JPH10163634A - Multilayer wiring board - Google Patents

Abstract

(57) Abstract: A short circuit is caused by a void formed in an organic resin insulating layer interposed between a thin film wiring conductor layer for power supply and a thin film wiring conductor layer for grounding. A plurality of organic resin insulating layers (3a) are provided on a substrate (1).
3b, 3c, 3d are applied in multiple layers, and between the organic resin insulating layers 3a, 3b, 3c, 3d, the power supply thin film wiring conductor layer 4a, the grounding thin film wiring conductor layer 4b, and the signal thin film wiring conductor layer 4c, 4d, wherein the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b each have a mesh shape in which a plurality of openings H are arranged in a grid. And the conductor of the power supply thin-film wiring conductor layer 4a is located in the opening H of the grounding thin-film wiring conductor layer 4b.
The conductor of the grounding thin film wiring conductor layer 4b faces the opening of the power supply thin film wiring conductor layer 4a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board, and more particularly to a multilayer wiring board used for a hybrid integrated circuit device, a semiconductor element housing package for housing a semiconductor element, and the like.

[0002]

2. Description of the Related Art Hitherto, a multilayer wiring board used in a hybrid integrated circuit device, a package for accommodating a semiconductor element, or the like, has its wiring conductor formed by a thick film forming technique such as the Mo-Mn method.

[0003] This Mo-Mn method is generally used for tungsten,
Organic solvents for high melting point metal powders such as molybdenum and manganese,
A solvent is added and mixed, and a paste-like metal paste is applied by printing on the outer surface of the green ceramic body in a predetermined pattern by a screen printing method. This is a method of sintering and integrating a metal powder and a green ceramic body.

The ceramic body on which the wiring conductor is formed is usually an oxide ceramic such as an aluminum oxide sintered body or a mullite sintered body, or an aluminum nitride having an oxide film deposited on the surface. Non-oxide ceramics such as a porous sintered body and a silicon carbide sintered body are used.

However, when the wiring conductor is formed by using the Mo-Mn method, the wiring conductor is formed by screen-printing a metal paste, so that miniaturization is difficult, and the wiring conductor is formed at a high density. Had the disadvantage of not being able to do so. Therefore, in order to solve the above-mentioned drawbacks, instead of forming the wiring conductor by a conventionally known thick film forming technique, a multilayer wiring board formed by using a thin film forming technique capable of miniaturization is used. It has become

A multilayer wiring board in which such wiring conductors are formed by a thin film forming technique is made of a glass epoxy resin formed by impregnating a ceramic cloth made of an aluminum oxide sintered body or a glass cloth woven with glass fibers with an epoxy resin. An insulating layer made of an organic resin such as an epoxy resin formed by spin coating and thermosetting on the upper surface of a substrate made of a metal, such as copper or aluminum, and a thin film forming technique such as an electroless plating method or a vapor deposition method, and photolithography. It has a structure in which thin-film wiring conductor layers for power supply, grounding and signal formed by adopting the technology are alternately laminated, and the power supply is formed on the upper surface of the uppermost organic resin insulating layer. Bonding pads electrically connected to the respective thin-film wiring conductor layers for connection, grounding, and signal. Electrodes of active components such as semiconductor devices and capacitance components, and passive components such as resistors are joined by thermocompression bonding or the like, whereby power supply terminals for semiconductor devices and the like are connected to the thin-film wiring conductor layers for power supply, grounding and signal. The ground terminal and the signal terminal are electrically connected.

[0007]

However, a multilayer wiring board in which the organic resin insulating layer and the thin film wiring conductor layers for power supply, grounding and signal are alternately laminated is a thin film wiring conductor layer for power supply. A large area over almost the entire surface between the organic resin insulating layers so that the current flowing through the thin-film wiring conductor layer for grounding is large and can withstand the flowing current, and to match the characteristic impedance of the thin-film wiring conductor layer for signals. When a large-area thin-film wiring conductor layer for power supply and a thin-film wiring conductor layer for grounding are formed with an organic resin insulating layer interposed therebetween, a gas generated when the organic resin insulating layer is thermally cured is formed as described above. The power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer prevent emission to the outside. As a result, the power-supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer and the organic resin insulating layer Unnecessary gas is accumulated between, and lead to disadvantage the bonding strength between the organic resin insulating layer and the power supply and the ground thin-film wiring conductor layer greatly decreases.

In view of this, a plurality of openings are arranged in a grid in opposing regions of the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer formed with the organic resin insulating layer interposed therebetween to form a mesh. None, it is conceivable that an unnecessary gas generated when the organic resin insulating layer is thermally cured through the opening is satisfactorily released to the outside.

However, when an opening is provided in each of the opposing regions of the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer, the conductor portions of the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer are separated from each other. The organic resin insulating layer has a thickness of 5 μm to 30 μm
Since it is as thin as possible, voids (holes) penetrating vertically are easily formed, and when the voids (holes) are formed, the thin-film wiring conductor layer for power supply and the thin-film wiring conductor layer for grounding are electrically connected via the voids. Short circuit was caused, resulting in the loss of the function as a multilayer wiring board.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object the purpose of forming a part or all of a wiring conductor by a thin film forming technique and forming the wiring conductor at a high density. It is to provide a wiring board.

Another object of the present invention is to efficiently discharge unnecessary gas generated when the organic resin insulating layer is thermally cured to the outside so that the organic resin insulating layer and each thin-film wiring conductor layer are firmly joined. To provide a multilayer wiring board.

Still another object of the present invention is to improve the electrical insulation between the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer which are disposed opposite to each other with an organic resin insulating layer interposed therebetween, thereby improving the electrical insulation of the multilayer wiring board. An object of the present invention is to provide a multilayer wiring board that can exhibit its functions over a long period of time.

[0013]

According to the present invention, a plurality of organic resin insulating layers are applied in multiple layers on a substrate, and between the organic resin insulating layers, a thin film wiring conductor layer for power supply, a thin film wiring conductor layer for grounding, and A multilayer wiring board having a signal thin-film wiring conductor layer arranged therein, wherein each of the power supply thin-film wiring conductor layer and the ground thin-film wiring conductor layer has a mesh shape in which a plurality of openings are arranged in a grid. And the conductor of the thin-film wiring conductor layer for power supply faces the opening of the thin-film wiring conductor layer for grounding, and the conductor of the thin-film wiring conductor layer for grounding faces the opening of the thin-film wiring conductor layer for power supply. It is characterized by the following.

Further, according to the present invention, the area of each opening of the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer having a mesh shape is 2.5 × 10 ⁻³ (mm ² ) to 90 × 10 ⁻³ (mm ² ). m
m ² ), the total opening area of the openings provided in the power supply thin film wiring conductor layer is 5% to 30% of the total area of the power supply thin film wiring conductor layer, and the total opening area provided in the grounding thin film wiring conductor layer is The opening area is 5% to 3% of the total area of the thin film wiring conductor layer for grounding.
0%.

According to the multilayer wiring board of the present invention, since the wiring is formed on the insulating substrate by the thin film forming technique, the wiring can be miniaturized, and the wiring can be formed at an extremely high density.

Further, according to the multilayer wiring board of the present invention, since the thin-film wiring conductor layer for power supply and the thin-film wiring conductor layer for grounding are formed in a mesh shape in which a plurality of openings are arranged in a grid, the organic resin insulating layer can be heated. At the time of curing, even if unnecessary gas is generated, the gas is satisfactorily released to the outside through the opening of the mesh, and does not accumulate between the organic resin insulating layer and the thin film wiring conductor layer for power supply and ground, As a result, the organic resin insulating layer and the thin-film wiring conductor layers for power supply and ground are securely adhered to each other, and the bonding strength between them can be increased.

Further, according to the multilayer wiring board of the present invention, the conductor of the thin-film wiring conductor layer for power supply is placed in the opening of the thin-film wiring conductor layer for grounding, and the conductor of the thin-film wiring conductor layer for ground is placed in the thin-film wiring conductor for power supply. The organic resin insulating layer disposed between the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer has a small thickness because it is opposed to the opening of each layer, and a void penetrates vertically.
Even when the thin film wiring conductor layer for power supply and the thin film wiring conductor layer for grounding are hardly electrically shorted, the function as a multilayer wiring board can be exhibited for a long period of time. Becomes

[0018]

Next, the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 shows an embodiment of a multilayer wiring board according to the present invention, wherein 1 is a board, and 2 is a multilayer wiring section.

The substrate 1 has four organic resin insulating layers 3a, 3b, 3c and 3d on its upper surface and a thin film wiring conductor layer 4 for power supply.
a, a multilayer wiring section 2 is formed by alternately arranging four thin-film wiring conductor layers of a thin-film wiring conductor layer 4b for grounding and signal thin-film wiring conductor layers 4c and 4d in multiple layers. 2 acts as a support member for supporting

The substrate 1 is made of an oxide ceramic such as an aluminum oxide sintered body or a mullite sintered body, or a non-oxide ceramic such as an aluminum nitride sintered body or a silicon carbide sintered body having an oxide film on its surface. Oxide ceramics, and further made of an electrically insulating material such as glass epoxy resin impregnated with epoxy resin in a cloth woven with glass fiber, for example, when formed of aluminum oxide sintered body , Alumina, silica, calcia, magnesia, etc., an appropriate organic solvent and a solvent are added and mixed to form a slurry, which is then formed into a ceramic green sheet by using a conventionally known doctor blade method or calendar roll method. Ceramic green sheet), and after that, the ceramic green sheet is subjected to an appropriate punching process to obtain a predetermined shape. Hot together form (about 1600
C) or by mixing a raw material powder such as alumina with an appropriate organic solvent and solvent to adjust the raw material powder and form the raw material powder into a predetermined shape by a press molding machine. If the body is manufactured by firing the body at a temperature of about 1600 ° C. and is made of a glass epoxy resin, for example, a cloth woven of glass fibers is impregnated with the epoxy resin precursor and the epoxy resin precursor is filled in a predetermined manner. Manufactured by thermosetting at a temperature.

The substrate 1 has a through hole 5 having a diameter of, for example, 300 μm to 500 μm which penetrates the upper and lower main surfaces.
A conductive layer 6 extending to both upper and lower main surfaces of the substrate 1 is attached to the inner wall of the through hole 5.

The through-hole 5 is provided in the thin-film wiring conductor layer 4a for power supply, the thin-film wiring conductor layer 4b for grounding, and the thin-film wiring conductor layer 4 for signal of the multilayer wiring portion 2 formed on the upper surface of the substrate 1 described later.
c, 4d and an external electric circuit, or when the multilayer wiring portions 2 are arranged on both upper and lower main surfaces of the substrate 1, the thin film wiring conductor layers for power supply of the multilayer wiring portions 2 on both main surfaces. 4a, ground thin-film wiring conductor layer 4b and signal thin-film wiring conductor layer 4
The substrate 1 serves as a forming hole for forming a conductive layer 6 for electrically connecting the substrates 4 and 4d, and is formed in a predetermined shape at a predetermined position on the substrate 1 by performing a drilling method on the substrate 1.

The conductive layer 6 formed on the inner wall of the through hole 5 and the upper and lower main surfaces of the substrate 1 is made of a metal material such as copper or nickel. By adopting, the both ends are attached to the inner wall of the through hole 5 with the both ends being led out to the upper and lower main surfaces of the substrate 1.

The conductive layer 6 is provided on each of the thin-film wiring conductor layers 4a, 4b, 4c, 4c of the multilayer wiring portion 2 disposed on the main surface of the substrate 1.
d is electrically connected to an external electric circuit or the thin film wiring conductor layers 4a, 4b, 4c, and 4d of the respective multilayer wiring portions 2 provided on the upper and lower main surfaces of the substrate 1 are electrically connected to each other. To act.

The through-hole 5 formed in the substrate 1 is filled with an organic resin filler 7 made of epoxy resin. The through-hole 5 is completely filled with the organic resin filler 7, and the Both ends of the resin filler 7 are the substrate 1
Are flush with the surface of the conductive layer 6 deposited on the upper and lower main surfaces of the conductive layer.

The organic resin filler 7 is provided on the upper surface and / or lower surface of the substrate 1 with a plurality of organic resin insulating layers 3a,
b, 3c, 3d, the thin-film wiring conductor layer 4a for power supply, the thin-film wiring conductor layer 4b for grounding, and the thin-film wiring conductor layers 4c, 4d for signals, when forming the multi-layer wiring part 2, The resin insulating layers 3a, 3b, 3c, and 3d, the thin film wiring conductor layer for power supply 4a, the thin film wiring conductor layer for grounding 4b, and the thin film wiring conductor layers for signal 4c and 4d are kept flat.

The organic resin filler 7 fills the through hole 5 of the substrate 1 with a precursor of an epoxy resin.
A temperature of 80 ° C. to 200 ° C. is applied to this for 0.5 to 3 hours, and the substrate is completely cured by heat.
Is filled in.

Further, the substrate 1 has four organic resin insulating layers 3a, 3b, 3c, 3d, a power supply thin film wiring conductor layer 4a, a grounding thin film wiring conductor layer 4b, and a signal thin film wiring conductor layer 4c, 4d on the upper surface thereof. Are formed alternately in multiple layers, and the thin-film wiring conductor layer 4 for power supply is formed.
a, the ground thin-film wiring conductor layer 4b and the signal thin-film wiring conductor layers 4c, 4d are electrically connected to the conductive layer 6.

The organic resin insulating layers 3a, 3b, 3c, and 3d constituting the multilayer wiring section 2 are composed of a power supply thin-film wiring conductor layer 4a, a grounding thin-film wiring conductor layer 4b, and a signal thin-film wiring conductor layer 4c which are positioned above and below. , 4d function to provide electrical insulation, and the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b supply electric power to the electronic component A and have the characteristics of the signal thin-film wiring conductor layers 4c, 4d. The thin film wiring conductor layers for signals 4c and 4d have a function of matching impedance and a function of transmitting an electric signal to the electronic component A.

Each organic resin insulating layer 3 of the multilayer wiring section 2
a, 3b, 3c, and 3d are made of an organic resin such as an epoxy resin, a bismaleimide polyazide resin, a polyphenylene ether resin, and a fluororesin. For example, when the epoxy resin is used, bisphenol A epoxy resin, novolak epoxy resin, and glycidyl A curing agent such as an amine-based curing agent, an imidazole-based curing agent, or an acid anhydride-based curing agent is added to and mixed with an ester-type epoxy resin to obtain a paste-like epoxy resin precursor, and the epoxy resin precursor is used for the substrate 1. It is formed on the upper portion by spin coating, followed by heat treatment at 80 to 200 ° C. for 0.5 to 3 hours and thermosetting.

Each of the organic resin insulating layers 3a, 3b, 3
In each of c and 3d, a through hole 8 having a minimum diameter of about 1.5 times the thickness of the organic resin insulating layer is formed at a predetermined position of each of the holes. , 3b, 3c, 3d, a power supply thin film wiring conductor layer 4a, a grounding thin film wiring conductor layer 4b,
It functions as a forming hole for forming a through-hole conductor 9 for electrically connecting each of the signal thin film wiring conductor layers 4c and 4d.

Each of the organic resin insulating layers 3a, 3b, 3c,
The through hole 8 provided in 3d is formed, for example, by a photolithography technique, specifically, each of the organic resin insulating layers 3a, 3b,
3c and 3d are coated with a resist material and exposed and developed to form a window of a predetermined shape at a predetermined position. Then, an etchant is disposed on the window of the resist material, and a resist material is formed. Organic resin insulation layer 3 located in window
a, 3b, 3c and 3d are removed, and the organic resin insulating layer 3 is removed.
forming holes (through holes) in a, 3b, 3c, 3d,
Finally, the resist material is applied to the organic resin insulating layers 3a, 3b, 3
c, 3d by peeling off from above and removing.

Further, each of the organic resin insulating layers 3a, 3b, 3
On the upper surface of each of c and 3d, a thin-film conductor layer 4a for power supply, a thin-film conductor layer 4b for ground, and a thin-film conductor layer 4c and 4d for signal having a predetermined pattern are provided.
a, 3b, 3c, and 3d, through-hole conductors 9 are provided on the inner walls of the through-holes 8, and the organic resin insulating layers 3a, 3b, 3
Each of the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4d which are located above and below the c and 3d are electrically connected.

Each of the organic resin insulating layers 3a, 3b, 3c,
The thin-film conductor layer 4a for power supply, the thin-film conductor layer 4b for grounding, the thin-film conductor layers 4c and 4d for signal, and the through-hole conductor 9 disposed in the upper surface of 3d and in the through-hole 8 are made of copper, gold, aluminum or the like. The metal material is formed by adopting a thin film forming technology such as an electroless plating method, a vapor deposition method, a sputtering method and a photolithography technology,
For example, when formed of copper, 0.06 mol / liter of copper sulfate and 0.3 mol / liter of formalin are provided on the upper surfaces of the organic resin insulating layers 3a, 3b, 3c, and 3d and the inner surface of the through hole 8. A copper layer having a thickness of 1 μm to 40 μm is deposited using an electroless copper plating bath consisting of 0.35 mol / l of sodium hydroxide and 0.35 mol / l of ethylenediaminetetraacetic acid. Each of the organic resin insulating layers 3a, 3b, 3c, 3d is processed into a predetermined pattern by photolithography technology.
It is arranged on the inner wall of the gap and the through hole 8. In this case, since the power supply thin film wiring conductor layer 4a, the grounding thin film wiring conductor layer 4b, the signal thin film wiring conductor layers 4c and 4d, and the through-hole conductor 9 are formed by a thin film forming technique, the wiring can be miniaturized. This makes it possible to form the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4d at extremely high densities.

The power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b have a large flowing current and are formed in a wide area to withstand the flowing current. It is in the form of a mesh.

The reason why the power supply thin film wiring conductor layer 4a and the grounding thin film wiring conductor layer 4b are formed in a mesh shape in which a plurality of openings H are arranged in a grid pattern is that the organic resin insulating layers 3a and 3b are generated during thermosetting. This is for satisfactorily releasing unnecessary gas to the outside. The openings H enable the organic resin insulating layers 3a and 3b, the power supply thin film wiring conductor layer 4a and the grounding thin film wiring conductor layer 4b.
Unnecessary gas does not accumulate in between, and as a result, the organic resin insulating layers 3a and 3b are in close contact with the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b, and the bonding strength of each is strengthened. Can be made.

The plurality of openings H provided in the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b each have an opening area of less than 2.5 × 10 ⁻³ (mm ² ) and a total opening area. Is less than 5% of the total area of each of the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b, unnecessary gas generated when the organic resin insulating layers 3a and 3b are thermoset is efficiently discharged to the outside. It is difficult to discharge well, the opening area exceeds 90 × 10 ⁻³ (mm ² ), and the total opening area is the total area of each of the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b. If it exceeds 30%, the characteristic impedances of the signal thin film wiring conductor layers 4c and 4d become mismatched, and there is a risk that electric signals cannot be propagated well. Accordingly, the plurality of openings H provided in the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b have an opening area of 2.5 × 10 ⁻³ (mm ² ) to 90 × 10 ⁻³ (mm). ² ) The total opening area is preferably 5% to 30% of the total area of each of the power supply thin film wiring conductor layer 4a and the grounding thin film wiring conductor layer 4b.

Further, the conductor of the power supply thin-film wiring conductor layer 4a has an opening H of the grounding thin-film wiring conductor layer 4b with the organic resin insulating layer 3b interposed therebetween, and the conductor of the grounding thin-film wiring conductor layer 4b has The openings H of the power supply thin film wiring conductor layer 4a are opposed to each other with the organic resin insulating layer 3b interposed therebetween. Therefore, even if the thickness of the organic resin insulating layer 3b is thin and a void (hole) penetrating vertically is formed, the power supply thin-film wiring conductor layer 4a and the grounding thin-film wiring conductor layer 4b can be electrically short-circuited. As a result, the function as a multilayer wiring board can be exhibited over a long period of time.

The organic resin insulating layers 3a, 3b, 3
c, 3d and the thin-film wiring conductor layer 4a for power supply, the thin-film wiring conductor layer 4b for grounding, and the thin-film wiring conductor layers 4c, 4d for signals are alternately arranged in multiple layers. When the upper surfaces of the insulating layers 3a, 3b, 3c, and 3d are roughened to have a center line average roughness (Ra) of 0.05 μm ≦ Ra ≦ 5 μm, the organic resin insulating layers 3a, 3b, 3c, and 3d and the power supply thin film The bonding with the wiring conductor layer 4a, the thin-film wiring conductor layer 4b for grounding, and the thin-film wiring conductor layers 4c and 4d for signal and the bonding between the organic resin insulating layers 3a, 3b, 3c and 3d located above and below can be made strong. it can. Accordingly, the upper surface of each of the organic resin insulating layers 3a, 3b, 3c, and 3d of the multilayer wiring portion 2 is roughened by etching or the like, and the center line average roughness (R
It is preferable to set a rough surface of 0.05 μm ≦ Ra ≦ 5 μm in a).

The organic resin insulating layers 3a, 3b, 3
When the thickness of each of the layers c and 3d exceeds 100 μm, the etching processing time becomes longer when the through holes 8 are formed by employing the photolithography technology for the organic resin insulating layers 3a, 3b, 3c and 3d. It becomes difficult to form the hole 8 into a desired sharp shape,
When the thickness is less than 5 μm, the organic resin insulating layers 3a, 3b, 3
c, 3d organic resin insulating layers 3a located on the upper surface
When roughening is performed to increase the bonding strength of 3b, 3c, and 3d, unnecessary holes are formed in the organic resin insulating layers 3a, 3b, 3c, and 3d, and the power supply thin film wiring conductor layers 4a, There is a risk that an unnecessary electrical short circuit may be caused in the grounding thin film wiring conductor layer 4b and the signal thin film wiring conductor layers 4c and 4d.

Accordingly, the organic resin insulating layers 3a, 3b,
It is preferable that each of 3c and 3d has a thickness in the range of 5 μm to 100 μm.

Further, when the thickness of the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4d of the multilayer wiring section 2 is less than 1 μm, their electrical resistances are reduced. Becomes large and 40 μm
Is exceeded, the power supply thin film conductor layer 4a, the ground thin film conductor layer 4b, and the signal thin film conductor layers 4c, 4d are applied to the organic resin insulating layers 3a, 3b, 3c, 3d. Wiring conductor layer 4a, thin-film wiring conductor layer 4 for grounding
b, and a large stress is present inside the signal thin-film wiring conductor layers 4c and 4d, and due to the intrinsic stress, the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layer 4c. 4d is an organic resin insulating layer 3a, 3b, 3
c and 3d are easily peeled off. Therefore, it is preferable that the thickness of the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4d of the multilayer wiring part 2 be in the range of 1 μm to 40 μm.

The organic resin insulating layers 3a, 3b, 3c, 3
d, the thin-film wiring conductor layer 4a for power supply, the thin-film wiring conductor layer 4b for grounding, and the thin-film wiring conductor layers 4c and 4d for signal are alternately laminated in multiple layers. The thin film wiring conductor layer 4 for power supply is formed on the upper surface of the organic resin insulating layer 3d.
a, a bonding pad 10 electrically connected to the thin film wiring conductor layer 4b for grounding and the thin film wiring conductor layers 4c and 4d for signal is provided (in FIG. 1, the bonding pad 10 is connected to the thin film wiring conductor layer 4d for signal). Only the bonding pad 10 is shown.)

The power supply terminal, the ground terminal, and the signal terminal of the electronic component A composed of an active component such as a semiconductor device, a capacitive device, and a passive component such as a resistor are bonded to the bonding pad 10 by thermocompression bonding or the like. As a result, the electronic component A composed of an active component such as a semiconductor device and a passive component such as a capacitor and a resistor is connected to the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4c.
d will be electrically connected.

The bonding pad 10 is made of the same metal material as the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4d, specifically, copper, nickel, gold, It is made of a metal material such as aluminum, and is simultaneously formed with the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and the signal thin-film wiring conductor layers 4c and 4d on the uppermost organic resin insulating layer 3d. The thin film wiring conductor layer for power supply 4a, the thin film wiring conductor layer for grounding 4b, and the thin film wiring conductor layers for signal 4c and 4d are formed in electrical connection.

Thus, according to the multilayer wiring board of the present invention,
A power supply terminal, a ground terminal, and a signal terminal of an electronic component A including an active component such as a semiconductor device, a capacitance device, and a passive component such as a resistor are bonded to the bonding pad 10 provided on the surface of the uppermost organic resin insulating layer 3d by thermocompression bonding. The electronic component A is electrically connected to the power supply thin film wiring conductor layer 4a, the grounding thin film wiring conductor layer 4b, and the signal thin film wiring conductor layers 4c and 4d, thereby forming a semiconductor device or a hybrid integrated circuit device. If the power supply thin-film wiring conductor layer 4a, the grounding thin-film wiring conductor layer 4b, and a part of the signal thin-film wiring conductor layers 4c and 4d are connected to an external electric circuit, the semiconductor element and the capacitor element can be connected to the external electric circuit. Is electrically connected to the

It should be noted that the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. A plurality of organic resin insulating layers 3a, 3
b, 3c, 3d, the power supply thin film wiring conductor layer 4a, the grounding thin film wiring conductor layer 4b, and the signal thin film wiring conductor layers 4c, 4c
Although the multilayer wiring portion 2 is formed by alternately stacking the multilayer wiring portions d, the multilayer wiring portion 2 may be provided only on the lower side of the substrate 1 or on both upper and lower surfaces.

[0048]

According to the multilayer wiring board of the present invention, since the wiring is formed on the insulating substrate by the thin film forming technique, the wiring can be miniaturized and the wiring can be formed at an extremely high density. .

According to the multilayer wiring board of the present invention, since the thin film wiring conductor layer for power supply and the thin film wiring conductor layer for grounding are formed in a mesh shape in which a plurality of openings are arranged in a grid pattern, the organic resin insulating layer can be heated. At the time of curing, even if unnecessary gas is generated, the gas is satisfactorily released to the outside through the opening of the mesh, and does not accumulate between the organic resin insulating layer and the thin film wiring conductor layer for power supply and ground, As a result, the organic resin insulating layer and the thin-film wiring conductor layers for power supply and ground are securely adhered to each other, and the bonding strength between them can be increased.

Further, according to the multilayer wiring board of the present invention, the conductor of the thin-film wiring conductor layer for power supply is provided in the opening of the thin-film wiring conductor layer for grounding, and the conductor of the thin-film wiring conductor layer for ground is connected to the thin-film wiring conductor for power supply. The organic resin insulating layer disposed between the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer has a small thickness because it is opposed to the opening of each layer, and a void penetrates vertically.
Even when the thin film wiring conductor layer for power supply and the thin film wiring conductor layer for grounding are hardly electrically shorted, the function as a multilayer wiring board can be exhibited for a long period of time. Becomes

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a multilayer wiring board of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Multilayer wiring part 3a, 3b, 3c, 3d ... Organic resin insulation layer 4a ... Power supply thin film wiring conductor layer 4b ... ···· Thin-film wiring conductor layer for grounding 4c, 4d ······ Thin-film wiring conductor layer for signal A ··· Electronic components H ··· ..... Openings provided in power supply thin film wiring conductor layer and grounding thin film wiring conductor layer

Claims (2)

[Claims] A thin film wiring conductor layer for power supply, a thin film wiring conductor layer for grounding, and a thin film wiring conductor layer for signal are arranged between a plurality of organic resin insulating layers on a substrate. A multilayer wiring board comprising: the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer, each of which has a mesh shape in which a plurality of openings are arranged in a grid,
The conductor of the power supply thin film wiring conductor layer faces the opening of the grounding thin film wiring conductor layer, and the conductor of the grounding thin film wiring conductor layer faces the opening of the power supply thin film wiring conductor layer. Multilayer wiring board. 2. An opening area of each of the power supply thin-film wiring conductor layer and the grounding thin-film wiring conductor layer having a mesh shape is 2.5 ×.
10 ⁻³ (mm ² ) to 90 × 10 ⁻³ (mm ² ),
2. The multilayer wiring board according to claim 1, wherein the total opening area is 5% to 30% of the total area of each of the power supply thin film wiring conductor layer and the grounding thin film wiring conductor layer.