JPH0974259A - Electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component device, which is prevented a crack due to a thermal stress and a mechanical stress from being developed therein and is enhanced in a fall impact resistance. SOLUTION: A circuit or an electronic component (not being shown in the diagram) is built or mounted in or on a base body 1 and external electrodes 2 are formed on the side surfaces of the base body 1 to constitute an electronic component 10 and the component 10 is mounted on a printed board 4. In that case, the board 4 and the component 10 are arranged in such a way that an impact absorbent material 3 is pinchingly attached between the board 4 and the component 10 and the electrodes 2 and electrode patterns 5 on the board 4 are bonded together with solders 6. At this time, gaps are generated between the electrodes 2 and the patterns 5 by the existence of the material 3 and the solders 6, which are used for the bonding, are formed into a columnar form. In such a way, an electronic component device 30 with the component 10 mounted on the board 4 is constituted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component device mounted on a printed circuit board or the like.

[0002]

2. Description of the Related Art A conventional electronic component device mounted on a printed circuit board or the like is shown in FIG. In FIG. 4, a circuit or electronic component (not shown) is built in or mounted on a ceramic substrate 1, and an external electrode 2 is formed on a side surface of the substrate 1 to form an electronic component 10. Then, the external electrode 2 and the electrode pattern 5 of the printed circuit board 4 are soldered with the solder 6, and the electronic component 10 is mounted on the printed circuit board 4 to form the electronic component device 20.

[0003]

However, in the above-mentioned conventional example, the printed circuit board 4 is mounted when the electronic component 10 is mounted on the printed circuit board 4, or when an electronic device in which the electronic component device 20 is used is used. When the bending occurs, there is a problem that the base body 1 is mechanically stressed and cracked. In particular, in the case of multi-functionalization, since the base body 1 becomes large, it becomes more affected by the bending, and cracks are likely to occur.

Further, when the base 1 and the printed circuit board 4 have different thermal expansion coefficients, when the operating environment is thermally changed, the base 1 and the printed circuit board 4 are bent, and the base 1 is subjected to a compressive stress. There was a problem that it was damaged and cracked.

Further, when the electronic component is used as a component for a portable device such as a mobile phone or a pager, the portable device is often dropped, and in the conventional electronic component device 20, the electronic component is directly mounted on the substrate. As a result, the impact of the drop is directly transmitted to the electronic parts, which causes damage or failure due to the drop.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an electronic component device which prevents cracks due to thermal stress and mechanical stress and has improved drop impact resistance.

[0007]

In order to achieve the above object, in the present invention, an electronic component comprising a base and an external electrode formed on the side surface of the base or from the side surface to the bottom surface, and the electronic component is mounted. A substrate, an electrode pattern formed on the surface of the substrate, and a shock absorbing material, and the shock absorbing material is sandwiched between the electronic component and the substrate.

As a result, the impact of the bending of the printed circuit board is reduced by the shock absorbing material. Further, the drop impact resistance is also improved by the impact being absorbed by the impact absorbing material.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION One embodiment of an electronic component device of the present invention will be described in detail below with reference to FIGS. The same parts as those in the conventional example are designated by the same reference numerals. In FIG. 1, reference numeral 1 is a base body made of ceramics. A circuit or electronic component (not shown) is built in or mounted on the base body 1, and an external electrode 2 is formed on a side surface of the base body 1 to form an electronic component 10. The electronic component 10 thus configured is mounted on the printed circuit board 4. that time,
The shock absorber 3 is arranged so as to be sandwiched between the printed circuit board 4 and the electronic component 10, and the external electrode 2 and the electrode pattern 5 on the printed circuit board 4 are joined by the solder 6 to form the electronic component 1
An electronic component device 30 in which 0 is mounted on the printed circuit board 4 is configured. At this time, due to the presence of the impact absorbing material 3, a gap is created between the external electrode 2 and the electrode pattern 5, and the solder 6 used for joining is formed in a columnar shape as shown in FIG. .

In the electronic component device 30 configured as described above, the method of sandwiching the shock absorbing material 3 is as shown in FIG. 2, in which the shock absorbing material 3 is previously mounted on the printed circuit board 4.
The electronic component 10 is mounted on the shock absorbing material 3, that is, the printed circuit board 4.
Implement on top. Further, as shown in FIG. 3, the shock absorbing material 3 may be mounted on the bottom surface of the electronic component 10 in advance, and the electronic component 10 may be mounted on the printed board 4 via the shock absorbing material 3.

Next, Table 1 shows the results of confirming the effect of shock absorption by a drop test. In the drop test, the electronic components are mounted on the printed circuit board, the printed circuit board is screwed to the housing,
From a height of 1.8 m, drop it on a concrete block,
It was performed by counting the number of times until cracks occurred in the electronic component. In this test, as the shock absorbing material, silicon grease was used as grease, silicon rubber was used as an elastic body, Kapton film (Kapton was a registered trademark of Ei DuPont Denimoirs & CO), and PET film were used. Table 1 also shows the results of the conventional product and the thickness of the impact absorbing material for reference.

[0012]

[Table 1]

From Table 1, sample No. For the silicon grease thickness of 10 μm of Sample No. 2, Compared with the conventional product of No. 1, the impact resistance is improved, and the sample No. When the thickness of the silicon grease of 3 is 20 μm, the impact resistance is further improved. Sample No. Impact resistance is also improved for those of 3 to 11. This is due to the shock absorbing effect of the columnar solder as well as the shock absorbing effect of the shock absorbing material. The thickness of the shock absorber is 200μ
When it exceeds m, it becomes difficult to connect and fix the external electrode of the electronic component and the electrode pattern of the printed board by soldering.

The shock absorbing material is not limited to the grease, the elastic body, the film and the like used in the above-mentioned embodiment, and various shock absorbing materials can be selected depending on the application.

[0015]

As described above, in the electronic component device according to the present invention, the influence of the flexure of the printed circuit board is reduced by the impact absorbing material, and the drop impact resistance is also improved by the impact absorbing material absorbing the impact. To do. Further, by sandwiching the shock absorbing material between the electronic component and the printed circuit board, the solder that joins the electronic component and the printed circuit board becomes columnar, and the drop shock is absorbed by the solder and the shock absorbing material formed in the columnar shape. , The strength is improved.

[Brief description of drawings]

FIG. 1 shows an electronic component device according to an embodiment of the present invention, (a) is a perspective view, and (b) is a sectional view taken along the line AA.

FIG. 2 is an explanatory diagram showing a method of mounting an electronic component according to the electronic component device of the present invention.

FIG. 3 is an explanatory diagram showing another example of an electronic component mounting method according to the electronic component device of the present invention.

FIG. 4 is a cross-sectional view showing a conventional electronic component device.

[Explanation of symbols]

 1 Base 2 External Electrode 3 Shock Absorber 4 Substrate 5 Electrode Pattern 10 Electronic Component 30 Electronic Component Device

Claims (1)

[Claims] 1. An electronic component including a base and an external electrode formed on a side surface of the base or from a side surface to a bottom surface, a substrate on which the electronic component is mounted, an electrode pattern formed on the surface of the substrate, and shock absorption. An electronic component device comprising a material, wherein the shock absorbing material is sandwiched between the electronic component and the substrate.