JPH1012702A5 - - Google Patents

Info

Publication number
JPH1012702A5
JPH1012702A5 JP1996181309A JP18130996A JPH1012702A5 JP H1012702 A5 JPH1012702 A5 JP H1012702A5 JP 1996181309 A JP1996181309 A JP 1996181309A JP 18130996 A JP18130996 A JP 18130996A JP H1012702 A5 JPH1012702 A5 JP H1012702A5
Authority
JP
Japan
Prior art keywords
substrate
substrates
device manufacturing
manufacturing line
transport error
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1996181309A
Other languages
Japanese (ja)
Other versions
JPH1012702A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP8181309A priority Critical patent/JPH1012702A/en
Priority claimed from JP8181309A external-priority patent/JPH1012702A/en
Publication of JPH1012702A publication Critical patent/JPH1012702A/en
Publication of JPH1012702A5 publication Critical patent/JPH1012702A5/ja
Withdrawn legal-status Critical Current

Links

Description

【0006】
【課題を解決するための手段】上記課題を解決するために、本発明においては、デバイス製造ライン内での基板の処理状況を常時監視し、搬送エラーが発生したときに、監視している処理状況に基づいて、デバイス製造ライン内に存在する全ての基板について、各々の基板に対応する搬出元格納部を判別する。そして、全ての基板を判別された対応する搬出元格納部に搬送した後に、搬出元格納部に戻された基板の処理を再開する。ここで、搬出元格納部に戻された基板の内、処理済みの基板については、搬入先格納部に搬送する。
又、本発明においては、搬送エラーが発生した時に、デバイス製造ライン内に存在する全ての基板を、各々の基板が搬出された搬出元格納部へ自動回収する工程を含み、さらに、前記自動回収が不可能な基板が前記デバイス製造ライン内に存在するか否かを判定する工程を含む。ここで、自動回収の可否を表示手段に表示しても良い。また、デバイス製造ライン内での基板の位置情報を逐次監視する工程を含む場合、自動回収が不可能な基板を手作業にて回収した際には、基板のデバイス製造ライン内での位置情報を修正する。
[0006]
[Means for Solving the Problems] In order to solve the above problems, the present invention constantly monitors the processing status of substrates in a device manufacturing line, and when a transfer error occurs, determines the source storage unit corresponding to each substrate for all substrates present in the device manufacturing line based on the monitored processing status. After all substrates have been transported to the identified source storage unit, processing of substrates returned to the source storage unit is resumed. Among the substrates returned to the source storage unit, processed substrates are then transported to the destination storage unit.
Furthermore, the present invention includes a step of automatically recovering all substrates present in the device manufacturing line to the source storage unit from which each substrate was removed when a transport error occurs, and further includes a step of determining whether or not any substrates that cannot be automatically recovered exist in the device manufacturing line. Here, the feasibility of automatic recovery may be displayed on a display means. Furthermore, if the method includes a step of continuously monitoring positional information of substrates in the device manufacturing line, when a substrate that cannot be automatically recovered is manually recovered, the positional information of the substrate in the device manufacturing line is corrected.

【0007】
【作用及び効果】上記のような本発明においては、デバイス製造ライン内での基板の処理状況を監視しているため、基板の所属するロット、すなわち、対応する搬出元格納部を容易且つ正確に特定することができる。また、監視している処理状況に基づいて、デバイス製造ライン内に存在する全ての基板をそれぞれ第1の格納部に一旦戻しているため、基板の復帰処理を画一化することができ、基板の復帰処理が容易になる。また、搬出元格納部に戻された基板の内、処理済みの基板を搬入先格納部に搬送すれば、一旦処理の終わった基板を再び処理するような2重処理を回避することができる。
また、搬送エラーが発生時に各々の基板を搬出元格納部へ自動回収する場合、自動回収が不可能な基板がデバイス製造ライン内に存在するか否かを判定するため、たとえば自動回収の可否を表示手段に表示することが可能となる。また、デバイス製造ライン内での基板の位置情報を逐次監視する場合に、自動回収が不可能な基板を手作業にて回収した際には、基板のデバイス製造ライン内での位置情報を修正することが可能であるため、基板の位置情報を常に適正なものに保つことが可能となる。
[0007]
[Operation and Effect] In the present invention as described above, the processing status of substrates in a device manufacturing line is monitored, so the lot to which a substrate belongs, i.e., the corresponding source storage unit, can be easily and accurately identified. Furthermore, because all substrates in the device manufacturing line are temporarily returned to their respective first storage units based on the monitored processing status, the return processing of substrates can be standardized and made easier. Furthermore, by transporting processed substrates from the source storage unit to the destination storage unit, it is possible to avoid double processing, such as reprocessing substrates that have already been processed.
Furthermore, when a transport error occurs and each substrate is automatically returned to the source storage section, it is possible to determine whether or not there are any substrates in the device manufacturing line that cannot be automatically returned, and therefore, for example, whether or not automatic return is possible can be displayed on a display means. Furthermore, when positional information of substrates in the device manufacturing line is monitored sequentially, if a substrate that cannot be automatically returned is returned manually, it is possible to correct the positional information of the substrate in the device manufacturing line, and therefore, it is possible to always keep the positional information of the substrate appropriate.

Claims (5)

複数のデバイス製造装置を連結して構成されるデバイス製造ライン内で、搬出元格納部から搬出された複数の基板を連続的に処理する工程の中で、前記基板の搬送エラーが生じた際の当該基板の復帰処理方法において、
前記デバイス製造ライン内での前記基板の処理状況を常時監視する第1工程と;
前記搬送エラーが発生したときに、前記監視している処理状況に基づいて、前記デバイス製造ライン内に存在する全ての基板について、各々の基板が搬出された前記搬出元格納部を判別する第2工程と;
前記全ての基板を前記判別された搬出元格納部に搬送する第3工程と;
前記第3工程の後に、前記搬出元格納部に搬送された前記基板の処理を再開する第4工程とを含むことを特徴とする基板の搬送エラー復帰処理方法。
A method for recovering a plurality of substrates when a transport error occurs in a process of continuously processing a plurality of substrates unloaded from an origin storage unit in a device manufacturing line configured by connecting a plurality of device manufacturing apparatuses, comprising:
a first step of constantly monitoring the processing status of the substrate in the device manufacturing line;
a second step of determining, when the transport error occurs, the source storage unit from which each substrate was transported for all substrates present in the device manufacturing line based on the monitored processing status;
a third step of transporting all of the substrates to the identified source storage unit;
a fourth step of resuming processing of the substrate transported to the source storage section after the third step;
前記第4工程を行う前に、前記第3工程において前記搬出元格納部に戻された前記基板の内、処理済みの基板については、処理後の基板を搬入するための搬入先格納部に搬送することを特徴とする請求項1に記載の基板の搬送エラー復帰処理方法。2. The substrate transport error recovery processing method according to claim 1, characterized in that, before performing the fourth step, processed substrates among the substrates returned to the source storage section in the third step are transported to a destination storage section for receiving processed substrates. 複数のデバイス製造装置を連結して構成されるデバイス製造ライン内で、搬出元格納部から搬出された複数の基板を連続的に処理する工程の中で、前記基板の搬送エラーが生じた際の当該基板の復帰処理方法であって、A method for recovering a substrate when a transport error occurs in a process of continuously processing a plurality of substrates unloaded from an origin storage unit in a device manufacturing line configured by connecting a plurality of device manufacturing apparatuses, the method comprising:
前記搬送エラーが発生した時に、前記デバイス製造ライン内に存在する全ての基板を、各々の基板が搬出された前記搬出元格納部へ自動回収する工程と、When the transport error occurs, automatically recovering all of the substrates present in the device manufacturing line to the source storage unit from which each substrate was unloaded;
前記自動回収が不可能な基板が前記デバイス製造ライン内に存在するか否かを判定する工程とを含むことを特徴とする基板の搬送エラー復帰処理方法。A substrate transport error recovery processing method, comprising the step of determining whether or not the substrate that cannot be automatically collected is present in the device manufacturing line.
請求項3の方法において、The method of claim 3,
前記判定結果に応じて各基板が自動回収可能か否かを表示手段に表示する工程a step of displaying on a display means whether or not each substrate can be automatically collected according to the result of the determination. を含むことを特徴とする基板の搬送エラー復帰処理方法。A substrate transport error recovery processing method comprising:
請求項3又は4の方法において、In the method of claim 3 or 4,
前記デバイス製造ライン内での前記基板の位置情報を逐次監視する工程を含み、a step of sequentially monitoring position information of the substrate in the device manufacturing line,
前記自動回収が不可能な基板を手作業により回収した場合に、前記基板の位置情報を修正する工程を含むことを特徴とする基板の搬送エラー復帰処理方法。A substrate transport error recovery processing method, comprising the step of correcting position information of the substrate when the substrate that cannot be automatically recovered is recovered manually.
JP8181309A 1996-06-21 1996-06-21 Board transfer error recovery method Withdrawn JPH1012702A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8181309A JPH1012702A (en) 1996-06-21 1996-06-21 Board transfer error recovery method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8181309A JPH1012702A (en) 1996-06-21 1996-06-21 Board transfer error recovery method

Publications (2)

Publication Number Publication Date
JPH1012702A JPH1012702A (en) 1998-01-16
JPH1012702A5 true JPH1012702A5 (en) 2004-07-15

Family

ID=16098430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8181309A Withdrawn JPH1012702A (en) 1996-06-21 1996-06-21 Board transfer error recovery method

Country Status (1)

Country Link
JP (1) JPH1012702A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4915033B2 (en) 2000-06-15 2012-04-11 株式会社ニコン Exposure apparatus, substrate processing apparatus, lithography system, and device manufacturing method
JP2011091415A (en) * 2010-12-02 2011-05-06 Hitachi Kokusai Electric Inc Substrate detecting method, substrate detecting method in semiconductor manufacturing apparatus, semiconductor manufacturing apparatus, and substrate collecting method in the semiconductor manufacturing apparatus
CN104699019B (en) * 2013-12-09 2019-09-17 中芯国际集成电路制造(上海)有限公司 Board restores checking system and board restores the method for inspection

Similar Documents

Publication Publication Date Title
JPS5981049A (en) Production processing method in production processing system
JP2008231499A (en) Defective electrode plate sorting apparatus and defective electrode plate sorting method
JPH1012702A5 (en)
JPH05261649A (en) Input control method
US7751310B2 (en) Fault tolerant duplex computer system and its control method
TW201133689A (en) Method of operating vacuum apparatus
JP2000236008A (en) Transfer control method in automatic wafer transfer system
JP4490124B2 (en) Transport status presentation system and method, program, and information storage medium
JPH03158961A (en) Software maintenance management method for distributed processors
JP5217614B2 (en) Work control data monitoring system for inline manufacturing and processing equipment
JP3264117B2 (en) Production management device
JPH0260140A (en) Reject article processing system by lsi chip installation device
JP2743299B2 (en) Semiconductor wafer management system
JP2006210712A (en) Substrate processing equipment
JPH09159981A (en) Film forming device
JPH08145908A (en) Meander follow-up system in defect inspection equipment
JP5023651B2 (en) Data tracking system for transport control
JPH0242743A (en) Automatic conveyance control system
JP2002270481A (en) System for recovering sample automatically
JPS60171504A (en) Data tracking system
JP2005019911A (en) Process progress control system and manufacturing method for semiconductor device
JPH04127555A (en) Sample transport device
JP3437632B2 (en) System monitoring equipment
CN119660568A (en) Crown block operation method
JPH048436A (en) Production process control method