JPH0970865A - Temperature control device of thermosetting resin molding machine - Google Patents
Temperature control device of thermosetting resin molding machineInfo
- Publication number
- JPH0970865A JPH0970865A JP25018895A JP25018895A JPH0970865A JP H0970865 A JPH0970865 A JP H0970865A JP 25018895 A JP25018895 A JP 25018895A JP 25018895 A JP25018895 A JP 25018895A JP H0970865 A JPH0970865 A JP H0970865A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- circuit
- mold
- molding operation
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title claims abstract description 23
- 238000000465 moulding Methods 0.000 title claims abstract description 22
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 12
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 238000013007 heat curing Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001723 curing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は熱硬化性樹脂成形機
の温度制御に係わり、特にノズルの温度制御装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to temperature control of a thermosetting resin molding machine, and more particularly to a nozzle temperature control device.
【０００２】[0002]
【従来技術】従来、熱硬化性樹脂成形に際しては、バレ
ル先端のノズルを金型に当接させ、溶融した樹脂を金型
内に充填するようにしているが、加熱バレルの先端部設
定温度が３０〜１００。Ｃに対し、金型側が１３０〜２
１０。Ｃとなっていて、高温の金型へのノズルタッチを
しているノズルは樹脂の熱硬化温度に達しているのが通
常である。2. Description of the Related Art Conventionally, when molding a thermosetting resin, the nozzle at the tip of the barrel is brought into contact with the mold to fill the molten resin into the mold. 30-100 . For C, the mold side is 130-2
10 . The nozzle that is C and is touching the nozzle to the high temperature mold usually reaches the thermosetting temperature of the resin.
【０００３】[0003]
【発明が解決しょうとする課題】従って、ノズル内の樹
脂は、成形運転中の樹脂の流れている状態では硬化しな
いが、休憩等で機械が停止して樹脂の流れが止まった場
合、高温の金型からノズルを離しておいても、ノズル内
の樹脂は熱硬化温度に達しているので時間とともに硬化
が進んでしまうのが現状であった。本発明の目的は前述
のようなノズルを高温の金型から離しておいても、ノズ
ル内の残留樹脂が硬化してしまうという欠点を取除い
た、熱硬化性樹脂成形機のノズルの温度制御装置を提供
することである。Therefore, the resin in the nozzle does not cure in the state where the resin is flowing during the molding operation, but when the machine stops due to a break or the like and the resin flow stops, a high temperature is generated. Even if the nozzle is separated from the mold, the resin in the nozzle has reached the thermosetting temperature, so that the curing has progressed with time. The object of the present invention is to control the temperature of a nozzle of a thermosetting resin molding machine, which eliminates the drawback that the residual resin in the nozzle is cured even if the nozzle is separated from the hot mold as described above. It is to provide a device.
【０００４】[0004]
【課題を解決するための手段】前述の目的を達成するた
め、本発明は成形運転完了後、或いは成形運転中に機械
停止をする場合、ノズルの金型へのノズルタッチから後
退させる熱硬化性樹脂成形機のノズル温度制御装置にお
いて、ノズルの金型へのノズルタッチ時の成形運転温度
制御回路と、ノズルが金型へのノズルタッチから離れた
時、ノズル内の樹脂が熱硬化しない温度にシフトダウン
して制御を行うシフトダウン回路と、ノズルが金型から
離れたか否かを検出する検出装置と、前記検出装置の検
出した信号により作動し、所定時間経過するとカウント
アウト信号を発するタイマと、前記カウントアウト信号
により成形運転温度制御回路からシフトダウン回路への
切換えを行う切換スイッチとを有してなる熱硬化性樹脂
成形機のノズル温度制御装置とした。In order to achieve the above-mentioned object, the present invention is a thermosetting method for retracting from the nozzle touch to the mold of the nozzle when the machine is stopped after the molding operation is completed or during the molding operation. In the nozzle temperature control device of the resin molding machine, the molding operation temperature control circuit when the nozzle touches the mold and when the nozzle separates from the nozzle touch to the mold, the temperature at which the resin inside the nozzle does not heat cure A shift-down circuit for performing shift-down and control, a detection device for detecting whether or not the nozzle is separated from the mold, and a timer that operates by a signal detected by the detection device and issues a count-out signal when a predetermined time has elapsed. , A nozzle temperature of a thermosetting resin molding machine having a changeover switch for changing over from a molding operation temperature control circuit to a shift-down circuit according to the count-out signal. And a control device.
【０００５】[0005]
【発明の実施の形態】次に本発明の１実施形態を図１な
いし図３により説明する。１は射出装置で、ホッパ２か
ら投入された原料樹脂をスクリュが回転および所定距離
だけ進退自在に挿入されている加熱バレル３に導入し、
加熱バレル３の外周面に設けたヒータ４ないし６により
加熱溶融して、スクリュの回転によりスクリュ前方へ移
送し、計量した後、ノズル７から金型８および９により
形成されたキャビティ内に射出するようにしている。BEST MODE FOR CARRYING OUT THE INVENTION Next, one embodiment of the present invention will be described with reference to FIGS. Reference numeral 1 denotes an injection device, which introduces the raw material resin charged from the hopper 2 into a heating barrel 3 in which a screw is inserted so as to rotate and advance and retract by a predetermined distance,
It is heated and melted by the heaters 4 to 6 provided on the outer peripheral surface of the heating barrel 3, transferred to the front of the screw by the rotation of the screw, weighed, and then injected from the nozzle 7 into the cavity formed by the molds 8 and 9. I am trying.
【０００６】前記ヒータ４ないし６は夫々熱電対により
夫々の領域における温度を検知し、図示してない温度制
御装置にフィードバックすることにより温度制御されて
いる。The heaters 4 to 6 are temperature-controlled by detecting the temperature in their respective regions by thermocouples and feeding them back to a temperature control device (not shown).
【０００７】１０は移動シリンダで、固定盤１１および
射出ブラケット１２の間に設けてあり、電磁切換弁１３
の切換により射出装置１を摺動板１４上を軸方向に進退
させ、ノズル７を金型８にノズルタッチ或いは離型する
ようにしている。前記ノズル７にはヒータ１５が設けて
あり、熱電対１６を介してノズル部の温度を検出し、温
度制御をするようになっている。A moving cylinder 10 is provided between the fixed plate 11 and the injection bracket 12 and has an electromagnetic switching valve 13.
The injection device 1 is moved back and forth in the axial direction on the sliding plate 14 by switching the above, and the nozzle 7 touches the mold 8 or is released from the mold. A heater 15 is provided in the nozzle 7, and the temperature of the nozzle portion is detected through a thermocouple 16 to control the temperature.
【０００８】１７は圧力スイッチで、ノズルタッチが行
われたか否かを検知するものであり、勿論、この検知装
置は圧力スイッチ１７に限らず、ノズル７の先端等に設
けた圧力スイッチで金型８に接したか否かを検出しても
良いし、或いは射出ブラケット１２の移動位置によりノ
ズルタッチの有無を検知しても良い。Reference numeral 17 is a pressure switch for detecting whether or not the nozzle is touched. Of course, this detection device is not limited to the pressure switch 17, but a pressure switch provided at the tip of the nozzle 7 or the like can be used to mold. 8 may be detected, or the presence or absence of nozzle touch may be detected by the moving position of the injection bracket 12.
【０００９】次に図２および図３の電気展開接続図によ
り、本発明の制御装置の動作に付いて説明する。電気展
開接続図は各回路に３０〜３４の番号を付し、右端に動
作を示す名称を付す。前記ノズルの熱電対１６は成形運
転温度制御回路１８と樹脂の熱硬化しない温度に制御す
るシフトダウン回路１９とを共有するように接続されて
いる。前記ノズルヒータ１５は電磁開閉器（ＨＭＣ）２
０によりその入切が行われるようになっており、その回
路３４はＨＭＣ２０のＡ接点ＨＭＣを有する。Next, the operation of the control device of the present invention will be described with reference to the electrical expansion connection diagrams of FIGS. In the electric expansion connection diagram, each circuit is numbered 30 to 34, and the right end is given a name indicating the operation. The thermocouple 16 of the nozzle is connected so as to share a molding operation temperature control circuit 18 and a shift down circuit 19 for controlling the temperature at which the resin does not heat cure. The nozzle heater 15 is an electromagnetic switch (HMC) 2
The circuit 34 has an A contact HMC of the HMC 20.
【００１０】２１はシフトダウン制御回路用リレーで、
回路３１にＡ接点ＡＲＸおよぴ回路３０および熱電対１
６回路にＢ接点ＢＲＸを有する。２２はノズル離れ時間
用リレーで、回路３２にそのタイムアウト信号により作
動するＡ接点ＴＲ1 を有する。回路３３にある２３は圧
力スイッチ１７のＯＦＦ信号によりＯＮするＡ接点であ
る。Reference numeral 21 is a shift down control circuit relay,
Circuit 31 has A contact ARX, circuit 30 and thermocouple 1
It has B contacts BRX in 6 circuits. 22 is a nozzle separation time relay, which has an A contact TR1 in the circuit 32 which is activated by its time-out signal. Reference numeral 23 in the circuit 33 is an A contact which is turned on by an OFF signal of the pressure switch 17.
【００１１】以上のように構成されており、次に動作に
付いて説明すると、何等かの事情により圧力スイッチ１
７がＯＦＦとなると（ノズルが金型から離れると）、Ａ
接点２３が接続され、ノズル離れ時間用リレー２２が作
動し、タイマーがタイミングを開始する。予め定められ
た時間が経過する（ノズルが予め定められた時間以上金
型から離れる）と、そのタイムアウト信号により回路３
２に有るＡ接点ＴＲ1が閉じ、リレー２１が作動する。
これにより今まで閉じていた回路３０のＢ接点ＢＲＸが
開き、回路３１のＡ接点ＡＲＸが閉じる、即ち成形運転
温度制御回路１８からシフトダウン回路１９の制御に切
換る。The structure of the pressure switch 1 is as follows. The operation of the pressure switch 1 will be described below.
When 7 is turned off (when the nozzle separates from the mold), A
The contact 23 is connected, the nozzle separation time relay 22 is activated, and the timer starts timing. When a predetermined time has elapsed (the nozzle is separated from the mold for a predetermined time or more), the time-out signal causes the circuit 3
The A contact TR1 at 2 is closed and the relay 21 is activated.
As a result, the B contact BRX of the circuit 30 which has been closed until now is opened, and the A contact ARX of the circuit 31 is closed, that is, the molding operation temperature control circuit 18 is switched to the control of the shift down circuit 19.
【００１２】[0012]
【発明の効果】以上説明したようにノズルが予め定めら
れた時間以上金型から離れると、ノズルの温度制御はノ
ズル内の樹脂が熱硬化しないような温度に制御するシフ
トダウン回路により行われるので、当初に掲げたような
欠点は取除かれ、休憩等で機械が停止し、金型からノズ
ルが離れてもノズル内の樹脂が熱硬化がない。As described above, when the nozzle is separated from the mold for a predetermined time or longer, the temperature of the nozzle is controlled by the shift down circuit for controlling the temperature so that the resin in the nozzle is not thermally cured. However, the drawbacks listed at the beginning were removed, the machine stopped after a break, etc., and the resin in the nozzle was not thermoset even when the nozzle was separated from the mold.
【図１】本発明の１実施の形態を示す図。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】本発明の１実施の形態を行うための電気展開接
続図。FIG. 2 is an electrical deployment connection diagram for carrying out one embodiment of the present invention.
１ 射出装置 ２ ホッバ ３ 加熱バレル ４ ヒータ ５ ヒータ ６ ヒータ ７ ノズル ８ 金型 ９ 金型 １０ 移動シリンダ １１ 固定盤 １２ 射出ブラケット １３ 電磁切換弁 １４ 摺動板 １５ ノズルヒータ １６ 熱電対 １７ 圧力スイッチ ２０ 電磁開閉器 ２１ シフトタウン制御回路用リレー ２２ タイマ ２３ 圧力のＯＦＦ信号にによりＯＮするＡ接点 ３０ 回路 ３１ 回路 ３２ 回路 ３３ 回路 ３４ 回路 1 Injection Device 2 Hobber 3 Heating Barrel 4 Heater 5 Heater 6 Heater 7 Nozzle 8 Mold 9 Mold 10 Moving Cylinder 11 Fixed Plate 12 Injection Bracket 13 Electromagnetic Changeover Valve 14 Sliding Plate 15 Nozzle Heater 16 Thermocouple 17 Pressure Switch 20 Electromagnetic Opening and Closing Device 21 Shifttown control circuit relay 22 Timer 23 A contact that turns on by pressure OFF signal 30 circuit 31 circuit 32 circuit 33 circuit 34 circuit
【手続補正書】[Procedure amendment]
【提出日】平成８年２月１４日[Submission date] February 14, 1996
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Correction target item name] Brief description of drawings
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の１実施の形態を示す図。FIG. 1 is a diagram showing an embodiment of the present invention.
【図２】本発明の１実施の形態を行うための電気展開接
続図。FIG. 2 is an electrical deployment connection diagram for carrying out one embodiment of the present invention.
【図３】本発明の１実施の形態を行うためのノズルヒー
タ部の電気展開接続図。FIG. 3 is an electrical expansion connection diagram of a nozzle heater portion for carrying out one embodiment of the present invention.
【符号の説明】 １ 射出装置 ２ ホッパ ３ 加熱バレル ４ ヒータ ５ ヒータ ６ ヒータ ７ ノズル ８ 金型 ９ 金型 １０ 移動シリンダ １１ 固定盤 １２ 射出ブラケット １３ 電磁切換弁 １４ 揩動板 １５ ノズルヒータ １６ 熱電対 １７ 圧力スイッチ ２０ 電磁開閉器 ２１ シフトダウン制御回路用リレー ２２ タイマ ２３ 圧力のＯＦＦ信号によりＯＮするＡ接点 ３０ 回路 ３１ 回路 ３２ 回路 ３３ 回路 ３４ 回路[Explanation of reference numerals] 1 injection device 2 hopper 3 heating barrel 4 heater 5 heater 6 heater 7 nozzle 8 mold 9 mold 10 moving cylinder 11 fixed plate 12 injection bracket 13 electromagnetic switching valve 14 sliding plate 15 nozzle heater 16 thermocouple 17 Pressure switch 20 Electromagnetic switch 21 Shift down control circuit relay 22 Timer 23 A contact that turns on by pressure OFF signal 30 circuit 31 circuit 32 circuit 33 circuit 34 circuit
Claims (1)
械停止をする場合、ノズルの金型へのノズルタッチから
後退させる熱硬化性樹脂成形機のノズル温度制御装置に
おいて、ノズルの金型へのノズルタッチ時の成形運転温
度制御回路と、ノズルが金型へのノズルタッチから離れ
た時、ノズル内の樹脂が熱硬化しない温度にシフトダウ
ンして制御を行うシフトダウン回路と、ノズルが金型か
ら離れたか否かを検出する検出装置と、前記検出装置の
検出した信号により作動し、所定時間経過するとカウン
トアウト信号を発するタイマと、前記カウントアウト信
号により成形運転温度制御回路からシフトダウン回路へ
の切換えを行う切換スイッチとを有してなる熱硬化性樹
脂成形機のノズル温度制御装置。1. When the machine is stopped after the molding operation is completed or during the molding operation, the nozzle temperature control device of the thermosetting resin molding machine is set back from the nozzle touch to the mold of the nozzle. Molding operation temperature control circuit at the time of nozzle touch, shift down circuit to control by downshifting to a temperature at which the resin inside the nozzle does not heat cure when the nozzle separates from the nozzle touch to the mold, and the nozzle A detection device that detects whether or not the mold is released, a timer that operates by a signal detected by the detection device, and issues a count-out signal when a predetermined time has elapsed, and a shift-down circuit from the molding operation temperature control circuit by the count-out signal. Nozzle temperature control device for a thermosetting resin molding machine, which has a changeover switch for changing over to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25018895A JPH0970865A (en) | 1995-09-04 | 1995-09-04 | Temperature control device of thermosetting resin molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25018895A JPH0970865A (en) | 1995-09-04 | 1995-09-04 | Temperature control device of thermosetting resin molding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0970865A true JPH0970865A (en) | 1997-03-18 |
Family
ID=17204128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25018895A Pending JPH0970865A (en) | 1995-09-04 | 1995-09-04 | Temperature control device of thermosetting resin molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0970865A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007098815A (en) * | 2005-10-05 | 2007-04-19 | Toshiba Mach Co Ltd | Apparatus and method for controlling nozzle temperature of injection molding machine |
| JP2020124821A (en) * | 2019-02-01 | 2020-08-20 | 東洋機械金属株式会社 | Injection molding machine and its control method |
-
1995
- 1995-09-04 JP JP25018895A patent/JPH0970865A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007098815A (en) * | 2005-10-05 | 2007-04-19 | Toshiba Mach Co Ltd | Apparatus and method for controlling nozzle temperature of injection molding machine |
| JP2020124821A (en) * | 2019-02-01 | 2020-08-20 | 東洋機械金属株式会社 | Injection molding machine and its control method |
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