JPH1058413A - Manufacture of particle board - Google Patents
Manufacture of particle boardInfo
- Publication number
- JPH1058413A JPH1058413A JP23972796A JP23972796A JPH1058413A JP H1058413 A JPH1058413 A JP H1058413A JP 23972796 A JP23972796 A JP 23972796A JP 23972796 A JP23972796 A JP 23972796A JP H1058413 A JPH1058413 A JP H1058413A
- Authority
- JP
- Japan
- Prior art keywords
- particle board
- wood pieces
- wood
- water content
- isocyanate resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000002023 wood Substances 0.000 claims abstract description 25
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000012948 isocyanate Substances 0.000 claims abstract description 16
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 16
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 238000007731 hot pressing Methods 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000009736 wetting Methods 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 238000005187 foaming Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- 229920000877 Melamine resin Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000000077 insect repellent Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、製造後にホルマリ
ン放出量が少なく、しかも成形も容易なパーティクルボ
ードの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a particle board which releases a small amount of formalin after production and is easy to mold.
【０００２】[0002]
【従来の技術】パーティクルボードは、木材を細かい小
片に細分した木片にフェノール樹脂、メラミン樹脂、尿
素樹脂、尿素メラミン共縮合樹脂、グアナミン樹脂等の
熱硬化性合成樹脂接着剤を噴霧してフォーミングした
後、熱圧締成形して製造されるものであり、表面を化粧
して家具、建具や建材等に広く使用されている。2. Description of the Related Art Particleboard is formed by spraying a thermosetting synthetic resin adhesive such as a phenol resin, a melamine resin, a urea resin, a urea melamine co-condensation resin, and a guanamine resin on a wood chip obtained by dividing wood into small pieces. After that, it is manufactured by hot press molding, and is widely used for furniture, fittings, building materials and the like with its surface decorated.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記し
たフェノール樹脂、メラミン樹脂、尿素樹脂、尿素メラ
ミン共縮合樹脂、グアナミン樹脂等の熱硬化性合成樹脂
接着剤がホルマリンを使用して合成されているため、製
造されたパーティクルボードあるいはパーティクルボー
ドより製造された家具、建材等から、ホルマリンが放出
されるという問題があった。そこで、ホリマリン放出の
少ないイソシアネート樹脂によるパーティクルボードの
製造方法が考えられるが、イソシアネート樹脂はきわめ
て粘性が低いため、通常３〜８重量％程度の含水率の木
片に前記樹脂を噴霧処理してベルトコンベア上に成形し
たフォーミングマットはホットプレスへ搬送される際の
振動等により型崩れしてプレス成形ができないという問
題があった。本発明はかかる事情に鑑みてなされたもの
で、ホルマリンの発生の少ないイソシアネート樹脂を用
いて、フォーミングマットが型崩れし難く、しかも品質
が良いパーティクルボードの製造方法を提供することを
目的とする。However, thermosetting synthetic resin adhesives such as phenolic resin, melamine resin, urea resin, urea-melamine cocondensation resin, and guanamine resin are synthesized using formalin. There has been a problem that formalin is released from the manufactured particle board or furniture, building materials, and the like manufactured from the particle board. Therefore, a method of producing a particle board using an isocyanate resin that emits little horimarin can be considered. However, since the isocyanate resin has a very low viscosity, the resin is usually spray-treated on a piece of wood having a water content of about 3 to 8% by weight to perform a belt conveyor. There is a problem that the forming mat formed above loses its shape due to vibration or the like when it is conveyed to a hot press and cannot be press-formed. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method for manufacturing a particle board in which a forming mat is less likely to lose its shape and has high quality by using an isocyanate resin which generates less formalin.
【０００４】[0004]
【課題を解決するための手段】前記目的に沿う請求項１
記載のパーティクルボードの製造方法は、木片の含水率
を高めた後、イソシアネート樹脂接着剤を噴霧しながら
フォーミングし、熱圧締成形している。また、請求項２
記載のパーティクルボードの製造方法は、請求項１記載
のパーティクルボードの製造方法において、前記木片の
含水率が１２〜１８重量％程度の範囲としている。According to the present invention, there is provided a semiconductor device comprising:
In the method for producing a particle board described above, after increasing the water content of a piece of wood, forming is performed while spraying an isocyanate resin adhesive, and hot pressing is performed. Claim 2
In the method for producing a particle board according to the first aspect, the water content of the wood piece is in a range of about 12 to 18% by weight.
【０００５】請求項１及び２記載のパーティクルボード
の製造方法においては、イソシアネート樹脂接着剤を噴
霧処理する前に、木片に水を噴霧処理し木片の含水率を
通常より十分に高めておく。この噴霧による木片の濡れ
によって木片同士の結合が良くなり、マットを成形した
後に振動程度では型崩れが生じなくなる。また、熱圧締
時にはイソシアネート樹脂が木片表面の水と反応して尿
素結合し、木片（セルロース）のＯＨ基ともウレタン結
合してパーティクルボードが強固に製造される。[0005] In the method for producing a particle board according to the first and second aspects, before the isocyanate resin adhesive is sprayed, water is sprayed on the wood pieces so that the water content of the wood pieces is sufficiently higher than usual. Due to the wetting of the wood pieces by the spraying, the bonding between the wood pieces is improved, and the shape does not collapse due to the vibration after forming the mat. Further, at the time of hot pressing, the isocyanate resin reacts with water on the surface of the wood chip to form a urea bond, and the OH group of the wood chip (cellulose) also forms a urethane bond to form a particle board firmly.
【０００６】[0006]
【発明の実施の形態】続いて、本発明を具体化した実施
の形態につき説明し、本発明の理解に供する。まず、パ
ーティクルボードの素材となる木片を用意し、これに水
の噴霧処理をして含水率を１２〜１８重量％程度、更に
好ましくは１５重量％前後に調整しておく。これによっ
て木片の表面の濡れによって木片同士の結合が良くな
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described to provide an understanding of the present invention. First, a piece of wood to be used as a material for a particle board is prepared and sprayed with water to adjust the water content to about 12 to 18% by weight, and more preferably to about 15% by weight. This improves the bonding between the pieces of wood due to the wetting of the surfaces of the pieces of wood.
【０００７】このように含水率を高めた木片に均一にイ
ソシアネート樹脂接着剤を噴霧しながらフォーミング
し、ホットプレスにて熱圧締処理をする。この場合のイ
ソシアネート樹脂の塗布量は、加湿された木片に対して
６〜１１重量％程度である。また、熱圧締温度は１００
〜１５０℃、圧力は１０〜１５ｋｇ／ｃｍ2 、圧締時間
は５〜１０分程度である。これによって、前記したよう
に、イソシアネート樹脂と水やＯＨ基が反応して、強固
なパーティクルボードが製造される。The isocyanate resin adhesive is formed while uniformly spraying the wood piece having a high water content as described above, and hot pressing is performed by a hot press. In this case, the application amount of the isocyanate resin is about 6 to 11% by weight based on the humidified wood chips. The hot pressing temperature is 100
The pressure is 10 to 15 kg / cm 2 , and the pressing time is about 5 to 10 minutes. Thereby, as described above, the isocyanate resin reacts with water or OH groups, and a strong particle board is manufactured.
【０００８】前記実施の形態は、単層のパーティクルボ
ードについて説明したが、多層のパーティクルボードや
ＯＳＢ等にも本発明は適用される。また、前記噴霧する
水やイソシアネート樹脂接着剤に耐水性を向上するため
の添加剤や防虫薬剤、難燃性付与のための薬剤を添加す
ることは自由である。Although the above embodiment has been described with reference to a single-layer particle board, the present invention is also applicable to a multi-layer particle board, an OSB, and the like. In addition, it is free to add an additive for improving water resistance, an insect repellent agent, and an agent for imparting flame retardancy to the sprayed water or the isocyanate resin adhesive.
【０００９】[0009]
【発明の効果】請求項１、２記載のパーティクルボード
の製造方法においては、熱硬化性樹脂としてイソシアネ
ート樹脂接着剤を使用しているので、ホルマリンの発生
が殆どない。更には、木片の含水率を高めているので、
型崩れをすることなく成形ができ、イソシアネート樹脂
接着剤と、水や木片との反応によって硬化も促進され、
より品質の良い曲げ強度の優れるパーティクルボードの
製造が可能となる。In the method for producing a particle board according to the first and second aspects, since an isocyanate resin adhesive is used as the thermosetting resin, almost no formalin is generated. Furthermore, since the moisture content of the wood chips is increased,
Molding can be performed without losing shape, curing is promoted by the reaction of isocyanate resin adhesive, water and wood chips,
It is possible to manufacture a particle board of better quality and excellent bending strength.
Claims (2)
ト樹脂接着剤を噴霧しながらフォーミングし、熱圧締成
形することを特徴とするパーティクルボードの製造方
法。1. A method for producing a particle board, comprising: increasing the water content of a piece of wood, forming the composition while spraying an isocyanate resin adhesive, and performing hot pressing.
度の範囲である請求項１記載のパーティクルボードの製
造方法。2. The method for producing a particle board according to claim 1, wherein the water content of the wood chips is in a range of about 12 to 18% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23972796A JPH1058413A (en) | 1996-08-21 | 1996-08-21 | Manufacture of particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23972796A JPH1058413A (en) | 1996-08-21 | 1996-08-21 | Manufacture of particle board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1058413A true JPH1058413A (en) | 1998-03-03 |
Family
ID=17049036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23972796A Pending JPH1058413A (en) | 1996-08-21 | 1996-08-21 | Manufacture of particle board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1058413A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007044966A (en) * | 2005-08-09 | 2007-02-22 | Neive:Kk | Wood chip molded product and manufacturing method thereof |
| WO2008056992A1 (en) * | 2006-11-10 | 2008-05-15 | Dynea Oy | Improved gluing method |
| CN103144180A (en) * | 2013-03-15 | 2013-06-12 | 南京元凯生物能源环保工程有限公司 | Method for manufacturing plywood and plastic-wood composite with manioc waste |
| CN103950085A (en) * | 2013-08-05 | 2014-07-30 | 西南林业大学 | Method for establishing moisture content gradient of shaving board |
| CN104029270A (en) * | 2014-06-24 | 2014-09-10 | 绥阳兴翰轮盘制造有限公司 | Cornstalk particle board processing method |
| CN104526830A (en) * | 2014-12-08 | 2015-04-22 | 杭州国立工贸集团有限公司 | High-strength invisible mesh reinforcement wood residue plate and manufacturing method thereof |
-
1996
- 1996-08-21 JP JP23972796A patent/JPH1058413A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007044966A (en) * | 2005-08-09 | 2007-02-22 | Neive:Kk | Wood chip molded product and manufacturing method thereof |
| WO2008056992A1 (en) * | 2006-11-10 | 2008-05-15 | Dynea Oy | Improved gluing method |
| CN103144180A (en) * | 2013-03-15 | 2013-06-12 | 南京元凯生物能源环保工程有限公司 | Method for manufacturing plywood and plastic-wood composite with manioc waste |
| CN103950085A (en) * | 2013-08-05 | 2014-07-30 | 西南林业大学 | Method for establishing moisture content gradient of shaving board |
| CN104029270A (en) * | 2014-06-24 | 2014-09-10 | 绥阳兴翰轮盘制造有限公司 | Cornstalk particle board processing method |
| CN104526830A (en) * | 2014-12-08 | 2015-04-22 | 杭州国立工贸集团有限公司 | High-strength invisible mesh reinforcement wood residue plate and manufacturing method thereof |
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