JPH0979995A - Optical defect inspection system - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] To accurately set an inspection area and shorten the inspection processing time. A reference portion is imaged, the position coordinates of the reference portion are obtained from this image, and the inspection area is determined based on the positional coordinates of the reference portion based on the known positional relationship between the reference portion and the inspection area. Defect inspection is performed on the determined inspection area.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a defect inspection having a function of automatically teaching an inspection area to an inspection device for performing an external defect inspection of an electronic component represented by a semiconductor integrated circuit such as an LSI. Regarding the device.

[0002]

2. Description of the Related Art An inspection for setting a necessary inspection area in an image to detect a defect such as a scratch or a hole in the electronic component from an image of an inspection surface of an electronic component to be inspected As a method of teaching a region, an operator generally manually inputs an image. However, if the inspection range setting accuracy is poor by manual input and there are many variations in shape size, it is necessary to input each inspection region individually, which is troublesome and productivity is poor. Therefore, a method has been developed for automatically teaching an inspection area from the shape of the inspection object obtained by performing image processing on the captured image of the inspection object.

[0003]

However, in order to automatically teach the inspection area, in the case where the original image pattern is complicated or there is a mixture of objects that hinder the extraction of the target image, The image processing becomes complicated, the image processing is impossible, and the processing time and the processing device are wasteful, which lowers the productivity. In particular, electronic parts are placed on the tape and transported and stored. So-called TCP (TapeCarr
In the ier Package), it was difficult to distinguish the tape and the mold part of the device on the image, which was an obstacle to automatic inspection. Therefore, an object of the present invention is to provide an optical defect inspection apparatus configured to accurately teach the inspection area by detecting the reference portion of the inspection area setting by the arrangement of the imaging device and the illumination. To provide.

[0004]

In order to achieve the above-mentioned object, the first means adopted by the present invention is a defect of an object to be inspected with respect to an inspection area designated on an image obtained by picking up an image of an object to be inspected of the object to be inspected. In a device for inspecting, a reference part image pickup means for picking up an image of the reference part of the object to be inspected, which serves as a reference for determining the inspection area, and a reference part for detecting the position coordinates of the reference part from the image picked up by the reference part image pickup means. An image processing means and an inspection area setting means for setting an inspection area on an image obtained by imaging the inspection target portion based on the position coordinates of the reference portion, and performing a defect inspection on the inspection area. It is configured as a characteristic optical inspection device. or,
The second means is an optical defect inspection apparatus for detecting an opening defect in the mold part of a TCP device in which a mold part is located on one side of a tape that does not completely shield light and a chip part is located on the other side. One surface epi-illumination, which is arranged on one surface side and illuminates the mold portion from a direction orthogonal to the tape surface, and one surface side illumination, which is arranged on the other surface side and images the other surface side from a direction orthogonal to the tape surface. A first camera and another surface side illumination that is disposed on the other surface side and that illuminates the chip section from a direction orthogonal to the tape surface, and illuminates the mold section by the one surface side epi-illumination; Regarding the inspection area which is illuminated by the other surface side illumination in the shadow image of the mold portion imaged by the first camera and is enlarged by a predetermined range from the image of the chip portion imaged by the first camera, And it is configured as an optical defect inspection apparatus characterized by examining the opening defect of de unit.

Further, a third means is an optical defect inspection apparatus for inspecting a defect of the mold part of a TCP device having a mold part on one surface side and a chip part on the other surface side which does not completely shield light. In the above, the oblique illumination which is disposed on the one surface side and illuminates the mold portion from an oblique direction, the second camera which is disposed on the one surface side and images the mold portion from a vertical direction, and the other surface Placed on the side,
A third camera for taking an image from the vertical direction of the chip section,
Image processing for detecting fillet coordinates of the mold part from a shadow image of the mold part illuminated by the oblique illumination and taken by the third camera, and setting an inspection area in which the fillet coordinates are reduced by a predetermined amount. Means, a conversion means for converting the inspection region by the image processing means into a coordinate system on the side of the second camera, and an image of the mold portion illuminated by the oblique illumination and imaged by the second camera. The optical defect inspection apparatus is characterized in that the surface of the mold portion is inspected with respect to the inspection area converted by the conversion means. If the position of the reference portion that determines the inspection area to be set in the inspection object portion of the inspection object can be detected, it is easy to teach the inspection area on the captured image of the inspection object portion. Therefore, the reference portion can be imaged, the position coordinates of the reference portion can be obtained from this image, and the inspection area can be determined based on this. The inspection area can be taught by inputting the determined inspection area into the captured image of the inspection target portion. Inspection is performed on the taught inspection area. Claim 1 corresponds to this.

In order to automatically teach the inspection area in the perforation defect inspection of the mold part of the TCP device, epi-illumination is installed on the mold part on one side of the tape and the chip part on the other side, and The chip is illuminated by epi-illumination on the surface side, and the chip part is imaged by a camera arranged on the other surface side. The inspection area of the mold part is determined based on enlarging or reducing the area of the chip part. The mold part is illuminated by epi-illumination on one surface side, a shadow image of the mold part is obtained by imaging with the camera on the other surface side, and the mold part is inspected for the above inspection area detected by the same camera. When a bright portion due to punching is detected in the shadow image inside, a punching defect in the mold portion can be detected. Also, TC
When automatically instructing the inspection area in the inspection of surface defects such as bubble voids of the mold part of the P device, diagonal illumination for illuminating the mold part from diagonally above is provided on one side of the tape, and both sides of the tape are respectively provided. A camera is arranged so that the other side camera captures a shadow image of the mold section and the one side camera captures an oblique illumination image of the mold section. The fillet coordinates of the shadow image of the mold portion are obtained, the coordinates are converted into the oblique illumination image, and the image is reduced by a predetermined length to set an inspection area in the oblique illumination image. Bubble voids emphasized by oblique illumination are detected for this inspection region. The inspection area on the second camera side may be obtained by converting the fillet coordinate into the coordinate system on the second camera side and then reducing the same by a predetermined amount. According to these inventions, the inspection area can be accurately set even when there is no difference in the image between the tape and the mold portion.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the accompanying drawings to provide an understanding of the present invention. The following embodiments are examples embodying the present invention and do not limit the technical scope of the present invention. Here, FIG. 1 is a schematic diagram showing the configuration of the inspection device for a semiconductor device according to the first embodiment of the present invention, and FIG. 2 is a schematic diagram for explaining the inspection region detection process. In FIG. 1, an inspection area teaching device 1 according to the first embodiment is
TC formed in TCP (Tape Carrier Package) format
The inspection area can be taught to an inspection apparatus that detects a perforated defect in the P device. The TCP devices 3 are arranged on the semi-translucent tape 30 at predetermined intervals, and the mold part 31 is located on one side of the tape 30 and the chip part 32 is located on the other side. The TCP device 3 is sequentially conveyed to the inspection position by the running of the tape 30, and the appearance inspection of the mold part 31 is executed. In this case, the inspection is performed around the chip portion 32 with a predetermined width with the vertical defect hole existing in the mold portion 31 being symmetrical.

The teaching device 1 in the inspection area for inspecting the outer appearance of the mold portion 31 includes a chip portion 32 of the TPC device 3.
The other side illumination 8 disposed on the side, the CCD camera 6 (first camera), the one-side incident illumination 5 disposed on the mold part 31 side, and the image processor 7 are configured. The procedure for teaching the inspection area and the defect inspection according to this configuration will be described below in order. (1) Illuminate the chip portion 32 with the other side illumination 8 and CC
A chip image (FIG. 2A) obtained by imaging the chip section 32 by the D camera 6 is input to the image processor 7. (2) The image processor 7 extracts the chip portion 32 by binarizing and labeling the image. Once extracted, the fillet coordinates can be determined. (3) A region enlarged by a predetermined distance set in advance from the coordinates of the tip portion 32 is set. This is the mold part 31
Of the inspection area (FIG. 2b). (4) Mold part 31 transmitted by the one-sided epi-illumination 5
The shadow image of is captured by the CCD camera 6. (5) As shown in FIG. 2B, the inspection area detected in (3) is applied to the shadow image of the mold section 32. (6) When a histogram in the inspection area is acquired and a count exceeding the preset brightness threshold is detected in the histogram, it is determined that a perforated defect exists.

In the configuration of the present embodiment, the setting image of the inspection area and the inspection image are captured by the same camera, and the main content of the processing is the comparison of data in the same image processor, so the coordinate conversion is performed. And no need for data transmission. Next, FIG.
A second embodiment of the present invention shown in FIG. FIG. 4 is a schematic diagram for explaining the setting of the inspection area. In FIG. 3, the teaching device 10 according to the second embodiment is a diagonal illumination 11 that illuminates the mold part 31 side (one surface side) of the TCP device 3 to be inspected from obliquely above, and one surface provided on the one surface side. Side camera 12 (second camera), the one-side camera 1
2. An image processing device for inspection 14, which performs a defect inspection of the mold portion 3 based on an image captured by the image pickup device 2, another camera 13 (third camera) on the other side of the chip 32 (the other side), and the other surface. Based on the image captured by the side camera 13, the mold portion 31
The teaching image processor 15 for extracting the inspection area and the data communication cable 16 connecting the image processors 14 and 15 are provided.

The teaching of the inspection area and the inspection procedure for performing the bubble void inspection on the surface of the mold portion 31 having the above-described structure will be described below in sequence. (1) Illumination is performed by the oblique illumination 11 and the shadow image (FIG. 4A) of the mold portion 31 is captured by the other-side camera 13. (2) The captured image is input to the teaching image processor 15, the label of the mold part 31 is acquired by differentiating, binarizing, and labeling, and the fillet coordinates (outline coordinates) of the mold part 31 are detected. (3) The detected fillet coordinates of the mold portion 31 are transmitted from the teaching image processor 13 to the inspection image teaching device 14 via the communication cable 16. (4) The inspection image processor 14 performs coordinate conversion between the other-side camera 13 and the one-side camera 12, and the presence of the mold part 31 from the fillet coordinates of the mold part 31 by a preset length. Reduce the range. This will be the inspection area (FIG. 4b) for bubble void inspection.

(5) Next, in order to acquire an inspection image, the mold portion 31 is illuminated by the oblique illumination 11 and the mold portion 31 which is illuminated obliquely from above is imaged by the one-sided camera 12. (6) The captured image is input to the inspection image processor 14,
The inspection area detected in (4) is applied. (7) The histogram in the inspection area is obtained, and when the count exceeding the predetermined brightness threshold is present in the histogram and the count value exceeds the predetermined threshold, it is determined that there is a bubble void defect. As shown in each of the above embodiments, when the position of the reference portion that determines the inspection area to be set in the inspection target portion can be detected, it becomes easy to teach the inspection area on the captured image of the inspection target portion. In the case of the TCP device 3 in each of the above-mentioned embodiments, the mold part 31 is the inspection target part and the chip part 32.
Corresponds to the reference part.

[0012]

As described above, according to the present invention, the reference portion for determining the inspection area is imaged, the position coordinates of the reference portion are obtained from this image, and the known positional relationship between the reference portion and the inspection area is obtained. The inspection area can be determined based on The defect inspection is performed only on the determined inspection area. Claim 1 corresponds to this. Therefore, the unnecessary time is not inspected and the processing time is not wasted.
When automatically instructing the inspection area in the perforated defect inspection of the mold part of the TCP device, epi-illumination is installed on the mold part on one side of the tape and the chip part on the other side, and the other side of the tape is inspected. The chip is illuminated by epi-illumination and the chip part is imaged by a camera arranged on the other side. Since the inspection area of the mold part can be determined based on the position of the chip part, the mold part is illuminated by epi-illumination on one surface side, the shadow image of the mold part is obtained by imaging with the camera on the other surface side, and the same camera is used. The captured image of the chip is aligned with the shadow image of the mold section. Since the inspection area can be set by enlarging the image of the chip portion in a predetermined direction, when a bright portion due to perforation is detected in the shadow image in this inspection area, a perforation defect in the mold portion can be detected. Claim 2 corresponds to this. Therefore, in this case, even if the tape image and the image of the mold portion cannot be discriminated from each other, the inspection region can be set accurately, the inspection accuracy is improved, and the processing time is shortened.

In the case of automatically teaching the inspection area in the bubble void defect inspection of the mold part of the TCP device, the mold part is illuminated obliquely from above on one surface side of the tape, and the cameras are arranged on both surface sides of the tape. Then, the shadow image of the mold part is captured by the other-side camera, and the oblique illumination image of the mold part is captured by the one-side camera. By obtaining the coordinates of the shadow image of the mold part, converting the coordinates into the oblique illumination image, and reducing it by a predetermined length,
An inspection area is set in the oblique illumination image. Bubble voids emphasized by oblique illumination are detected for this inspection region. Claim 3 corresponds to this. Therefore, also in this case, since the inspection area is set accurately, even if the tape and the mold portion cannot be distinguished from each other, the inspection can be performed with high accuracy. Also, the processing time can be shortened.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of an automatic teaching device for an inspection area according to a first embodiment.

FIG. 2 is a schematic diagram showing an image according to the first embodiment.

FIG. 3 is a schematic diagram showing a configuration of an inspection area automatic teaching device according to a second embodiment.

FIG. 4 is a schematic diagram showing an image according to a second embodiment.

[Explanation of symbols]

 1, 10 ... Teaching device 3 ... TCP device 5 ... One side illumination 6 ... CCD camera (first camera) 7 ... Image processor 8 ... Other side camera 11 ... Oblique illumination 12 ... One side camera (second Camera) 13 ... Other-side camera (third camera) 14 ... Image processing device for inspection 15 ... Image processing device for teaching

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masatoshi Fujimoto 2-3-3 Higashi-Tokorozawa Wada, Tokorozawa-shi, Saitama MM Building 3F Genesis Technology Co., Ltd. (72) Inventor Eiji Takahashi Takatsukadai, Nishi-ku, Kobe-shi, Hyogo Prefecture 1-5-5 Kobe Steel Co., Ltd., Kobe Research Institute (72) Inventor Yuichiro Goto 1-5-5 Takatsukadai, Nishi-ku, Kobe-shi, Hyogo Kobe Steel Works, Kobe Research Institute (72) Inventor Yamaguchi 1-5-5 Takatsukadai, Nishi-ku, Kobe-shi, Hyogo Within Kobe Steel Co., Ltd. Technical Research Institute (72) Yoshiro Nishimoto 1-5-5 Takatsukadai, Nishi-ku, Kobe-shi, Hyogo Kobe Steel Works Kobe Research Institute (72) Inventor Maki Nakayama 1-5-5 Takatsukadai, Nishi-ku, Kobe-shi, Hyogo Stock Company Kobe Steel, Kobe comprehensive technology within the Institute

Claims (4)

[Claims] 1. A reference part of an object to be inspected, which serves as a reference for determining the inspection area in an apparatus for inspecting a defect of the object to be inspected in an inspection area designated on an image of an image of the object to be inspected of the object to be inspected. A reference part image pickup means for picking up images, a reference part image processing means for detecting a position coordinate of the reference part from an image picked up by the reference part image pickup means, and an image obtained by picking up the inspection target part based on the position coordinates of the reference part. An optical inspection apparatus comprising: an inspection area setting unit for setting an inspection area on the upper side, and performing a defect inspection on the inspection area. 2. An optical defect inspection apparatus for detecting an opening defect in a mold part of a TCP device, wherein a mold part is located on one side of a tape that does not completely shield light and a chip part is located on the other side of the tape. And one surface epi-illumination for illuminating the mold part from a direction orthogonal to the tape surface, and another surface for illuminating the other surface from the direction orthogonal to the tape surface. 1 camera and another surface side illumination which is disposed on the other surface side and illuminates the chip portion from a direction orthogonal to the tape surface, and the mold portion is illuminated by the one surface side incident illumination. The inspection area illuminated by the other-side illumination in the shadow image of the mold section imaged by the first camera and enlarged by a predetermined range from the image of the chip section imaged by the first camera An optical defect inspecting apparatus, which inspects an opening defect in a cord portion. 3. An optical defect inspecting apparatus for inspecting a defect of the mold part of a TCP device, wherein a mold part is present on one surface side of a tape which does not completely shield light and a chip part is present on the other surface side of the tape. Oblique lighting for illuminating the mold part from an oblique direction, a second camera arranged on the one surface side for picking up the mold part from a vertical direction, and arranged on the other surface side, A third camera for picking up an image from the vertical direction of the chip section and a fillet coordinate of the mold section is detected from a shadow image of the mold section which is illuminated by the oblique illumination and picked up by the third camera, Image processing means for setting an inspection area in which the fillet coordinates are reduced by a predetermined amount, conversion means for converting the inspection area by the image processing means into the coordinate system on the second camera side, and illumination by the oblique illumination. The optical defect inspection apparatus is characterized in that the surface of the mold part is inspected with respect to the inspection area converted by the conversion means in the image of the mold part imaged by the second camera. 4. The inspection area is obtained by converting the fillet coordinates into a coordinate system on the second camera side and then reducing the size by a predetermined amount.
The optical defect inspection apparatus described.