JPH0979815A - ワークの位置検出装置 - Google Patents

ワークの位置検出装置

Info

Publication number
JPH0979815A
JPH0979815A JP25950995A JP25950995A JPH0979815A JP H0979815 A JPH0979815 A JP H0979815A JP 25950995 A JP25950995 A JP 25950995A JP 25950995 A JP25950995 A JP 25950995A JP H0979815 A JPH0979815 A JP H0979815A
Authority
JP
Japan
Prior art keywords
positioning hole
position detecting
light source
work
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25950995A
Other languages
English (en)
Japanese (ja)
Inventor
Nobuyuki Aoyanagi
伸幸 青柳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP25950995A priority Critical patent/JPH0979815A/ja
Priority to TW85103475A priority patent/TW305926B/zh
Publication of JPH0979815A publication Critical patent/JPH0979815A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
JP25950995A 1995-09-13 1995-09-13 ワークの位置検出装置 Pending JPH0979815A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP25950995A JPH0979815A (ja) 1995-09-13 1995-09-13 ワークの位置検出装置
TW85103475A TW305926B (de) 1995-09-13 1996-03-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25950995A JPH0979815A (ja) 1995-09-13 1995-09-13 ワークの位置検出装置

Publications (1)

Publication Number Publication Date
JPH0979815A true JPH0979815A (ja) 1997-03-28

Family

ID=17335099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25950995A Pending JPH0979815A (ja) 1995-09-13 1995-09-13 ワークの位置検出装置

Country Status (2)

Country Link
JP (1) JPH0979815A (de)
TW (1) TW305926B (de)

Also Published As

Publication number Publication date
TW305926B (de) 1997-05-21

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