JPH10151609A - Multilayer particle board and its manufacture - Google Patents
Multilayer particle board and its manufactureInfo
- Publication number
- JPH10151609A JPH10151609A JP8327796A JP32779696A JPH10151609A JP H10151609 A JPH10151609 A JP H10151609A JP 8327796 A JP8327796 A JP 8327796A JP 32779696 A JP32779696 A JP 32779696A JP H10151609 A JPH10151609 A JP H10151609A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- particle board
- adhesive
- manufacture
- multilayer particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 15
- 239000004640 Melamine resin Substances 0.000 claims abstract description 13
- 239000012792 core layer Substances 0.000 claims abstract description 12
- 239000004312 hexamethylene tetramine Substances 0.000 claims abstract description 10
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims abstract description 10
- 239000012948 isocyanate Substances 0.000 claims abstract description 10
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 10
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims abstract description 5
- 239000002344 surface layer Substances 0.000 claims description 14
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 15
- 230000000704 physical effect Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 abstract 2
- 229960004011 methenamine Drugs 0.000 abstract 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Chemical And Physical Treatments For Wood And The Like (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は物性の優れる多層パ
ーティクルボードとその製造方法に係る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer particle board having excellent physical properties and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】多層パーティクルボードの物性を向上さ
せるために、芯層及び表層に用いる接着剤として、芯
層用はイソシアネート樹脂＋表層用はアルカリフェノー
ル樹脂、芯層用、表層用とも低モル比メラミン樹脂、
芯層用、表層用ともイソシアネート樹脂の構成が提案
されている。2. Description of the Related Art To improve the physical properties of a multilayer particle board, as an adhesive used for a core layer and a surface layer, an isocyanate resin for the core layer + an alkali phenol resin for the surface layer, and a low molar ratio for both the core layer and the surface layer. Melamine resin,
The constitution of the isocyanate resin has been proposed for both the core layer and the surface layer.
【０００３】[0003]
【発明が解決しようとする課題】ところが、の構成で
は表層にアルカリフェノール樹脂を用いるためパーティ
クルボードの表面が暗赤色にアルカリ汚染する問題があ
った。また、の構成ではイソシアネート樹脂は金属と
の接着性が良いから製造時にホットプレスの熱盤へ付着
する問題があった。さらに、の構成では長時間の熱圧
締を必要とするとともに物性も満足できるものではない
問題があった。However, the structure described above has a problem that the surface of the particle board is alkali-polluted to a dark red color because an alkali phenol resin is used for the surface layer. In addition, in the configuration (1), there is a problem that the isocyanate resin adheres to a hot press hot platen at the time of production because of good adhesion to metal. In addition, the above configuration requires long-time heat-pressing and has a problem that physical properties are not satisfactory.
【０００４】本発明の目的とするところは、物性の優れ
る多層パーティクルボードを製造に支障なく得ることが
できる構成と方法を提供することにある。An object of the present invention is to provide a structure and a method capable of obtaining a multilayer particle board having excellent physical properties without hindering the production.
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１記載の
発明は、芯層用接着剤の樹脂としてイソシアネート樹脂
を、表層用接着剤の樹脂としてメラミン樹脂にヘキサメ
チレンテトラミンを添加した接着剤を使用したことを特
徴とする。According to a first aspect of the present invention, there is provided an adhesive obtained by adding an isocyanate resin as a resin for an adhesive for a core layer and a melamine resin to a melamine resin as a resin for an adhesive for a surface layer. Is used.
【０００６】本発明の請求項２記載の発明は、芯層用チ
ップにイソシアネート樹脂を表層用チップにメラミン樹
脂にヘキサメチレンテトラミンを添加した接着剤を塗布
してフォーミングし、熱圧締成形することを特徴とす
る。According to a second aspect of the present invention, a core layer chip is coated with an isocyanate resin, and a surface layer chip is coated with an adhesive obtained by adding hexamethylenetetramine to melamine resin, followed by forming and hot pressing. It is characterized by.
【０００７】表層用チップに塗布する接着剤は、ホルム
アルデヒド／メラミンのモル比１．０〜１．７のメラミ
ン樹脂に対してヘキサメチレンテトラミンを３〜１０重
量％添加した組成物をバインダとして用い、必要に応じ
て塩化アンモニウム等の硬化剤を添加して熱圧時間を短
縮してもよい。熱圧締温度は１８０〜２００℃で行う。[0007] The adhesive applied to the surface layer chip is a melamine resin having a formaldehyde / melamine molar ratio of 1.0 to 1.7 and 3 to 10% by weight of hexamethylenetetramine added thereto as a binder. If necessary, a curing agent such as ammonium chloride may be added to shorten the hot pressing time. The hot pressing temperature is 180 to 200 ° C.
【０００８】ヘキサメチレンテトラミンは１８０℃以上
で分離し、メラミン樹脂が完全硬化するに必要とするホ
ルムアルデヒド源となり、パーティクルボードの物性が
向上されるものである。Hexamethylenetetramine separates at 180 ° C. or higher, becomes a formaldehyde source necessary for the melamine resin to be completely cured, and improves the physical properties of the particle board.
【０００９】[0009]
【実施例】木質廃材を破砕して特定メッシュを通過させ
て乾燥し、所望の大きさの芯層用チップ及び表層用チッ
プを得た。この芯層用チップにイソシアネート樹脂を５
ｋｇ／ｍ３、表層用チップにホルムアルデヒド／メラミ
ンのモル比１．７のメラミン樹脂にヘキサメチレンテト
ラミンを５重量％と塩化アンモニウム少量を添加した組
成物を５ｋｇ／ｍ３塗布してフォーミングし、温度１８
０℃で常法で熱圧成形し、求める多層パーティクルボー
ドを得た。EXAMPLE Waste wood was crushed, passed through a specific mesh, and dried to obtain core layer chips and surface layer chips of desired sizes. Add 5 isocyanate resin to the core layer chip.
5 kg / m3 of a composition obtained by adding 5% by weight of hexamethylenetetramine and a small amount of ammonium chloride to a melamine resin having a formaldehyde / melamine molar ratio of 1.7 on a surface layer chip was applied at 5 kg / m3, and formed at a temperature of 18 ° C.
It was hot-pressed at 0 ° C. by a conventional method to obtain a desired multilayer particle board.
【０００９】[0009]
【発明の効果】本発明によれば、芯層用接着剤の樹脂と
してイソシアネート樹脂を、表層用接着剤の樹脂として
メラミン樹脂にヘキサメチレンテトラミンを添加したも
のを使用したから、製造時にホットプレスの熱盤にチッ
プが付着したりすることなく容易に製造でき、表層用接
着剤の樹脂に添加したヘキサメチレンテトラミンが熱圧
締温度１８０℃以上で分離し、メラミン樹脂が完全硬化
する必要となるホルムアルデヒド源となって、パーティ
クルボードの物性を向上させる。According to the present invention, an isocyanate resin is used as the resin for the core layer adhesive, and a melamine resin to which hexamethylenetetramine is added is used as the resin for the surface layer adhesive. Formaldehyde that can be easily manufactured without chips attached to the hot platen, hexamethylenetetramine added to the resin for the surface layer adhesive separates at a hot pressing temperature of 180 ° C or higher, and the melamine resin needs to be completely cured As a source, improve the physical properties of the particle board.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０９Ｊ 175/00 Ｃ０９Ｊ 175/00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI C09J 175/00 C09J 175/00
Claims (2)
ト樹脂を、表層用接着剤の樹脂としてメラミン樹脂にヘ
キサメチレンテトラミンを添加した接着剤を使用したこ
とを特徴とする多層パーティクルボード。1. A multilayer particle board comprising: an isocyanate resin as a resin for a core layer adhesive; and an adhesive obtained by adding hexamethylenetetramine to a melamine resin as a resin for a surface layer adhesive.
層用チップにメラミン樹脂にヘキサメチレンテトラミン
を添加した接着剤を塗布してフォーミングし、熱圧締成
形することを特徴とする多層パーティクルボードの製造
方法。2. A method for producing a multilayer particle board, comprising applying an isocyanate resin to a core layer chip, applying an adhesive obtained by adding hexamethylenetetramine to a melamine resin to a surface layer chip, forming, and hot pressing. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8327796A JPH10151609A (en) | 1996-11-25 | 1996-11-25 | Multilayer particle board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8327796A JPH10151609A (en) | 1996-11-25 | 1996-11-25 | Multilayer particle board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10151609A true JPH10151609A (en) | 1998-06-09 |
Family
ID=18203097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8327796A Pending JPH10151609A (en) | 1996-11-25 | 1996-11-25 | Multilayer particle board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10151609A (en) |
-
1996
- 1996-11-25 JP JP8327796A patent/JPH10151609A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2007521163A (en) | Oriented strand board | |
| US3658622A (en) | Process for making wood laminate | |
| CN102585129B (en) | Urea-formaldehyde resin for artificial board and modification modulation method thereof | |
| JPH1058413A (en) | Manufacture of particle board | |
| JP3979705B2 (en) | Manufacturing method of wooden board | |
| US2262422A (en) | Protein plastic molding compound and method of preparing the same | |
| JPS5925656B2 (en) | Manufacturing method of dry-formed plate | |
| US4069276A (en) | Low-pressure, no-cool phenolic type resin for decorative laminates | |
| JP3002754B2 (en) | Manufacturing method of decorative paper, impregnated paper and decorative board | |
| US3556929A (en) | Tremolite faced laminated panels | |
| JPH0976212A (en) | Particleboard manufacturing method | |
| JP2620168B2 (en) | Wood board manufacturing method | |
| JPS6114904A (en) | Manufacturing method of particle board | |
| JPS6124183B2 (en) | ||
| JPH11254410A (en) | Manufacture of particle board | |
| JP3120167B2 (en) | Wood board manufacturing method | |
| JPH03281202A (en) | Preparation of particle board | |
| CN121374782A (en) | A formaldehyde-free, mugwort-scented oriented strand board and its preparation method | |
| JP3393537B2 (en) | Manufacturing method of decorative board | |
| JPS59136252A (en) | Laminate and its manufacture | |
| KR20000076519A (en) | Production of surface-enhanced moulded fibre parts | |
| JP2654958B2 (en) | Phenol-modified melamine resin adhesive | |
| SU120324A1 (en) | The method of obtaining modified epoxy resins | |
| JP2608753B2 (en) | Particleboard manufacturing method | |
| US4122144A (en) | Production of rigid shaped articles using phenol-formaldehyde resins |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071122 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20081122 |
|
| LAPS | Cancellation because of no payment of annual fees |