JPH10165902A - Chip parts sorting equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute total inspection without executing a destructive inspection of chip parts by a method wherein an external electrode is composed of a plurality of layers, and one layer is equipped with a first converying means conveying chip parts having a magnetic metal layer, and a second conveying means having a magnet of which one end side is disposed at a suitable space above that. SOLUTION: An external electrode is composed of a plurality of layers, and equipped with a first conveying means 12 consisting of a belt conveyer 11 conveying chip parts of which at least one layer is a magnetic metal layer. A non-defective inspection is carried out in a process wherein the chip parts conveyed with the first conveying means 12 are conveyed with a second conveying means 14 in which a magnet 13 is contained in the belt conveyor 11. That is, by adjusting magnetic force of the magnet 13 contained in the second conveyor means 14, a non-defective article is attracted with the magnet 13 according to a thickness of an intermediate electrode in the external electrode of the chip parts, the non-defective article is conveyed to a non-defective pan 16, and a defective article is conveyed to a defective pan 15 without attraction. Thereby, total inspection of the chip parts can be carried out without executing a destructive inspection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for sorting chip components.

[0002]

2. Description of the Related Art FIG. 3 shows the structure of a chip component. In FIG. 3, 1 is a main body, 2 is a base electrode baked on the main body 1, and 3 is an intermediate made of a magnetic metal such as nickel formed on the base electrode 2 in order to increase solder heat resistance when mounting chip components. The electrodes 4 are surface electrodes formed on the intermediate electrode 3 in order to enhance solderability at the time of mounting a chip component. Reference numeral 5 denotes an external electrode composed of the base electrode 2, the intermediate electrode 3, and the surface electrode 4.

[0003] Since the thickness of the intermediate electrode 3 greatly affects the soldering heat resistance at the time of mounting a chip component, it is necessary to select a good product or a defective product according to the thickness.

Conventionally, this sorting has been carried out by polishing a chip component and visually inspecting the thickness of the intermediate electrode 3 on the polished surface (cross section) with a microscope.

[0005]

However, in the above-mentioned conventional sorting method, since chip components must be subjected to destructive inspection, 100% inspection cannot be performed, and sample inspection is required. there were.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned conventional problems and to perform a 100% inspection without performing a destructive inspection, and also to select a non-defective product.

[0007]

According to the present invention, there is provided a sorting apparatus comprising: a first transporting means for transporting a chip component having external electrodes composed of a plurality of layers, at least one of which is a magnetic metal layer; A chip component sorting apparatus is constituted by a second transporting means having first magnets, one end of which is provided at an appropriate interval above the first transporting means.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, there is provided a first transport means for transporting a chip component in which external electrodes are composed of a plurality of layers and at least one of which is a magnetic metal layer; A chip component sorting device comprising an upper part and a second conveying means having first magnets provided at one end thereof at appropriate intervals, wherein only good products are conveyed by the magnet of the second conveying means. Becomes

According to a second aspect of the present invention, one end of a third conveying means is provided below the other end of the first conveying means, and an appropriate distance is provided above the other end of the third conveying means. 4. The chip component sorting apparatus according to claim 1, wherein a fourth conveying means having a second magnet is provided, and the second magnet has a stronger magnetic force than the first magnet. A magnetic material such as a snowball used at the time of formation or the like can be suctioned and removed by the first magnet.

An embodiment of the present invention will be described below with reference to the drawings. (Embodiment 1) In FIG. 1, reference numeral 11 denotes a belt conveyor, and reference numeral 12 denotes a first transport unit including the belt conveyor 11. Reference numeral 13 denotes a magnet, and reference numeral 14 denotes a second transport unit in which the magnet 13 is built in the belt conveyor 11. Reference numeral 15 denotes a defective product tray, and 16 denotes a good product tray.

According to this embodiment, the first transport means 12
The chip component shown in FIG.
By adjusting the magnetic force of the magnet 13 built in 4,
The non-defective product is attracted by the magnet 13 and transported to the non-defective product tray 16 depending on the thickness of the intermediate electrode 3 in the external electrode 5 of the chip component, and the defective product is transported to the defective product tray 15 without suction. Therefore,
100% inspection can be performed without destructive inspection of chip components.

The present invention can be applied not only to a chip component having the external electrode structure shown in FIG. 3 but also to any other chip component having a plurality of layers of external electrodes, at least one of which is a magnetic metal layer.

(Embodiment 2) As shown in FIG. 2, one end of a third transporting means 12A is provided below the other end of the first transporting means 12, and is provided above the other end of the third transporting means 12A. At an appropriate interval, the fourth transport unit 1 having the second magnet 13A
4A, and the magnetic force of the second magnet 13A is
Stronger than it is. Therefore, the chip component shown in FIG. 3 transported by the first transport unit 12 and the magnetic material such as a steel ball used at the time of forming the electrodes are used for the second transport unit 1.
By adjusting the magnetic force of the magnet 13 built in 4,
The magnetic material can be easily sorted and discharged to the magnetic material tray 22.

The chip parts are separated into defective and non-defective receiving trays 15, 16 as in FIG.

[0015]

As described above, according to the present invention, by providing the first transfer means and the second transfer means having magnets provided in parallel and at an appropriate interval on the first transfer means, the external electrode is provided. Is composed of a plurality of layers, and a 100% inspection can be performed without performing a destructive inspection on a chip component in which at least one layer is a magnetic metal layer.

[Brief description of the drawings]

FIG. 1 is a front view of a sorting device according to a first embodiment of the present invention.

FIG. 2 is a front view of a sorting device according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing an external electrode portion of the chip component in a cross section.

[Description of Signs] 11 Belt Conveyor 12 First Conveying Means 13 Magnet 14 Second Conveying Means 15 Defective Product Pan 16 Good Product Pan

Claims (2)

[Claims] An external electrode is composed of a plurality of layers, a first transport means for transporting a chip component at least one of which is a magnetic metal layer, and one end side thereof is provided above the first transport means at an appropriate interval. And a second conveying means having a first magnet. 2. A method according to claim 1, wherein one end of the third conveying means is provided below the other end of the first conveying means, and a second magnet having a second magnet at an appropriate interval above the other end of the third conveying means. 2. The chip component sorting apparatus according to claim 1, wherein four conveying means are provided, and a second magnet is made stronger than a magnetic force of the first magnet.