JPH10125568A - Control equipment for semiconductor manufacturing equipment - Google Patents

Abstract

(57) [Summary] [PROBLEMS] Conventionally, data necessary for calculating an index shown in E-10 of SEMI is output as a measured value to a display or the like, and the index is manually calculated by a user. According to the present invention, there is provided a control device for a semiconductor manufacturing apparatus capable of automatically performing calculations based on measured values. SOLUTION: A device data collection unit 11 of a control device 1 monitors a state of a device received from a semiconductor manufacturing device 3 via a device control unit 2, measures a time spent in each state, and detects a failure occurrence or a device down. When the occurrence is received, the number of times is counted and stored in the device data / input data storage memory 19, the screen control unit 14 calculates the index shown in E-10 of SEMI, and the screen display / input unit 15 Screen 4
Is a control device of the semiconductor manufacturing apparatus which displays an index.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a control apparatus for a semiconductor manufacturing apparatus having a measuring device for measuring performance data of the semiconductor manufacturing apparatus, and more particularly to E-10 (SEMI (International Standard for Semiconductor Manufacturing Equipment and Materials)). The present invention relates to a control device for a semiconductor manufacturing apparatus that can automatically output an index indicating the performance of the apparatus based on the definition and guidelines for measurement of the reliability, usability, and maintainability of the apparatus.

[0002]

2. Description of the Related Art A semiconductor manufacturing apparatus is provided with a mechanism for reporting the start of production, the end of production, the occurrence of a failure, etc., and a control device receives and records this report. Further, the control device is provided with a timer for recording the time, and records a production start time, a production end time, a failure occurrence time, and the like, and outputs them to a display or the like. Here, the production time is obtained by subtracting the total time during which the apparatus is stopped due to a failure from the time during which the apparatus is measured (total time), and the apparatus cycle is the presence or absence of a wafer load. Regardless of the manufacturing equipment system or subsystem, it refers to the complete operation sequence including the processing, manufacturing, and test stages.

On the other hand, in SEMI E-10, the production time within mean time between failures (MTBF), the equipment cycle within mean time between failures (MCBF), and the average repair time (MTTR) ), Mean repair offline time (MTOL), equipment operational availability,
It defines the total usability of the equipment. Here, MTBF is a value obtained by dividing the production time by the number of failures.
Is the equipment cycle divided by the number of failures, and M
TTR is the total repair time divided by the number of failures, MTOL is the sum of the equipment downtime divided by the number of downtime occurrences, and the equipment operation availability is the production time relative to the operation time. Is expressed as a percentage, and the total apparatus utilization is the percentage of the production time to the total time expressed as a percentage.

A conventional control device for a semiconductor manufacturing apparatus will be described with reference to the drawings. As shown in FIG. 14, a conventional control apparatus for a semiconductor manufacturing apparatus controls a plurality of semiconductor manufacturing apparatuses via a LAN (Local Area Network). FIG. 14 is an explanatory diagram schematically showing a conventional semiconductor manufacturing system. A conventional semiconductor manufacturing system includes a control device 1 ′ that receives information from a user, outputs information for controlling the semiconductor manufacturing device to a LAN, and displays measurement information of the semiconductor manufacturing device received via the LAN on a display or the like. Receiving the measurement information from the semiconductor manufacturing apparatus and transmitting the measurement information to the control device 1 'via the LAN;
Device control unit 2, which is a terminal server for transmitting control information received from control device 1 'to semiconductor manufacturing device through
It is composed of

Conventionally, the user has calculated the value of MTBF or the like based on the measurement information output to the display of the control device 1 '. For example, in the calculation of the MTBF, the production time displayed on the display is divided by the number of failures recorded separately.

[0006]

However, in the above-described conventional control apparatus for a semiconductor manufacturing apparatus, the SEMI E-1
The index indicated by 0 cannot be calculated automatically, and there is a problem that a calculation error due to a recording error or the like is likely to occur.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a control apparatus for a semiconductor manufacturing apparatus capable of automatically calculating an index indicated in SEMI E-10. .

[0008]

According to the first aspect of the present invention, there is provided a timer management unit for measuring the date and time, and information of the apparatus transmitted from the semiconductor manufacturing apparatus is stored in the apparatus. Is classified into “production time” indicating that the semiconductor is producing semiconductors, “unplanned time” during which production is not performed, and “downtime” indicating that the device is malfunctioning or stopped. A device data collection unit that measures the time that the device is in each state for each day using the date and time input from the timer management unit, and counts the number of times a failure has occurred and the number of times the device has gone down, The time measured,
A device data / input data storage memory for storing the number of times counted, and information stored in the device data / input data storage memory, using the reliability and utilization of an international standard device for semiconductor manufacturing devices and materials. It is characterized by having a screen control unit that calculates each numerical value listed in the guidelines for the definition and measurement of maintainability and maintainability by calculation, and a screen display / input unit that displays each of the calculated numerical values on a screen.

[0009]

Embodiments of the present invention will be described with reference to the drawings. The control device (the present device) of the semiconductor manufacturing apparatus according to the present invention is replaced with the control device of the conventional semiconductor manufacturing apparatus, records the received measurement information, and based on the recorded measurement information, is shown in SEMI E-10. The calculated index is calculated automatically. This apparatus will be described with reference to FIG. FIG. 1 is a block diagram showing the configuration of the present apparatus.

As shown in FIG. 1, the present apparatus has a device data collection unit 11, a system management unit 12, a shared memory 13
, A screen control unit 14, a screen display / input unit 15, a timer management unit 16, a device communication unit 17, a memory 18, and a device data / input data storage memory 19. Further, the control device 1 according to the present embodiment is connected to the screen 4 having a keypad and a display device, such as a touch panel, and the device control unit 2 via a LAN. 2 is connected to a plurality of semiconductor manufacturing apparatuses 3.

In the following description, downtime means
This is the time during which the manufacturing apparatus cannot perform its planned function, and the recipe is the processing condition of a material (eg, a silicon wafer) to be a product. The device mode is “RESET” indicating a state in which the apparatus returns to the initial state.
"GO_STA" indicating the state of shifting to the production preparation state.
NDBY "and" STA indicating that it is in a production ready state.
"NDBY" and "RUN" indicating that it is in a production state
And “GO_EN” indicating a state of shifting to a production end state.
"D", "END" indicating a production end state, "MANUAL" indicating a state requiring human intervention such as a failure, and "IDO" indicating a production preparation state such as temporary suspension of production.
"L" and any one of "device down" indicating that the device is down, such as the device being turned off.

The device state indicates whether the semiconductor manufacturing device is "production time", "engineering time", "preparation time", or "unplanned time". And
The “state update processing” means that the latest state input to the latest state of the “control record” of the device data and the input data storage memory 19 is received, and the current date and time are set to the latest state change date and time, respectively. This processing is to store the latest state that has been input and also stored in the latest apparatus state of “latest apparatus data” in the memory 18. Then, the “timekeeping process” refers to the latest state change date and time of the “control record” of the device data and the input data storage memory 19, obtains a difference from the current date and time,
It shows a process of adding to the total time of the corresponding state of the “data record” and storing it.

Next, each part will be described in detail. The device communication unit 17 determines the type of data received from the device control unit 2 via the LAN as shown in FIG.
If the data is necessary to calculate the index shown in E-10 of EMI, the data is passed to the device data collection unit 11. FIG. 2 is a flowchart illustrating the operation of the device communication unit 17.

More specifically, the device communication unit 17 waits for reception of data from the device (101), and upon receiving data from the device, stores the received data in the shared memory 13 (102). . And the received data is SE
It is determined whether or not the data is necessary to calculate the index shown in MI E-10 (103). If the data is necessary, the received data is edited into a mail (104), The data is transmitted to the device data collection unit 11 (10
5). Then, the process returns to standby for receiving data from the device. If it is determined in step 103 that the received data is not data necessary for calculating the index, the process returns to the standby state for receiving data from the apparatus. The data transmitted from the device to the device communication unit 17 can be identified by information such as a header to indicate what the data represents.

The mail edited in the process 104 differs depending on the content of the data received by the device communication unit 17 from the device. A description will be given separately of the case where the data is received, the case where the device alarm occurrence / cancellation data is received, and the case where the maintenance data is received.

First, when the device mode change data is received, a header indicating the change of the device mode is added to the changed device mode value and transmitted to the device data collection unit 11. When the maintenance input data is received, a header for receiving the maintenance input data is added to the input maintenance data, and the device data collection unit 11
Send to When the device event change data is received, or when the device alarm occurrence / cancellation data is received, a mail having only a header representing each content is edited and transmitted to the device data collection unit 11.

Further, when receiving the data of the initialization request from the system management unit 12, the device communication unit 17 edits the mail having only the header indicating the initialization request, and transmits it to the device data collection unit 11. . Further, when receiving the data of the end request from the system management unit 12, the mail processing unit 10 edits the mail having only the header indicating the end request and transmits the mail to the device data collection unit 11.

The timer management unit 16 measures the time and outputs the time to the system management unit 12 and the device data collection unit 11. At 0:00 am (end of the day)
A time-out indicating the end of the day is edited into a mail and transmitted to the device data collection unit 11.

As shown in FIG. 3, the device data collection unit 11 receives a mail from the device communication unit 17 and performs processing suitable for the content. FIG. 3 is a flowchart illustrating the operation of the device data collection unit 11. Also,
The device data sets and stores in advance scheduled maintenance items among the inputted maintenance.

More specifically, the device data collection unit 11 is in a standby state until a mail is received (110). When a mail is received, the device data collecting unit 11 analyzes the header of the mail and branches according to the contents (111). ). If the mail indicates a device mode / event change, a device mode / event change reception process is performed (112), and if the mail indicates a device alarm occurrence / release, a device alarm occurrence / release reception process is performed (113). ), If it represents a maintenance input,
A maintenance input data receiving process is performed (114), and if a timeout indicating the end of the day is to be notified, a timeout notification receiving process is performed (115). If an initialization request, an initialization request receiving process is performed. (116)
Things.

If it is determined in step S111 that the mail is a request to end or a time-out other than midnight, the system down date and time are stored in the memory 18 (117). It is determined whether or not it is an end request (118), and the process is ended. If it is determined in step 118 that the mail is not an end request, the process returns to a mail receiving standby state.

The operations of the apparatus mode / event change reception processing, the apparatus alarm occurrence / release reception processing, the maintenance input data reception processing, the timeout notification reception processing, and the initialization request reception processing are as follows. The details will be described later.

The system management section 12 copies and stores data in a built-in system parameter storage section (not shown) in the shared memory 13 in accordance with a user's instruction input via the screen display / input section 15. The control information is transmitted to the terminal server 2 on the LAN via the device communication unit 17.
Is transmitted to the device data collection unit 11.

The shared memory 13 stores information about the system, such as the number of connected devices, stored in the system management unit 12, device mode information for each device, the number of wafers to be processed, and data transferred to the device. The number of wafers and the like are separately stored.

The screen control unit 14 selects information to be displayed from information stored in the device data / input data storage memory and information stored in the shared memory, and outputs the selected information to the screen display / input unit 15. Further, a calculation is performed using the information, and the performance information is output to the screen display / input unit 15. The screen display / input unit 15 includes a screen control unit 14
Is displayed on the screen, and outputs the information input by the user to the system management unit 12.

The memory 18 is a non-volatile RAM that retains its contents even when the power is turned off. For each semiconductor manufacturing apparatus, the latest apparatus mode, the number of maintenance being executed, and the latest apparatus state And the “latest device data” including a wafer number acquisition flag indicating whether the number of wafers has been acquired, a system down date and time, and a “non-production RUN time parameter” indicating whether or not a recipe has been designated. Is what it is. The memory 18 is also used as a work area of the device data collection unit 11.

Device data / input data storage memory 19
Is a "control record" for each device as shown in FIG.
And a "data record" that stores the device data for one day
It is composed of FIG. 12 is a conceptual diagram showing the contents of the device data / input data storage memory 19. The "control record" is, for each semiconductor manufacturing equipment,
It consists of a current record that is the number of the “data record” that is currently being recorded, the latest state, the date and time when the state has changed to the latest state, and a work number save area for storing the number of wafers currently being processed. The “data record” includes the total number of starts, the total number of equipment cycles, the total number of failures, the total number of downtime occurrences, the total production time, the total engineering time, and the system down time. It consists of the sum of time and the like. As for the “data record”, as shown in FIG. 12, a number of days may be reserved in advance. In the following, the term “data record” simply refers to the “data record” corresponding to the number stored in the current record of the “control record”.

Next, each process performed by the device data collection unit 11 will be described in order. First, the device mode / event change receiving process will be described with reference to FIGS. 4 and 5 are flowcharts showing the device mode / event change receiving process of the device data collection unit 11.

In the device mode / event change receiving process, the device data collecting section 11 first determines whether the received mail indicates a mode change or an event change (120), and indicates the mode change. If so, the value of the device mode included in the mail is stored in the area of the latest device data in the memory 18 indicating the latest device mode. Then, a process (121) for converting the device mode to the device state is performed, and the device state obtained by the process 121 is stored in the work area of the memory 18. Note that the process of converting the device mode into the device state in the process 121 will be described later.

Then, the device data collecting unit 11 converts the “latest device data” in the memory 18 into a process 121,
By referring to the device state stored in the work area of the memory 18, it is checked whether the latest state has changed (122). If the latest state has changed, it is determined whether or not the latest state is an initial value with reference to the device data and input data storage memory 19 (123). If the latest state is the initial value, the latest state of the device data and input data storage memory 19 is updated to the current state obtained in the processing 121 (145). Then, similarly, the latest state of the “latest device data” in the memory 18 is also updated (133), and the process returns to the process 110 in FIG. Here, the initial value refers to a state in which the state has never been updated (the state of the first processing when the power is turned on).

In the process 123, if the latest state is not the initial value, a "timekeeping process" is performed, and the current date and time are stored in the "control record" as the date and time when the latest status was changed (124). Then, the device data collection unit 11
Indicates that the device mode stored in the “latest device data” of the memory 18 is “END” and the device mode stored in the shared memory 13 is “RUN” (the device mode has changed from RUN to END). , Ie, the recipe has completed successfully) (125), and if so, add "1" to the "data record" device cycle (126) to determine if the production time has ended. It is determined (127), and if the production time has ended, the value of the start number save area of the “control record” is added to the start number area of the “data record” and stored (128).

Then, the device data collecting unit 11 determines that the device mode stored in the shared memory 13 is “RUN” and the device mode stored in the “latest device data” of the memory 18 is not “RUN” ( It is determined whether or not the recipe has been completed (129), and if so, the value of the start work saving area in the "control record" is set to "0" (cleared) (130). On the other hand, in the process 129, if the recipe is not completed, nothing is performed.

Then, the apparatus data collecting unit 11 sets the wafer number acquisition flag of the "latest apparatus data" in the memory 18 to "not yet acquired" (131). On the other hand, if the recipe has not been completed normally in process 125, these processes 1
The processes from 26 to 131 are not performed. In addition, if the production time has not ended in process 127,
Steps 128 to 131 are not performed.

Then, the device data collection unit 11 executes the processing 1
In the current state obtained in 21, “state update processing is performed (132), (133), and the processing returns to processing 110 in FIG. 3.

On the other hand, in the process 120, if the mail indicates an event change (A), the latest state of the "latest device data" in the memory 18 is referred to as shown in FIG. It is determined whether or not it is the production time (140). If so, it is determined whether or not the wafer number acquisition flag of the "latest device data" in the memory 18 is "acquired" (141). If it is "unacquired", the process wafer number process is executed during the execution of the recipe (142). The process wafer number processing during recipe execution refers to and adds the number of wafers stored in the shared memory 13 to obtain the number of wafers processed per apparatus cycle in the entire system.

Then, the device data collection unit 11 executes the processing 1
At 42, it is determined whether an error has occurred (14).
3) If no error has occurred, the wafer number acquisition flag is not acquired (144). If an error occurs in the process 143, the process 144 is not performed.

On the other hand, if the latest state is not the production time in step 140, steps 141 to 143 are executed.
Is not performed. If the wafer number acquisition flag is “acquired” in process 141,
The processing from processing 140 to processing 143 is not performed (B).

The processing data collection unit 11 processes the latest state of the “latest device data” in the memory 18
Is updated to the current state obtained in (133), and FIG.
It returns to the process 110 of.

Next, the process wafer number process during recipe execution in process 142 will be described with reference to FIG. FIG. 6 is a flowchart showing the operation of the apparatus data collection unit 11 for processing the number of process wafers during the execution of a recipe.

In the processing of the number of process wafers during the execution of the recipe, the apparatus data collection unit 11 first
The number of wafers processed by each device stored in the memory 18 is copied / stored in the work area of the memory 18 (150).

Then, the device data collecting section 11 refers to the number of transferred wafers in the shared memory 13 and determines whether or not wafers of all process lots have been transferred (1).
51) If the transfer has been completed (YES), the sum of the number of wafers of each device stored in the memory 18 is obtained (152), and the sum is stored in the starting number save area of the "control record" (153), The fact that there is no error is returned to the process 143 (154). If it is determined in step 151 that the data has not been transferred (NO), an error is returned to step 143 (15).
5).

Next, a device alarm occurrence / cancellation reception process in the device data collection unit 11 will be described with reference to FIG. FIG. 7 is a flowchart illustrating the operation of the device alarm generation / cancellation reception process of the device data collection unit 11.

First, the device data collection unit 11 determines whether the contents of the device alarm indicate that the device is down (160). If the content of the device alarm indicates that the device is down, it is determined whether the device alarm is to notify the occurrence of the device down or to notify the cancellation (161). if,
If the device alarm is to notify the occurrence of the device down, the latest device mode of the device of which the alarm of "latest device data" in the memory 18 is notified is set to "device down" (162).

Then, the device data collecting unit 11 performs a process of converting the device mode into a device state (16).
3) Referring to the latest device state of "latest device data" in the memory 18, it is determined whether or not they are different (whether or not the latest device state has changed) (16).
4).

If the latest device state has changed (YE
If S), the device data collection unit 11 performs “time counting process” (165), and performs “state update process” on the device state obtained in process 163 (166), (16)
7). If the alarm is released in the process 161 and if the latest state has not changed (NO) in the process 164, the process ends at that point.

Next, the operation of the device data collection unit 11 in the maintenance input data receiving process will be described with reference to FIGS.
This will be described with reference to FIG. FIG. 8 and FIG. 9 are flowcharts showing the operation in the maintenance input data receiving process of the device data collecting unit 11.

First, the device data collecting section 11 acquires the input maintenance data from the received mail (170). Then, it is determined whether or not it indicates the start of maintenance (171).

If the processing 171 indicates the start of maintenance, the apparatus data collection unit 11
Refers to the "latest device data" in the memory 18, reads the number of maintenances currently performed by the device for which maintenance has been input, and determines whether it is "0" (172).

In the process 172, if the number of ongoing maintenances is "0" (no maintenance is performed), a "time counting process" is performed (17).
3). Then, the device data collection unit 11 performs “state update processing” in “engineering time” (17).
4), (175). In the process 172, if the number of ongoing maintenance is not “0” (currently, some maintenance is being performed), the processes 173 to 1
The processing up to 75 is not performed.

Then, the apparatus data collection unit 11 determines whether the input maintenance is “unscheduled” or “scheduled” based on preset information. (176). If it is "in schedule"
If so, "1" is added to the number of failures stored in the "data record" of the device data and input data memory 19 and stored (177). On the other hand, processing 176
In, if the input maintenance is “unscheduled”, the process 177 is not performed.

Then, the device data collection unit 11 adds “1” to the downtime occurrence count stored in the “data record” of the device data and the input data memory 19 and stores it (178). “1” is added to the number of ongoing maintenances stored in the “latest device data” and stored (179), and the maintenance input data receiving process ends.

On the other hand, in the process 171, if the input data indicates the end of the maintenance (C), the device data collecting unit 11
“1” is subtracted from the number of ongoing maintenance stored in “Latest device data” in the memory 18 and stored (18)
0), it is determined whether or not the resulting number of ongoing maintenance is “0” (181).

If the number of ongoing maintenances is “0”, the latest state change date and time of the “control record” of the device data and the input data storage memory 19 is referred to, and a difference from the current date and time is obtained. It is added to the total time of the corresponding state of the "data record" and stored (182).
(D).

Then, the device data collection unit 11 refers to the latest device mode of the device that has received the maintenance of “latest device data” in the memory 18 (183), and performs a process of converting the device mode into a device state. Do (18
4). Then, the device data collection unit 11 performs “state update processing” in the device state (185), (1)
86), end.

If the number of ongoing maintenance is not "0" in the process 181, the process is terminated.

Next, the timeout notification receiving process of the device data collection unit 11 will be described with reference to FIG. FIG.
0 is a flowchart showing the timeout notification receiving process of the device data collection unit 11.

When the device data collection unit 11 receives the timeout notification (at midnight) indicating the end of the day, it refers to the latest state of the “latest device data” in the memory 18 and obtains the current device state. (190), "Timekeeping processing" is performed in the device state (191), and "1" is added to the current record of the "control record" in the device data and input data storage memory 19 and stored (192).

Then, the device data collection unit 11 stores the current date in the date of the “data record” corresponding to the value of the current record of the new “control record” (193),
The current date and time are stored in the latest state change date and time of the "control record" (194), and the process ends. In the following description, the operations of the processes 192 to 194 will be referred to as “date update process”.

Next, the initialization request receiving process of the device data collection unit 11 will be described with reference to FIG. FIG.
FIG. 9 is a flowchart illustrating an initialization request receiving process of the device data collection unit 11;

The device data collection section 11 first
8, the latest device data is initialized (200), the current date and time is acquired from the timer management unit 16 (201), and stored in the work area of the memory 18. Then, the difference between the “system down date and time” in the memory 18 and the current date and time obtained in the process 201 is obtained (202). Then, it is determined whether or not the date of “system down date and time” is different from the current date (203). If they are different, the difference is stored in the system down time of the “data record” corresponding to the date when the system was down (20).
4) Perform "date update processing" (205). On the other hand, if the date of the “system down date and time” is not different from the current date, the date and time stored in the work area of the memory 18 is stored in the latest state change date and time of the “control record” of the device data and input data storage memory. (206).

Next, a process of converting the device mode of the device data collection unit 11 into the device state will be described with reference to FIG. FIG. 13 is a flowchart illustrating a process of converting the device mode of the device data collection unit 11 into the device state.

The device data collecting section 11 determines what the device mode is (210), and determines that the
In the case of "T", "END", "MANUAL", or "device down", the device state is set to the non-planned time (211). In the process 210, the device mode is set to “IDOL”, “STANDBY”, or “GO_
In the case of "STANDBY", the apparatus state is set to the preparation time (212). Further, in the process 210, when the apparatus mode is “RUN” or “GO_END”, it is determined whether or not a recipe is designated by referring to the “non-production RUN time parameter” in the memory 18 (213). .

If a recipe is specified, it is determined whether the data of the device in the shared memory 13 is within the range of the preset data (whether the operation of the device is obstructed or a failure or the like has not occurred). Check if (21)
4). If no failure or the like has occurred, the device state is the production time (215). On the other hand, if an error has occurred, the device state becomes the engineering time (216).

In the process 213, if no recipe is specified, the device state becomes the production time (215).

Further, in the process 210, when the device mode is not any of the above (when an error occurs), the device data collection unit 11 refers to the device state of “latest device data” in the memory 18 (217). ), And set it as the device state (218).

Next, the operation of the present apparatus is changed to the apparatus mode RUN.
A description will be given of a case where the state changes from GO_END to GO_END. First, the semiconductor manufacturing device 3 is connected via the device control unit 2 to:
The information that the device mode has changed is transmitted to the device communication unit 17 of the control device 1. The device mode change information is analyzed by the device communication unit 17, and the new device mode (the changed device mode) is stored in the shared memory 13. Then, it is determined that the device mode change information needs to be notified to the device data collection unit by the device communication unit 17, and the header of the device mode / event change and the new device mode are mailed to the device data collection unit. It is transmitted to the unit 11.

The e-mail is received by the device data collection unit 11 and its header is interpreted, which is interpreted as meaning a device mode / event change. Then, a device mode / event change receiving process is performed.

The device data collection unit 11 converts the device mode to the device state, and changes the device state of the “latest device data” stored in the memory 18 by the device mode / event change receiving process. At the same time, the time spent in the device data and the "data record" of the input data storage memory 19, which corresponds to the old device state (the device state before the change) and stayed in the state, is updated by the "timekeeping process". The time spent in each state is automatically recorded.

Then, the screen control unit 14 stores the production time,
The number of failures, the device cycle, the total repair time, the sum of the device downtime, the number of times of downtime, the operating time, and the total time are extracted.

Then, the screen control unit 14 divides the production time by the number of failures to obtain the MTBF, divides the device cycle by the number of failures to obtain the MCBF, divides the total repair time by the number of failures to obtain the MTTR, The total time is divided by the number of occurrences of downtime to obtain MTOL, the production time is divided by the operation time, and then multiplied by "100" to obtain the device operation availability, the production time is divided by the total time, and "100"
Screen display and input unit 15
Output to

Then, the screen display / input unit 15 displays the information input from the screen control unit 14 on the screen 4.

According to the control device of the semiconductor manufacturing apparatus of the present invention, since information is automatically collected and the calculation is performed in real time using the information, the recording error and the calculation error are less likely to occur. There is.

[0073]

According to the present invention, the device communication unit receives the device mode transmitted by the semiconductor manufacturing device via the device control unit, and the device data collection unit receives the device mode received by the device communication unit. And the mode is "production time"
It determines which of “unplanned time” and “down time” corresponds, counts each time, counts the number of failures and the number of times the device goes down, and the device data / input data storage memory The screen control unit calculates each numerical value indicated in SEMI E-10 using the stored time, the number of failures, and the number of times of down, storing the counted time and the number of failures. Since each of the numerical values is used as a control device of a semiconductor manufacturing apparatus in which a screen display / input unit displays the data on a screen, the performance information is automatically collected, calculated, displayed in real time, and errors are recorded and calculated. There is an effect that it is performed without precision and with high accuracy.

[Brief description of the drawings]

FIG. 1 is a configuration block diagram of the present apparatus.

FIG. 2 is a flowchart illustrating an operation of a device communication unit 17;

FIG. 3 is a flowchart illustrating the operation of the device data collection unit 11;

FIG. 4 is a flowchart illustrating a device mode / event change reception process of the device data collection unit 11;

FIG. 5 is a flowchart illustrating a device mode / event change reception process of the device data collection unit 11;

FIG. 6 is a flowchart illustrating an operation of processing the number of process wafers during the execution of a recipe by the apparatus data collection unit 11;

FIG. 7 is a flowchart illustrating an operation of a device alarm generation / cancellation reception process of the device data collection unit 11;

FIG. 8 is a flowchart illustrating an operation in a maintenance input data receiving process of the device data collecting unit 11;

FIG. 9 is a flowchart illustrating an operation in a maintenance input data receiving process of the device data collecting unit 11;

FIG. 10 is a flowchart illustrating a timeout notification receiving process of the device data collection unit 11;

FIG. 11 is a flowchart illustrating an initialization request receiving process of the device data collection unit 11;

FIG. 12 is a conceptual diagram showing the contents of a device data / input data storage memory 19;

FIG. 13 is a flowchart illustrating a process of converting a device mode of the device data collection unit 11 into a device state.

FIG. 14 is an explanatory view schematically showing a conventional semiconductor manufacturing system.

[Explanation of symbols]

1, 1 ': control device, 2: device control unit, 3: semiconductor manufacturing device, 4: screen, 11: device data collection unit, 12: system management unit, 13: shared memory,
14 ... screen control unit, 15 ... screen display input unit, 16 ...
Timer management unit, 17: device communication unit, 18: memory,
19: Device data input data storage memory

Claims (1)

[Claims] 1. A timer management unit for measuring the date and time, and information of a device transmitted from a semiconductor manufacturing device is referred to as “production time” indicating that the device is producing semiconductors, or “non-production time” It is classified into "planned time" or "downtime" indicating that the device is out of order or malfunctioning, and uses the date and time input from the timer management unit for the time that the device is in each state every day. A device data collection unit that counts the number of times a failure has occurred and the number of times that the device has gone down, a device data / input data storage memory that stores the counted time and the number of times counted, Using the information stored in the device data / input data storage memory, the guidelines for the definition and measurement of the reliability, usability, and maintainability of the international standard for semiconductor manufacturing equipment and materials are given. A control device for a semiconductor manufacturing apparatus, comprising: a screen control unit for calculating each calculated numerical value by calculation; and a screen display / input unit for displaying the calculated numerical values on a screen.