JPH0983090A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPH0983090A JPH0983090A JP23995695A JP23995695A JPH0983090A JP H0983090 A JPH0983090 A JP H0983090A JP 23995695 A JP23995695 A JP 23995695A JP 23995695 A JP23995695 A JP 23995695A JP H0983090 A JPH0983090 A JP H0983090A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic component
- external electrode
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Ceramic Capacitors (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品に関し、
詳しくはセラミック電子部品に関するものである。TECHNICAL FIELD The present invention relates to an electronic component,
Specifically, it relates to a ceramic electronic component.
【０００２】[0002]
【従来の技術】従来の電子部品を、図４，図５を用いて
説明する。図４に示すように、従来の電子部品３は、セ
ラミックからなる基板３１と、基板３１の側面に形成さ
れた凹部３３と、凹部３３に形成された外部電極３２
と、基板３１の表面に形成された配線パターン（図示せ
ず）とから構成される。また、図５に示すように、他の
従来の電子部品４は、セラミックからなる基板４１と、
基板４１の側面に形成された凹部４３と、凹部４３の壁
面に形成された外部電極４２と、基板４１の表面に形成
された配線パターン（図示せず）とから構成される。2. Description of the Related Art A conventional electronic component will be described with reference to FIGS. As shown in FIG. 4, the conventional electronic component 3 includes a substrate 31 made of ceramic, a recess 33 formed on a side surface of the substrate 31, and an external electrode 32 formed in the recess 33.
And a wiring pattern (not shown) formed on the surface of the substrate 31. Further, as shown in FIG. 5, another conventional electronic component 4 includes a substrate 41 made of ceramic,
It is composed of a recess 43 formed on the side surface of the substrate 41, an external electrode 42 formed on the wall surface of the recess 43, and a wiring pattern (not shown) formed on the surface of the substrate 41.
【０００３】なお、電子部品３の外部電極３２は、基板
側面の凹部３３に導電体が充填されて形成されており、
電子部品４の外部電極４２は、凹部４３の壁面にメッキ
により形成されている。The external electrode 32 of the electronic component 3 is formed by filling the recess 33 on the side surface of the substrate with a conductor.
The external electrode 42 of the electronic component 4 is formed on the wall surface of the recess 43 by plating.
【０００４】上記従来の電子部品３，４の製造方法は特
に図示しないが、セラミック材料からなる複数のグリー
ンシートに、電子部品３の場合はビアホール，電子部品
４の場合はスルーホールを形成し、配線パターンを形成
した後、グリーンシートを積み重ね圧着し、ビアホー
ル，スルーホールが露出するようにグリーンシートを切
断する。なお、電子部品３を製造する際は、予めビアホ
ールに導電ペーストを印刷などの方法により充填してお
く。そして、切断された各部品を、焼成して電子部品
３，４が製造される。Although not shown in the drawings, the conventional method for manufacturing the electronic parts 3 and 4 is to form via holes in the case of the electronic parts 3 and through holes in the case of the electronic parts 4 on a plurality of green sheets made of a ceramic material. After forming the wiring pattern, the green sheets are stacked and pressure-bonded, and the green sheets are cut so that the via holes and the through holes are exposed. When the electronic component 3 is manufactured, the via hole is previously filled with a conductive paste by a method such as printing. Then, the cut components are fired to manufacture the electronic components 3 and 4.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
電子部品３，４においては、電子部品３，４を実装する
プリント基板（図示せず）に、外部電極３２，４２をは
んだ付けして固定している。このとき、電子部品３，４
の底面とプリント基板は接しているため、プリント基板
に撓みが生じると、撓みによる応力が電子部品３，４に
直接伝わるため、電子部品３，４にクラック等が生じる
という問題があった。また、電子部品３，４の基板側面
に形成される外部電極３２，４２は、電極強度を保証す
るために電極面積を大きくする必要があり、そのため、
形成できる外部電極の数に制限があった。However, in the conventional electronic components 3 and 4, the external electrodes 32 and 42 are soldered and fixed to the printed circuit board (not shown) on which the electronic components 3 and 4 are mounted. ing. At this time, electronic parts 3, 4
Since the bottom surface of the printed circuit board and the printed circuit board are in contact with each other, when the printed circuit board is bent, the stress due to the bending is directly transmitted to the electronic components 3 and 4, so that there is a problem that the electronic components 3 and 4 are cracked. Further, the external electrodes 32 and 42 formed on the side surfaces of the substrates of the electronic components 3 and 4 need to have a large electrode area in order to guarantee the electrode strength.
There is a limit to the number of external electrodes that can be formed.
【０００６】従って、本発明の目的は、撓み強度を向上
し、外部電極の数を増加することができる電子部品を提
供することにある。Therefore, an object of the present invention is to provide an electronic component which can improve the flexural strength and increase the number of external electrodes.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の電子部品においては、セラミックからなる
基板と、該基板の側面または底面の少なくともいずれか
に、前記基板の底面側で基板から突出して形成された外
部電極とから構成されることを特徴としている。In order to achieve the above object, in an electronic component of the present invention, a substrate made of ceramic and at least one of a side surface and a bottom surface of the substrate is provided on the bottom surface side of the substrate. And an external electrode formed so as to project from the external electrode.
【０００８】また、前記外部電極の内、前記基板の底面
に形成された外部電極は、基板の内部から底面側に向か
って延び、底面側で基板から突出して形成されることを
特徴としている。Further, among the external electrodes, the external electrode formed on the bottom surface of the substrate is formed so as to extend from the inside of the substrate toward the bottom surface side and project from the substrate on the bottom surface side.
【０００９】さらに、前記外部電極は、前記電子部品の
製造工程の一つである焼成工程における、前記基板の収
縮率より収縮率が小さいことを利用して形成されること
を特徴としている。Further, the external electrode is formed by utilizing the fact that the shrinkage rate is smaller than the shrinkage rate of the substrate in the firing step which is one of the manufacturing steps of the electronic component.
【００１０】これにより、電子部品を実装するプリント
基板の撓みによる応力の影響が、突出した外部電極によ
り緩衝され、撓み強度が向上する。As a result, the influence of the stress due to the bending of the printed circuit board on which the electronic component is mounted is buffered by the protruding external electrodes, and the bending strength is improved.
【００１１】また、底面に突出して形成された外部電極
が、基板内部から伸びている場合、電極強度が向上する
ため、外部電極の直径を細くすることができ、外部電極
が基板底面に占める面積が小さくなり、よって、外部電
極の数を増加させることができる。Further, when the external electrode formed so as to project from the bottom surface extends from the inside of the substrate, the electrode strength is improved, so that the diameter of the external electrode can be reduced, and the area occupied by the external electrode on the bottom surface of the substrate is improved. Is smaller, and thus the number of external electrodes can be increased.
【００１２】さらに、基板と外部電極の収縮率の差を利
用して外部電極を突出させる場合、外部電極の突出する
部分を別工程で成形する手間が省ける。Further, when the external electrode is projected by utilizing the difference in contraction rate between the substrate and the external electrode, it is possible to save the labor of molding the projecting portion of the external electrode in a separate process.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態を図
１，図２を用いて詳細に説明する。図１において、電子
部品１は、セラミックからなる基板１１と、基板１１の
側面に形成された凹部１３と、凹部１３に形成された外
部電極１２と、基板１１の表面に形成された配線パター
ン（図示せず）とから構成される。このとき、外部電極
１２は、図１に示すように、基板１１の底面側で基板１
１より突出して形成される。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to FIGS. In FIG. 1, the electronic component 1 includes a substrate 11 made of ceramic, a recess 13 formed in a side surface of the substrate 11, an external electrode 12 formed in the recess 13, and a wiring pattern formed on the surface of the substrate 11 ( (Not shown). At this time, the external electrode 12 is disposed on the bottom surface side of the substrate 11 as shown in FIG.
1 is formed so as to project.
【００１４】また、図２において、電子部品２は、セラ
ミックからなる基板２１と、基板２１の底面形成された
外部電極２２と、基板２１の表面に形成された配線パタ
ーン（図示せず）とから構成される。このとき、外部電
極２２は、図２（ｂ）に示すように、基板２１の内部か
ら底面側に向かって延び、底面で突出して形成されてい
る。In FIG. 2, the electronic component 2 comprises a substrate 21 made of ceramic, an external electrode 22 formed on the bottom surface of the substrate 21, and a wiring pattern (not shown) formed on the surface of the substrate 21. Composed. At this time, as shown in FIG. 2B, the external electrode 22 is formed so as to extend from the inside of the substrate 21 toward the bottom surface and project at the bottom surface.
【００１５】次に、本発明の電子部品の製造方法につい
て、図３を用いて説明する。なお、電子部品として、側
面および底面に外部電極を有するものを対象として説明
を行う。Next, a method of manufacturing the electronic component of the present invention will be described with reference to FIG. It should be noted that the electronic component will be described as an electronic component having an external electrode on the side surface and the bottom surface.
【００１６】図３（ａ）に示すように、セラミック材料
からなる複数のグリーンシート５１ａ，５１ｂを準備す
る。このうち、グリーンシート５１ｂには、底面に形成
される外部電極のための円形状のビアホール５２ａ、お
よび、側面に形成される外部電極のための長方形状のビ
アホール５２ｂが形成されており、ビアホール５２ａ，
５２ｂには、導電ペーストが印刷などの方法により充填
されている。また、グリーンシート５１ａは電子部品の
上面に位置するもので、グリーンシート５１ａの表面に
はビアホールは形成されず、配線パターン（図示せず）
が形成される。そして、グリーンシート５１ａ，５１ｂ
を積み重ね、図３（ｂ）に示す一点鎖線部で切断し、切
断された各ブロック５３を焼成して、図３（ｃ）に示す
電子部品５０が製造される。このとき外部電極が基板よ
り底面側に突出するには、焼成による導電ペーストの収
縮率がグリーンシートの収縮率より小さければよい。導
電ペーストの収縮率の制御は、例えば、導電ペーストに
用いる金属粒子の含有量を増減させたり、導電ペースト
に添加剤を加えることにより行われる。また、別の方法
として、ビアホールに充填する導電ペーストの充填量の
調節、すなわち、ビアホールへ導電ペーストを印刷する
回数を調節して、ビアホール内の導電ペーストの充填密
度を変化させ、焼成による導電ペーストの収縮の度合を
調節することもできる。As shown in FIG. 3 (a), a plurality of green sheets 51a and 51b made of a ceramic material are prepared. Of these, the green sheet 51b is provided with a circular via hole 52a for the external electrode formed on the bottom surface and a rectangular via hole 52b for the external electrode formed on the side surface. ，
52b is filled with a conductive paste by a method such as printing. Further, the green sheet 51a is located on the upper surface of the electronic component, a via hole is not formed on the surface of the green sheet 51a, and a wiring pattern (not shown) is formed.
Is formed. Then, the green sheets 51a and 51b
Are stacked, cut along the dashed-dotted line portion shown in FIG. 3B, and the cut blocks 53 are fired to manufacture the electronic component 50 shown in FIG. 3C. At this time, in order for the external electrodes to protrude from the substrate to the bottom surface side, the shrinkage rate of the conductive paste due to firing may be smaller than the shrinkage rate of the green sheet. The contraction rate of the conductive paste is controlled, for example, by increasing or decreasing the content of metal particles used in the conductive paste or adding an additive to the conductive paste. As another method, adjustment of the filling amount of the conductive paste to be filled in the via hole, that is, the number of times the conductive paste is printed in the via hole is adjusted to change the filling density of the conductive paste in the via hole, and the conductive paste is baked. The degree of contraction can be adjusted.
【００１７】このように形成された電子部品を、プリン
ト基板上に実装した際の、撓み強度の上昇を実験により
確認した。実験方法は、１０ｃｍ平方のプリント基板中
央部に、側面に８ヶ所外部電極を有する８×５×２ｍｍ
の電子部品をはんだ付けにより搭載し、プリント基板の
中央部裏側から圧力を加えてプリント基板を撓ませる。
そして、はんだ付け部が破損したり、電子部品にクラッ
クが生じるまでの、プリント基板が裏面から表面方向に
撓んだ長さを測定する。このとき、プリント基板を撓ま
せた長さが大きい程、電子部品に加わるプリント基板の
撓みによる応力も大きくなり、はんだ付け部が破損した
り、電子部品にクラックが生じるまでにプリント基板を
撓ませた長さは、電子部品に加えられた応力と対応す
る。このため、プリント基板の撓んだ長さが大きくなる
ほど、電子部品の撓み強度が大きいことを表す。実験の
結果を表１に示す。また、参考に、外部電極が基板の底
面側に突出している長さを併記し、従来の電子部品の撓
み強度についての実験結果も記した。An experiment confirmed that the bending strength of the electronic component thus formed was increased when the electronic component was mounted on a printed circuit board. The test method is 8 × 5 × 2 mm with 8 external electrodes on the side surface in the center of the printed circuit board of 10 cm square.
The electronic components of (3) are mounted by soldering, and pressure is applied from the back side of the central portion of the printed circuit board to bend the printed circuit board.
Then, the length of the printed circuit board bent from the back surface to the surface direction is measured until the soldered portion is damaged or the electronic component is cracked. At this time, the larger the bent length of the printed circuit board is, the larger the stress due to the bending of the printed circuit board applied to the electronic component is, so that the printed circuit board is bent before the soldered portion is damaged or the electronic component is cracked. The length corresponding to the stress applied to the electronic component. For this reason, the greater the bending length of the printed circuit board, the greater the bending strength of the electronic component. The results of the experiment are shown in Table 1. Further, for reference, the length of the external electrode protruding to the bottom surface side of the substrate is also shown, and the experimental results on the bending strength of the conventional electronic component are also shown.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表１に示すように試料Ｎｏ．１の従来品の
撓み強度に比べて試料Ｎｏ．２からＮｏ．６すべて撓み
強度が向上している。但し、突出する長さが５００μｍ
を超えると、導電ペーストとグリーンシートの焼成によ
る収縮率が大きく異なるため、外部電極とセラミック基
板の境界面にクラックが生じやすくなり実用的ではな
い。As shown in Table 1, the sample No. Compared with the bending strength of the conventional product of No. 1, sample No. 2 to No. 2 6 All flexing strength is improved. However, the protruding length is 500 μm
If it exceeds, the contraction rate due to firing of the conductive paste and the green sheet greatly differs, and cracks are likely to occur at the interface between the external electrode and the ceramic substrate, which is not practical.
【００２０】このように、外部電極を基板の底面側で底
面から突出させることにより、電子部品の撓み強度が向
上し、突出する長さが大きくなるほど撓み強度も大きく
なる。By thus projecting the external electrodes from the bottom surface of the substrate, the bending strength of the electronic component is improved, and the bending strength increases as the protruding length increases.
【００２１】なお、本発明に係る電子部品は前記実施の
形態に限定するものでなく、電極に用いる金属は銅、銀
など用途に応じて種々変更できる。The electronic component according to the present invention is not limited to the above embodiment, and the metal used for the electrode can be variously changed according to the application such as copper and silver.
【００２２】[0022]
【発明の効果】以上のように、本発明による電子部品で
は、電子部品を実装するプリント基板の撓みによる応力
の影響が、実装面である電子部品の底面側で、底面から
突出した外部電極により緩衝され、電子部品の撓み強度
が向上する。As described above, in the electronic component according to the present invention, the influence of the stress due to the bending of the printed circuit board on which the electronic component is mounted is influenced by the external electrodes protruding from the bottom surface of the electronic component, which is the mounting surface. It is buffered and the bending strength of the electronic component is improved.
【００２３】また、底面に突出して形成された外部電極
が、基板内部から伸びている場合、電極強度が向上し、
その分外部電極の直径を細くすることができ、電極が基
板底面に占める面積が小さくなり、よって、外部電極の
数を増加させることができる。When the external electrode formed on the bottom surface is extended from the inside of the substrate, the electrode strength is improved,
The diameter of the external electrodes can be reduced accordingly, and the area occupied by the electrodes on the bottom surface of the substrate can be reduced, so that the number of external electrodes can be increased.
【００２４】さらに、基板と外部電極の収縮率の差を利
用して外部電極を突出させる場合、外部電極の突出する
部分を別工程で成形する手間が省ける。Furthermore, when the external electrode is projected by utilizing the difference in contraction rate between the substrate and the external electrode, it is possible to save the labor of molding the projecting portion of the external electrode in a separate process.
【図１】本発明の一つの実施形態に係る電子部品の構造
を示す、（ａ）は斜視図であり、（ｂ）はＡ−Ａ線断面
図である。FIG. 1 is a perspective view showing a structure of an electronic component according to an embodiment of the present invention, and FIG.
【図２】本発明の他の実施形態に係る電子部品の構造を
示す（ａ）は斜視図であり、（ｂ）はＢ−Ｂ線断面図で
ある。FIG. 2A is a perspective view showing a structure of an electronic component according to another embodiment of the present invention, and FIG. 2B is a sectional view taken along line BB.
【図３】本発明の電子部品の製造方法を示す説明図であ
る。FIG. 3 is an explanatory diagram showing a method for manufacturing an electronic component of the present invention.
【図４】従来の電子部品の一つの例の構造を示す、
（ａ）は斜視図であり、（ｂ）はＣ−Ｃ線断面図であ
る。FIG. 4 shows a structure of one example of a conventional electronic component,
(A) is a perspective view, (b) is CC sectional view taken on the line.
【図５】従来の電子部品の他の例の構造を示す、（ａ）
は斜視図であり、（ｂ）はＤ−Ｄ線断面図である。FIG. 5 shows a structure of another example of a conventional electronic component, (a)
Is a perspective view, and (b) is a cross-sectional view taken along the line D-D.
１、２、５０ 電子部品 １１、２１ 基板 １２、２２ 外部電極 1, 2, 50 Electronic parts 11, 21 Substrate 12, 22 External electrode
Claims (3)
面または底面の少なくともいずれかに、前記基板の底面
側で基板から突出して形成された外部電極とから構成さ
れることを特徴とする電子部品。1. An electronic component comprising a ceramic substrate and an external electrode formed on at least one of a side surface and a bottom surface of the substrate so as to project from the substrate on the bottom surface side of the substrate. .
成された外部電極は、基板の内部から底面側に向かって
延び、底面側で基板から突出して形成されることを特徴
とする請求項１に記載の電子部品。2. The external electrode formed on the bottom surface of the substrate among the external electrodes is formed to extend from the inside of the substrate toward the bottom surface side and project from the substrate on the bottom surface side. Item 1. The electronic component according to Item 1.
程の一つである焼成工程における、前記基板の収縮率よ
り収縮率が小さいことを利用して形成されることを特徴
とする請求項１記載の電子部品。3. The external electrode is formed by utilizing the fact that the shrinkage rate is smaller than the shrinkage rate of the substrate in the firing step which is one of the manufacturing steps of the electronic component. The electronic component described in 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23995695A JPH0983090A (en) | 1995-09-19 | 1995-09-19 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23995695A JPH0983090A (en) | 1995-09-19 | 1995-09-19 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0983090A true JPH0983090A (en) | 1997-03-28 |
Family
ID=17052337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23995695A Pending JPH0983090A (en) | 1995-09-19 | 1995-09-19 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0983090A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005034592A1 (en) * | 2003-10-06 | 2005-04-14 | Sanyo Electric Co., Ltd. | Multilayer ceramic substrate and its manufacturing method |
| US7820916B2 (en) | 2004-09-08 | 2010-10-26 | Murata Manufacturing Co., Ltd. | Composite ceramic substrate |
-
1995
- 1995-09-19 JP JP23995695A patent/JPH0983090A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005034592A1 (en) * | 2003-10-06 | 2005-04-14 | Sanyo Electric Co., Ltd. | Multilayer ceramic substrate and its manufacturing method |
| US7440256B2 (en) | 2003-10-06 | 2008-10-21 | Sanyo Electric Co., Ltd. | Laminated ceramic substrate and manufacturing method therefor |
| US7820916B2 (en) | 2004-09-08 | 2010-10-26 | Murata Manufacturing Co., Ltd. | Composite ceramic substrate |
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