JPH098432A - High-frequency circuit device - Google Patents

Abstract

(57) [Abstract] [Purpose] In a high frequency circuit device, it is possible to prevent heat from being accumulated in an electronic component during operation and to operate the electronic component in a stable state. [Structure] Between the dielectric substrate (1) and the metal carrier (2), the dielectric substrate (1) has a large thermal conductivity and a large thickness.
Or a metal plate (1) that is sufficiently thinner than the metal carrier (2)
By inserting 0) and mounting an electronic component that generates a large amount of heat thereon, the heat generated in the electronic component during operation diffuses rapidly over a wide range along the inserted metal plate (10).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency circuit device, and is particularly applicable to a device using an electronic part which generates a large amount of heat.

[0002]

2. Description of the Related Art FIG. 17 shows a structure of a conventional high-frequency circuit device. In the figure, 1 is a dielectric substrate having a matching circuit, a bias circuit, etc. on the front surface, and a grounding conductor on the back surface, and 2 is A metal carrier 3 for fixing the dielectric substrate 1 via a grounding conductor is a lead for connecting the high-frequency circuit device and an external circuit.

FIG. 18 is a detailed view of the amplifier on the surface of this high-frequency circuit device. In the figure, 4 is a microstrip line on the dielectric substrate 1, 5 is a surface-mounted electronic component with large heat generation, and 6 is It is a conductive wire that connects the microstrip line 4 and the surface-mounted electronic component 5.
19 is a sectional view of FIG.

In FIG. 17, a matching circuit, a bias circuit, etc. are installed on the surface of the dielectric substrate 1, and the amplifier section is configured to amplify a high frequency signal. The metal carrier 2 is a grounding conductor on the back surface of the dielectric substrate 1,
It is adhered by solder or a conductive adhesive. The metal carrier 2 is fixed to the external ground conductor portion by a conductive screw, solder or a conductive adhesive depending on the application. As a result, the ground plane potential is supplied to the grounding conductor on the back surface of the dielectric substrate 1.

In the amplifier section, as shown in FIG.
The surface mount type electronic component 5 is adhered to the metal carrier 2 by solder or a conductive adhesive through a hole formed in the dielectric substrate 1. The electrode portion of the surface mount type electronic component and the dielectric substrate 1 are What is the microstrip line 4 of
It is connected by a conductive wire 6.

[0006]

The conventional high-frequency circuit device is constructed as described above, and the dielectric substrate 1 and the metallic carrier 2 are bonded by solder or a conductive adhesive. Especially when bonding by soldering, the dielectric substrate 1
The metal carrier 2 and the metal carrier 2 are in a high temperature state of 100 [° C.] or more. At this time, if there is an excessive difference in the coefficient of thermal expansion between the dielectric substrate 1 and the metal carrier 2, the dielectric substrate 1 is damaged. There is a risk that

For this reason, it is necessary to select the material of the metallic carrier 2 from a material having a coefficient of thermal expansion close to that of the dielectric substrate 1, but in this case, there is a case where a material having a small thermal conductivity must be selected. However, in this way, as diffusion of heat generated in the surface-mounted electronic component 5 during operation of the high-frequency circuit device, the horizontal direction is as shown by AR1 in FIG. 20, and the downward direction is as shown by AR2 in FIG. Also stops in a narrow range.

In FIGS. 20 and 21, AR1
Is an area where the heat generated by the electronic component diffuses laterally on the metallic carrier 2 in a unit time t, and AR2 indicates that the heat generated by the electronic component diffuses downward on the metallic carrier 2 in a unit time t. It is an area to do. As a result, heat is accumulated in the surface-mounted electronic component 5, which may adversely affect the operation of the surface-mounted electronic component 5.

The present invention has been made in order to solve the above-mentioned problems, and it is possible to prevent heat from being accumulated in the electronic parts during operation and to operate the electronic parts in a stable state. It is an object to provide a circuit device.

[0010]

A high frequency circuit device according to the present invention has a matching circuit, a bias circuit, etc. arranged on the surface thereof.
Dielectric board with grounding conductor on the back side, electronic parts with large heat generation in the opening or notch formed in the dielectric board, and fixing the dielectric board through the grounding conductor A metal carrier to be provided, and a metal plate that is interposed between the dielectric substrate and the metal carrier and has a large thermal conductivity and a thickness that is sufficiently thin compared to the dielectric substrate and the metal carrier, Electronic components are mounted on a metal plate.

A high frequency circuit device according to the next invention is
Equipped with a metal pedestal according to the shape of the electronic component, if the thickness of the electronic component is thinner than the thickness of the dielectric substrate, place the metal pedestal on the metal plate and mount the electronic component on the metal pedestal To do.

A high frequency circuit device according to the next invention is
A plurality of electronic components are mounted on a metal carrier or through a metal pedestal in the opening or notch of the dielectric substrate.

[0013]

Function: A metal plate having a large thermal conductivity and a thickness sufficiently smaller than that of the dielectric substrate or the metal carrier is inserted between the dielectric substrate and the metal carrier, and an electron having a large heat generation is placed on the metal plate. By mounting the components, the heat generated by the electronic components during operation diffuses rapidly along a wide area along the inserted metal plate. Thus, it is possible to prevent heat from being accumulated in the electronic component and to operate it in a stable state.

Further, when the thickness of the electronic component is thinner than the thickness of the dielectric substrate, a metal pedestal is placed on a metal plate, and the electronic component is mounted on the metal pedestal, so that the electronic component during operation is mounted. The heat generated by the heat diffuses widely and rapidly along the metal plate inserted through the metal pedestal. Thus, it is possible to prevent heat from being accumulated in the electronic component and to operate it in a stable state.

Furthermore, by mounting a plurality of electronic components on the metal carrier or through the metal pedestal in the opening or the notch of the dielectric substrate, the heat generated by the plurality of electronic components during operation is generated by the metal. It diffuses extensively and rapidly, either through the pedestal or along a metal plate inserted directly. Thus, it is possible to prevent heat from accumulating in the plurality of electronic components and to operate the electronic components in a stable state.

[0016]

Embodiments of the present invention will be described in detail below with reference to the drawings.

Embodiment 1. FIG. 1 in which parts corresponding to those in FIG. 17 are designated by the same reference numerals shows the first embodiment of the high-frequency circuit device according to the present invention as a whole. In the case of Example 1, the dielectric substrate 1 and the metallic carrier 2 have a large thermal conductivity between the dielectric substrate 1 and the metallic carrier 2.
17 is different from the conventional one described above in that the surface-mounted electronic component 5 is mounted on the metal plate 10 which is sufficiently thinner than that of FIG. Further, FIG. 2 in which parts corresponding to those in FIG. 18 are designated by the same reference numerals shows details around the amplifier section when the metal plate 10 is inserted, and FIG. 3 in which parts corresponding to those in FIG. 2 shows a cross section.

Next, the operation will be described. The diffusion of heat generated in the surface-mounted electronic component 5 during operation of the high-frequency circuit device is low because the thickness of the metal plate 10 in the downward direction is sufficiently smaller than that of the dielectric substrate 1 and the metal carrier 2. Although there is not much difference from the case of, the thermal conductivity of the metal plate 10 is large in the case of the lateral direction, so that the metal plate 10 diffuses widely and rapidly along the metal plate 10 as shown by AR10 in FIG. AR
10 indicates that the heat generated by the electronic component is the metal plate 10 per unit time t.
Is an area that spreads in the horizontal direction.

As a result, the surface mount type electronic component 5 is prevented from retaining heat, and the surface mount type electronic component 5 can continue to operate in a stable state. Further, since the metal plate 10 is sufficiently thinner than the dielectric substrate 1 and the metal carrier 2, the coefficient of thermal expansion of the metal plate 10 is the same as that of the dielectric substrate 1 and the metal carrier 2. Even if there is a difference, there is almost no effect, and the dielectric substrate 1 is not damaged during bonding.

Example 2. In the first embodiment, the case where the surface mount type electronic component is directly adhered to the metal carrier has been described. However, when the height of the surface mount type electronic component is low, the surface mount type electronic component is adjusted for height adjustment. A metal pedestal with high thermal conductivity may be provided below. Even in this case, the present invention is effective. This is shown as a second embodiment in FIG. 5, in which parts corresponding to those in FIG. The second embodiment differs from the first embodiment in that the surface mount electronic component 12 having a low height and the metal pedestal 13 having a large thermal conductivity are provided. A cross section of the second embodiment is shown in FIG.

In this case, since the heat generated in the surface mount type electronic component 12 during the operation of the high frequency circuit device has a large thermal conductivity of the metal pedestal 13, the metal pedestal 13 can be quickly retained on the metal plate 10. It is transmitted.

In the case of heat diffusion in this case as well, in the case of the downward direction, the thickness of the metal plate 10 is sufficiently smaller than that of the dielectric substrate 1 and the metal carrier 2 as described in the first embodiment. Although there is not much difference from the case of, the metal plate 10 has a large thermal conductivity in the case of the lateral direction, so that it diffuses widely and rapidly along the metal plate 10 as indicated by AR11 in FIG. In addition, the heat generated by the electronic components in AR11 is the unit time t
It is an area that is diffused in the lateral direction of the metal plate 10.

As a result, the surface mount type electronic component 12 is prevented from retaining heat, and the surface mount type electronic component 12 can continue to operate in a stable state.

Embodiment 3 FIG. Although the first and second embodiments describe the case where the surface mount type electronic component is used, the present invention is also effective when the leaded package type electronic component is used. This is shown as a third embodiment in FIG. 8 in which parts corresponding to those in FIG. The third embodiment differs from the first embodiment in that the packaged electronic component with leads 16 is provided and the conductive wire 6 is not provided. A cross section of the third embodiment is shown in FIG.

In this case, the diffusion of heat generated in the leaded package type electronic component 16 during the operation of the high frequency circuit device is
As described in the first embodiment, in the case of the downward direction, the metal plate 1
Since the thickness of 0 is sufficiently thinner than the dielectric substrate 1 and the metal carrier 2, there is not much difference from the conventional case, but in the case of the lateral direction, the thermal conductivity of the metal plate 10 is large, so that FIG. As shown in AR12, the metal diffuses rapidly along a wide area along the metal plate 10. The AR 12 is an area where heat generated in the electronic component diffuses in the lateral direction of the metal plate 10 in a unit time t.

As a result, heat is not trapped in the package electronic component 16 with leads, and the package electronic component 16 with leads can continue to operate in a stable state.

Example 4. In the third embodiment, the case of using the package electronic component with leads has been described, but the present invention is also effective when using the package electronic component with leads of screw type. This is shown as Example 4 in FIG.
FIG. 11 shows the parts corresponding to and with the same reference numerals. The fourth embodiment differs from the third embodiment in that it has a screw-type package electronic component with lead 19 and a mounting screw 20. The cross section of the fourth embodiment is shown in FIG.

In this case, the diffusion of heat generated in the screwed package electronic component with lead 19 during the operation of the high frequency circuit device is, as described in the first embodiment, the metal plate 10 in the downward direction. Since the thickness is sufficiently smaller than that of the dielectric substrate 1 and the metal carrier 2, there is not much difference from the conventional case, but in the case of the lateral direction, the thermal conductivity of the metal plate 10 is large, and therefore AR13 of FIG. 13 is used. As shown in FIG. 5, the metal diffuses rapidly along a wide area along the metal plate 10. The AR 13 is an area where heat generated in the electronic component diffuses in the lateral direction of the metal plate 10 in a unit time t.

As a result, heat is not trapped in the screw-fastened package electronic component with lead 19 and the screw-fastened package electronic component 1 with screw is maintained in a stable state.
9 will be able to continue operating. Further, since the metal plate 10 is thin, it is easy to make a screw hole.

Example 5. In the second embodiment, the case where the surface-mounted electronic component having a low height is placed on the metal pedestal has been described. However, the surface-mounted electronic component having a low height, the metal pedestal, the small dielectric substrate, etc. The present invention is also effective when a small amplifying section is formed by using the small amplifying section and is adhered to a metal carrier.

This is shown in FIG. 14 as a fifth embodiment. The surface-mounted electronic component 12 having a low height, the metal pedestal 23 which is larger than the metal pedestal 13, and the small dielectric substrate 24 constitute a small amplifier section, which is adhered onto the metal plate 10. There is. The surface mount type electronic component 12, the microstrip line 26 on the small dielectric substrate 24, and the microstrip line 4 on the dielectric substrate 1 are formed of a conductive ribbon 25.
Connected by.

Also in this case, as described in the second embodiment, the heat generated in the surface mount type electronic component 12 during the operation of the high frequency circuit device has a large thermal conductivity of the metal pedestal 23, so that the metal pedestal 23 is not affected. In the case where heat is transmitted to the metal plate 10 without being muffled and heat diffusion is in the downward direction, the thickness of the metal plate 10 is sufficiently smaller than that of the dielectric substrate 1 or the metal carrier 2, so there is not much difference from the conventional case. However, in the case of the horizontal direction, the thermal conductivity of the metal plate 10 is large, and therefore, as indicated by AR14 in FIG.
It diffuses widely and rapidly along the metal plate 10. AR14 is an area where heat generated in the electronic component diffuses in the lateral direction of the metal plate 10 in a unit time t.

As a result, the surface mount type electronic component 12 is prevented from retaining heat, and the surface mount type electronic component 12 can continue to operate in a stable state. Although the above-described first to fifth embodiments have described the case where the amplifier is used as the electronic component, the present invention is not limited to this.
In short, any electronic component that generates high heat during operation can achieve the same effects as those of the above-described embodiments.

[0034]

As described above, according to the present invention, a metal having a large thermal conductivity and a thickness sufficiently smaller than that of the dielectric substrate or the metal carrier is provided between the dielectric substrate and the metal carrier. By inserting a plate and mounting an electronic component that generates a large amount of heat thereon, the heat generated by the electronic component during operation diffuses rapidly over a wide range along the inserted metal plate. Thus, it is possible to realize a high-frequency circuit device that can prevent heat from being accumulated in the electronic parts and can operate in a stable state.

Further, according to the next invention, when the thickness of the electronic component is thinner than the thickness of the dielectric substrate, the metal pedestal is placed on the metal plate, and the electronic component is mounted on the metal pedestal. Thus, the heat generated in the electronic component during operation diffuses rapidly over a wide area along the metal plate inserted through the metal pedestal. Thus, it is possible to realize a high-frequency circuit device that can prevent heat from being accumulated in the electronic parts and can operate in a stable state.

Further, according to the next invention, a plurality of electronic components are mounted on the metal carrier or through the metal pedestal in the opening or the notch of the dielectric substrate, so that the plurality of electronic components are generated during operation. The heat generated diffuses widely and rapidly through the metal pedestal or along the metal plate directly inserted. Thus, it is possible to realize a high-frequency circuit device that can prevent heat from being accumulated in a plurality of electronic components and can operate in a stable state.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing the structure of a high-frequency circuit device according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a detailed configuration around an amplifier on the surface of the high-frequency circuit device according to the first embodiment of the present invention.

3 is a cross-sectional view of FIG.

FIG. 4 is a schematic diagram showing how heat generated in the electronic component according to the first embodiment diffuses laterally.

FIG. 5 is a plan view showing a detailed configuration around an amplifier on the surface of a high-frequency circuit device according to a second embodiment of the present invention.

FIG. 6 is a sectional view of FIG.

FIG. 7 is a schematic diagram showing how heat generated in an electronic component according to a second embodiment diffuses laterally.

FIG. 8 is a plan view showing a detailed configuration around an amplifier on the surface of a high-frequency circuit device according to a third embodiment of the present invention.

9 is a cross-sectional view of FIG.

FIG. 10 is a schematic diagram showing how heat generated in an electronic component according to a third embodiment diffuses laterally.

FIG. 11 is a plan view showing a detailed configuration around an amplifier on the surface of a high-frequency circuit device according to Embodiment 4 of the present invention.

FIG. 12 is a sectional view of FIG.

FIG. 13 is a schematic diagram showing how heat generated in an electronic component according to a fourth embodiment diffuses laterally.

FIG. 14 is a plan view showing a detailed configuration around an amplifier on the surface of a high-frequency circuit device according to Embodiment 5 of the present invention.

FIG. 15 is a sectional view of FIG.

FIG. 16 is a schematic diagram showing how heat generated in an electronic component according to a fifth embodiment diffuses laterally.

FIG. 17 is a schematic diagram showing a structure of a conventional high-frequency circuit device.

FIG. 18 is a plan view showing a detailed configuration around an amplifier section on the surface of a conventional high-frequency circuit device.

19 is a cross-sectional view of FIG.

FIG. 20 is a schematic diagram showing how heat generated in an electronic component in a conventional high-frequency circuit device diffuses laterally.

FIG. 21 is a diagram showing downward diffusion of heat generated in an electronic component in a conventional high frequency circuit device.

[Explanation of symbols]

 1 Dielectric Substrate 2 Metal Carrier 3 Lead 4 Microstrip Line 5 Surface Mount Electronic Component 6 Conductive Wire 10 Metal Plate 12 Surface Mount Electronic Component 13 Metal Pedestal 16 Leaded Package Electronic Component 19 Screw-type Lead Packaged electronic components 20 Screws 23 Metal pedestal 24 Small dielectric substrate 25 Conductive ribbon 26 Microstrip line

Claims (3)

[Claims] 1. A dielectric substrate having a matching circuit, a bias circuit, etc. on its front surface and a grounding conductor on its back surface, and heat generated in an opening or a notch formed in the dielectric substrate. A large electronic component, a metal carrier that fixes the dielectric substrate via the grounding conductor, and a large thermal conductivity and a thickness that are inserted between the dielectric substrate and the metal carrier. Is provided with a metal plate that is sufficiently thinner than the dielectric substrate and the metal carrier, and the electronic component is mounted on the metal plate. 2. A metal pedestal according to the shape of the electronic component is provided, and when the thickness of the electronic component is thinner than the thickness of the dielectric substrate, the metal pedestal is arranged on the metal plate,
The high frequency circuit device according to claim 1, wherein the electronic component is mounted on the metal pedestal. 3. A high-frequency circuit device, wherein a plurality of electronic components are mounted on the metal carrier or through the metal pedestal in an opening or a cutout portion of the dielectric substrate.