shape, 11 is an intake window provided on one side surface of the frame body 1 facing each other, and 12 is an exhaust window provided on the other side surface of the frame body 1. Reference numeral 2 denotes a side surface of the cooling fan 2, 3 which is attached to the intake window 11 and introduces outside air into the frame body 1 so that one end thereof is located below the cooling fan 2 and the other end thereof is lifted upward. Attach the mounting plate to the frame 1
Is inclined about 15 degrees with respect to the bottom surface. Reference numeral 4 denotes a heat sink mounted on the upper surface of the mounting plate 3, and has a plurality of fins 41 extending upwardly provided on the upper surface with the longitudinal direction oriented in the lateral direction. Therefore, the heat sink 4 is attached to be inclined with respect to the traveling direction of the cooling air blown out from the cooling fan 2. The mounting plate 3
Between the end of the cooling fan 2 side and the heat sink 4,
Vent holes 31 are provided so that cooling air can flow from the cooling fan 2 toward the lower surface of the heat sink 4. 5 is a semiconductor element unit incorporating a semiconductor element such as a transistor attached to the lower surface of the heat sink, 6 is a main circuit board fixed to the semiconductor element unit 5, 7 is arranged on the side surface side of the heat sink 4 and fixed to the frame body 1. Reference numeral 8 is a control unit composed of a printed circuit board, 8 is a built-in electric appliance such as a transformer fixed in the frame 1, and 9 is a magnetic shield plate.

Here, the cooling action in the frame will be described. When the cooling fan 2 is rotated, the outside air is sucked laterally through the intake window 11 and becomes cooling air, which is blown toward the seat sink 4 as indicated by an arrow. Heat sink 4
Are attached so as to be inclined by about 15 degrees, the cooling wind cleans the surfaces of the plurality of fins 41 provided on the heat sink 4 and flows toward the exhaust window 12 side, and at the same time, the cooling air flows toward the base portion between the fins 41. It is sprayed at an angle of 15 degrees,
The heat transferred from the semiconductor element unit 5 attached to the lower surface of the heat sink 4 is taken away. Further, the cooling air sent from the ventilation port 31 cools the main circuit board 6 and the control unit 8 provided below the heat sink 4, and is discharged to the outside through the exhaust window 12. In this way, since the heat sink is attached with an inclination of about 15 degrees with respect to the traveling direction of the cooling air blown by the cooling fan, the cooling air blown in the lateral direction hits the heat sink at an inclined angle and the fins The heat sink 4 is efficiently cooled by making contact with the base of 41. As shown in FIG. 3 as a second embodiment, the fins 41 of the heat sink 4 are
Makes it possible to effectively use the space in the frame 1 by making the inlet side of the cooling air high and the outlet side low.
Further, as shown in FIG. 4 as a third embodiment, the heat sink 4 is not tilted, but the cooling fan 2 is tilted downward, and the cooling fan 2 blows the cooling air toward the heat sink 4 at an angle. You may turn it on.

[0008]

As described above, according to the present invention, the longitudinal direction of the heat sink is oriented in the lateral direction, the fins of the heat sink are arranged upward, and the heat sink is directed in the traveling direction of the cooling air blown by the cooling fan. Since it is installed so as to be inclined, the cooling efficiency can be kept high and the height of the frame of one electronic device unit can be lowered, and the number of electronic device units stacked on the control panel can be reduced. There is an effect that can be increased.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a first embodiment of the present invention.

FIG. 2 is a plan sectional view showing a first embodiment of the present invention.

FIG. 3 is a side sectional view showing a second embodiment of the present invention.

FIG. 4 is a side sectional view showing a third embodiment of the present invention.

5 (a) is a side sectional view and FIG. 5 (b) is a front view showing a conventional example.

[Explanation of symbols]

1: Frame, 11: Air intake window, 12: Exhaust window, 2: Cooling fan, 3: Mounting plate, 31: Vent hole, 4: Heat sink, 41: Fin, 5: Semiconductor unit, 6: Main circuit board

Claims (4)

[Claims] 1. A rectangular parallelepiped frame body, a heat sink housed in the frame body and having a plurality of fins, a semiconductor element unit attached to the heat sink, and a cooling fan for cooling the heat sink. In an electronic device unit, the heat sink is arranged so that its longitudinal direction is oriented in the horizontal direction, the fins are provided on the upper surface of the heat sink, and the heat sink is inclined with respect to the traveling direction of the cooling air generated by the cooling fan. An electronic device unit characterized by that. 2. The electronic device unit according to claim 1, wherein the heat sink is arranged so as to be inclined with respect to the bottom surface of the frame body. 3. The electronic device unit according to claim 2, wherein the fins provided on the heat sink are formed so that a cooling air inlet side is high and an outlet side is low. 4. The electronic device unit according to claim 1, wherein the longitudinal direction of the heat sink is horizontally arranged, and the cooling fan is inclined with respect to the heat sink.