JPH10125737A - TAB tape with adhesive, TAB tape and semiconductor device - Google Patents

Abstract

[PROBLEMS] To meet the demand for stricter dimensional stability due to a decrease in yield at the time of pattern processing due to a tape dimensional change in a TAB tape processing step and a finer pattern, and
The present invention provides a novel TAB adhesive tape, a TAB tape, and a semiconductor device using the same, which are suitable for increasing the yield of P mounting. In a tape with an adhesive for TAB having at least an insulating film and an adhesive layer, the thickness of the adhesive layer is in the range of 3 to 10 μm, and the thickness of the laminated body comprising the adhesive layer and the insulating film is 20%. The elastic modulus at ℃ is in the range of 1,000 to 30,000 MPa, and the curvature in the tape width direction after curing of the adhesive layer of the laminate is 5.2 × 10 ^{-4 to} 6.5 × 10 ^-3. And a TAB tape and a semiconductor device obtained therefrom.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a TAB (tape / tape).
A tape with an adhesive for TAB, a TAB tape and a semiconductor device used for a tape for mounting a semiconductor integrated circuit (hereinafter, abbreviated as a TAB tape) referred to as an "automated bonding"method; more specifically, dimensional stability can be improved; The present invention relates to a TAB adhesive tape, a TAB tape, and a semiconductor device which are excellent in processability and outer lead bonding property of a TAB tape.

[0002]

2. Description of the Related Art A tape with an adhesive for TAB is usually produced by the following method. First, an adhesive resin mixed solution is applied to a first release film and dried, and a second release film is attached to the first release film if necessary. Next, slitting is performed to a target width. The first or second release film is peeled off from a flexible insulating film made of polyimide or the like which has been slit to a desired width in advance, and the adhesive surface is adhered. Further, as another method, an adhesive resin mixed solution is applied to a predetermined width directly on the flexible insulating film, and dried,
A release film (protective film) may be attached.

[0003] The TAB adhesive tape manufactured by the above method has a structure in which a flexible insulating film, an adhesive, and a protective film are laminated in this order, but the protective film is dustproof or easy to handle. Is used for the purpose of As the protective film, polyethylene,
Polypropylene, polyethylene terephthalate, polyphenylene sulfide and the like are used.

[0004] On the other hand, a TAB tape for mounting an IC is manufactured through the following steps using the above-mentioned tape with an adhesive, and the TAB tape thus obtained (FIG. 1 shows the shape of the TAB tape). An IC is mounted.

[0005] That is, the TAB processing step includes (1) a punching step of forming sprocket holes and device holes in a tape with an adhesive for TAB using a mold, and (2) removal of a protective film.
Copper foil laminating step, (3) adhesive heat curing step to cure the adhesive layer, (4) photoresist coating / pattern exposure / developing step, (5) copper foil pattern etching step, (6) photoresist peeling step, ((7) Solder resist coating process if necessary) (8) Plating process (tin, solder, gold, etc.)
And so on.

The TAB tape thus obtained is used as a tape carrier package (TCP) after IC mounting, for example, by soldering or wire bonding to a printed wiring board, or an anisotropic conductive film (ACF).
Conductive Film).

In recent years, liquid crystal displays, which are the main applications of TCP, have begun to spread multi-windows (simultaneous display of a plurality of screens) and moving image display even in a notebook PC due to enhancement of personal computer (hereinafter, PC) functions and enhancement of PC software. The demand for image quality of a display screen is increasing. In order to improve the image quality of such a liquid crystal display, from VGA (pixel number: 480 × 640 RGB) to SVGA (pixel number: 6)
00 × 800 RGB), and the number of pixels on a glass substrate of the same size has increased. With the increase in the number of pixels, there is an increasing demand for miniaturization of the lead pitch of TCP mounted on a glass substrate.

[0008] From such a background, TAB adhesive tapes and TAB tapes are required to have various characteristics in each process.

In particular, when forming a fine pattern in the step (4), if the TAB copper-applied tape is not aligned, the mask dimension for forming the pattern may not match the dimension of the formed pattern. There is. Therefore, the current pattern processing is performed using a pattern mask in which the warpage of the TAB copper-attached tape is considered in advance. However, in order to respond to the recent trend of narrowing the pitch of semiconductor devices, a material having higher flatness is required.

It is considered that the pattern misalignment mentioned here occurs due to the following reasons.

That is, the TAB copper-attached tape obtained in the step (3) using the conventional TAB adhesive tape is fixed when the curing reaction of the adhesive layer is completed. However, since the copper foil has high rigidity, dimensional change due to curing shrinkage of the adhesive layer does not occur, and internal stress is accumulated in the adhesive. And TAB in this state
When the copper paste tape is patterned in step (4) and the copper foil is removed by etching, the accumulated internal stress is released, and a pattern wider than the mask dimensions is formed. Caused a pattern displacement when the TCP was mounted.

Therefore, in the conventional pattern pitch, slight misalignment did not pose a problem because the lead width and the interval between adjacent leads were wide. However, with the miniaturization of the pattern, especially at a pitch of 70 μm or less, the same as the conventional pattern pitch. Since it is not possible to cope with the degree of pattern displacement, the mounting becomes difficult, and the design of circuit formation is also restricted.

In order to solve this problem, it has been proposed to improve the warpage of the tape by defining the dimensional shrinkage and the moisture swelling ratio of the flexible insulating film. (JP-B-7-35106, JP-A-8-139133, etc.)

[0014]

However, TAB adhesive tapes improved by various methods have gradually been effective, but meet the demands for stricter dimensional stability accompanying finer patterns. Was not enough.

An object of the present invention is to make the adhesive layer thinner than before so as to reduce the accumulation of internal stress, to minimize the curing shrinkage of the adhesive layer, and to make the adhesive layer flexible. By optimizing the physical properties of the laminate consisting of insulating films,
New TAB suitable for increasing the yield of TCP implementation
It is intended to provide a tape with an adhesive for use.

[0016]

That is, the present invention relates to a tape with an adhesive for TAB having at least an insulating film and an adhesive layer, wherein the adhesive layer has a thickness of 3 to 3 mm.
Within the range of 10 μm, the laminate at 20 ° C. of the laminate comprising the adhesive layer and the insulating film has an elastic modulus of 1,000.
And the curvature in the tape width direction after curing of the adhesive layer of the laminate is 5.2 × 10 ^−4.
TAB characterized by being in the range of ~ 6.5 × 10 ^-3
Adhesive for TAB, TAB tape and semiconductor device obtained by using such TAB adhesive tape, and TAB tape obtained by laminating copper foil on TAB adhesive tape; A TAB tape characterized in that the surface average roughness of the copper foil treated surface in contact with the surface is in the range of 0.5 to 4 μm and the maximum surface roughness is 9 μm or less.

Further, in order to enhance the electrical insulation and adhesiveness required for recent TAB tapes, the adhesive layer after curing has a tensile modulus at 20 ° C. of 450 to 2,000M.
Pa, the insulating film is 20 to 133
μm thick polyimide film, the surface of the insulating film on which the adhesive is to be laminated has been subjected to electric discharge treatment, and the adhesive layer is made of a polyamide resin containing a dicarboxylic acid having 36 carbon atoms as an essential component. By containing, the adhesive layer contains an epoxy resin, or the adhesive layer contains a resol-type phenol resin containing paratertiary butyl phenol as a main component, thereby further providing dimensional stability, electrical insulation, and adhesion. It is possible to obtain a TAB adhesive tape with high performance, a TAB tape and a semiconductor device using the same.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The adhesive tape for TAB of the present invention has a basic structure in which an insulating film and an adhesive layer are laminated.

The insulating film used in the present invention generally has a thickness of 12.5 to 250 μm, preferably 20 to 1 μm.
33 μm, for example, polyimide, polyetherimide,
A so-called heat-resistant film such as an aromatic polyamide, or a composite material such as a flexible epoxy / glass cloth can be used. Among these materials, polyimide is preferably used from the viewpoints of heat resistance and insulating properties. Usually, a flexible insulating film is used.

It is preferable that the surface of the insulating film used in the present invention on which the adhesive is to be laminated is subjected to a discharge treatment for improving the adhesiveness according to the purpose, such as a corona discharge treatment or a low-temperature plasma treatment. By performing these treatments, it is possible to further improve the adhesiveness. The discharge treatment referred to here is a so-called normal pressure plasma treatment that discharges near atmospheric pressure, a corona discharge treatment, a low-temperature plasma treatment, or the like. Means that

The adhesive used in the adhesive layer of the present invention is not particularly limited, but is preferably a thermosetting adhesive and a semi-cured adhesive.

Examples of the adhesive used in the present invention include an adhesive composed of a polyamide resin, an epoxy resin, a phenol resin, and a curing accelerator.

The polyamide resin used for the adhesive layer is
Any one obtained by thermally polymerizing a mixture of an acid and a diamine, which can be dissolved in a mixed solvent containing an alcohol such as methanol as a main component, can be used. In particular, as a raw material of the polyamide resin, a resin containing a dicarboxylic acid having 36 carbon atoms (so-called “dimer acid”) as a main component (commonly called “dimer acid polyamide”) is preferable. The polyamide resin generally has a high water absorption and thus tends to have a low insulation resistance. However, the use of dimer acid makes it possible to reduce the water absorption and increase the electrical insulation.

The dimer acid polyamide can be obtained by thermally polymerizing an equimolar mixture of dimer acid and diamine. As the dicarboxylic acid component, not only dimer acid but also other dicarboxylic acids such as azelaic acid and sebacic acid may be contained as copolymer components. At this time, the dimer acid content is more preferably 70 mol% or more in the acid component. Among the dimer acid-based polyamides, those having a high degree of polymerization are preferred because they have a relatively low water absorption rate and tend to have high electrical insulation even in a high humidity atmosphere.

Examples of the diamine component include hexamethylenediamine, ethylenediamine, piperazine, bis (4-aminocyclohexyl) methane, and bis (4-amino-1,1).
Examples thereof include 2-dimethylcyclohexyl) methane, and particularly preferred is hexamethylenediamine. A dimer acid-based polyamide containing hexamethylenediamine as a main component is particularly preferable because it exhibits excellent characteristics in overall performance. Further, not only one kind of diamine component but also a mixture of two or more kinds can be used.

The epoxy resin used for the adhesive layer is 1
There is no particular limitation as long as it has two or more epoxy groups in the molecule. Specific examples thereof include bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolak type epoxy resin, and cresol novolak type epoxy resin. And biphenyl type epoxy resins, naphthalene type epoxy resins, linear aliphatic epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, and halogenated epoxy resins. Among these epoxy resins, bisphenol A type epoxy resin, bisphenol F type epoxy resin, in terms of excellent adhesiveness, chemical resistance and insulation properties,
It is preferable to contain at least one of phenol novolak type epoxy resin, cresol novolak type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin and heterocyclic epoxy resin. The amount of the epoxy resin added is 100
In the case of parts by weight, it is in the range of 3 to 110 parts by weight, preferably 20 to 70 parts by weight.

The phenol resin used for the adhesive layer is
Known phenolic resins such as polyparavinylphenol, including various types such as novolak type, resol type and cresol novolak type can be used. Among these types, a resol-type phenol resin containing paratertiary butyl phenol as a main component is preferably used in order to enhance heat resistance and electrical insulation. The amount of the phenol resin is in the range of 5 to 150 parts by weight, preferably 20 to 80 parts by weight when the polyamide resin is 100 parts by weight.
It is in the range of parts by weight.

The adhesive layer of the present invention may contain a curing accelerator which promotes a single reaction of an epoxy resin or a reaction between an epoxy resin and a polyamide resin or a phenol resin. The curing accelerator is not particularly limited as long as it accelerates the curing reaction, and specific examples thereof include, for example, 2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole , 2-phenyl-4-methylimidazole and 2
-Imidazole compounds such as heptadecyl imidazole, triethylamine, benzyldimethylamine, α-
Tertiary amine compounds such as methylbenzyldimethylamine, 2- (dimethylaminomethyl) phenol, 2,4,6-tris (dimethylaminomethyl) phenol and 1,8-diazabicyclo (5,4,0) undecene-7; Organometallic compounds such as zirconium tetramethoxide, zirconium tetrapropoxide, tetrakis (acetylacetonato) zirconium and tri (acetylacetonato) aluminum, and triphenylphosphine, trimethylphosphine, triethylphosphine,
Organic phosphine compounds such as tributylphosphine, tri (p-methylphenyl) phosphine and tri (nonylphenyl) phosphine are included.

The amount of the curing accelerator is preferably in the range of 0.1 to 10 parts by weight, based on 100 parts by weight of the polyamide resin.

Further, fine particles such as silica and alumina may be added as long as various properties of the adhesive are not deteriorated.

The adhesive layer of the present invention preferably has a tensile modulus in the range of 450 to 2,000 MPa when the adhesive layer alone is cured.

The elastic modulus of the laminate comprising the insulating film and the adhesive layer of the present invention and the curvature in the tape width direction when the adhesive layer is cured without bonding the laminate to the copper foil are as follows: The following conditions must be satisfied.

Elastic modulus: The elastic modulus at 20 ° C. of the laminate comprising the insulating film and the adhesive layer is in the range of 1,000 to 30,000 MPa under the following measurement conditions.
When the elastic modulus of the laminate exceeds 30,000 MPa, T
Unable to punch AB tape with adhesive. On the other hand, if it is less than 1,000 MPa, the adhesive strength at the time of solder reflow is remarkably reduced. Elastic modulus measurement condition; Measuring machine: RHEO VIBRON DDV-II-EA
[Manufactured by ORIENTEC Co., Ltd.] Measurement conditions: -100 ° C. to 300 ° C. (measurement temperature interval: 2
° C) Driving frequency; 110 Hz.

Curvature: Curvature in the tape width direction after curing of the adhesive layer of the laminate comprising the flexible insulating film and the adhesive layer is as follows:
Must be in the range of 5.2 × 10 ^{−4 to} 6.5 × 10 ^{−3 under} the following conditions. The curvature of the laminate after curing of the adhesive is 6.
If it exceeds 5 × 10 ⁻³ , the warpage of the TCP formed is so great that a fine pattern of semiconductor mounting or outer lead connection cannot be performed. In addition, the adhesive layer that is less than 5.2 × 10 ^-4
The degree of crosslinking of the resin at the time of curing is low, and the reliability of insulation is significantly reduced. Curvature measurement condition; Adhesive curing condition; 80 ° C × 3 hours → 100 ° C × 5 hours →
150 ° C. × 5 hours Sample shape; length 10 mm × width 35 mm (adhesive width 26.
0 mm) Measuring machine; micrometer Measuring method: Laminate after curing the adhesive shown in FIG. 2 is placed on a smooth glass plate, height b in FIG. 2 is measured, and curvature is obtained by the following method. Curvature calculation method: The curvature is calculated from the value b measured by the micrometer according to the following equation. Curvature ρ ⁻¹ = {(35/2) ² + b ² } / 2 × b.

In the present invention, an insulating film,
Normally, a protective film is laminated on this adhesive purely. As the protective film, usually, a flexible plastic film is used, and polyethylene terephthalate and polyphenylene sulfide film are particularly preferably used.

The tape with an adhesive for TAB is usually produced by any of the following methods.

First, an adhesive resin mixed solution is applied to a first release film, dried, and a second release film is attached to the first release film if necessary. Next, slitting is performed to a target width. The first or second release film is peeled off from a flexible insulating film made of polyimide or the like which has been subjected to corona discharge treatment or low-temperature plasma treatment in advance and slit to a desired width, and the adhesive surface is adhered. Also,
As another method, an adhesive resin mixed solution is directly applied to a predetermined width on a flexible insulating film which has been subjected to corona discharge treatment or low-temperature plasma treatment, dried, and a release film (protective film) is laminated. Good. The adhesive resin mixed solution is obtained by dissolving the adhesive component in a solvent. Solvents for dissolving each component of the adhesive include aromatic solvents such as toluene, xylene, chlorobenzene, and benzyl alcohol, and alcohol solvents such as methanol, ethanol, isopropyl alcohol, and butyl alcohol. Can be used as a mixed solvent.

Usually, the width of the adhesive of the tape produced by the above-mentioned method is set to be narrower than that of the flexible insulating film as the base material so as not to cover the sprocket holes.

The TAB tape for mounting the IC is the above-described TAB tape.
It is made through the steps of (1) to (8) using a tape with an adhesive.

Thus, the TAB tape of the present invention prepared by using the TAB adhesive tape of the present invention can be preferably applied to a tape having a conductor pattern having a wiring pattern pitch of 20 to 150 μm.

A TCP on which an IC is mounted is formed on the TAB tape thus obtained. This TCP is mounted, for example, on a glass substrate for a liquid crystal display through steps (9) to (12). And the liquid crystal display is a notebook PC
And so on.

(1) Punching process for sprocket holes, device holes, etc. (2) Removal of protective film, copper foil laminating process (3) Adhesive heating curing process (4) Photoresist coating, pattern exposure, developing process (5) Copper Foil pattern etching process (6) Photoresist stripping process (7) (Solder resist coating process if necessary) (8) Plating process (tin, solder, gold, etc.) (9) ACF attachment (10) TCP punching (11) TCP Alignment, temporary crimping (12) Heating, pressure bonding (final crimping).

In the present invention, the copper foil used in the step (2) is not particularly limited.
m, preferably 10 to 25 μm, various electrolytic copper foils and rolled copper foils can be used. Among these copper foils, if the surface maximum roughness of the copper foil treated surface is larger than the thickness of the adhesive, it is difficult to form TCP due to a decrease in adhesive strength, and it is necessary to select an adhesive to be laminated. Therefore, it is particularly preferable that the average surface roughness of the treated surface of the copper foil is in the range of 0.5 to 4 μm and the maximum surface roughness is 9 μm or less.

[0044]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples.

The pattern displacement test in this embodiment was performed as follows in the manner shown in FIG.

[Copper foil pattern misalignment inspection method] TAB
The protective film of the adhesive tape was removed, and the copper foil treated surface was laminated with an electrolytic copper foil having a maximum surface roughness of 3.8 μm and a thickness of 25 μm and an adhesive surface at 130 ° C. and 1 m / min.
After curing the adhesive in an air oven under the conditions of 80 ° C. × 3 hours, 100 ° C. × 5 hours, and 150 ° C. × 5 hours, apply photoresist on the copper foil surface, pattern exposure,
After development, copper foil pattern etching, and photoresist stripping steps, a pattern was formed using the following three levels of glass masks. a: conductor width 25 μm, pattern pitch 50 μm, conductor interval 25 μm, number of conductors 400 b: conductor width 50 μm, pattern pitch 100 μm, conductor interval 50 μm, number of conductors 200 c: conductor width 100 μm, pattern pitch 200 μm, conductor interval 100 μm, 100 conductors A 0.5-μm-thick square substrate with a side of about 3.5 cm was formed by plating this pattern with a tin plating solution.

An ITO electrode was vapor-deposited on a glass plate so as to correspond to the above pattern, and a glass substrate having the following pattern was prepared.

A ': conductor width 25 μm, pattern pitch 5
0 μm, conductor spacing 25 μm, number of conductors 400 b ′: conductor width 50 μm, pattern pitch 100 μm, conductor spacing 50 μm, number of conductors 200 c ′: conductor width 100 μm, pattern pitch 200 μm,
Conductor spacing 100 μm, number of conductors 100 The above glass substrate was made to correspond to patterns a, b, and c in order.

The TAB tape and the glass substrate thus prepared were bonded to each other through a 30 μm-thick ACF (CP4131 manufactured by Sony Chemical) using a thermocompression bonding apparatus (“Pulse Heat Bonder” TCW125 manufactured by Nippon Avionics).
After thermocompression bonding under the conditions of 70 ° C. and 3.92 MPa, the displacement of the pattern electrode and the ITO electrode in the width direction (the length of A in FIG. 3) was observed with an optical microscope. Were judged as unacceptable, those within the range were judged as slightly good, and those below the lower limit were judged as good. Judgment reference range Pattern pitch Length of A in FIG. 3 (μm) 50 μm 3 to 7 μm 100 μm 5 to 15 μm 200 μm 12 to 32 μm.

Examples 1 to 4 The following adhesive composition was dissolved in a mixed solution of methanol / monochlorobenzene so as to have a solid concentration of 20% by weight, and then subjected to a mold release treatment. A 25 μm-thick polyethylene terephthalate film (Toray Co., Ltd.) Each of these was applied to a PET film “Lumirror” T type) so that the dry film thickness became a predetermined thickness.
Dried at 50 ° C. for 2 minutes. The adhesive side of these films
A tape with an adhesive for TAB was prepared by bonding at a temperature of 120 ° C. by a roll laminating method to a 75 μm-thick polyimide film which had been previously subjected to a low-temperature plasma treatment in an argon atmosphere.

<Flexible insulating film> Polyimide film S type 75 μm manufactured by Ube Industries, Ltd. <Adhesive layer> 1: Composition / polyamide resin (Nylon “MACROMELT” 6900 manufactured by Henkel): 100 parts by weight Thermosetting alkylphenol resin (TD-2625, manufactured by Dainippon Ink): 75 parts by weight Epoxy resin (Ep828, manufactured by Yuka Shell): 50 parts by weight triphenylphosphine: 1 part by weight: thickness / 3 μm 2: composition / polyamide resin (manufactured by Henkel) Nylon "MACROMELT" 6900): 100 parts by weight Thermosetting alkylphenol resin (TD-2625 manufactured by Dainippon Ink): 80 parts by weight Epoxy resin (Ep828 manufactured by Yuka Shell Co.): 45 parts by weight: thickness / 3 μm 3: Composition / Polyamide resin (Nylon “MACROMELT manufactured by Henkel”) 6900): 100 parts by weight Thermosetting alkylphenol resin (TD-2625 manufactured by Dainippon Ink): 80 parts by weight Epoxy resin (Ep828 manufactured by Yuka Shell): 45 parts by weight: thickness / 5 μm 4: composition / polyamide resin (Nylon "MACROMELT" 6900, manufactured by Henkel): 100 parts by weight Thermosetting alkylphenol resin (TD-2625, manufactured by Dainippon Ink): 80 parts by weight Epoxy resin (Ep828, manufactured by Yuka Shell): 45 parts by weight: thickness / 10 μm The results obtained by examining the elastic modulus at 20 ° C. and the curvature in the tape width direction of the laminate comprising the flexible insulating film and the adhesive layer of the TAB adhesive tape obtained above are shown in Table 1. Table 2 shows the results of inspection of the TAB tape obtained from the TAB adhesive tape for pattern displacement.
It was shown to.

Using the TAB adhesive tape obtained by the above procedure, a conductor circuit for connecting a semiconductor integrated circuit is formed by the same method as the above-described method of inspecting the displacement of the copper foil pattern. The pattern tape shown was obtained. Further, using this pattern tape, inner lead bonding was performed at 450 ° C. for 1 minute to connect a semiconductor integrated circuit. Thereafter, resin sealing was performed with an epoxy liquid sealing material ("Chipcoat" 1320-617, manufactured by Hokuriku Paint Co., Ltd.) to obtain a semiconductor device. FIG. 4 shows a cross section of the obtained semiconductor device.

Comparative Examples 5 to 7 Except that the following was used as the adhesive layer, the same tape as in Example 1 was prepared with an adhesive for TAB.

<Adhesive Layer> 5: Composition / Polyamide resin (Nylon “MACROMELT” 6900, manufactured by Henkel): 100 parts by weight Thermosetting alkylphenol resin (TD-2625, manufactured by Dainippon Ink): 80 parts by weight Epoxy resin (Ep828 manufactured by Yuka Shell Co.): 45 parts by weight: thickness / 12 μm 6: Composition / polyamide resin (Nylon “MACROMELT” 6900 manufactured by Henkel): 100 parts by weight Thermosetting alkylphenol resin (TD- manufactured by Dainippon Ink) 2625): 150 parts by weight Epoxy resin (Ep828 manufactured by Yuka Shell Co.): 5 parts by weight: thickness / 12 μm 7: Composition Polyamide resin (nylon “MACROMELT” 6901 manufactured by Henkel Co.): 100 parts by weight Epoxy resin (oiled shell) Ep828): 1000 parts by weight metaphenylene Amine: 200 parts by weight: Thickness / 5 [mu] m

The laminated body comprising the flexible insulating film and the adhesive layer of the TAB adhesive tape obtained above was used.
Table 1 shows the results of inspection of the elastic modulus at ° C. and the curvature in the tape width direction. Table 2 shows the results of inspecting the pattern displacement of the TAB tape obtained from the TAB adhesive tape and determining the result.

[0056]

[Table 1]

[0057]

[Table 2]

[0058]

By using the TAB adhesive tape of the present invention, in the TAB tape processing step,
Due to the stress of each layer caused by the shrinkage of the copper foil, adhesive layer and the adhesive layer of the base film due to the curing shrinkage, it is possible to prevent defects such as poor adhesion between conductors due to misalignment of the pattern and floating of the conductors, resulting in high yield. TAB tape excellent in the above and a semiconductor device using the same can be industrially provided.

[Brief description of the drawings]

FIG. 1 is a perspective view of one embodiment of a TAB adhesive tape showing a state in which the TAB adhesive tape is patterned.

FIG. 2 is a cross-sectional view of one embodiment of a TAB adhesive tape showing a portion for measuring the warpage and the amount of warpage of the TAB adhesive tape when the adhesive layer is cured without bonding a copper foil;

FIG. 3 shows that a TAB tape is connected to a glass substrate on which an ITO electrode is formed via an ACF and TA
FIG. 4 is a partial cross-sectional view of one embodiment of a TAB tape showing a positional shift of a B tape.

FIG. 4 is a sectional view of a semiconductor device using the TAB adhesive tape of the present invention.

[Explanation of symbols]

 1. 1. Flexible insulating film (base film) Adhesive 3. Sprocket hole 4. Device hole 5. Conductor 6. Glass substrate 7. 7. ITO electrode ACF 9. Sealing resin 10. Gold bump 11. Protective film 12. Glass plate

Claims (11)

[Claims] 1. A tape with an adhesive for TAB having at least an insulating film and an adhesive layer, wherein the thickness of the adhesive layer is in the range of 3 to 10 μm, and a laminate comprising the adhesive layer and the insulating film is further provided. The elastic modulus at 20 ° C. is in the range of 1,000 to 30,000 MPa, and the curvature in the tape width direction of the laminate after curing of the adhesive layer is 5.2 × 10 ^{−4 to} 6.5 × 10 ^{−. 3.} A tape with an adhesive for TAB, which is in the range of ³ . 2. The tape with an adhesive for TAB according to claim 1, wherein the tensile elastic modulus when the adhesive layer alone is cured is in the range of 450 to 2,000 MPa. 3. An insulating film according to claim 1, wherein said insulating film is a polyimide film having a thickness of 20 to 133 μm.
The adhesive tape for TAB according to the above. 4. The surface of the insulating film on which the adhesive is laminated,
The TAB according to claim 1, wherein the TAB has been subjected to a discharge treatment.
Tape with adhesive. 5. The tape with adhesive for TAB according to claim 1, wherein the adhesive layer contains a polyamide resin containing a dicarboxylic acid having 36 carbon atoms as an essential component. 6. The tape with an adhesive for TAB according to claim 1, wherein the adhesive layer contains a resol type phenol resin containing p-tert-butylphenol as a main component. 7. The tape with an adhesive for TAB according to claim 1, wherein the adhesive layer contains an epoxy resin. 8. A TAB tape obtained by using the TAB adhesive tape according to any one of claims 1 to 7, wherein the wiring pattern pitch of the conductor circuit is 20 to 150 μm. 9. A semiconductor device obtained from the tape with an adhesive for TAB according to claim 1. 10. A TAB tape obtained by laminating a copper foil on a tape with an adhesive for TAB, wherein the copper foil surface in contact with the adhesive of the copper foil has a surface average roughness in the range of 0.5 to 4 μm, A TAB tape having a maximum surface roughness of 9 μm or less. 11. A semiconductor device obtained from the TAB tape according to claim 10.