JPH1012183A - Photoelectric detector with cooler and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a photoelectric detector with a cooler having a good thermal bonding property and good assembling workability of a detector and a cooler by connecting a contact part for placing a tip end portion and a cooler of a cathode substrate via a container filling with a low-melting point metal and bonding them through dissolving and, solidifying the low-melting point metal. SOLUTION: When a detector main body 2 is inserted into a glass bulb from a downward direction in a state in which a low-melting point metal holding container 12 filled with a chip-shaped low-melting point metal is held by a groove at a bottom portion of the container 12, the container 12 comes into contact with a top board 14a having a contact portion with its thermal conductivity and electrical insulation property adhered and fixed to an upper end of the glass bulb 1 and inserted into the container 12, and the contact part is inserted into the container 12. When, in this state, the low-melting point metal is solidified after heated and dissolved a bonding piece 5A and the top board 14a are bonded with each other. A cooler 21 is placed on the top board 14a. Thus, thermal bonding property and assembling workability with the detector main body and the cooler are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a side-on type photoelectric detector provided with a cooling device and a method for manufacturing the same.

[0002]

2. Description of the Related Art Japanese Patent Laid-Open No. 49-106380 discloses an example of a conventional photoelectric detector with a cooling device. The device disclosed in this publication includes a detector body in a transparent glass bulb. The detector body generates photoelectrons at a photoelectric conversion unit, that is, a photocathode according to light incident through a glass bulb and a grid electrode, and collects the photoelectrons at an anode while multiplying the photoelectrons by a plurality of dynodes. It has a configuration.

[0003] Further, this device has a cathode substrate which has a photoelectric conversion portion in close contact and has both electrical insulation and thermal conductivity. The tip of the cathode substrate is directly attached to a metal plate disposed on the top of the glass bulb,
The low-temperature plate on the low-temperature side of the Peltier element is directly fixed to this metal plate. Then, a heat sink provided with a radiation fin is fixed to the high-temperature plate on the high-temperature side of the Peltier element having the Peltier effect. The Peltier device includes a low-temperature plate and a high-temperature plate that are thermally good conductors, and has a thermoelectric cooling unit between these plates for cooling the heat drawn from the low-temperature plate to the high-temperature plate by an applied voltage. Accordingly, the cooling device can keep the photocathode efficiently cooled through the cathode substrate, so that thermoelectrons are hardly generated from the photocathode, and the performance of the photodetector can be improved.

[0004] Japanese Patent Application Laid-Open No. H8-17390 also discloses that
An example of a photoelectric detector with a cooling device is disclosed, and this publication discloses a technique in which a cathode substrate and a cooling device are joined by a contact piece having a spring property.

[0005]

However, the photoelectric detector with the cooling device disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 49-106380 has the above-mentioned structure.
The following issues existed. That is, since the tip of the cathode substrate is directly attached to the metal plate disposed on the top of the glass bulb, the bonding property between the metal plate and the cathode substrate may be deteriorated. There was a problem that the workability of assembling was extremely poor.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and in particular, a photoelectric detection device with a cooling device for improving the thermal joining property between the detector body and the cooling device and the workability of the assembly. It is an object of the present invention to provide a vessel and a method for manufacturing the same.

[0007]

According to a first aspect of the present invention, there is provided a method for manufacturing a photoelectric detector with a cooling device, comprising: a photoelectric conversion unit which is disposed in a transparent glass bulb and generates photoelectrons in response to incident light; A detector body having a dynode for secondary electron multiplication of photoelectrons from the photoelectric conversion unit and an anode for injecting the multiplied electrons, and a thermally conductive cathode having the photoelectric conversion unit and protruding from the top of the detector body Board and
A method for manufacturing a photoelectric detector with a cooling device, comprising: a cooling device for cooling a cathode substrate via a heat conductor fixed to a glass bulb. Fixing a heat conductor having a conductive contact portion and projecting the contact portion into the glass bulb, and surrounding the low-melting-point metal in a heat-conductive low-melting-point metal holding container disposed at the tip of the cathode substrate. A step of inserting the detector body from the other end of the glass bulb while holding the solid thermally conductive low melting point metal in the space, and bringing the low melting point metal holding container and the contact portion close to each other to surround the low melting point metal. A step of inserting the contact portion into the space, and a step of melting the low-melting-point metal in the low-melting-point metal holding container with heat, and joining the low-melting-point metal holding container and the contact portion via the low-melting-point metal; Characterized by comprising.

In this method for manufacturing a photoelectric detector, a heat conductor having a contact portion is fixed to one end of a glass bulb, and the contact portion is projected into the glass bulb.
The low-melting-point metal holding container is inserted from the other end of the glass bulb together with the detector body. At this time, a low-melting-point metal is loaded in the low-melting-point metal surrounding space formed in advance in the low-melting-point metal holding container. The contact part is inserted into the surrounding space. Thereafter, the low-melting-point metal in the low-melting-point metal holding container is melted by heat, and the low-melting-point metal holding container and the contact portion are thermally bonded via the low-melting-point metal. As a result, a heat path is created between the cathode substrate and the heat conductor, and the heat of the heated cathode substrate can be transmitted to the heat conductor through the low melting point metal holding container, the low melting point metal and the contact portion. . Then, the heat of the cathode substrate is released to the outside by cooling the heat of the heat conductor by the cooling device.

According to a second aspect of the present invention, there is provided a method for manufacturing a photoelectric detector with a cooling device, wherein the photoelectric conversion unit is disposed in a transparent glass bulb and generates photoelectrons in response to incident light. A detector body having a dynode for secondary electron multiplication of photoelectrons and an anode for injecting the multiplied electrons, a thermally conductive cathode substrate having a photoelectric conversion unit and projecting from the top of the detector body, and a glass bulb. A cooling device for cooling a cathode substrate via a heat conductor fixed to the device, wherein a photoconductive detector with a cooling device is provided. Fixing a heat conductor having a portion and projecting a contact portion into a glass bulb, and a heat conductive low melting point metal holding container disposed at a tip portion of a cathode substrate. A step of inserting the detector body from the other end of the glass bulb while holding the solid thermally conductive low melting point metal, bringing the low melting point metal holding container and the contact portion close to each other, and contacting the low melting point metal holding container and the contact. Forming a low-melting-point metal surrounding space with the portion, and melting the low-melting-point metal in the low-melting-point metal surrounding space by heat, and joining the low-melting-point metal holding container and the contact portion via the low-melting-point metal. And characterized in that:

In this method of manufacturing a photoelectric detector, a heat conductor having a contact portion is fixed to one end of a glass bulb, and the contact portion is projected into the glass bulb.
The low-melting-point metal holding container is inserted from the other end of the glass bulb together with the detector body. At this time, the low-melting-point metal holding container holds the low-melting-point metal. By bringing the low-melting-point metal holding container and the contact portion close to each other, a low-melting-point metal surrounding space is created by their cooperation. Thereafter, the low-melting-point metal in the low-melting-point metal surrounding space is melted by heat, and the low-melting-point metal holding container and the contact portion are thermally joined via the low-melting-point metal. At this time, the low melting point metal surrounding space prevents leakage when the low melting point metal is melted by heat. As a result, a heat path is created between the cathode substrate and the heat conductor, and the heat of the heated cathode substrate can be transmitted to the heat conductor through the low melting point metal holding container, the low melting point metal and the contact portion. . Then, by cooling the heat of the heat conductor by the cooling device, the heat of the cathode substrate is released to the outside.

According to a third aspect of the present invention, there is provided a photoelectric detector with a cooling device according to the present invention, wherein the photoelectric detector is disposed in a transparent glass bulb and generates photoelectrons in response to incident light. A detector body having a dynode for multiplying secondary electrons and an anode for injecting the multiplied electrons, a thermally conductive cathode substrate having a photoelectric conversion unit and protruding from the top of the detector body, and fixed to a glass bulb And a cooling device for cooling the cathode substrate, wherein the heat-conductive contact is fixed to a heat conductor provided at one end of the glass bulb and protrudes into the glass bulb. And a heat-conductive low-melting-point metal holding container disposed at the tip of the cathode substrate and holding a heat-conductive low-melting-point metal. Characterized in that the metal holding vessel is bonded via a low-melting-point metal.

In this photoelectric detector, a high voltage is applied to the detector main body. As a result, photoelectrons are emitted from the photoelectric conversion unit in response to the incidence of light, and the photoelectrons are sequentially multiplied by a plurality of dynodes and finally captured by the anode. During such operation, the photoelectric conversion unit is heated, and this heat also heats the cathode substrate. Accordingly, the heat of the heated cathode substrate is transmitted to the heat conductor through the low-melting-point metal holding container, the low-melting-point metal, and the contact portion, and by cooling this heat by the cooling device, the heat of the cathode substrate is transferred to the outside. Escaped.

In this case, it is preferable that the low-melting-point metal holding container has a concave low-melting-point metal surrounding space for accommodating the low-melting-point metal, and that the contact portion protrudes into the low-melting-point metal surrounding space. When such a configuration is adopted, a concave low melting point metal surrounding space is formed in advance in the low melting point metal holding container, so that when the low melting point metal holding container is inserted into the glass bulb, the low melting point metal is low. The low-melting-point metal does not leak out of the low-melting-point metal holding container even when the low-melting-point metal is melted by heat. Further, the contact portion can be easily inserted into the low melting point metal surrounding space.

Further, it is preferable that a slit groove for inserting a tip portion of the cathode substrate is formed in a lower portion of the low melting point metal holding container. When such a configuration is adopted, the low-melting-point metal holding container and the cathode substrate can be separated from each other, and the shape of the low-melting-point metal holding container can be easily changed. The cathode substrate and the different materials can be formed.

Further, it is preferable that the low-melting-point metal holding container is fixed to the front end portion of the cathode substrate. When such a configuration is adopted, the low-melting-point metal holding container and the cathode substrate are integrated by welding or the like so that the low-melting-point metal holding container comes off from the cathode substrate when the cathode substrate is inserted into the glass bulb. And the assembling of the low melting point metal holding container and the contact portion becomes easy.

Further, it is preferable that a low-melting-point metal holding container is integrally formed at the tip of the cathode substrate. When such a configuration is adopted, a low melting point metal holding container integrated with the cathode substrate is produced by subjecting the tip portion of the cathode substrate to bending or pressing.
Therefore, when the cathode substrate is inserted into the glass bulb, the low-melting-point metal holding container does not come off the cathode substrate, and the assembling of the low-melting-point metal holding container and the contact portion is facilitated. Further, the cathode substrate and the low melting point metal holding container can be formed of the same material.

Furthermore, it is preferable that the contact portion is formed in a U-shape or an L-shape. When such a configuration is employed, the contact portion can be easily inserted into the low-melting-point metal surrounding space.

Furthermore, it is preferable that the contact portion is formed in a cup shape. When such a configuration is employed, the surface area of the contact portion can be increased. In addition, the low-melting metal that has been melted by heat can be poured into the space having a U-shaped cross section formed inside the contact portion, and the contact area between the contact portion and the low-melting metal can be extremely increased.

Furthermore, it is preferable that the contact portion is formed in a conical or pyramid shape. When such a configuration is employed, the contact portion can be inserted into the low-melting-point metal surrounding space so that the low-melting-point metal housed in the low-melting-point metal holding container is swept away.

Further, it is preferable that the contact portion is formed in a cylindrical or prismatic shape. When such a configuration is employed, the contact area between the contact portion and the low melting point metal can be increased.

Further, it is preferable that a low melting point metal surrounding space for accommodating the low melting point metal is formed by cooperation of the low melting point metal holding container and the contact portion. When such a configuration is adopted, the volume of the low melting point metal surrounding space can be increased, and the amount of the low melting point metal can be increased.

In this case, the low-melting-point metal holding container is formed in a U-shape, the contact portion is formed in a U-shape, and the U-shaped portion of the low-melting-point metal holding container and the U-shaped portion of the contact portion are alternately formed. It is preferable to form a low melting point metal surrounding space by combining the above.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a photoelectric detector with a cooling device and a method of manufacturing the same according to the present invention will be described below in detail with reference to the drawings.

[First Embodiment] FIG. 1 is a sectional view showing a photoelectric detector with a cooling device according to this embodiment, and FIG.
3 is a perspective view illustrating a main part of the photoelectric detector illustrated in FIG. 1, and FIG. 3 is a cross-sectional view taken along a line III-III in FIG. 1. As shown in these drawings, the photoelectric detector with a cooling device has a cylindrical transparent glass bulb 1.
The detector main body 2 is provided inside. The detector main body 2 includes a photoelectric conversion unit 4 that generates photoelectrons by light incident through the glass bulb 1 and the grid electrode 3,
A cathode substrate 5 made of a material having good thermal conductivity and electrical conductivity having the photoelectric conversion unit 4 on the surface and a plurality of dynodes 6 for sequentially multiplying the photoelectric conversion unit 4, that is, photoelectrons emitted from the photoelectric surface; An anode 30 for collecting and outputting the multiplied photoelectrons as an output signal; a plurality of pin terminals 7 for sequentially applying a high voltage between the grid electrode 3 and the anode 30; and a stem for fixing the pin terminals 7. 8
And a tube 9 disposed so as to penetrate the stem 8.

The pin terminal 7a connected to the cathode substrate 5 among the plurality of pin terminals 7 has an extremely low temperature. Therefore, a coil K for preventing dew condensation is provided in the middle of the connection L connecting the pin terminal 7a and the cathode substrate 5. In the present embodiment, the photoelectric conversion unit 4 is described as a photoelectric surface deposited on the cathode substrate 5, but a shield plate having the photoelectric surface deposited on the surface may be used. Pasted.

The cathode substrate 5 includes first and second disk-shaped cathode substrates.
The protrusions from the insulator substrates 10 and 11 and the protrusion amount from the first insulator substrate 10 are particularly large. A wide bonding piece 5A is formed on the top (tip) of the cathode substrate 5. A low-melting-point metal holding container 12 formed into a hat shape by deep drawing is arranged on the joining piece 5A. As shown in FIGS. 4 and 5, the low melting point metal holding container 12 is made of a material having good heat conductivity (for example, Ni,
Al, Cu), and has a cylindrical cup-shaped storage section 12a for storing a chip-shaped low-melting point metal (for example, indium) 13. The storage section 12a forms a concave low-melting point metal surrounding space S. Have been. On the opening side of the storage portion 12a, an annular flange portion 12b protruding outward from the storage portion 12a is formed. Further, the accommodation portion 12a is formed with a slit groove 12c cut straight from the bottom wall to the side wall. This slit groove 12c is formed of a chip-shaped solid low melting point metal 13.
Does not fall from the housing portion 12a and the cathode substrate 5
Are formed in such a gap that the joining piece 5A can be inserted. Thus, by inserting the joining piece 5A of the cathode substrate 5 into the slit groove 12c, the low melting point metal holding container 12 can be placed on the top of the joining piece 5A.

As shown in FIG. 6, the low melting point metal holding container 1
2, a U-shaped contact part 22 is inserted. As shown in FIG. 7, the contact part 22 is made of a material having good heat conductivity (for example, Ni, Al, Cu) and has a disk shape. The top plate 14a is fixed to the center of the back surface by silver brazing or the like, and two projecting pieces 22a protrude from the top plate 14a. The top plate 14a is formed of a material (for example, ceramics) having good thermal conductivity and electrical insulation, and is adhered and fixed to the open end of the glass bulb 1 via a frit glass 23 (FIG. 1). reference). The low-melting-point metal surrounding space S of the low-melting-point metal holding container 12 is filled with the low-melting-point metal 13 solidified after being melted by heat. Therefore, with the low melting point metal 13 interposed, the low melting point metal holding container 12, the cathode substrate 5, and the projection 2
2a can be joined to each other, and the low melting point metal 13 functions as an adhesive, so that the low melting point metal holding container 12 is firmly fixed to the cathode substrate 5, and the low melting point metal The holding container 12 does not rattle.

As shown in FIG. 1, the heat conductor 14 is a ceramic top plate 14a bonded and fixed to the open end of the glass bulb 1 via a frit glass 23 so as to close one end of the glass bulb 1. And a mounting table 14b made of a Cu or Al material adhered via a resin adhesive [preferably an R bond (trade name)] 16 having good thermal conductivity and electrical insulation. . Here, a cylindrical support member 17 made of silicone rubber is mounted on the outer peripheral surface of the top of the glass bulb 1.
4 is housed. Therefore, by using the support member 17, it is possible to prevent dew condensation at the top of the glass bulb 1 and to save labor in the manufacturing process. Further, the support member 17 prevents the adhesive 16 from flowing out, and ensures the positioning of the heat conductor 14.

On the mounting table 14b, a Peltier element 18 constituting a part of the cooling device 21 is mounted. The surface of the low-temperature plate 18a on the low-temperature side of the Peltier element 18 is brought into contact with the surface of the mounting table 14b. ing. The high-temperature plate 18b on the high-temperature side of the Peltier element 18 has a radiation fin 19a.
The heat sink 19 provided as a part of the cooling device 21 is fixed. In the Peltier element 18, a thermoelectric cooling unit 18c is provided between the low-temperature plate 18a and the high-temperature plate 18b to cool the heat drawn from the low-temperature plate 18a to the high-temperature plate 18b by an applied voltage.
The Peltier element 18 is held between the mounting table 14 b and the heat sink 19 by a pair of plastic screws 20. One end of the screw 20 is connected to the mounting table 14.
b and the other end is locked to the heat sink 19.

Next, this operation will be described based on the configuration of the photoelectric detector with a cooling device described above.

A high voltage is applied to the detector main body 2 via the pin terminal 7. As a result, the photoelectric conversion unit 4 according to the light incidence
That is, photoelectrons are generated from the photocathode, and the photoelectrons are sequentially multiplied by the plurality of dynodes 6, and the multiplied photoelectrons are collected by the anode 30 as an output signal. Also,
Unnecessary thermoelectrons are emitted from the photoelectric conversion unit 4, that is, the heat of the photoelectric surface. Therefore, the cathode substrate 5 and the top plate 14a are connected to the low-melting-point metal holding container 1.
2, heat generated from the photoelectric conversion unit 4 is transmitted from the cathode substrate 5 to the thermal conductor 14 because the thermal connection is made via the low melting point metal 13 and the contact unit 22, and the low temperature plate of the Peltier element 18 While being cooled by the Peltier effect while being sucked up from the hot plate 18b to the hot plate 18b, the generation of thermoelectrons from the photocathode 4 can be reduced.

Here, a method of manufacturing the photoelectric detector with the cooling device having the above-described configuration will be described.

As shown in FIG. 8, first, a U-shaped contact portion 22 is formed on the surface 14c of the ceramic top plate 14a.
Is fixed in advance by silver brazing or welding. Then, a top plate 14a forming a part of the thermal conductor 14 is attached to one end of the glass bulb 1 having both ends opened.
And fixed through. At this time, the contact part 22
It is positioned so as to protrude into the glass bulb 1.

Further, the joining piece 5A provided on the cathode substrate 5 of the detector main body 2 is inserted into the slit groove 12c of the low melting point metal holding container 12, and the low melting point metal holding container 12 is placed on the joining piece 5A. And the low melting point metal holding container 12
The solid indium 13 in the form of a chip is put therein so as not to spill. In this state, the detector main body 2 is inserted from the other end of the glass bulb 1 with the low melting point metal holding container 12 facing the contact portion 22. Then, as shown in FIG. 9, the protruding piece 22 a of the contact portion 22 is placed in the low melting point metal holding container 12.
By inserting the top plate 14a through the indium 13.
And the detector main body 2 are united. Thereafter, the glass bulb 1 and the stem 8 are fused with an oxygen burner or the like. As a result, the glass bulb 1 is sealed by the top plate 14a and the stem 8.

Thereafter, the inside of the glass bulb 1 is finally evacuated to 10 ^-8 torr while the inside of the glass bulb 1 is evacuated in the direction of arrow B through the tube 9. At this time, since Sb is previously deposited on the photoelectric conversion unit 4 and the dynode 6, at least one of Na, K, Cs, and Rb of an appropriate amount is fed through the tube 9 so that the glass bulb 1 is formed.
Alkaline activity takes place within. During this alkali activation, the entire glass bulb 1 is heated up to 280 ° C. At this time, since the melting point of the indium 13 is around 160 ° C., as shown in FIG.
The projecting piece 2 of the contact part 22 in the low melting point metal holding container 12
Melt to wrap 2a. As a result, the low melting point metal holding container 12 and the cathode substrate 5 are interposed with the indium 13 interposed therebetween.
And the contact portion 22 are joined to each other, and after the indium 13 is solidified, the indium 13 functions as an adhesive, so that the low-melting-point metal holding container 12 is firmly fixed to the cathode substrate 5. Therefore, the low melting point metal holding container 12 does not rattle in the glass bulb 1.

As described above, since the top plate 14a with the indium 13 interposed therebetween and the detector main body 2 can be joined during the evacuation process, the assembling work efficiency is extremely high. When the indium 13 is thermally melted, the indium 13 does not leak out of the slit groove 12c of the low melting point metal holding container 12 due to the surface tension of the indium 13 itself. By the above assembling procedure, the main body part A of the photoelectric detector shown in FIG. 2 is created.

Next, the procedure for mounting the cooling device 21 on the main body A will be described with reference to FIG. First, the projection 17a of the support member 17 is attached to the top plate 14a while the support member 17 made of silicon rubber is fitted into the glass bulb 1. Thereafter, a resin adhesive (preferably R bond [trade name]) 16 having good thermal conductivity and electrical insulation is poured into the space formed by the projection 17a and the top plate 14a. Thereafter, the mounting table 14b is inserted into the support member 17 from above, and the mounting table 14b is fixed to the top plate 14a via the adhesive 16 and the protruding portion 17a, and the work of assembling the heat conductor 14 is completed. In addition, it is necessary to firmly push the mounting table 14b so that no gap is generated between the adhesive 16 and the mounting table 14b. After assembling the heat conductor 14, the adhesive 16 is left for a certain period of time (for example, overnight).
Is solidified, and the mounting table 14b and the top plate 14a can be securely fixed.

Thereafter, the Peltier device 1 is placed on the mounting table 14b.
8 and then the heat sink 1
The bottom surface 19b of 9 is abutted on the high-temperature plate 18b of the Peltier element 18. Then, the two screws 20 are connected to the heat sink 1
9 and screwed into the female screw portion 14d of the mounting table 14b while being inserted into the through hole 19c. As a result, the cooling device 21
It will be properly positioned with respect to the heat conductor 14.

[Second Embodiment] As shown in FIGS. 10 and 11, a low melting point metal surrounding space S for containing solid indium 13 is formed in a low melting point metal holding container 40. The low-melting-point metal holding container 40 has a prismatic low-melting-point metal surrounding space S formed by deep drawing, and is fitted into a notch 5Ba formed in the top 5B of the cathode substrate 5, and the top 5B The upper part is fixed in advance by brazing or welding. When such a configuration is adopted, the low-melting-point metal holding container 40 and the cathode substrate 5 can be separated from each other, and the low-melting-point metal holding container 40
Can be easily changed. Further, the low melting point metal holding container 40 and the cathode substrate 5 can be formed of different materials. Further, the position of the low-melting-point metal holding container 40 is fixed on the cathode substrate 5, so that the low-melting-point metal holding container 40 and the contact portion 22 can be easily assembled.

[Third Embodiment] As shown in FIGS. 12 and 13, the top 5C of the cathode substrate 5 is bent at a right angle so as to be parallel to the top plate 14a.
In this example, a hemispherical low-melting point metal holding container 50 is integrally formed by press working or the like. Therefore, the cathode substrate 5
When the is inserted into the glass bulb 1, the low melting point metal holding container 50 does not come off the cathode substrate 5, and the assembling of the low melting point metal holding container 50 and the contact portion 22 becomes easy. Further, the cathode substrate 5 and the low melting point metal holding container 5
0 can be formed of the same material, and the cathode substrate 5
Thus, the low melting point metal holding container 50 can be easily produced.

[Fourth Embodiment] As shown in FIGS. 14 and 15, an L-shaped contact portion 22A is fixed to the center of the top plate 14a by brazing or welding. As a result, one protruding piece 22Aa can protrude from the top plate 14a, and this protruding piece 22Aa is
It can be inserted into. Therefore, the low melting point metal holding container 12 containing the solid indium 13 and the contact portion 2
At the time of assembling with 2A, the protruding piece 22Aa of the contact portion 22A can be easily inserted into the low melting point metal holding container 12.

[Fifth Embodiment] As shown in FIGS. 16 and 17, a cup-shaped contact portion 22B is fixed to the center of the top plate 14a by brazing or welding. The contact portion 22B has a square shape, and has a quadrangular prism-shaped low melting point metal storage space portion 22Ba in the center. Accordingly, since the indium 13 that has been melted by heat can be poured into the low melting point metal storage space 22Ba having a U-shaped cross section formed inside the contact portion 22B, the contact area between the contact portion 22B and the indium 13 is extremely small. growing. The contact portion 22B is not limited to a circular or polyhedral cylindrical shape.

Sixth Embodiment As shown in FIGS. 18 and 19, a conical projection 14aA is provided at the center of the top plate 14a.
Is formed on the surface of the projection 14aA. A metal having high thermal conductivity and good bonding with the indium 13 (for example, A
1) is applied or vapor-deposited to form a conical contact portion 22C on the top plate 14a. Therefore, when assembling the low melting point metal holding container 12 loaded with the solid indium 13 and the contact portion 22C, the low melting point metal holding container 1
The contact portion 22 </ b> C can be easily inserted into the low-melting-point metal holding container 12 such that the indium 13 in the second member 2 is swept away. Note that the contact portion 22C is not limited to the shape as long as it is a circle or a polygonal cone.
Further, the conical contact portion 22C may be fixed to the top plate 14a by brazing or welding.

[Seventh Embodiment] As shown in FIG. 20, a cylindrical contact portion 22D is fixed to the center of the top plate 14a by brazing or welding. Therefore, since the surface area of the contact portion 22D can be increased, the indium 13 thermally melted in the low melting point metal holding container 12 and the contact portion 22D can be reliably brought into contact.
The contact portion 22D is not limited to the shape as long as it is a circular or polyhedral pillar shape. Further, the columnar contact portion 22D may be formed by the metal vapor deposition technique described in the sixth embodiment.

[Eighth Embodiment] As shown in FIG. 21, a U-shaped contact portion 22E is fixed to the center of the top plate 14a by brazing or welding.
2Ea is projected. A low-melting-point metal holding container 60 bent and formed in a U-shape is provided on the top 5D of the cathode substrate 5, and the U-shaped portion 60a
Is overhanging. The low melting point metal holding container 60 cannot form the low melting point metal surrounding space S by itself. Therefore, as shown in FIG. 22, when assembling the photoelectric detector, the low melting point metal holding container 60 is used.
The U-shaped portion 22Ea of the contact portion 22E and the U-shaped portion 60a of the low-melting-point metal holding container 60 are alternately combined while the relatively large lump of indium 13 is pushed into the box-shaped low-melting-point metal. The surrounding space S is formed.
Therefore, even when the indium 13 is thermally melted in the low melting point metal surrounding space S, the indium 13 does not leak out of the low melting point metal surrounding space S. With this configuration, the volume of the low melting point metal surrounding space S can be increased.

The present invention is not limited to the above-described various embodiments, and the combination of the contact portion and the low-melting-point metal holding container is arbitrary, and is appropriately selected. And
The shapes of the contact portion and the low-melting-point metal holding container are not limited to the above-described embodiment. Further, Al having good bondability with indium may be deposited on the outer surface of the contact portion and the inner surface of the low melting point metal holding container.

[0047]

The photoelectric detector with a cooling device and the method of manufacturing the same according to the present invention are constructed as described above.
The following effects can be obtained.

According to the method for manufacturing a photoelectric detector with a cooling device according to the first aspect, one end of a glass bulb whose both ends are opened,
Fix the thermal conductor with thermal conductive contact,
The step of projecting the contact portion into the glass bulb, and holding the solid thermally conductive low melting point metal in the low melting point metal surrounding space of the thermally conductive low melting point metal holding container disposed at the tip of the cathode substrate. In the state, a step of inserting the detector main body from the other end of the glass bulb, a step of bringing the low-melting-point metal holding container and the contact portion close to each other, and inserting a contact portion in the low-melting-point metal surrounding space; Melting the low-melting-point metal in the container with heat and joining the low-melting-point metal holding container and the contact portion via the low-melting-point metal, so that the thermal connection between the detector main body and the cooling device is provided. Very good workability and assembly workability.

According to a second aspect of the present invention, there is provided a method for manufacturing a photoelectric detector with a cooling device, comprising the steps of:
Fix the thermal conductor with thermal conductive contact,
A step of projecting the contact portion into the glass bulb, and holding the solid heat-conductive low-melting-point metal in a heat-conductive low-melting-point metal holding container placed at the tip of the cathode substrate, Inserting the low melting point metal holding container and the contact portion close to each other, forming the low melting point metal surrounding space with the low melting point metal holding container and the contact portion, Melting the low-melting-point metal in the space by heat and joining the low-melting-point metal holding container and the contact portion via the low-melting-point metal, so that the thermal connection between the detector main body and the cooling device is provided. Very good workability and assembly workability.

According to a third aspect of the present invention, a photodetector with a cooling device is fixed to a heat conductor fixed to one end of a glass bulb, and has a thermally conductive contact portion protruding into the interior of the glass bulb. A heat-conductive low-melting-point metal holding container arranged at the tip and holding the heat-conductive low-melting-point metal; the contact portion and the low-melting-point metal holding container are joined via the low-melting-point metal; Therefore, the thermal joining property between the detector main body and the cooling device and the assembling workability are extremely good.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of a photoelectric detector with a cooling device according to the present invention.

FIG. 2 is a perspective view showing a main part of the photoelectric detector of FIG. 1;

FIG. 3 is a sectional view taken along the line III-III in FIG. 1;

FIG. 4 is a perspective view showing a state before a cathode substrate is inserted into a slit groove of a low melting point metal holding container.

FIG. 5 is a sectional view showing a state before assembling a cathode substrate, a low-melting-point metal holding container, and a contact portion.

FIG. 6 is a cross-sectional view showing a state in which indium is thermally melted in a low melting point metal holding container.

FIG. 7 is a perspective view showing a contact portion.

FIG. 8 is a cross-sectional view showing a state before assembling the photoelectric detector.

FIG. 9 is a cross-sectional view showing a state where solid indium is stored in a low melting point metal holding container.

FIG. 10 is a perspective view showing a modification of the low melting point metal holding container.

FIG. 11 is a sectional view taken along the line XI-XI in FIG. 10;

FIG. 12 is a perspective view showing another modification of the low melting point metal holding container.

FIG. 13 is a sectional view taken along the line XIII-XIII in FIG.

FIG. 14 is a perspective view showing a modification of the contact section.

15 is a side view of the contact section shown in FIG.

FIG. 16 is a perspective view showing another modification of the contact portion.

FIG. 17 is a side view of the contact section shown in FIG.

FIG. 18 is a perspective view showing still another modified example of the contact portion.

19 is a cross-sectional view of the contact section shown in FIG.

FIG. 20 is a perspective view showing still another modified example of the contact portion.

FIG. 21 is a perspective view showing a main part of the photoelectric detector of the present invention in which a low-melting-point metal surrounding space is completed after assembling the low-melting-point metal holding container and the contact part.

22 is a cross-sectional view showing a state after the low-melting-point metal holding container and the contact portion shown in FIG. 21 have been assembled.

[Explanation of symbols]

S: low melting metal surrounding space, 1: glass bulb, 2: detector body, 4: photoelectric conversion unit (photoelectric surface), 5: cathode substrate, 6: dynode, 12, 40, 50, 60: low melting metal holding Container, 12c: slit groove, 13: low melting point metal (indium), 14: heat conductor, 14a: top plate, 21
... Coolers, 22, 22A, 22B, 22C, 22D,
22E: contact portion, 22Ea, 60a: U-shaped portion.

Claims (13)

[Claims] 1. A photoelectric conversion unit which is disposed in a transparent glass bulb and generates photoelectrons in response to incident light, a dynode for multiplying photoelectrons from the photoelectric conversion unit by secondary electrons, and a multiplied electron. A detector body having an anode, a thermally conductive cathode substrate having the photoelectric conversion unit and projecting from the top of the detector body, and the cathode via a heat conductor fixed to the glass bulb; A method for manufacturing a photoelectric detector with a cooling device comprising a cooling device for cooling a substrate, wherein the heat conductor having a heat conductive contact portion is fixed to one end of the glass bulb having both ends opened. Protruding the contact portion into the glass bulb, and enclosing the low-melting-point metal surrounding space of the heat-conductive low-melting-point metal holding container disposed at the tip of the cathode substrate. A step of inserting the detector main body from the other end of the glass bulb while holding a solid thermally conductive low melting point metal therein, and bringing the low melting point metal holding container and the contact portion close to each other, Inserting the contact portion into the low-melting-point metal surrounding space; and melting the low-melting-point metal in the low-melting-point metal holding container with heat, so that the low-melting-point metal holding container and the contact portion have the low melting point. A method of manufacturing a photoelectric detector with a cooling device, comprising: 2. A photoelectric conversion unit which is disposed in a transparent glass bulb and generates photoelectrons in response to light incidence, a dynode for multiplying photoelectrons from the photoelectric conversion unit by secondary electrons, and a multiplied electron being incident thereon. A detector body having an anode, a thermally conductive cathode substrate having the photoelectric conversion unit and projecting from the top of the detector body, and the cathode via a heat conductor fixed to the glass bulb; A method for manufacturing a photoelectric detector with a cooling device comprising a cooling device for cooling a substrate, wherein the heat conductor having a heat conductive contact portion is fixed to one end of the glass bulb having both ends opened. Projecting the contact portion into the glass bulb, and forming a solid heat conductive material in a heat conductive low melting point metal holding container disposed at the tip portion of the cathode substrate. Inserting the detector body from the other end of the glass bulb while holding the melting point metal; bringing the low melting point metal holding container and the contact portion close to each other; Forming a low-melting-point metal-enclosed space with the heat-dissipating metal in the low-melting-point-metal-enclosed space; A method of manufacturing a photoelectric detector with a cooling device, comprising the steps of: 3. A photoelectric conversion unit which is disposed in a transparent glass bulb and generates photoelectrons in response to incident light, a dynode for multiplying photoelectrons from the photoelectric conversion unit by secondary electrons, and a multiplied electron. A detector body having an anode, a thermally conductive cathode substrate having the photoelectric conversion unit and projecting from the top of the detector body, and the cathode via a heat conductor fixed to the glass bulb; A photodetector provided with a cooling device for cooling the substrate, wherein the heat conductive contact portion fixed to the heat conductor provided at one end of the glass bulb and protruding into the glass bulb. And a heat-conductive low-melting-point metal holding container arranged at the tip of the cathode substrate and holding a heat-conductive low-melting-point metal, A photoelectric detector with a cooling device, wherein the low-melting-point metal holding container is joined via the low-melting-point metal. 4. The low melting point metal holding container has a concave low melting point metal surrounding space for accommodating the low melting point metal, and the contact portion protrudes into the low melting point metal surrounding space. A photoelectric detector with a cooling device according to claim 3. 5. The photoelectric detector with a cooling device according to claim 4, wherein a slit groove for inserting said tip portion of said cathode substrate is formed in a lower portion of said low melting point metal holding container. 6. The photoelectric detector with a cooling device according to claim 4, wherein the low-melting-point metal holding container is fixed to the tip portion of the cathode substrate. 7. The photoelectric detector with a cooling device according to claim 4, wherein the low-melting-point metal holding container is formed integrally with a tip portion of the cathode substrate. 8. The photoelectric detector with a cooling device according to claim 4, wherein the contact portion is formed in a U-shape or an L-shape. 9. The photoelectric detector with a cooling device according to claim 4, wherein said contact portion is formed in a cup shape. 10. The photoelectric detector with a cooling device according to claim 4, wherein the contact portion is formed in a conical or pyramid shape. 11. The photoelectric detector with a cooling device according to claim 4, wherein the contact portion is formed in a cylindrical or prismatic shape. 12. The photoelectric device with a cooling device according to claim 3, wherein a low melting point metal surrounding space for accommodating the low melting point metal is formed by cooperation of the low melting point metal holding container and the contact portion. Detector. 13. The low melting point metal holding container is formed in a U-shape, the contact portion is formed in a U shape, and the U-shaped portion of the low melting point metal holding container and the U-shaped portion of the contact portion are provided. 13. The photoelectric detector with a cooling device according to claim 12, wherein the low melting point metal surrounding space is formed by alternately combining the above.