JPH0982437A - IC measuring jig and IC measuring method - Google Patents

Abstract

(57) Abstract: An IC carrier holding an IC is pressed against a probe needle support to bring the probe needle into contact with the shoulder portion of the lead of the IC, thereby facilitating handling such as IC transportation. Make sure that the IC leads are not in electrical contact with anything in the state. SOLUTION: In an IC supply station, by pressing a carrier tray 38 against an IC pressing opening / closing plate 74, an opening / closing pin 78 comes into contact with an IC pressing 18, and I
Open the C retainer 18. In that state, IC carrier 1
Place IC28 on 0. When the carrier tray 38 is separated from the IC pressing opening / closing plate 74, the IC pressing 18 causes the IC
28 is held by the IC carrier 10. Next, when the carrier tray 38 is pressed against the support base 60 at the measurement station, the probe needle 36 comes into contact with the shoulder of the lead 30 of the IC 28.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring jig for measuring an IC component sealed in a package, and an IC measuring method using the measuring jig.

[0002]

2. Description of the Related Art A tester is generally used to measure the electrical characteristics of an IC component sealed in a package. In this case, the IC is mounted in the IC socket, and the tester is connected to this IC socket. That is, the leads of the IC come into contact with the internal terminals of the IC socket, and the internal terminals are connected to the tester via the external terminals of the IC socket.

[0003]

The above-described IC socket system has the following problems.

(1) Until the IC is mounted in the IC socket, the IC is conveyed in an exposed state.
Should be handled with care.

(2) In order to avoid carrying the IC in an exposed state, if a system is adopted in which the IC is carried in a portable IC socket, the electrical communication between the IC and the IC socket is made. Contact and electrical contact between the IC socket and the tester are required, increasing the number of electrical contact points. When the number of electrical contact points increases, a measurement error increases, and when there is a problem in electrical contact, it becomes difficult to identify which part of the electrical contact point is the problem.

(3) When the IC is mounted, passive elements such as capacitors and resistors may be connected in the vicinity of the leads of the IC. However, if the IC is mounted in the IC socket, such a mounted state may occur. In a state close to, that is, I with a capacitor or resistor connected near the lead
C measurement becomes impossible. In this case, even if a capacitor or a resistor is connected between the external terminal of the IC socket and the tester, there is a problem that the mounting state cannot be reproduced particularly in the measurement of high frequency characteristics due to the existence of the electric passage inside the IC socket. .

The present invention has been made to solve the above-mentioned problems, and an object thereof is to
An object of the present invention is to provide an IC measuring jig which can be handled while being held in a carrier, such as being transported, and in which the IC leads are not in electrical contact with anything. Another object of the present invention is to provide an IC measuring jig which can shorten the distance from the IC lead to the tester as much as possible. Still another object of the present invention is I
An object of the present invention is to provide an IC measuring jig that can minimize the number of electrical contact points from the C lead to the tester.

[0008]

An IC measuring jig according to the present invention comprises an IC carrier capable of detachably holding an IC having a plurality of leads by means of an IC retainer, and a plurality of IC carriers arranged corresponding to the arrangement of the leads of the IC. Of the probe carrier supporting the probe needle of the IC carrier and the IC of the IC carrier
An opening and closing pin that can open and close the IC holder by contacting the holder is provided. And the IC that holds the IC
The probe needle can be brought into contact with the shoulder portion of the lead of the IC by mounting the carrier on the probe needle support in a positionable manner. That is, the IC carrier and the probe needle support are separately configured, and the IC can be handled while being held by the IC carrier. When held by the IC carrier, the leads of the IC are not in electrical contact with anything.

The probe needle is preferably a cantilever type, but a pogo pin type may be used.

The simplest configuration of the present invention is one IC
This IC is designed to hold one IC on the carrier.
This is a configuration in which the C carrier is attached to one probe needle support. However, preferably, a plurality of IC carriers can be mounted in one carrier tray,
Each IC carrier holds one IC. Then, correspondingly, a plurality of probe needle supports are fixed to one support base. For example, 20 ICs
20 carriers with one carrier tray
One probe needle support can be fixed to one support base. Further, a plurality of opening / closing pins are fixed to one IC holding / opening / closing plate corresponding to each IC carrier, and the carrier tray is attached to the IC holding / opening / closing plate, so that a plurality of IC holdings of all the IC carriers can be obtained. It is preferable to open them simultaneously with the opening and closing pins. When the IC retainer is open, place the IC on the IC carrier, and then separate the IC retainer opening / closing plate from the IC carrier.
The retainer returns to its original position, and the IC is held by the IC carrier. Then, by mounting the carrier tray and the support so that they can be positioned, the shoulder portions of the leads of a plurality of ICs can be brought into contact with the probe needles at the same time. IC
The carrier is preferably mounted on the carrier tray via an elastic member such as a spring.

Next, the operation of the present invention will be described. IC is IC
It can be handled while being held by the carrier, and in this state, the leads of the IC are not in electrical contact with anything. When this IC carrier is mounted on the probe needle support, the shoulder of the IC lead comes into contact with the probe needle. If the probe needle support is connected to the tester, the IC can be measured using the tester.

If a plurality of IC carriers are mounted on the carrier tray, and on the other hand, the same number of probe needle supports as the IC carriers are fixed to the support base, the carrier trays can be mounted on the support base so that a plurality of IC carriers can be mounted. The IC can be brought into contact with the probe needle at one time. In this case, the individual IC
And the positional relationship between the probe needle and the corresponding probe needle are determined by the positioning of each IC carrier and the corresponding probe needle support. Therefore, it is preferable that the IC carrier can be slightly moved with respect to the carrier tray, and the IC carrier is preferably mounted on the carrier tray via an elastic member such as a spring.

For example, when 20 IC carriers are mounted on the carrier tray, 20 ICs can be simultaneously brought into contact with the probe needle by mounting the carrier tray on the support base. If ICs are set in different carrier trays while measuring ICs using one carrier tray, a large number of ICs can be efficiently measured. I to be mounted on the carrier tray
The number of C carriers is not limited to 20 and can be any number.

The IC carrier according to the present invention includes an IC
Since there is no part which makes electrical contact with the leads of the above, no problem such as poor contact inside the conventional portable IC socket occurs, and the contact state with the lead changes for each portable IC socket. Such a problem does not occur. Further, the distance from the leads of the IC to the tester is shortened, and the number of electrical contact points between them is reduced.

Since the IC carrier and the carrier tray do not have expensive electric contact portions, even if the IC carrier or the carrier tray is broken or damaged, these can be replaced as consumables.

By the way, Japan Micronics Co., Ltd., one of the co-applicants of the present application, has filed a patent application for an invention related to the present invention as Japanese Patent Application No. 6-43369 (hereinafter referred to as the prior application). An invention is called a prior invention). This prior invention is common with the present invention in that the IC is set on the carrier, the carrier is mounted on the probe needle support, and the probe needle is brought into contact with the lead of the IC. However, in the embodiment of the prior invention, the probe needle is brought into contact with the vicinity of the tip of the IC lead, and the lead is supported by the lead retainer from the opposite side of the probe needle. In the present invention, since the probe needle is brought into contact with the shoulder portion of the lead, the lead pressing described above is unnecessary. As a result, the carrier can be made thin and the carrier transport mechanism can be made small.
Also, since the heat capacity of the carrier is small, the IC can be
When measuring, the time required to heat to a predetermined temperature is shortened. Further, since the lead retainer acting on the tip of the lead is not used, deformation of the tip of the lead can be prevented.

[0017]

1 is a perspective view of an IC carrier according to an embodiment of the present invention, and FIG. 2 is a plan view thereof. This IC carrier 10 is a QFP (quad flat).
It is designed to hold one package type IC, and has an approximately square shape. A square mounting surface 12 for mounting an IC on the center of the IC carrier 10.
Is formed so as to be slightly higher than the upper surface 13. There are four mold guides 14 around the mounting surface 12.
Is protruding upwards. Two lead guides 16 project higher than the mold guide 14 at diagonal positions on the mounting surface 12. Two IC retainers 18 are rotatably attached at different diagonal positions where the lead guide 16 does not exist. Four receiving seats 20 project from the upper surface 13 near the four corners of the IC carrier 10. A guide hole 22 (first guide means) is formed in two of the diagonally opposite receiving seats 20. A peripheral wall 24 is formed on the IC carrier 10, and two carrier guide pins 26 project upward at diagonal positions of the peripheral wall 24.

As shown in FIG.
When C28 is supplied from above, the mold portion of the IC 28 is guided by the mold guide 14, and the leads 30 at both ends of each side of the IC 28 are guided by the lead guide 16. As a result, the IC 28 can be properly positioned and placed on the mounting surface 12.

FIG. 3 is a sectional view showing the IC carrier 10 holding the IC 28 and the probe needle support 32 corresponding thereto. FIG. 3 is a sectional view corresponding to the section taken along line 3-3 of FIG. Therefore, the right side of the center line 34 is cut along a cutting plane parallel to one side of the square IC carrier, and the left side of the center line 34 is cut along a diagonal line of the IC carrier. Center line 34
The shape of the lead 30 of the IC 28 and the probe needle 36 of the probe needle support 32 is clearly shown on the right side of the line, and the shapes of the IC retainer 18 and the guide hole 22 are clearly shown on the left side of the center line 34. Has been done.

In FIG. 3, the IC carrier 10 is elastically attached to the carrier tray 38. The carrier tray 38 includes an upper plate 40, a lower plate 42 and a spacer 4 between them.
4 and the IC carrier 10 is arranged in the space between the upper plate 40 and the lower plate 42. As shown in an enlarged view in FIG. 6, a positioning hole 46 is formed in the upper plate 40 of the carrier tray 38, and the two carrier guide pins 26 of the IC carrier 10 are loosened in the positioning hole 46 (that is, somewhat). Has been inserted). The diameter of the carrier guide pin 26 is smaller than the inner diameter of the positioning hole 46 by about 1 mm. As a result, the IC carrier 10 can be moved by a minute distance in the horizontal plane.
The recesses 4 are provided on the back side of the four receiving seats 20 of the IC carrier 10.
8 is formed, and the upper end of the compression coil spring 50 is pressed into the inside of the recess 48. The lower end of the compression coil spring 50 is pressed against the lower plate 42 while being caught by the protrusion 52 formed on the lower plate 42. As a result, the IC carrier 10 is stationary with the upper end of the peripheral wall 24 elastically pressed against the lower surface of the upper plate 40.

In FIG. 6, the IC retainer 18 is rotatable around the shaft 53, and a clockwise rotational moment is given by the action of the torsion coil spring 54.
The upper end of the mold portion 56 of the IC 28 can be pressed by the right end of the C presser 18. Mold part 5 of IC28
The lower surface of 6 rests on the mounting surface 12. An opening / closing pin, which will be described later, can contact the left end of the IC retainer 18. The lower end of the right end of the IC retainer 18 is a stopper 58, and the stopper 58 is in contact with the upper surface 13 of the IC carrier 10. Therefore, the IC holder 18 does not press the mold portion 56 more than necessary.

FIG. 5 is a perspective view of the probe needle support 32 seen from the lower surface side. The square probe needle support 32 has four needle holders 66, and a large number of probe needles 36 are fixed to the needle holders 66 with an adhesive. The tips of these probe needles 36 are arranged at the same pitch as the leads so that they can contact the shoulders of the leads of the IC. The probe needle support 32 is fixed to the support base 60 as shown in FIG. The base end side of the probe needle 36 penetrates the probe needle support 32 and then emerges on the opposite side to be soldered to the wiring pattern 62 of the support base 60. The other terminal of the wiring pattern is connected to the tester. In FIG. 5, four columnar protrusions 63 are projected at four corners of the probe needle support 32, and guide pins 64 (second guide means) are further projected at two diagonal corners thereof. The tip of the guide pin 64 is curved. Protrusion 6
The tip of 3 is a flat surface.

The probe needle 36 has a crank shape with a chisel-shaped tip, and the entire area between the needle retainer 66 and the needle tip is exposed. If necessary, a specific small number (eg, 2) of these many probe needles 36
Can be directly connected to a ground (GND) line or a power supply line via a wide conductor. This makes it easy to pass a large current. Also, for a specific probe needle,
It is also possible to directly connect passive elements such as a capacitor and a resistor, and it is also possible to perform measurement with the IC brought close to the mounted state. This reduces the measurement error of the IC characteristics (particularly high frequency characteristics) in the mounted state. As described above, various kinds of connection work can be directly performed in the vicinity of the tip of the probe needle 36 because the IC carrier and the probe needle support are separate and the probe needle is exposed. This is because it is supported by the needle support.

Returning to FIG. 3, when the carrier tray 38 is raised while holding the IC 28, the tips of the two guide pins 64 of the probe needle support 32 are moved to the IC carrier 1
0 into the two guide holes 22 and the IC carrier 10
And the probe needle support 32 are positioned. When the carrier tray 38 is further raised, the probe needle support 3
The lower ends of the four protrusions 63 of 2 contact the upper ends of the four receiving seats 20 of the IC carrier 10, and the distance between the IC carrier 10 and the probe needle support 32 is set to a predetermined value. At this time, the probe needle 36 contacts the shoulder of the lead 30 of the IC 28. Even after that, the carrier tray 38 slightly rises, but the IC carrier 10 can descend with respect to the carrier tray 38 while compressing the compression coil spring 50.
Even if the height position of the support base 60 is fixed, the distance between the probe needle support 32 and the IC carrier 10 has a predetermined value determined by the contact between the protrusion 63 and the receiving seat 22. This distance is set to a value such that the probe needle 36 contacts the lead with a predetermined overdrive amount. Multiple I
Since the C carrier 10 is supported by the carrier tray 38 by the individual compression coil springs 50, the probe needle support 3
Even if there is variation in the needle tip height of the probe needle 36 between the two ICs, this variation is elastically absorbed, and each IC2
The probe needle 36 can be brought into uniform contact with the lead 30 of No. 8.

FIG. 4 is an enlarged front sectional view showing a state where the tip of the probe needle 36 is in contact with the lead 30 of the IC 28. The lower end of the mold portion 56 of the IC 28 rests on the mounting surface 12, and the side surface of the mold 56 is guided by the mold guide 14. The lead 30 of the QFP type IC 28 projects horizontally from the side surface of the mold portion 56 and then bends downward to form an inclined portion, and the tip is bent horizontally. Therefore, the lead 30
Is a horizontal shoulder portion 30a, a sloped portion 30b, and a horizontal tip portion 3
0c. Then, the needle tip of the probe needle 36 contacts the shoulder portion 30a. Although the shoulder portion 30a is not in contact with the mold guide 14, the shoulder portion 30a is strong and does not deform even if the probe needle 36 comes into contact with it. As described above, by bringing the probe needle 36 into contact with the shoulder portion 30a of the lead, a component for supporting the tip portion 30c of the lead 30 when the probe needle comes into contact is not necessary. Tip 30
When the probe needle 36 is brought into contact with c (from above or from below), a large bending moment acts on the lead 30, and the tip portion 30c of the lead is placed on the side opposite to the side where the probe needle comes into contact. Supporting parts are required.

FIG. 7 is a perspective view of the carrier tray 38. This carrier tray 38 has 4 rows × 5 columns, and a total of 20 IC carriers can be attached. The carrier tray 38 is composed of an upper plate 40, a lower plate 42 and a plurality of spacers 44, and has a hollow structure. The upper plate 40 has two guide holes 68 (fourth guide means) for positioning between the support base and the IC pressing opening / closing plate. Further, 20 openings 70 are formed in the upper plate 40 corresponding to each IC carrier, and two positioning holes 46 are formed in the vicinity of the diagonal of the openings 70. The carrier guide pin 26 (see FIG. 6) of the IC carrier is inserted into the positioning hole 46. As shown in FIG. 3, the IC retainer 18 and the receiving seat 20 of the IC carrier are exposed from the opening 70.

FIG. 8 is a perspective view of the support base 60 as seen from the lower surface side. A total of 20 probe needle supports 32 are fixed to this support base 60 in 4 rows × 5 columns. Each probe needle support 32 is fixed to the support base 60 by passing a screw through the two counterbore holes 33. 2 for support 60
There are individual guide pins 72 (fifth guide means), and these guide pins 72 are the two guide holes 6 of the carrier tray 38.
8 (see FIG. 7) enables positioning of the carrier tray 38 and the support base 60. Note that the positioning by this does not perform the positioning between the probe needle and the lead of the IC, but the guide pin 64 (see FIG. 3) of the probe needle support body is used for the IC carrier 10.
The positioning is performed to such an extent that the guide hole 22 can be inserted.

FIG. 9 is a perspective view of the IC pressing opening / closing plate 74 as seen from the lower surface side. This IC pressing opening / closing plate 74 has 4
A total of 20 openings 75 are formed in rows × 5 columns. Two protrusions 76 and two opening / closing pins 78 project near the diagonal of the opening 75. Guide pins 80 (third guide means) further project from the two protrusions 76, respectively. The tip of the protrusion 76 is a flat surface, and the guide pin 8
The tip of 0 is a curved surface. The roles of the protrusion 76 and the guide pin 80 are the same as the roles of the protrusion 63 and the guide pin 64 of the probe needle support shown in FIG. 3, and they function for positioning between the IC carrier and the IC pressing opening / closing plate 74. . That is, the guide pin 80 of the IC pressing opening / closing plate 74 enters the guide hole 22 of the IC carrier 10, and the projection 76 of the IC pressing opening / closing plate 74 is inserted into the receiving seat 2 of the IC carrier 10.
Touch 0. The two opening / closing pins 78 have a function of contacting the IC retainer 18 and opening the IC retainer 18. Further, the IC pressing opening / closing plate 74 has two guide pins 82.
(Sixth guide means) is fixed. By inserting the guide pin 82 into the guide hole 68 of the carrier tray 38 shown in FIG. 7, the carrier tray 38 can be positioned with respect to the IC pressing opening / closing plate 74. Note that the positioning by this does not perform the positioning of the opening / closing pin 80 and the IC retainer 18, but the positioning that allows the guide pin 80 to enter the guide hole 22 of the IC carrier 10. is there.

FIG. 10 is a sectional view showing the operation of opening the IC retainer and supplying the IC to the IC carrier. This FIG.
[Fig. 3] is a sectional view taken along a line 3-3 in Fig. 2 at a cutting position. In FIG. 10A, the carrier tray 38 is raised toward the IC pressing opening / closing plate 74. Then
First, the guide pin 82 (see FIG. 9) of the IC pressing opening / closing plate 74 is inserted into the guide hole 68 (see FIG. 7) of the carrier tray 38, and the carrier tray 38 is positioned with respect to the IC pressing opening / closing plate 74. . Then, the guide pin 80 of the IC pressing opening / closing plate 74 is inserted into the guide hole 22 of the IC carrier 10, and the IC carrier 10 is positioned with respect to the IC pressing opening / closing plate 74. Finally, the protrusion 76 of the IC pressing opening / closing plate 74 is formed into the receiving seat 2 of the IC carrier 10.
Touch 0. Even after that, the carrier tray 38 is slightly raised, but the IC carrier 10 is compressed by the compression coil spring 50.
Since it is lowered with respect to the carrier tray 38 while it is compressed, the distance between the IC pressing opening / closing plate 74 and the IC carrier 10 is fixed even if the height position of the IC pressing opening / closing plate 74 is fixed. It becomes a predetermined value determined by the contact of.

From the stage in which the guide pin 80 of the IC pressing opening / closing plate 74 enters the guide hole 22 of the IC carrier 10, the tip of the opening / closing pin 78 of the IC pressing opening / closing plate 74 contacts the rear end of the IC pressing member 18. , Push this down. As a result, as shown in FIG. 10 (B), the IC retainer 18 rotates, the tip of the IC retainer 18 rises, and an opening is formed between the two opposing IC retainers 18. In this manner, by pressing the carrier tray 38 against the IC pressing opening / closing plate 74, the IC pressing members 18 of all the IC carriers 10 mounted on the carrier tray 38 are simultaneously opened. In this state, the IC sucked by the vacuum suction pad 84
28 is inserted from the opening 70 of the IC pressing opening / closing plate 74 and placed on the mounting surface 12 of the IC carrier 10. Finally,
When the carrier tray 38 is lowered, the opening / closing pin 78 is I
The IC retainer 18 is separated from the C retainer 18 and is rotated to the original position by the action of the torsion coil spring, and the upper face of the mold portion of the IC 28 is retained by the IC retainer 18. In this way, the IC 28 is firmly held by the IC carrier 10, so that the IC 28 does not jump even while the carrier tray 38 is being transported.

FIG. 11 is an elevational view showing a measuring method using the IC measuring jig of the present invention. The carrier tray 38 carrying an empty IC carrier is conveyed from left to right on the guide rail 86 and stops at the IC supply station 88. The carrier tray 38 is lifted by the pusher 92 and pressed against the IC pressing opening / closing plate 74. As a result, the IC retainer 18 is opened by the opening / closing pin 78 as shown in FIG. In that state, the IC is supplied from the vacuum suction pad 84 to the IC carrier. When the pusher 92 is lowered to return the carrier tray 38 to the original height, the IC is held by the IC carrier by the IC retainer. Next, the carrier tray 38 is conveyed to the preheat station 94 in the constant temperature bath and heated to a predetermined temperature. Since the IC carrier and carrier tray used in the present invention are thin and have a small heat capacity, the IC can reach a predetermined temperature in a relatively short time. Next, the carrier tray 38 is transported to the measuring station 96 in the same constant temperature bath. Here, the carrier tray 38 is lifted by the pusher 100 and pressed against the support base 60. As a result, as shown in FIG.
The needle tip of the probe needle 36 comes into contact with the shoulder portion 30a of the lead 30 of FIG. In this state, the tester 102 measures the IC. When the measurement is completed, the carrier tray 38 is returned to the original height and then carried out. In this way, if the carrier trays 38 are flushed one after another, many ICs can be efficiently measured.

[0032]

EFFECTS OF THE INVENTION The present invention has the following effects by having the above-mentioned configuration.

(1) The IC can be handled while being held by the IC carrier, which facilitates handling during measurement.

(2) By mounting a plurality of IC carriers on the carrier tray, a plurality of ICs can be brought into contact with the probe needles at the same time.

(3) Since the IC carrier does not have a portion that makes electrical contact with the leads of the IC, no electrical contact failure occurs inside the IC carrier, and the state of contact with the leads for each IC carrier does not occur. There is no changing problem.

(4) Since there is no electrical path inside the IC carrier, the distance from the IC lead to the tester becomes short during the measurement of the IC, and the distance between the IC lead and the tester becomes short. There are also fewer electrical contacts.

(5) Since the IC carrier and the carrier tray do not have expensive electric contact portions, even if the IC carrier or the carrier tray is broken or damaged, these can be replaced as consumable items.

(6) Since the probe needle is brought into contact with the shoulder portion of the IC lead, it is not necessary to hold the lead. As a result, the IC carrier can be made thin, so that the carrying mechanism can be made small and the time required to heat the IC to a predetermined temperature can be shortened when the IC is measured in a high temperature state. Further, since the lead retainer acting on the tip of the lead is not used, deformation of the tip of the lead can be prevented.

(7) A large current is directly grounded from the vicinity of the tip of the probe needle by directly connecting the vicinity of the tip of the probe needle to a ground line or a power supply line, or by connecting through a passive element. It is possible to escape to a line or a power supply line, and particularly to measure an IC in a state close to a mounted state in high frequency measurement.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC carrier according to an embodiment of the present invention.

FIG. 2 is a plan view of the IC carrier of FIG.

FIG. 3 is a sectional view taken along line 3-3 of FIG. 2;

FIG. 4 is an enlarged front sectional view showing a contact state of a probe needle.

FIG. 5 is a perspective view of the probe needle support seen from the lower surface side.

FIG. 6 is an enlarged front sectional view of a part of the IC carrier.

FIG. 7 is a perspective view of a carrier tray.

FIG. 8 is a perspective view of the support base seen from the lower surface side.

FIG. 9 is a perspective view of the IC pressing opening / closing plate as viewed from the lower surface side.

FIG. 10 is a front sectional view showing an operation of supplying an IC to an IC carrier.

FIG. 11 is an elevational view showing a measuring method using the IC measuring jig of the present invention.

[Explanation of symbols]

 10 IC carrier 18 IC retainer 22 Guide hole (first guide means) 26 Carrier guide pin 28 IC 30 Lead 32 Probe needle support 36 Probe needle 38 Carrier tray 46 Positioning hole 50 Compression coil spring 54 Torsion coil spring 60 Support base 64 Guide Pin (second guide means) 68 Guide hole (fourth guide means) 72 Guide pin (fifth guide means) 74 IC pressing opening / closing plate 78 Opening / closing pin 80 Guide pin (third guide means) 82 Guide pin (sixth guide means) )

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Echi Osato 2-6-8 Honcho, Kichijoji City, Musashino City, Tokyo Japan Micronics Co., Ltd.

Claims (10)

[Claims] 1. An IC carrier capable of detachably holding an IC having a plurality of leads by means of an IC retainer, and a probe needle support for supporting a plurality of probe needles arranged corresponding to the arrangement of the leads in an exposed state. And an opening / closing pin capable of opening and closing the IC holder by contacting the IC holder of the IC carrier,
An IC measuring jig, characterized in that a shoulder portion of the lead is brought into contact with the probe needle by mounting a C carrier on the probe needle support in a positionable manner. 2. The IC measurement jig according to claim 1, wherein the probe needle support is provided with probe needles capable of contacting respective shoulder portions of leads protruding from four side surfaces of the flat package IC. Ingredient 3. A plurality of said IC carriers are mounted on one carrier tray, a plurality of said probe needle supports are fixed to one support base, and a plurality of opening / closing pins are fixed to one IC pressing opening / closing plate, By mounting the carrier tray so that it can be positioned with respect to the IC pressing opening / closing plate, the opening / closing pin can be brought into contact with the IC pressing, and by mounting the carrier tray so that it can be positioned with respect to the support base, the probe 2. The IC measuring jig according to claim 1, wherein the needle can be brought into contact with the shoulder portion of the lead of the IC. 4. The IC measuring jig according to claim 3, wherein the IC carrier is mounted on a carrier tray via an elastic member. 5. The IC retainer is rotatably attached to the IC carrier, and one end side of a rotation fulcrum is an IC.
7. The mold part can be pressed, the other end side can contact the opening / closing pin, and a rotational moment in a direction of pressing the IC is applied to the IC pressing by an elastic member. 3. IC measuring jig described in 3. 6. The IC measuring jig according to claim 5, wherein the IC carrier is provided with two facing IC retainers. 7. The IC measuring jig according to claim 6, wherein the two IC holders can hold two corner portions of the flat package IC which are diagonally located. 8. The IC carrier has first guide means, the probe needle support has second guide means, and the IC pressing opening / closing plate has third guide means.
By engaging the first guide means and the second guide means, the IC carrier can be positioned with respect to the probe needle support, and by engaging the first guide means and the third guide means, the IC carrier opening / closing plate for holding the IC carrier 4. The I according to claim 3, wherein the pin can be positioned with respect to the opening / closing pin.
C measurement jig. 9. The carrier tray has a fourth guide means, and the support base has a fifth guide means.
The C-holding opening / closing plate has a sixth guide means, and by engaging the fourth guide means and the fifth guide means, the carrier tray can be positioned with respect to the support base, and the fourth guide means and the sixth guide means are engaged. 9. The IC measuring jig according to claim 8, wherein the carrier tray can be positioned with respect to the IC pressing opening / closing plate by combining them. 10. An IC measuring method comprising the following steps. (A) A step of transporting one carrier tray carrying a plurality of IC carriers to an IC supply station provided with an IC pressing opening / closing plate. (B) A step of pressing the carrier tray against the IC pressing opening / closing plate to bring the opening / closing pin of the IC pressing into contact with the IC pressing of the IC carrier to open the IC pressing against the elastic member. (C) A step of mounting an IC having a plurality of leads on each of the IC carriers. (D) By separating the carrier tray from the IC pressing opening / closing plate, the opening / closing pin of the IC pressing is moved to the IC.
The step of holding the IC on the IC carrier by the IC pressing by the action of the elastic member, apart from the IC pressing of the carrier. (E) A plurality of I's are installed in the measurement station, which is provided with a support base having a probe needle support body that supports a plurality of probe needles arranged corresponding to the arrangement of the leads in an exposed state.
Transporting the carrier tray holding C. (F) Pressing the carrier tray against the support to bring the probe needle into contact with the shoulder of the lead of the IC.