JPH10149723A - Power cable and connecting structure thereof - Google Patents
Power cable and connecting structure thereofInfo
- Publication number
- JPH10149723A JPH10149723A JP30922896A JP30922896A JPH10149723A JP H10149723 A JPH10149723 A JP H10149723A JP 30922896 A JP30922896 A JP 30922896A JP 30922896 A JP30922896 A JP 30922896A JP H10149723 A JPH10149723 A JP H10149723A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- power cable
- insulating layer
- connection structure
- xlpe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004743 Polypropylene Substances 0.000 claims abstract description 50
- 229920003020 cross-linked polyethylene Polymers 0.000 claims abstract description 35
- 239000004703 cross-linked polyethylene Substances 0.000 claims abstract description 35
- -1 polypropylene Polymers 0.000 claims abstract description 12
- 229920001155 polypropylene Polymers 0.000 claims abstract description 11
- 238000003475 lamination Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 abstract description 22
- 238000000034 method Methods 0.000 abstract description 11
- 238000004132 cross linking Methods 0.000 abstract description 7
- 229920001684 low density polyethylene Polymers 0.000 abstract description 6
- 239000004702 low-density polyethylene Substances 0.000 abstract description 6
- 239000003431 cross linking reagent Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 88
- 230000000052 comparative effect Effects 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 230000006378 damage Effects 0.000 description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- PBKONEOXTCPAFI-UHFFFAOYSA-N 1,2,4-trichlorobenzene Chemical compound ClC1=CC=C(Cl)C(Cl)=C1 PBKONEOXTCPAFI-UHFFFAOYSA-N 0.000 description 3
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- UBRWPVTUQDJKCC-UHFFFAOYSA-N 1,3-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC(C(C)(C)OOC(C)(C)C)=C1 UBRWPVTUQDJKCC-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000181 Ethylene propylene rubber Polymers 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000001460 carbon-13 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 239000012796 inorganic flame retardant Substances 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005606 polypropylene copolymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000012721 stereospecific polymerization Methods 0.000 description 1
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電力ケーブルおよ
びその接続構造に関し、詳しくはシンジオタクチックポ
リプロピレン層と架橋ポリエチレン層との積層を含む絶
縁層を有する電力ケーブルおよびその接続構造に関す
る。The present invention relates to a power cable and a connection structure thereof, and more particularly, to a power cable having an insulating layer including a laminate of a syndiotactic polypropylene layer and a crosslinked polyethylene layer, and a connection structure thereof.
【０００２】[0002]
【従来の技術・発明が解決しようとする課題】従来、超
高圧送電線路等には油浸紙絶縁ケーブルが利用されてき
たが、プラスチック絶縁技術の目覚ましい進歩により、
防災特性、誘電特性に優れ、保守の容易な架橋ポリエチ
レン（以下、ＸＬＰＥという）絶縁ケーブルの利用が拡
大している。しかし、近年の大都市圏における電力需要
の増大に対処するために、より高圧の送電に耐え得る電
力ケーブルおよびその接続構造の開発が望まれており、
それに伴ってさらに高度な電気特性や物性をもつプラス
チック電気絶縁層が求められている。2. Description of the Related Art Conventionally, oil-impregnated insulated cables have been used for ultrahigh-voltage transmission lines and the like, but with the remarkable progress of plastic insulation technology,
The use of crosslinked polyethylene (hereinafter referred to as XLPE) insulated cables, which have excellent disaster prevention properties and dielectric properties and are easy to maintain, is expanding. However, in order to cope with an increase in power demand in a recent metropolitan area, development of a power cable and a connection structure capable of withstanding higher-voltage power transmission is desired.
Accordingly, a plastic electric insulating layer having higher electric properties and physical properties has been demanded.
【０００３】本発明の目的は、より高度な耐電圧特性を
有し、かつ可撓性に優れた絶縁層を有する、電力ケーブ
ルおよびその接続構造を提供することにある。[0003] An object of the present invention is to provide a power cable and a connection structure thereof having a higher withstand voltage characteristic and an insulating layer having excellent flexibility.
【０００４】[0004]
【課題を解決するための手段】本発明者は、上記目的を
達成するために鋭意研究を行った結果、シンジオタクチ
ックポリプロピレン（以下、ｓ−ＰＰという）が、従来
の汎用電気絶縁材料であるＸＬＰＥよりも高度な耐電圧
特性を有することを見出した。さらに、ｓ−ＰＰ層とＸ
ＬＰＥ層とを積層することによって得られる絶縁層は、
耐電圧特性に優れ、かつケーブルに適用する際の必要特
性である可撓性にも優れていることを見出し、本発明を
完成するに至った。Means for Solving the Problems The present inventor has made intensive studies to achieve the above object, and as a result, syndiotactic polypropylene (hereinafter referred to as s-PP) is a conventional general-purpose electric insulating material. It has been found that it has higher withstand voltage characteristics than XLPE. Further, the s-PP layer and X
The insulating layer obtained by laminating the LPE layer,
The inventors have found that they have excellent withstand voltage characteristics and also have excellent flexibility, which is a characteristic required when applied to a cable, and have completed the present invention.
【０００５】即ち本発明は、ｓ−ＰＰ層とＸＬＰＥ層と
の積層を含む絶縁層を有する電力ケーブルおよびその接
続構造に関する。また、該絶縁層のｓ−ＰＰ層とＸＬＰ
Ｅ層との積層において、該ｓ−ＰＰ層が内側の層である
電力ケーブルおよびその接続構造に関する。That is, the present invention relates to a power cable having an insulating layer including a stack of an s-PP layer and an XLPE layer, and a connection structure thereof. Also, the s-PP layer of the insulating layer and the XLP
The present invention relates to a power cable in which the s-PP layer is an inner layer in a stack with an E layer and a connection structure thereof.
【０００６】[0006]
【発明の実施の形態】本発明の電力ケーブルおよび電力
ケーブルの接続構造を図を用いて詳しく説明する。図１
は、本発明による電力ケーブルおよび電力ケーブルの接
続構造の断面を示す模式図である。同図では、本発明の
電力ケーブルＡ１、Ａ２を用いて、本発明の接続構造Ｂ
を構成した場合を示している。本発明の電力ケーブル
は、ｓ−ＰＰ層とＸＬＰＥ層との積層を含む絶縁層を有
する。図１に示すように、電力ケーブルＡ１において、
絶縁層１ａは導体４上に設けられる。このとき、絶縁層
１ａの構成要素であるｓ−ＰＰ層２ａおよびＸＬＰＥ層
３ａは、いずれの積層順で設けられていてもよいが、図
１のようにｓ−ＰＰ層２ａが下層側となって導体４に直
に接することが好ましい。また、本発明の接続構造も、
ｓ−ＰＰ層とＸＬＰＥ層との積層を含む絶縁層を有す
る。図１に示すように、電力ケーブルの接続構造Ｂにお
いて、絶縁層１ｂは導体接続スリーブ５上に設けられ
る。このとき、電力ケーブルＡ１と同様に、絶縁層１ｂ
の構成要素であるｓ−ＰＰ層２ｂおよびＸＬＰＥ層３ｂ
は、いずれの積層順で設けられていてもよいが、図１の
ようにｓ−ＰＰ層２ｂが下層側となって導体接続スリー
ブ５に直に接することが好ましい。さらに、図１のよう
に、本発明の電力ケーブルを本発明の電力ケーブルの接
続構造を用いて接続するにあたって、電力ケーブルの絶
縁層の積層の外側に、さらにｓ−ＰＰ層および／または
ＸＬＰＥ層が積層された部分Ｃが存在してもよい。DESCRIPTION OF THE PREFERRED EMBODIMENTS A power cable and a connection structure of the power cable according to the present invention will be described in detail with reference to the drawings. FIG.
1 is a schematic view showing a cross section of a power cable and a connection structure of the power cable according to the present invention. In the figure, the connection structure B of the present invention is formed by using the power cables A1 and A2 of the present invention.
Is shown. The power cable of the present invention has an insulating layer including a stack of an s-PP layer and an XLPE layer. As shown in FIG. 1, in the power cable A1,
The insulating layer 1a is provided on the conductor 4. At this time, the s-PP layer 2a and the XLPE layer 3a, which are components of the insulating layer 1a, may be provided in any lamination order, but as shown in FIG. It is preferable to make direct contact with the conductor 4. Also, the connection structure of the present invention
An insulating layer including a stack of an s-PP layer and an XLPE layer is provided. As shown in FIG. 1, in the power cable connection structure B, the insulating layer 1 b is provided on the conductor connection sleeve 5. At this time, similarly to the power cable A1, the insulating layer 1b
S-PP layer 2b and XLPE layer 3b
May be provided in any lamination order, but it is preferable that the s-PP layer 2b is on the lower layer side and is in direct contact with the conductor connection sleeve 5 as shown in FIG. Further, as shown in FIG. 1, when the power cable of the present invention is connected using the power cable connection structure of the present invention, an s-PP layer and / or an XLPE layer are further provided outside the laminated power cable insulating layer. May be present.
【０００７】本発明で使用されるｓ−ＰＰは、シンジオ
タクチック構造を有するポリプロピレンの単独重合体の
みならず、プロピレンと他のオレフィンとの共重合体も
含む概念であり、以下の説明においては、当該共重合体
を含めてｓ−ＰＰという。本発明においては、ホモポリ
マーであるｓ−ＰＰが好ましい。The concept of s-PP used in the present invention includes not only a homopolymer of polypropylene having a syndiotactic structure but also a copolymer of propylene and another olefin. , S-PP including the copolymer. In the present invention, s-PP, which is a homopolymer, is preferred.
【０００８】共重合体を形成する他のオレフィンとして
は、例えばエチレンの他に炭素数４〜２０程度のα−オ
レフィンが挙げられる。Other olefins forming the copolymer include, for example, α-olefins having about 4 to 20 carbon atoms in addition to ethylene.
【０００９】当該ｓ−ＰＰの重量平均分子量は、押し出
し加工性等の点から、好ましくは3,000 〜400,000 、さ
らに好ましくは10,000〜200,000 である。The weight average molecular weight of the s-PP is preferably from 3,000 to 400,000, more preferably from 10,000 to 200,000, from the viewpoint of extrusion processability and the like.
【００１０】本発明で使用されるｓ−ＰＰは、そのシン
ジオタクチックペンタッド分率が０．７以上である。こ
こでシンジオタクチックペンタッド分率とは、１３５℃
の１，２，４−トリクロロベンゼン溶液で６７．８ＭＨ
ｚにて測定した13Ｃ−ＮＭＲスペクトルにおいて、テト
ラメチルシランを基準として２０．２ｐｐｍに観測され
るピーク強度（シンジオタクチックペンタッド連鎖に帰
属されるメチル基のピーク強度）のプロピレン単位の全
メチル基に帰属されるピーク強度に対する割合をいう。
シンジオタクチックペンタッド分率が０．７未満のｓ−
ＰＰは、融点が低く、かつ電気的破壊強度や機械特性も
低下するので、本発明の絶縁層の材料としては使用すべ
きでない。上記シンジオタクチックペンタッド分率は、
好ましくは耐電界性の点から０．８〜０．９５、さらに
好ましくは加工性の点から０．８６〜０．９５である。The s-PP used in the present invention has a syndiotactic pentad fraction of 0.7 or more. Here, the syndiotactic pentad fraction is 135 ° C.
67.8 MH in 1,2,4-trichlorobenzene solution
In the 13 C-NMR spectrum measured at z, the peak intensity (peak intensity of the methyl group attributable to the syndiotactic pentad chain) observed at 20.2 ppm with respect to tetramethylsilane is the total methyl of the propylene unit. It means the ratio to the peak intensity attributed to the group.
S- having a syndiotactic pentad fraction of less than 0.7
PP should not be used as a material for the insulating layer of the present invention because it has a low melting point and also has a low electrical breakdown strength and mechanical properties. The syndiotactic pentad fraction is
It is preferably 0.8 to 0.95 from the viewpoint of electric field resistance, and more preferably 0.86 to 0.95 from the viewpoint of workability.
【００１１】さらに当該ｓ−ＰＰは、ＡＳＴＭ−Ｄ−１
２３８で規定するメルトフローレート（ＭＦＲ，荷重：
１０ｋｇｆ、温度：２３０℃）が、０．１〜２０ｇ／１
０分の範囲である。２０ｇ／１０分を越えるＭＦＲをも
つｓ−ＰＰは高温における流動性が過大になりすぎ、逆
に０．１ｇ／１０分未満のＭＦＲをもつｓ−ＰＰは流動
性が過少となりすぎる。従って、上記範囲外のものは、
本発明の絶縁層の材料とした場合、加工性に難点がでて
くる。上記ＭＦＲは、好ましくは高温流動性の点から
０．３〜１５ｇ／１０分、さらに好ましくは加工性の点
から０．５〜１０ｇ／１０分の範囲である。Further, the s-PP is ASTM-D-1
Melt flow rate (MFR, load:
10 kgf, temperature: 230 ° C.) is 0.1 to 20 g / 1.
The range is 0 minutes. S-PP with MFR over 20 g / 10 min has too much fluidity at high temperatures, and s-PP with MFR below 0.1 g / 10 min has too little fluidity. Therefore, those outside the above range
When the material of the insulating layer of the present invention is used, there is a problem in workability. The MFR is preferably in the range of 0.3 to 15 g / 10 minutes from the viewpoint of high-temperature fluidity, and more preferably in the range of 0.5 to 10 g / 10 minutes from the viewpoint of processability.
【００１２】上記ｓ−ＰＰの製造法には特に制限はな
い。即ち、用いられる重合触媒としては、対称もしくは
非対称分子構造を有する有機金属錯体系触媒、例えばメ
タロセン化合物等の立体特異性重合触媒等が使用しう
る。また、重合条件にも特に制限はなく、例えば、塊状
重合法、気相重合法、不活性溶媒を用いる溶液重合法等
の方法によって製造しうる。The method for producing the s-PP is not particularly limited. That is, as the polymerization catalyst to be used, an organometallic complex catalyst having a symmetric or asymmetric molecular structure, for example, a stereospecific polymerization catalyst such as a metallocene compound or the like can be used. The polymerization conditions are not particularly limited. For example, they can be produced by a bulk polymerization method, a gas phase polymerization method, a solution polymerization method using an inert solvent, or the like.
【００１３】本発明に用いられるＸＬＰＥの架橋方法は
特に制限されないが、例えばＭＦＲ０．３〜１０ｇ／１
０分の低密度ポリエチレン（以下、ＬＤＰＥ）を、架橋
剤等により架橋したものが挙げられる。架橋剤として
は、ジクミルパーオキサイド（ＤＣＰ）、２，５−ジメ
チル−ジ−ｔ−ブチルパーオキシヘキサン、１，３−ビ
ス（ｔ−ブチルパーオキシイソプロピル）ベンゼン、
２，５−ジメチル−２，５−ジ（ｔ−ブチルパーオキ
シ）ヘキシン−３等が例示される。上記架橋剤の配合量
は、ポリエチレン１００重量部に対し、通常０．３〜
５．０重量部程度、好ましくは１．０〜３．０重量部、
より好ましくは１．５〜２．５重量部程度である。[0013] The method of crosslinking XLPE used in the present invention is not particularly limited. For example, the MFR is 0.3 to 10 g / 1.
A low-density polyethylene (hereinafter, LDPE) for 0 minutes is crosslinked with a crosslinking agent or the like. Examples of the crosslinking agent include dicumyl peroxide (DCP), 2,5-dimethyl-di-t-butylperoxyhexane, 1,3-bis (t-butylperoxyisopropyl) benzene,
Examples thereof include 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3 and the like. The amount of the crosslinking agent is usually 0.3 to 100 parts by weight of polyethylene.
About 5.0 parts by weight, preferably 1.0 to 3.0 parts by weight,
More preferably, it is about 1.5 to 2.5 parts by weight.
【００１４】該絶縁層には、ヒンダードフェノール系、
アミン系等の公知の酸化防止剤が配合されていてもよ
い。これらの酸化防止剤の配合量は、絶縁層を構成する
ｓ−ＰＰおよびＸＬＰＥ１００重量部に対して、通常
０．０５〜５．０重量部、好ましくは０．１〜２．０重
量部、より好ましくは０．１〜１．０重量部である。ま
た、当該絶縁層には、必要に応じて、架橋助剤、加工助
剤、ヒンダードフェノール系、アミン系、あるいはチオ
エーテル系等の安定剤、アミド系、ヒドラジッド系等の
銅害防止剤、ベンゾフェノン系、ベンゾイン系等の紫外
線防止剤、高級脂肪酸系あるいはその金属塩系等の滑
剤、有機・無機系顔料、有機・無機系難燃剤、およびシ
リカやクレー等の充填剤等、プラスチックに通常用いら
れる添加剤が配合されていてもよい。The insulating layer includes a hindered phenol type,
A known antioxidant such as an amine may be blended. The compounding amount of these antioxidants is usually 0.05 to 5.0 parts by weight, preferably 0.1 to 2.0 parts by weight, based on 100 parts by weight of s-PP and XLPE constituting the insulating layer. Preferably it is 0.1-1.0 weight part. In addition, the insulating layer may include a crosslinking aid, a processing aid, a hindered phenol-based, amine-based, or thioether-based stabilizer, an amide-based or hydrazide-based copper damage inhibitor, and benzophenone, if necessary. System, benzoin based UV inhibitors, higher fatty acid based or metal salt based lubricants, organic / inorganic pigments, organic / inorganic flame retardants, and fillers such as silica and clay, etc. An additive may be blended.
【００１５】本発明に用いられる絶縁層は、ｓ−ＰＰ層
とＸＬＰＥ層の２層からなり、耐電界性の点からｓ−Ｐ
Ｐ層を内側の層に、高温における絶縁体形状保持の点か
らＸＬＰＥ層を外側の層に置くことが望ましい。即ち、
図１のように、ｓ−ＰＰ層が下層側となって導体に直に
接することが好ましい。また、本発明の電力ケーブルを
本発明の電力ケーブルの接続構造を用いて接続するにあ
たっては、電力ケーブルの絶縁層と接続構造の絶縁層と
がオーバーラップすることによって、部分的に（図１に
おける部分Ｃ）電力ケーブルの絶縁層の積層の外側に、
さらにｓ−ＰＰ層および／またはＸＬＰＥ層が積層され
た状態となっていてもよい。本発明におけるｓ−ＰＰ層
とＸＬＰＥ層の厚さの比率は、１：９０〜５：５であ
り、好ましくは耐電界性の点から１：９〜５：５、さら
に好ましい比率は３：７〜５：５である。The insulating layer used in the present invention is composed of two layers, an s-PP layer and an XLPE layer.
It is desirable to place the P layer on the inner layer and the XLPE layer on the outer layer in order to maintain the insulator shape at high temperatures. That is,
As shown in FIG. 1, it is preferable that the s-PP layer be on the lower layer side and directly contact the conductor. When the power cable of the present invention is connected using the power cable connection structure of the present invention, the insulating layer of the power cable and the insulating layer of the connection structure partially overlap (FIG. 1). Part C) Outside the stack of insulating layers of the power cable,
Further, the s-PP layer and / or the XLPE layer may be in a laminated state. In the present invention, the ratio of the thickness of the s-PP layer to the thickness of the XLPE layer is 1:90 to 5: 5, preferably 1: 9 to 5: 5 from the viewpoint of electric field resistance, and more preferably 3: 7. ５5: 5.
【００１６】本発明の電力ケーブルに用いられる導体と
しては、公知の導体、例えば純銅、銅合金導体等が挙げ
られ、これら以外にも、前記導体にメッキを施したも
の、例えばニッケル、銀、錫によるメッキを施したもの
等が挙げられ、特にニッケルメッキしたものが好まし
い。さらに、前記導体にエナメル等を焼付したもの等も
用いられる。The conductors used in the power cable of the present invention include known conductors such as pure copper and copper alloy conductors. In addition to these, those obtained by plating the conductors such as nickel, silver and tin And the like, and particularly preferred is a nickel-plated one. Further, those obtained by baking enamel or the like on the conductor are also used.
【００１７】また、本発明において電力ケーブルの接続
構造とは、電力ケーブルと電力ケーブルとの接続構造の
みならず、電力ケーブルと配線器具端子との接続構造を
も意味する。In the present invention, the connection structure of the power cable means not only the connection structure between the power cable and the power cable but also the connection structure between the power cable and the wiring device terminal.
【００１８】本発明の電力ケーブルおよびその接続構造
の製造方法は特に制限されず、自体既知の方法によって
製造することができる。例えば、ｓ−ＰＰ／ＸＬＰＥ両
層を導体等の上に同時押出しする方法により製造するこ
とができる。The method of manufacturing the power cable and the connection structure of the present invention is not particularly limited, and the power cable and the connection structure can be manufactured by a method known per se. For example, it can be manufactured by a method of simultaneously extruding both s-PP / XLPE layers onto a conductor or the like.
【００１９】また、本発明の電力ケーブルおよびその接
続構造は、上記ｓ−ＰＰ層、ＸＬＰＥ層の他に、低密度
ポリエチレン、エチレンプロピレンゴム等の公知の絶縁
層と積層して用いてもよい。Further, the power cable and the connection structure of the present invention may be used by laminating a known insulating layer such as low-density polyethylene and ethylene propylene rubber in addition to the above-mentioned s-PP layer and XLPE layer.
【００２０】さらに、本発明の電力ケーブルおよびその
接続構造としては、さらにシース層を被覆したもの、導
体にセパレーターを施したものが挙げられる。また、導
体上及び絶縁体上に半導電層を付与したものであっても
よい。Further, examples of the power cable and the connection structure of the present invention include those in which a sheath layer is further coated and those in which a conductor is provided with a separator. Further, a semiconductive layer may be provided on a conductor and an insulator.
【００２１】本発明で使用される絶縁層の室温での交流
（ＡＣ）破壊電界強度は、ｓ−ＰＰ層を内層に置いた場
合、従来のＸＬＰＥよりも５〜１６％高く、また室温で
のインパルス破壊電界強度は、ｓ−ＰＰ層を内側の層に
置いた場合、従来のＸＬＰＥよりも５〜１５％高い。The alternating-current (AC) breakdown electric field strength at room temperature of the insulating layer used in the present invention is 5 to 16% higher than that of the conventional XLPE when the s-PP layer is placed in the inner layer, and at room temperature. The impulse breakdown field strength is 5-15% higher than conventional XLPE when the s-PP layer is placed on the inner layer.
【００２２】[0022]
【実施例】以下、実施例を用いて本発明をさらに詳しく
説明するが、本発明はこれらにより何ら限定されない。EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.
【００２３】本発明の電力ケーブルおよびその接続構造
の特性を評価するために、次のようにして得られる絶縁
層を用いて試験を行った。ｓ−ＰＰおよびＸＬＰＥシー
トを任意の厚さで作成した後、これらを金型内で張り合
わせ、圧縮成形機中で１８０℃で１５分間加圧・加熱し
て融着させ、表１に示す比率の１．０ｍｍ厚のシートを
得、これを試料とした。また、比較例３では下記ｓ−Ｐ
ＰおよびＸＬＰＥを１：１（重量比）でブレンドして１
ｍｍ厚のシートを得、これを試料とした。なお、実施例
の耐電圧試験は、ｓ−ＰＰ層を高電圧側にセットして行
った。なお、実施例、比較例で用いたポリマーは以下の
通りである。 （１）ｓ−ＰＰ（シンジオタクチックペンタッド分率：
０．８０，ＭＦＲ：８．９０ｇ／１０分） （２）ＸＬＰＥ（ＬＤＰＥ：三菱化学製 ＺＦ−３２;1
00重量部，架橋剤：ＤＣＰ;1.9重量部，老化防止剤：大
内新興化学工業製 ノクラック３００;0.2重量部，架橋
時間：１５分，架橋温度：１８０℃）In order to evaluate the characteristics of the power cable of the present invention and the connection structure thereof, a test was performed using an insulating layer obtained as follows. After preparing the s-PP and XLPE sheets at an arbitrary thickness, they are laminated in a mold, pressed and heated at 180 ° C. for 15 minutes in a compression molding machine and fused to obtain a sheet having a ratio shown in Table 1. A sheet having a thickness of 1.0 mm was obtained and used as a sample. In Comparative Example 3, the following sP
P and XLPE are blended at 1: 1 (weight ratio) to give 1
A sheet having a thickness of mm was obtained and used as a sample. The withstand voltage test of the example was performed with the s-PP layer set on the high voltage side. The polymers used in Examples and Comparative Examples are as follows. (1) s-PP (Syndiotactic pentad fraction:
0.80, MFR: 8.90 g / 10 min) (2) XLPE (LDPE: ZF-32; 1 manufactured by Mitsubishi Chemical Corporation)
(00 parts by weight, crosslinking agent: DCP; 1.9 parts by weight, antioxidant: Ouchi Shinko Chemical Nocrack 300; 0.2 parts by weight, crosslinking time: 15 minutes, crosslinking temperature: 180 ° C.)
【００２４】（インパルス破壊試験）上記試料を、改良
型McKeown 電極系にて、１×４０μsec の負極性インパ
ルス標準波を予想破壊電圧の７０％値を初期値として、
室温にて、５kv/3回印加のステップアップ昇圧方式で課
電した。なお、１条件につき１０試料のデータを採取
し、ワイブル解析後、破壊確率６３．３％における破壊
値をもって、その試料のインパルス耐圧値とした。(Impulse Breakdown Test) The above sample was subjected to a 1 × 40 μsec negative impulse standard wave using an improved McKeown electrode system with 70% of the expected breakdown voltage as an initial value.
At room temperature, power was applied by a step-up voltage boost method of applying 5 kv / 3 times. In addition, data of 10 samples were collected under one condition, and after Weibull analysis, the impulse withstand voltage value of the sample was defined as the destruction value at the probability of destruction of 63.3%.
【００２５】（ＡＣ破壊試験）上記試料を、改良型McKe
own 電極系にて、予想破壊電圧の７０％値を初期値とし
て、室温にて、１kv/1分印加のステップアップ昇圧方式
で課電した。なお、１条件につき１０試料のデータを採
取し、ワイブル解析後、破壊確率６３．３％における破
壊値をもって、その試料のＡＣ耐圧値とした。(AC destruction test) The above sample was used as an improved McKe
In the own electrode system, a voltage was applied at room temperature by a step-up step-up method of applying 1 kv / 1 minute at an initial value of 70% of the expected breakdown voltage. In addition, 10 samples of data were collected under one condition, and after Weibull analysis, the AC withstand voltage value of the sample was defined as the destruction value at the probability of destruction of 63.3%.
【００２６】（可撓性評価）ＪＩＳ Ｋ ７１１３（プ
ラスチックの引張試験法）に準じ、上記試料を２号形試
験片形状に打抜刃で打ち抜き、同試験片について引張試
験を行い（試験速度２００ｍｍ／ｍｉｎ）、引張降伏強
さを測定した。これらの結果を表１に示す。(Evaluation of Flexibility) According to JIS K 7113 (Plastic tensile test method), the above sample was punched into a No. 2 test piece shape with a punching blade, and a tensile test was performed on the test piece (test speed 200 mm). / Min), and the tensile yield strength was measured. Table 1 shows the results.
【００２７】[0027]
【表１】 [Table 1]
【００２８】表１からわかるように、実施例の絶縁層は
高い耐電圧特性を有し、かつ可撓性にも優れるものであ
った。一方、ｓ−ＰＰ単層を絶縁層とした比較例１は可
撓性に劣り、ＸＬＰＥ単層を絶縁層とした比較例２は耐
電圧特性に劣るものであった。また実施例の絶縁層は、
ｓ−ＰＰとＸＬＰＥをブレンドして得られた絶縁層であ
る比較例３と比較しても、耐電圧特性および可撓性に優
れるものであった。As can be seen from Table 1, the insulating layers of the examples had high withstand voltage characteristics and excellent flexibility. On the other hand, Comparative Example 1 using the s-PP single layer as the insulating layer was inferior in flexibility, and Comparative Example 2 using the XLPE single layer as the insulating layer was inferior in withstand voltage characteristics. In addition, the insulating layer of the embodiment,
Even in comparison with Comparative Example 3, which is an insulating layer obtained by blending s-PP and XLPE, it was excellent in withstand voltage characteristics and flexibility.
【００２９】実施例４ ２７５ｋＶのＣＶケーブル（導体径５７ｍｍ，断面積１
９００ｍｍ2 ）と、４層同時押出〔積層の内側から順
に、内部半導電層、絶縁層（ｓ−ＰＰ：ＸＬＰＥ＝３：
７（厚み比））、外部半導電層〕のケーブル（押出後加
熱架橋，絶縁厚２７ｍｍ）の２本のケーブルを用い、以
下のようにして、図１に示すような接続構造を形成し
た。ケーブルの端部の絶縁体部６０ｍｍを取り除いて導
体を露出させ、さらに絶縁体をテーパ状に加工した。次
いで、２本のケーブルの導体の露出部に導体接続スリー
ブを取り付けた。この後、接続部上にｓ−ＰＰを１４０
℃で２時間押出成形し、次にＬＤＰＥ（ＤＣＰ含有）を
１２０℃で２時間押出成形した。さらに全体を２２０℃
で６時間加熱し、架橋した。なお、接続構造における絶
縁層の最大厚みは３２ｍｍであり、ｓ−ＰＰ層とＸＬＰ
Ｅ層の厚み比は３：７である。Example 4 275 kV CV cable (conductor diameter 57 mm, cross-sectional area 1
900 mm 2 ) and four layers simultaneously extruded [inner semiconductive layer, insulating layer (s-PP: XLPE = 3:
7 (thickness ratio), and a cable (external semiconductive layer) (heat cross-linking after extrusion, insulation thickness 27 mm), and a connection structure as shown in FIG. 1 was formed as follows. The conductor was exposed by removing the insulator portion 60 mm at the end of the cable, and the insulator was further tapered. Next, a conductor connection sleeve was attached to the exposed portions of the conductors of the two cables. After this, 140 s-PP is placed on the connection.
C. for 2 hours, then LDPE (containing DCP) at 120.degree. C. for 2 hours. 220 ° C
For 6 hours to crosslink. The maximum thickness of the insulating layer in the connection structure is 32 mm, and the s-PP layer and the XLP
The thickness ratio of the E layer is 3: 7.
【００３０】比較例４ ケーブルおよびケーブルの接続構造の絶縁層をＸＬＰＥ
層のみとした以外は、実施例４と同様にして接続構造を
形成した。Comparative Example 4 The insulating layer of the cable and the cable connection structure was XLPE
A connection structure was formed in the same manner as in Example 4 except that only the layers were used.
【００３１】以上のようにして得られた実施例４および
比較例４の接続構造について、商用破壊電圧を測定した
ところ、実施例４は１０００ｋＶ以上であり、一方比較
例４は９１０ｋＶと低いものであった。With respect to the connection structures of Example 4 and Comparative Example 4 obtained as described above, when the commercial breakdown voltage was measured, Example 4 was 1000 kV or more, while Comparative Example 4 was as low as 910 kV. there were.
【００３２】[0032]
【発明の効果】本発明によれば、より高度な耐電圧特性
を有し、かつ可撓性に優れた絶縁層を有する、電力ケー
ブルおよびその接続構造を提供することができる。According to the present invention, it is possible to provide a power cable having a higher withstand voltage characteristic and an insulating layer having excellent flexibility, and a connection structure thereof.
【図１】本発明の電力ケーブルおよびその接続構造の一
実施態様を示す断面図である。FIG. 1 is a sectional view showing an embodiment of a power cable and a connection structure thereof according to the present invention.
Ａ１、Ａ２ 電力ケーブル Ｂ 電力ケーブルの接続構造 Ｃ 電力ケーブルと電力ケーブルの接続構造と
の重複部分 １ａ、１ｂ 絶縁層 ２ａ、２ｂ ｓ−ＰＰ層 ３ａ、３ｂ ＸＬＰＥ層 ４ 導体 ５ 導体接続スリーブA1, A2 Power cable B Power cable connection structure C Overlap portion between power cable and power cable connection structure 1a, 1b Insulation layer 2a, 2b s-PP layer 3a, 3b XLPE layer 4 Conductor 5 Conductor connection sleeve
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｂ 9/00 Ｈ０１Ｂ 9/00 Ａ (72)発明者 加藤 寛 兵庫県尼崎市東向島西之町８番地 三菱電 線工業株式会社内 (72)発明者 内田 治 大阪府高石市高砂１丁目６番地 三井東圧 化学株式会社内 (72)発明者 内川 進隆 東京都千代田区霞が関三丁目２番５号 三 井東圧化学株式会社内 (72)発明者 吉野 勝美 大阪府岸和田市尾生町166−３──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H01B 9/00 H01B 9/00 A (72) Inventor Hiroshi Kato 8 Nishinomachi, Higashimukaijima, Amagasaki City, Hyogo Prefecture Mitsubishi Electric Wire & Cable Co., Ltd. Within (72) Inventor Osamu Uchida 1-6-6 Takasago, Takaishi City, Osaka Prefecture Within Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Nobutaka Uchikawa 3-5-2 Kasumigaseki, Chiyoda-ku, Tokyo Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Katsumi Yoshino 166-3 Oomachi, Kishiwada-shi, Osaka
Claims (4)
架橋ポリエチレン層との積層を含む絶縁層を有する電力
ケーブル。1. A power cable having an insulating layer including a laminate of a syndiotactic polypropylene layer and a crosslinked polyethylene layer.
架橋ポリエチレン層との積層において、シンジオタクチ
ックポリプロピレン層が内側の層である請求項１記載の
電力ケーブル。2. The power cable according to claim 1, wherein in the lamination of the syndiotactic polypropylene layer and the crosslinked polyethylene layer, the syndiotactic polypropylene layer is an inner layer.
架橋ポリエチレン層との積層を含む絶縁層を有する電力
ケーブルの接続構造。3. A power cable connection structure having an insulating layer including a laminate of a syndiotactic polypropylene layer and a crosslinked polyethylene layer.
架橋ポリエチレン層との積層において、シンジオタクチ
ックポリプロピレン層が内側の層である請求項３記載の
電力ケーブルの接続構造。4. The power cable connection structure according to claim 3, wherein the syndiotactic polypropylene layer is an inner layer in the lamination of the syndiotactic polypropylene layer and the crosslinked polyethylene layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30922896A JPH10149723A (en) | 1996-11-20 | 1996-11-20 | Power cable and connecting structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30922896A JPH10149723A (en) | 1996-11-20 | 1996-11-20 | Power cable and connecting structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10149723A true JPH10149723A (en) | 1998-06-02 |
Family
ID=17990484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30922896A Pending JPH10149723A (en) | 1996-11-20 | 1996-11-20 | Power cable and connecting structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10149723A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002538591A (en) * | 1999-03-04 | 2002-11-12 | ネクサン | Power cable with at least one nanocomposite coating |
-
1996
- 1996-11-20 JP JP30922896A patent/JPH10149723A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002538591A (en) * | 1999-03-04 | 2002-11-12 | ネクサン | Power cable with at least one nanocomposite coating |
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