JPH0971469A - High-strength aluminum nitride sintered compact - Google Patents
High-strength aluminum nitride sintered compactInfo
- Publication number
- JPH0971469A JPH0971469A JP7225012A JP22501295A JPH0971469A JP H0971469 A JPH0971469 A JP H0971469A JP 7225012 A JP7225012 A JP 7225012A JP 22501295 A JP22501295 A JP 22501295A JP H0971469 A JPH0971469 A JP H0971469A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum nitride
- nitride sintered
- oxide
- sintered compact
- sintered body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 title claims abstract description 42
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 8
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002131 composite material Substances 0.000 claims description 10
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000002994 raw material Substances 0.000 abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000001301 oxygen Substances 0.000 abstract description 3
- 229910052760 oxygen Inorganic materials 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- 229920005822 acrylic binder Polymers 0.000 abstract description 2
- 239000000314 lubricant Substances 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 229910018404 Al2 O3 Inorganic materials 0.000 abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 3
- 239000002245 particle Substances 0.000 abstract 1
- 238000005452 bending Methods 0.000 description 21
- 239000011812 mixed powder Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000013022 formulation composition Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、窒化アルミニウ
ム焼結体に関し、特に高い熱伝導性とともに高い強度を
有する窒化アルミニウム焼結体に関するものである。TECHNICAL FIELD The present invention relates to an aluminum nitride sintered body, and more particularly to an aluminum nitride sintered body having high thermal conductivity and high strength.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】窒化
アルミニウム（ＡｌＮ）焼結体は、高い熱伝導率を有す
るので、従来からＩＣ（半導体集積回路装置）用基板と
して用いられてきたアルミナ（Ａｌ2 Ｏ3）に代わるも
のとして注目されている材料である。2. Description of the Related Art Since an aluminum nitride (AlN) sintered body has a high thermal conductivity, it has been conventionally used as a substrate for IC (semiconductor integrated circuit device) alumina (AlN). It is a material attracting attention as an alternative to 2 O 3 ).
【０００３】しかしながら、近年のＩＣの著しい高密度
化、あるいは高出力化等によって、窒化アルミニウム焼
結体のみからなる基板だけではＩＣから発生する熱を十
分に外部へ放出することができないようになってきてい
る。However, due to the remarkable increase in the density of ICs and the increase in output power in recent years, it has become impossible to sufficiently radiate the heat generated from the ICs to the outside only by the substrate made of only the aluminum nitride sintered body. Is coming.
【０００４】そこで、放熱性能を向上させるために、窒
化アルミニウムからなる基板にアルミニウム、銅等で形
成された放熱板（放熱フィン）を接着して基板やＩＣチ
ップの温度上昇を抑制する方法が採用されている。Therefore, in order to improve the heat dissipation performance, a method is adopted in which a heat dissipation plate (heat dissipation fin) made of aluminum, copper or the like is adhered to a substrate made of aluminum nitride to suppress the temperature rise of the substrate and the IC chip. Has been done.
【０００５】しかしながら、このような構成にすると、
放熱板を構成する金属と基板を構成する窒化アルミニウ
ム（セラミックス）との間の熱膨張係数の差により、放
熱板と基板との間に熱応力が生ずる。これにより、基板
を構成するセラミックスが放熱板を構成する金属に比べ
て強度が低い場合、基板はやがて破壊に至る。However, with such a configuration,
Due to the difference in thermal expansion coefficient between the metal forming the heat sink and the aluminum nitride (ceramics) forming the substrate, thermal stress is generated between the heat sink and the substrate. As a result, when the strength of the ceramics forming the substrate is lower than that of the metal forming the heat dissipation plate, the substrate will eventually be destroyed.
【０００６】この熱応力に耐えるための強度の尺度とし
て実用的には抗折強度が測定されている。従来の窒化ア
ルミニウム焼結体の抗折強度は３０ｋｇｆ／ｍｍ2 前後
とされている。しかしながら、上記のような使用に耐え
るためには、不十分であり、約３３ｋｇｆ／ｍｍ2 以上
の強度が窒化アルミニウム焼結体に要求される。As a measure of the strength for withstanding this thermal stress, the bending strength is practically measured. The bending strength of the conventional aluminum nitride sintered body is about 30 kgf / mm 2 . However, it is insufficient to withstand the use as described above, and the aluminum nitride sintered body is required to have a strength of about 33 kgf / mm 2 or more.
【０００７】窒化アルミニウム焼結体の強度を改善する
ために、たとえば特開平２−８０３７２号公報、特開平
３−２６５５６９号公報、特開平４−４２８６１号公
報、特開平４−５０１７１号公報、特開平５−２３８８
３０号公報等に種々の提案がなされている。しかしなが
ら、これらの提案によれば、得られる窒化アルミニウム
焼結体の強度が不十分であったり、または製造上の困難
を伴うという問題点があった。In order to improve the strength of the aluminum nitride sintered body, for example, JP-A-2-80372, JP-A-3-265569, JP-A-4-42861, JP-A-4-50171, and Kaihei 5-2388
Various proposals have been made in Japanese Patent No. 30 and the like. However, according to these proposals, there is a problem that the strength of the obtained aluminum nitride sintered body is insufficient or the manufacturing is difficult.
【０００８】なお、窒化アルミニウム焼結体の抗折強度
を改善する上で留意すべき点として、窒化アルミニウム
焼結体の本来の特性である高い熱伝導性を維持しておく
必要がある。具体的には、窒化アルミニウム焼結体の熱
伝導率が少なくとも１６０Ｗ／ｍ・Ｋ以上であることが
必要である。As a point to be noted in improving the bending strength of the aluminum nitride sintered body, it is necessary to maintain the high thermal conductivity which is the original characteristic of the aluminum nitride sintered body. Specifically, the thermal conductivity of the aluminum nitride sintered body needs to be at least 160 W / m · K or more.
【０００９】そこで、この発明の目的は、高い熱伝導率
を維持するとともに高い抗折強度を有する窒化アルミニ
ウム焼結体を提供することである。Therefore, an object of the present invention is to provide an aluminum nitride sintered body which maintains a high thermal conductivity and has a high bending strength.
【００１０】特に、この発明の目的は、窒化アルミニウ
ム焼結体の抗折強度を改善することであり、窒化アルミ
ニウム焼結体を電子部品（ＩＣ用基板等）として使用す
る際に生ずる、熱応力による部品の損傷・破壊を防止す
ることである。In particular, an object of the present invention is to improve the bending strength of the aluminum nitride sintered body, which is caused by the thermal stress generated when the aluminum nitride sintered body is used as an electronic component (IC substrate, etc.). This is to prevent damage and destruction of parts due to.
【００１１】[0011]
【課題を解決するための手段】この発明に従った窒化ア
ルミニウム焼結体は、複合酸化物であるＡとＢを含有
し、Ｘ線強度比で表わされた存在比率でＡ／Ｂが３０／
７０以上、９５／５以下の範囲内であり、かつＡは、化
学式Ｘ2 Ｏ3 ・Ａｌ2 Ｏ3 で示される、希土類元素Ｘの
酸化物とＡｌ2 Ｏ3 の複合酸化物であり、Ｂは、化学式
３Ｘ2 Ｏ3 ・５Ａｌ2 Ｏ3 で示される、希土類元素Ｘの
酸化物とＡｌ2 Ｏ3 の複合酸化物である。The aluminum nitride sintered body according to the present invention contains composite oxides A and B, and has an A / B ratio of 30 which is represented by an X-ray intensity ratio. /
It is in the range of 70 or more and 95/5 or less, and A is a composite oxide of an oxide of rare earth element X and Al 2 O 3 represented by the chemical formula X 2 O 3 .Al 2 O 3 , and B Is a composite oxide of an oxide of a rare earth element X and Al 2 O 3 represented by the chemical formula 3X 2 O 3 .5Al 2 O 3 .
【００１２】好ましくは、上記のＸは、イットリウム
（Ｙ）である。Ｘがイットリウム（Ｙ）の場合、ＡはＹ
2 Ｏ3 ・Ａｌ2 Ｏ3 （ＹＡＬと称する）であり、Ｂは３
Ｙ2 Ｏ 3 ・５Ａｌ2 Ｏ3 （ＹＡＧと称する）である。Preferably, X is yttrium.
(Y). When X is yttrium (Y), A is Y
2OThree・ Al2OThree(Referred to as YAL) and B is 3
Y2O Three・ 5Al2OThree(Referred to as YAG).
【００１３】本発明は、窒化アルミニウム焼結体中の複
合酸化物の組成を制御することにより、高い熱伝導率を
維持するとともに、抗折強度を大幅に向上させた窒化ア
ルミニウム焼結体を得ようとするものである。According to the present invention, by controlling the composition of the composite oxide in the aluminum nitride sintered body, a high thermal conductivity is maintained and an aluminum nitride sintered body having a significantly improved bending strength is obtained. It is something to try.
【００１４】このような複合酸化物のほとんどは、窒化
アルミニウム結晶組織の粒界相部分に存在する。窒化ア
ルミニウム焼結体の破壊は主としてこの粒界相部分で起
こる。そのため、複合酸化物が破壊現象に大きな影響を
与える。Most of such complex oxides exist in the grain boundary phase portion of the aluminum nitride crystal structure. The fracture of the aluminum nitride sintered body mainly occurs in this grain boundary phase portion. Therefore, the composite oxide has a great influence on the destruction phenomenon.
【００１５】そこで、本願発明者らは、鋭意研究した結
果、上記のＹＡＬ／ＹＡＧの存在比率がＸ線強度比で３
０／７０以上、９５／５以下の範囲内にあるとき、窒化
アルミニウム焼結体の抗折強度が大幅に向上することを
見いだした。また、この範囲内では、窒化アルミニウム
焼結体の熱伝導率も１６０Ｗ／ｍ・Ｋ以上と高い値を維
持しており、実用上問題とはならないことを見いだし
た。Therefore, as a result of earnest studies, the present inventors have found that the above YAL / YAG abundance ratio is 3 in terms of X-ray intensity ratio.
It was found that the bending strength of the aluminum nitride sintered body was significantly improved when it was in the range of 0/70 or more and 95/5 or less. Further, within this range, the thermal conductivity of the aluminum nitride sintered body was maintained at a high value of 160 W / m · K or more, and it was found that there is no practical problem.
【００１６】なお、イットリウム（Ｙ）以外の他の希土
類元素を含む複合酸化物についても、上記のＡ／Ｂの存
在比率がＸ線強度比で３０／７０以上、９５／５以下の
範囲内にあれば、同様に高い熱伝導率を維持するととも
に、窒化アルミニウム焼結体の抗折強度を大幅に向上さ
せることができる。Regarding the composite oxide containing a rare earth element other than yttrium (Y), the above A / B abundance ratio is within the range of 30/70 or more and 95/5 or less in the X-ray intensity ratio. If so, similarly, it is possible to maintain a high thermal conductivity and to significantly improve the bending strength of the aluminum nitride sintered body.
【００１７】したがって、この発明によれば、上記の複
合酸化物の存在比率を所定の範囲内に制御することによ
り、窒化アルミニウム焼結体の抗折強度として約３３ｋ
ｇｆ／ｍｍ2 以上を達成することができ、従来よりも高
い抗折強度が得られる。また、高い抗折強度が得られる
ような複合酸化物の存在比率の範囲内で、窒化アルミニ
ウム焼結体の熱伝導率を１６０Ｗ／ｍＫ以上に維持する
ことができる。Therefore, according to the present invention, by controlling the abundance ratio of the above complex oxide within a predetermined range, the bending strength of the aluminum nitride sintered body is about 33 k.
It is possible to achieve gf / mm 2 or more and obtain a higher bending strength than conventional ones. Further, the thermal conductivity of the aluminum nitride sintered body can be maintained at 160 W / mK or more within the range of the abundance ratio of the composite oxide that can obtain high bending strength.
【００１８】[0018]
【実施例】表１に示されるように酸素含有量を調整した
１３種類の窒化アルミニウム原料粉末を準備した。Example 13 kinds of aluminum nitride raw material powders whose oxygen contents were adjusted as shown in Table 1 were prepared.
【００１９】[0019]
【表１】 [Table 1]
【００２０】各種の窒化アルミニウム原料粉末を用い
て、以下の表２に示される２つの調合組成ＩとＩＩに従
って混合粉末を作製した。Mixed powders were prepared using various aluminum nitride raw material powders according to the two formulation compositions I and II shown in Table 2 below.
【００２１】[0021]
【表２】 [Table 2]
【００２２】なお、表２の中で、アクリルバインダはポ
リアルキルメタアクリレート、滑剤はステアリン酸、有
機溶剤はＩＰＡ（イソプロピルアルコール）とトルエン
を１対４の体積パーセント比で混合したものを用いた。In Table 2, the acrylic binder used was polyalkylmethacrylate, the lubricant used was stearic acid, and the organic solvent used was a mixture of IPA (isopropyl alcohol) and toluene at a volume ratio of 1: 4.
【００２３】上記の混合工程は、５００ｍｌのポリ容器
に、表２に示された各組成物を９９．９％アルミナ製の
ボール（直径が１０ｍｍ）２００ｇとともに装入して、
６０ｒ．ｐ．ｍ．の回転数で２時間回転させることによ
り行なわれた。In the above mixing step, each composition shown in Table 2 was charged in a 500 ml poly container together with 200 g of 99.9% alumina balls (diameter: 10 mm).
60r. p. m. It was carried out by rotating at a rotation speed of 2 hours.
【００２４】このようにして得られた各種の混合粉末を
温度８０℃で１８０分間乾燥させた。The various mixed powders thus obtained were dried at a temperature of 80 ° C. for 180 minutes.
【００２５】乾燥後、混合粉末を６０メッシュの篩に通
して整粒した。その後、乾式１軸プレスを用いて５００
ｋｇ／ｃｍ2 の圧力で各種の混合粉末を４．５ｍｍ×
３．４ｍｍ×４０ｍｍの大きさの棒状体に成型した。こ
のようにして得られた成型体を１０００ｋｇ／ｃｍ2 の
圧力で冷間静水圧成形した。After drying, the mixed powder was passed through a 60-mesh sieve to be sized. After that, 500 using a dry uniaxial press
4.5 mm × various mixed powders at a pressure of kg / cm 2.
It was molded into a rod-shaped body having a size of 3.4 mm × 40 mm. The molded body thus obtained was cold isostatically molded at a pressure of 1000 kg / cm 2 .
【００２６】このようにして得られた成形体に温度４５
０℃の乾燥空気中で１８０分間、脱脂処理を施した。The molded body thus obtained was heated to a temperature of 45.
Degreasing treatment was performed for 180 minutes in dry air at 0 ° C.
【００２７】その後、成形体を１８５０℃の窒素雰囲気
中で１８０分間、焼成した。以上のようにして作製され
た各種の窒化アルミニウム焼結体の試料を用いて抗折強
度とＸ線回折強度と熱伝導率の測定を行なった。Thereafter, the molded body was fired in a nitrogen atmosphere at 1850 ° C. for 180 minutes. The bending strength, the X-ray diffraction strength, and the thermal conductivity were measured using various samples of the aluminum nitride sintered bodies produced as described above.
【００２８】抗折強度は、東京試験機株式会社製の引張
・圧縮強度試験器（SENSTAR ESC-05TD）を用いて、測定
した。試料の寸法は、ＪＩＳ Ｒ１６０１に規定される
寸法（３ｍｍ×４ｍｍ×３６ｍｍ）を採用した。試験方
法としては支点間距離を３０ｍｍとし、クロスヘッドス
ピードを０．５ｍｍ／ｍｉｎ．として３点曲げ試験を行
なった。The bending strength was measured using a tensile / compressive strength tester (SENSTAR ESC-05TD) manufactured by Tokyo Test Machine Co., Ltd. As the dimensions of the sample, the dimensions (3 mm × 4 mm × 36 mm) specified in JIS R1601 were adopted. As the test method, the distance between fulcrums was set to 30 mm, and the crosshead speed was set to 0.5 mm / min. As a result, a 3-point bending test was performed.
【００２９】Ｘ線回折強度は、株式会社リガク製の粉末
Ｘ線回折装置（ＲＡＤ−Ｂシステム）を用いて測定し
た。試料としては、上記のようにして得られた焼結体を
陶磁器製およびメノウ製の乳鉢で粉砕したものを用い
た。回折条件は、対陰極としてＣｕ（Ｋα）を用いて、
４０ＫＶ×３０ｍＡの負荷で回折角度（２θ）を２０〜
４５°とした。Ｘ線強度比の計算は、回折角度範囲に含
まれるＹＡＭ（２Ｙ2 Ｏ3・Ａｌ2 Ｏ3 ）、ＹＡＬ（Ｙ
2 Ｏ3 ・Ａｌ2 Ｏ3 ）、ＹＡＧ（３Ｙ2 Ｏ3 ・５Ａｌ2
Ｏ3 ）のすべての回折線の観測強度と、標準回折強度と
から、最小自乗法により回折強度比を求めた。これは、
上記のＸ線回折装置に付属された解析プログラムに従っ
た。The X-ray diffraction intensity was measured using a powder X-ray diffractometer (RAD-B system) manufactured by Rigaku Corporation. As the sample, the one obtained by crushing the sintered body obtained as described above in a mortar made of ceramics or agate was used. The diffraction conditions are as follows: Cu (Kα) is used as the anticathode,
Diffraction angle (2θ) of 20 ~ with a load of 40 KV x 30 mA
It was set at 45 °. The calculation of the X-ray intensity ratio is performed by using YAM (2Y 2 O 3 · Al 2 O 3 ), YAL (Y
2 O 3 · Al 2 O 3 ), YAG (3Y 2 O 3 · 5Al 2
The diffraction intensity ratio was determined by the method of least squares from the observed intensities of all diffraction lines of O 3 ) and the standard diffraction intensities. this is,
The analysis program attached to the above X-ray diffractometer was followed.
【００３０】熱伝導率は、株式会社リガク製のレーザー
フラッシュ熱特性測定装置（ＬＦ／ＴＣＭ−ＦＡ８５１
０Ｂ）を用いて測定した。測定対象としての試料の大き
さは、直径が１０ｍｍ、厚みが２．０ｍｍであった。The thermal conductivity is measured by a laser flash thermal characteristic measuring device (LF / TCM-FA851, manufactured by Rigaku Corporation).
0B). The sample to be measured had a diameter of 10 mm and a thickness of 2.0 mm.
【００３１】以上のようにして測定された各試料のＸ線
強度比によるＹＡＧとＹＡＬの存在比率（％）と抗折強
度（ｋｇｆ／ｍｍ2 ）と熱伝導率（Ｗ／ｍ・Ｋ）は表３
と表４に示される。表３は、表２で示された調合組成Ｉ
に従った混合粉末を用いた場合の試料についての結果を
示しており、表４は、表２で示された調合組成ＩＩに従
った混合粉末を用いた試料についての結果を示してい
る。The abundance ratio (%) of YAG and YAL, the bending strength (kgf / mm 2 ), and the thermal conductivity (W / m · K) according to the X-ray intensity ratio of each sample measured as described above are Table 3
Is shown in Table 4. Table 3 shows the formulation composition I shown in Table 2.
Table 4 shows the results for the samples using the mixed powder according to the present invention, and Table 4 shows the results for the samples using the mixed powder according to the formulation composition II shown in Table 2.
【００３２】[0032]
【表３】 [Table 3]
【００３３】[0033]
【表４】 [Table 4]
【００３４】また、図１は、表３に基づいてＹＡＬ相の
Ｘ線強度比（存在比率）と、抗折強度および熱伝導率と
の関係を示す。Further, FIG. 1 shows the relationship between the X-ray intensity ratio (abundance ratio) of the YAL phase and the bending strength and the thermal conductivity based on Table 3.
【００３５】図２は、表４に基づいてＹＡＬ相のＸ線強
度比（存在比率）と、抗折強度および熱伝導率との関係
を示す。なお、各図において黒の四角印は抗折強度を示
し、白の四角印は熱伝導率を示す。FIG. 2 shows the relationship between the X-ray intensity ratio (abundance ratio) of the YAL phase and the bending strength and thermal conductivity based on Table 4. In each figure, the black squares indicate the bending strength, and the white squares indicate the thermal conductivity.
【００３６】図１と図２から明らかなように、ＹＡＬ相
のＸ線強度比（ＹＡＧとＹＡＬの和を１００％とした場
合のＹＡＬ相の存在比率）が３０〜９５％のとき約３３
ｋｇｆ／ｍｍ2 以上の抗折強度を得ることができる。ま
た、上記の範囲のＹＡＬ相のＸ線強度比においては、窒
化アルミニウム焼結体の熱伝導率は１６０Ｗ／ｍ・Ｋ以
上を維持していることがわかる。As is clear from FIGS. 1 and 2, about 33 when the X-ray intensity ratio of the YAL phase (the YAL phase existence ratio when the sum of YAG and YAL is 100%) is 30 to 95%.
It is possible to obtain a bending strength of not less than kgf / mm 2 . Further, it can be seen that in the X-ray intensity ratio of the YAL phase in the above range, the thermal conductivity of the aluminum nitride sintered body is maintained at 160 W / m · K or more.
【００３７】通常、窒化アルミニウムの原料粉末に焼結
助剤として希土類酸化物、たとえばＹ2 Ｏ3 を１〜１０
重量％の範囲内で配合して混合粉末を準備する。その混
合粉末を乾燥した後、加圧成形し、得られた成形体を焼
成して窒化アルミニウム焼結体を得る。Usually, 1 to 10 rare earth oxides such as Y 2 O 3 are added to the raw material powder of aluminum nitride as a sintering aid.
A mixed powder is prepared by blending in the range of wt%. The mixed powder is dried, pressure-molded, and the obtained molded body is fired to obtain an aluminum nitride sintered body.
【００３８】このような通常の窒化アルミニウム焼結体
の製造工程において、窒化アルミニウムの原料粉末に含
まれる酸素量、希土類酸化物の添加量、焼結条件等を調
整することにより、焼結体中の複合酸化物の存在比率Ａ
／Ｂ、たとえばＹＡＬ／ＹＡＧを３０／７０〜９５／５
の範囲内に制御することにより、高い熱伝導率を有し、
かつ高い抗折強度を有する焼結体を得ることができる。
このように、本発明の窒化アルミニウム焼結体は、容易
に製造することができる。In the usual manufacturing process of such an aluminum nitride sintered body, by adjusting the amount of oxygen contained in the raw material powder of aluminum nitride, the amount of rare earth oxide added, the sintering conditions, etc. Abundance ratio A of complex oxide
/ B, for example YAL / YAG 30/70 to 95/5
Has a high thermal conductivity by controlling within the range of
Moreover, a sintered body having a high bending strength can be obtained.
Thus, the aluminum nitride sintered body of the present invention can be easily manufactured.
【００３９】なお、上記の実施例は複合酸化物を構成す
る希土類元素としてイットリウム（Ｙ）の場合について
示したが、開示された実施例はすべての点で例示であっ
て制限的なものではないと考慮されるべきである。本発
明の範囲は、上記の実施例ではなく、特許請求の範囲に
よって示されるものであり、特許請求の範囲と均等の範
囲内におけるすべての修正や変更も含む。Although the above-mentioned embodiments show the case where yttrium (Y) is used as the rare earth element constituting the composite oxide, the disclosed embodiments are illustrative in all respects and not restrictive. Should be considered. The scope of the present invention is shown not by the above-described embodiments but by the scope of the claims, and includes all modifications and changes within the scope equivalent to the scope of the claims.
【図１】ある調合組成に従った混合粉末を用いて得られ
た窒化アルミニウム焼結体において、ＹＡＬ相のＸ線強
度比と、抗折強度および熱伝導率との関係を示す図であ
る。FIG. 1 is a diagram showing a relationship between an X-ray intensity ratio of a YAL phase, a bending strength, and a thermal conductivity in an aluminum nitride sintered body obtained by using a mixed powder according to a certain composition.
【図２】別の調合組成に従った混合粉末を用いて得られ
た窒化アルミニウム焼結体において、ＹＡＬ相のＸ線強
度比と、抗折強度および熱伝導率との関係を示す図であ
る。FIG. 2 is a diagram showing a relationship between an X-ray intensity ratio of a YAL phase, a bending strength and a thermal conductivity in an aluminum nitride sintered body obtained by using a mixed powder according to another formulation composition. .
Claims (2)
強度比で表わされた存在比率でＡ／Ｂが３０／７０以
上、９５／５以下の範囲内であり、かつＡは、化学式Ｘ
2 Ｏ3 ・Ａｌ2 Ｏ3 で示される、希土類元素Ｘの酸化物
とＡｌ2 Ｏ3 の複合酸化物であり、Ｂは、化学式３Ｘ2
Ｏ3 ・５Ａｌ2 Ｏ3 で示される、希土類元素Ｘの酸化物
とＡｌ2 Ｏ3 の複合酸化物である、高強度窒化アルミニ
ウム焼結体。1. A composite oxide containing A and B, and having an abundance ratio expressed as an X-ray intensity ratio, A / B is in the range of 30/70 or more and 95/5 or less, and A Is the chemical formula X
2 O 3 · Al 2 O 3 is a complex oxide of an oxide of rare earth element X and Al 2 O 3 , and B is a chemical formula 3X 2
O 3 · 5Al represented by 2 O 3, a composite oxide of oxide and Al 2 O 3 of a rare earth element X, high-strength aluminum nitride sintered body.
請求項１に記載の高強度窒化アルミニウム焼結体。2. The X is yttrium (Y),
The high-strength aluminum nitride sintered body according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7225012A JPH0971469A (en) | 1995-09-01 | 1995-09-01 | High-strength aluminum nitride sintered compact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7225012A JPH0971469A (en) | 1995-09-01 | 1995-09-01 | High-strength aluminum nitride sintered compact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0971469A true JPH0971469A (en) | 1997-03-18 |
Family
ID=16822698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7225012A Pending JPH0971469A (en) | 1995-09-01 | 1995-09-01 | High-strength aluminum nitride sintered compact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0971469A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11199324A (en) * | 1998-01-05 | 1999-07-27 | Fuji Electric Co Ltd | Aluminum nitride sintered body and method for producing the same |
| CN109095933A (en) * | 2018-07-24 | 2018-12-28 | 广东金刚新材料有限公司 | A kind of dedicated bending resistance ceramic rod of chilling band and preparation method thereof |
| JPWO2022210517A1 (en) * | 2021-03-31 | 2022-10-06 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219844A (en) * | 1993-01-27 | 1994-08-09 | Showa Denko Kk | Aln sintered compact and production thereof |
| JPH06219843A (en) * | 1993-01-21 | 1994-08-09 | Sumitomo Metal Ind Ltd | AlN sintered body having excellent surface cleanliness and method for producing the same |
-
1995
- 1995-09-01 JP JP7225012A patent/JPH0971469A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06219843A (en) * | 1993-01-21 | 1994-08-09 | Sumitomo Metal Ind Ltd | AlN sintered body having excellent surface cleanliness and method for producing the same |
| JPH06219844A (en) * | 1993-01-27 | 1994-08-09 | Showa Denko Kk | Aln sintered compact and production thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11199324A (en) * | 1998-01-05 | 1999-07-27 | Fuji Electric Co Ltd | Aluminum nitride sintered body and method for producing the same |
| CN109095933A (en) * | 2018-07-24 | 2018-12-28 | 广东金刚新材料有限公司 | A kind of dedicated bending resistance ceramic rod of chilling band and preparation method thereof |
| JPWO2022210517A1 (en) * | 2021-03-31 | 2022-10-06 |
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