JPH1012702A5 - - Google Patents
Info
- Publication number
- JPH1012702A5 JPH1012702A5 JP1996181309A JP18130996A JPH1012702A5 JP H1012702 A5 JPH1012702 A5 JP H1012702A5 JP 1996181309 A JP1996181309 A JP 1996181309A JP 18130996 A JP18130996 A JP 18130996A JP H1012702 A5 JPH1012702 A5 JP H1012702A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrates
- device manufacturing
- manufacturing line
- transport error
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Description
【0006】
【課題を解決するための手段】上記課題を解決するために、本発明においては、デバイス製造ライン内での基板の処理状況を常時監視し、搬送エラーが発生したときに、監視している処理状況に基づいて、デバイス製造ライン内に存在する全ての基板について、各々の基板に対応する搬出元格納部を判別する。そして、全ての基板を判別された対応する搬出元格納部に搬送した後に、搬出元格納部に戻された基板の処理を再開する。ここで、搬出元格納部に戻された基板の内、処理済みの基板については、搬入先格納部に搬送する。
又、本発明においては、搬送エラーが発生した時に、デバイス製造ライン内に存在する全ての基板を、各々の基板が搬出された搬出元格納部へ自動回収する工程を含み、さらに、前記自動回収が不可能な基板が前記デバイス製造ライン内に存在するか否かを判定する工程を含む。ここで、自動回収の可否を表示手段に表示しても良い。また、デバイス製造ライン内での基板の位置情報を逐次監視する工程を含む場合、自動回収が不可能な基板を手作業にて回収した際には、基板のデバイス製造ライン内での位置情報を修正する。 [0006]
[Means for Solving the Problems] In order to solve the above problems, the present invention constantly monitors the processing status of substrates in a device manufacturing line, and when a transfer error occurs, determines the source storage unit corresponding to each substrate for all substrates present in the device manufacturing line based on the monitored processing status. After all substrates have been transported to the identified source storage unit, processing of substrates returned to the source storage unit is resumed. Among the substrates returned to the source storage unit, processed substrates are then transported to the destination storage unit.
Furthermore, the present invention includes a step of automatically recovering all substrates present in the device manufacturing line to the source storage unit from which each substrate was removed when a transport error occurs, and further includes a step of determining whether or not any substrates that cannot be automatically recovered exist in the device manufacturing line. Here, the feasibility of automatic recovery may be displayed on a display means. Furthermore, if the method includes a step of continuously monitoring positional information of substrates in the device manufacturing line, when a substrate that cannot be automatically recovered is manually recovered, the positional information of the substrate in the device manufacturing line is corrected.
【0007】
【作用及び効果】上記のような本発明においては、デバイス製造ライン内での基板の処理状況を監視しているため、基板の所属するロット、すなわち、対応する搬出元格納部を容易且つ正確に特定することができる。また、監視している処理状況に基づいて、デバイス製造ライン内に存在する全ての基板をそれぞれ第1の格納部に一旦戻しているため、基板の復帰処理を画一化することができ、基板の復帰処理が容易になる。また、搬出元格納部に戻された基板の内、処理済みの基板を搬入先格納部に搬送すれば、一旦処理の終わった基板を再び処理するような2重処理を回避することができる。
また、搬送エラーが発生時に各々の基板を搬出元格納部へ自動回収する場合、自動回収が不可能な基板がデバイス製造ライン内に存在するか否かを判定するため、たとえば自動回収の可否を表示手段に表示することが可能となる。また、デバイス製造ライン内での基板の位置情報を逐次監視する場合に、自動回収が不可能な基板を手作業にて回収した際には、基板のデバイス製造ライン内での位置情報を修正することが可能であるため、基板の位置情報を常に適正なものに保つことが可能となる。 [0007]
[Operation and Effect] In the present invention as described above, the processing status of substrates in a device manufacturing line is monitored, so the lot to which a substrate belongs, i.e., the corresponding source storage unit, can be easily and accurately identified. Furthermore, because all substrates in the device manufacturing line are temporarily returned to their respective first storage units based on the monitored processing status, the return processing of substrates can be standardized and made easier. Furthermore, by transporting processed substrates from the source storage unit to the destination storage unit, it is possible to avoid double processing, such as reprocessing substrates that have already been processed.
Furthermore, when a transport error occurs and each substrate is automatically returned to the source storage section, it is possible to determine whether or not there are any substrates in the device manufacturing line that cannot be automatically returned, and therefore, for example, whether or not automatic return is possible can be displayed on a display means. Furthermore, when positional information of substrates in the device manufacturing line is monitored sequentially, if a substrate that cannot be automatically returned is returned manually, it is possible to correct the positional information of the substrate in the device manufacturing line, and therefore, it is possible to always keep the positional information of the substrate appropriate.
Claims (5)
前記デバイス製造ライン内での前記基板の処理状況を常時監視する第1工程と;
前記搬送エラーが発生したときに、前記監視している処理状況に基づいて、前記デバイス製造ライン内に存在する全ての基板について、各々の基板が搬出された前記搬出元格納部を判別する第2工程と;
前記全ての基板を前記判別された搬出元格納部に搬送する第3工程と;
前記第3工程の後に、前記搬出元格納部に搬送された前記基板の処理を再開する第4工程とを含むことを特徴とする基板の搬送エラー復帰処理方法。A method for recovering a plurality of substrates when a transport error occurs in a process of continuously processing a plurality of substrates unloaded from an origin storage unit in a device manufacturing line configured by connecting a plurality of device manufacturing apparatuses, comprising:
a first step of constantly monitoring the processing status of the substrate in the device manufacturing line;
a second step of determining, when the transport error occurs, the source storage unit from which each substrate was transported for all substrates present in the device manufacturing line based on the monitored processing status;
a third step of transporting all of the substrates to the identified source storage unit;
a fourth step of resuming processing of the substrate transported to the source storage section after the third step;
前記搬送エラーが発生した時に、前記デバイス製造ライン内に存在する全ての基板を、各々の基板が搬出された前記搬出元格納部へ自動回収する工程と、When the transport error occurs, automatically recovering all of the substrates present in the device manufacturing line to the source storage unit from which each substrate was unloaded;
前記自動回収が不可能な基板が前記デバイス製造ライン内に存在するか否かを判定する工程とを含むことを特徴とする基板の搬送エラー復帰処理方法。A substrate transport error recovery processing method, comprising the step of determining whether or not the substrate that cannot be automatically collected is present in the device manufacturing line.
前記判定結果に応じて各基板が自動回収可能か否かを表示手段に表示する工程a step of displaying on a display means whether or not each substrate can be automatically collected according to the result of the determination. を含むことを特徴とする基板の搬送エラー復帰処理方法。A substrate transport error recovery processing method comprising:
前記デバイス製造ライン内での前記基板の位置情報を逐次監視する工程を含み、a step of sequentially monitoring position information of the substrate in the device manufacturing line,
前記自動回収が不可能な基板を手作業により回収した場合に、前記基板の位置情報を修正する工程を含むことを特徴とする基板の搬送エラー復帰処理方法。A substrate transport error recovery processing method, comprising the step of correcting position information of the substrate when the substrate that cannot be automatically recovered is recovered manually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8181309A JPH1012702A (en) | 1996-06-21 | 1996-06-21 | Board transfer error recovery method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8181309A JPH1012702A (en) | 1996-06-21 | 1996-06-21 | Board transfer error recovery method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1012702A JPH1012702A (en) | 1998-01-16 |
| JPH1012702A5 true JPH1012702A5 (en) | 2004-07-15 |
Family
ID=16098430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8181309A Withdrawn JPH1012702A (en) | 1996-06-21 | 1996-06-21 | Board transfer error recovery method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1012702A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4915033B2 (en) | 2000-06-15 | 2012-04-11 | 株式会社ニコン | Exposure apparatus, substrate processing apparatus, lithography system, and device manufacturing method |
| JP2011091415A (en) * | 2010-12-02 | 2011-05-06 | Hitachi Kokusai Electric Inc | Substrate detecting method, substrate detecting method in semiconductor manufacturing apparatus, semiconductor manufacturing apparatus, and substrate collecting method in the semiconductor manufacturing apparatus |
| CN104699019B (en) * | 2013-12-09 | 2019-09-17 | 中芯国际集成电路制造(上海)有限公司 | Board restores checking system and board restores the method for inspection |
-
1996
- 1996-06-21 JP JP8181309A patent/JPH1012702A/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5981049A (en) | Production processing method in production processing system | |
| JP2008231499A (en) | Defective electrode plate sorting apparatus and defective electrode plate sorting method | |
| JPH1012702A5 (en) | ||
| JPH05261649A (en) | Input control method | |
| US7751310B2 (en) | Fault tolerant duplex computer system and its control method | |
| TW201133689A (en) | Method of operating vacuum apparatus | |
| JP2000236008A (en) | Transfer control method in automatic wafer transfer system | |
| JP4490124B2 (en) | Transport status presentation system and method, program, and information storage medium | |
| JPH03158961A (en) | Software maintenance management method for distributed processors | |
| JP5217614B2 (en) | Work control data monitoring system for inline manufacturing and processing equipment | |
| JP3264117B2 (en) | Production management device | |
| JPH0260140A (en) | Reject article processing system by lsi chip installation device | |
| JP2743299B2 (en) | Semiconductor wafer management system | |
| JP2006210712A (en) | Substrate processing equipment | |
| JPH09159981A (en) | Film forming device | |
| JPH08145908A (en) | Meander follow-up system in defect inspection equipment | |
| JP5023651B2 (en) | Data tracking system for transport control | |
| JPH0242743A (en) | Automatic conveyance control system | |
| JP2002270481A (en) | System for recovering sample automatically | |
| JPS60171504A (en) | Data tracking system | |
| JP2005019911A (en) | Process progress control system and manufacturing method for semiconductor device | |
| JPH04127555A (en) | Sample transport device | |
| JP3437632B2 (en) | System monitoring equipment | |
| CN119660568A (en) | Crown block operation method | |
| JPH048436A (en) | Production process control method |