JPH10171104A - Production of base for positive type photosensitive planographic printing plate - Google Patents
Production of base for positive type photosensitive planographic printing plateInfo
- Publication number
- JPH10171104A JPH10171104A JP33577096A JP33577096A JPH10171104A JP H10171104 A JPH10171104 A JP H10171104A JP 33577096 A JP33577096 A JP 33577096A JP 33577096 A JP33577096 A JP 33577096A JP H10171104 A JPH10171104 A JP H10171104A
- Authority
- JP
- Japan
- Prior art keywords
- treatment
- printing plate
- support
- lithographic printing
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000011282 treatment Methods 0.000 claims abstract description 81
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000007788 roughening Methods 0.000 claims abstract description 17
- 150000007942 carboxylates Chemical class 0.000 claims abstract description 11
- 230000003647 oxidation Effects 0.000 claims abstract description 8
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 8
- 239000007864 aqueous solution Substances 0.000 claims description 32
- 239000000243 solution Substances 0.000 claims description 23
- 229910052910 alkali metal silicate Inorganic materials 0.000 claims description 10
- 229920001477 hydrophilic polymer Polymers 0.000 claims description 6
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 150000001340 alkali metals Chemical class 0.000 claims description 4
- 239000010802 sludge Substances 0.000 abstract description 21
- 108091008695 photoreceptors Proteins 0.000 abstract description 20
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052914 metal silicate Inorganic materials 0.000 abstract description 3
- 229920000642 polymer Polymers 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 238000010186 staining Methods 0.000 abstract 2
- 150000001735 carboxylic acids Chemical class 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 18
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 16
- 238000011156 evaluation Methods 0.000 description 12
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 10
- 238000005238 degreasing Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 239000004115 Sodium Silicate Substances 0.000 description 7
- 239000002253 acid Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052911 sodium silicate Inorganic materials 0.000 description 7
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 7
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- -1 inorganic acid salts Chemical class 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229910017604 nitric acid Inorganic materials 0.000 description 6
- 235000011121 sodium hydroxide Nutrition 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 5
- 238000007654 immersion Methods 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 102000016751 Fringe-like Human genes 0.000 description 4
- 108050006300 Fringe-like Proteins 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 239000011133 lead Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000005695 Ammonium acetate Substances 0.000 description 3
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000002835 absorbance Methods 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 235000019257 ammonium acetate Nutrition 0.000 description 3
- 229940043376 ammonium acetate Drugs 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000001768 carboxy methyl cellulose Substances 0.000 description 3
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 3
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 3
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 2
- IVHVNMLJNASKHW-UHFFFAOYSA-M Chlorphonium chloride Chemical group [Cl-].CCCC[P+](CCCC)(CCCC)CC1=CC=C(Cl)C=C1Cl IVHVNMLJNASKHW-UHFFFAOYSA-M 0.000 description 2
- 239000004375 Dextrin Substances 0.000 description 2
- 229920001353 Dextrin Polymers 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229920003064 carboxyethyl cellulose Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 235000019425 dextrin Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 150000002433 hydrophilic molecules Chemical group 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229940078494 nickel acetate Drugs 0.000 description 2
- DOLZKNFSRCEOFV-UHFFFAOYSA-L nickel(2+);oxalate Chemical compound [Ni+2].[O-]C(=O)C([O-])=O DOLZKNFSRCEOFV-UHFFFAOYSA-L 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 2
- NROKBHXJSPEDAR-UHFFFAOYSA-M potassium fluoride Chemical compound [F-].[K+] NROKBHXJSPEDAR-UHFFFAOYSA-M 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- ZNCPFRVNHGOPAG-UHFFFAOYSA-L sodium oxalate Chemical compound [Na+].[Na+].[O-]C(=O)C([O-])=O ZNCPFRVNHGOPAG-UHFFFAOYSA-L 0.000 description 2
- 229940039790 sodium oxalate Drugs 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- QSAWQNUELGIYBC-OLQVQODUSA-N (1s,2r)-cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)[C@H]1CCCC[C@H]1C(O)=O QSAWQNUELGIYBC-OLQVQODUSA-N 0.000 description 1
- TXNFKHHYTGEPRL-UHFFFAOYSA-N 1-[4-(trifluoromethylsulfanyl)phenyl]ethanone Chemical compound CC(=O)C1=CC=C(SC(F)(F)F)C=C1 TXNFKHHYTGEPRL-UHFFFAOYSA-N 0.000 description 1
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- JXPHLUCMHXXHEJ-UHFFFAOYSA-N 2-(aminomethyl)-4-bromoaniline Chemical compound NCC1=CC(Br)=CC=C1N JXPHLUCMHXXHEJ-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- MCNPOZMLKGDJGP-UHFFFAOYSA-N 2-[2-(4-methoxyphenyl)ethenyl]-4,6-bis(trichloromethyl)-1,3,5-triazine Chemical compound C1=CC(OC)=CC=C1C=CC1=NC(C(Cl)(Cl)Cl)=NC(C(Cl)(Cl)Cl)=N1 MCNPOZMLKGDJGP-UHFFFAOYSA-N 0.000 description 1
- OURWKHLDAVYMGO-UHFFFAOYSA-N 7-thiophen-2-ylpyrazolo[1,5-a]pyrimidine-3-carboxylic acid Chemical compound C=1C=NC2=C(C(=O)O)C=NN2C=1C1=CC=CS1 OURWKHLDAVYMGO-UHFFFAOYSA-N 0.000 description 1
- 244000215068 Acacia senegal Species 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 101100309761 Aedes aegypti SDR-1 gene Proteins 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- CBOCVOKPQGJKKJ-UHFFFAOYSA-L Calcium formate Chemical compound [Ca+2].[O-]C=O.[O-]C=O CBOCVOKPQGJKKJ-UHFFFAOYSA-L 0.000 description 1
- BCZXFFBUYPCTSJ-UHFFFAOYSA-L Calcium propionate Chemical compound [Ca+2].CCC([O-])=O.CCC([O-])=O BCZXFFBUYPCTSJ-UHFFFAOYSA-L 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920002907 Guar gum Polymers 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 239000004354 Hydroxyethyl cellulose Substances 0.000 description 1
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000004368 Modified starch Substances 0.000 description 1
- 229920000881 Modified starch Polymers 0.000 description 1
- 102100038434 Neuroplastin Human genes 0.000 description 1
- 108700038050 Neuroplastin Proteins 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 239000004280 Sodium formate Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920001615 Tragacanth Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 229910001413 alkali metal ion Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 239000000305 astragalus gummifer gum Substances 0.000 description 1
- NHJPVZLSLOHJDM-UHFFFAOYSA-N azane;butanedioic acid Chemical compound [NH4+].[NH4+].[O-]C(=O)CCC([O-])=O NHJPVZLSLOHJDM-UHFFFAOYSA-N 0.000 description 1
- CHCFOMQHQIQBLZ-UHFFFAOYSA-N azane;phthalic acid Chemical compound N.N.OC(=O)C1=CC=CC=C1C(O)=O CHCFOMQHQIQBLZ-UHFFFAOYSA-N 0.000 description 1
- XJMWHXZUIGHOBA-UHFFFAOYSA-N azane;propanoic acid Chemical compound N.CCC(O)=O XJMWHXZUIGHOBA-UHFFFAOYSA-N 0.000 description 1
- YNTQKXBRXYIAHM-UHFFFAOYSA-N azanium;butanoate Chemical compound [NH4+].CCCC([O-])=O YNTQKXBRXYIAHM-UHFFFAOYSA-N 0.000 description 1
- ITHZDDVSAWDQPZ-UHFFFAOYSA-L barium acetate Chemical compound [Ba+2].CC([O-])=O.CC([O-])=O ITHZDDVSAWDQPZ-UHFFFAOYSA-L 0.000 description 1
- 229940112016 barium acetate Drugs 0.000 description 1
- GXUARMXARIJAFV-UHFFFAOYSA-L barium oxalate Chemical compound [Ba+2].[O-]C(=O)C([O-])=O GXUARMXARIJAFV-UHFFFAOYSA-L 0.000 description 1
- 229940094800 barium oxalate Drugs 0.000 description 1
- HFAQXXPQBRIXGD-UHFFFAOYSA-L barium(2+);butanedioate Chemical compound [Ba+2].[O-]C(=O)CCC([O-])=O HFAQXXPQBRIXGD-UHFFFAOYSA-L 0.000 description 1
- AESMDVCWMVZFRQ-UHFFFAOYSA-L barium(2+);butanoate Chemical compound [Ba+2].CCCC([O-])=O.CCCC([O-])=O AESMDVCWMVZFRQ-UHFFFAOYSA-L 0.000 description 1
- UXFOSWFWQAUFFZ-UHFFFAOYSA-L barium(2+);diformate Chemical compound [Ba+2].[O-]C=O.[O-]C=O UXFOSWFWQAUFFZ-UHFFFAOYSA-L 0.000 description 1
- VURCKCQSFXPUBR-UHFFFAOYSA-L barium(2+);pentanedioate Chemical compound [Ba+2].[O-]C(=O)CCCC([O-])=O VURCKCQSFXPUBR-UHFFFAOYSA-L 0.000 description 1
- MTZOKGSUOABQEO-UHFFFAOYSA-L barium(2+);phthalate Chemical compound [Ba+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O MTZOKGSUOABQEO-UHFFFAOYSA-L 0.000 description 1
- NINLDBMTAAKRTR-UHFFFAOYSA-L barium(2+);propanedioate Chemical compound [Ba+2].[O-]C(=O)CC([O-])=O NINLDBMTAAKRTR-UHFFFAOYSA-L 0.000 description 1
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- CEYLPYBDQDCTPB-UHFFFAOYSA-L butanedioate;lead(2+) Chemical compound [Pb+2].[O-]C(=O)CCC([O-])=O CEYLPYBDQDCTPB-UHFFFAOYSA-L 0.000 description 1
- UNRVMLDKEXPNDG-UHFFFAOYSA-N butanedioic acid;manganese Chemical compound [Mn].OC(=O)CCC(O)=O UNRVMLDKEXPNDG-UHFFFAOYSA-N 0.000 description 1
- OATWBNIWOJXKAN-UHFFFAOYSA-N butanedioic acid;nickel Chemical compound [Ni].OC(=O)CCC(O)=O OATWBNIWOJXKAN-UHFFFAOYSA-N 0.000 description 1
- MUXYIIUSPMEUAR-UHFFFAOYSA-N butanedioic acid;zinc Chemical compound [Zn].OC(=O)CCC(O)=O MUXYIIUSPMEUAR-UHFFFAOYSA-N 0.000 description 1
- ZFBGUXUJXUFOLU-UHFFFAOYSA-L butanoate;lead(2+) Chemical compound [Pb+2].CCCC([O-])=O.CCCC([O-])=O ZFBGUXUJXUFOLU-UHFFFAOYSA-L 0.000 description 1
- BLMXJJXSWRYMCS-UHFFFAOYSA-L butanoate;manganese(2+) Chemical compound [Mn+2].CCCC([O-])=O.CCCC([O-])=O BLMXJJXSWRYMCS-UHFFFAOYSA-L 0.000 description 1
- WRYKSRBKXBMZNY-UHFFFAOYSA-L butanoate;nickel(2+) Chemical compound [Ni+2].CCCC([O-])=O.CCCC([O-])=O WRYKSRBKXBMZNY-UHFFFAOYSA-L 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 239000004281 calcium formate Substances 0.000 description 1
- 235000019255 calcium formate Nutrition 0.000 description 1
- 229940044172 calcium formate Drugs 0.000 description 1
- QXDMQSPYEZFLGF-UHFFFAOYSA-L calcium oxalate Chemical compound [Ca+2].[O-]C(=O)C([O-])=O QXDMQSPYEZFLGF-UHFFFAOYSA-L 0.000 description 1
- 239000004330 calcium propionate Substances 0.000 description 1
- 235000010331 calcium propionate Nutrition 0.000 description 1
- PBUBJNYXWIDFMU-UHFFFAOYSA-L calcium;butanedioate Chemical compound [Ca+2].[O-]C(=O)CCC([O-])=O PBUBJNYXWIDFMU-UHFFFAOYSA-L 0.000 description 1
- FYPVXEILSNEKOO-UHFFFAOYSA-L calcium;butanoate Chemical compound [Ca+2].CCCC([O-])=O.CCCC([O-])=O FYPVXEILSNEKOO-UHFFFAOYSA-L 0.000 description 1
- GDVONGDJHUZLDB-UHFFFAOYSA-L calcium;pentanedioate Chemical compound [Ca+2].[O-]C(=O)CCCC([O-])=O GDVONGDJHUZLDB-UHFFFAOYSA-L 0.000 description 1
- PYSZASIZWHHPHJ-UHFFFAOYSA-L calcium;phthalate Chemical compound [Ca+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O PYSZASIZWHHPHJ-UHFFFAOYSA-L 0.000 description 1
- MLMODXBPCNLAGP-UHFFFAOYSA-L calcium;propanedioate Chemical compound [Ca+2].[O-]C(=O)CC([O-])=O MLMODXBPCNLAGP-UHFFFAOYSA-L 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- OKUGAOMPLZNWRT-UHFFFAOYSA-N diazanium;pentanedioate Chemical compound [NH4+].[NH4+].[O-]C(=O)CCCC([O-])=O OKUGAOMPLZNWRT-UHFFFAOYSA-N 0.000 description 1
- FRRMMWJCHSFNSG-UHFFFAOYSA-N diazanium;propanedioate Chemical compound [NH4+].[NH4+].[O-]C(=O)CC([O-])=O FRRMMWJCHSFNSG-UHFFFAOYSA-N 0.000 description 1
- YNQRWVCLAIUHHI-UHFFFAOYSA-L dilithium;oxalate Chemical compound [Li+].[Li+].[O-]C(=O)C([O-])=O YNQRWVCLAIUHHI-UHFFFAOYSA-L 0.000 description 1
- PLYZFCVUMQOYCR-UHFFFAOYSA-L dilithium;pentanedioate Chemical compound [Li+].[Li+].[O-]C(=O)CCCC([O-])=O PLYZFCVUMQOYCR-UHFFFAOYSA-L 0.000 description 1
- VNSVQJIXVXZDJF-UHFFFAOYSA-L dilithium;phthalate Chemical compound [Li+].[Li+].[O-]C(=O)C1=CC=CC=C1C([O-])=O VNSVQJIXVXZDJF-UHFFFAOYSA-L 0.000 description 1
- QTTDHHKBHTUYCK-UHFFFAOYSA-L dilithium;propanedioate Chemical compound [Li+].[Li+].[O-]C(=O)CC([O-])=O QTTDHHKBHTUYCK-UHFFFAOYSA-L 0.000 description 1
- CVOQYKPWIVSMDC-UHFFFAOYSA-L dipotassium;butanedioate Chemical compound [K+].[K+].[O-]C(=O)CCC([O-])=O CVOQYKPWIVSMDC-UHFFFAOYSA-L 0.000 description 1
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 1
- FLAYZGYYOSGYDY-UHFFFAOYSA-L dipotassium;pentanedioate Chemical compound [K+].[K+].[O-]C(=O)CCCC([O-])=O FLAYZGYYOSGYDY-UHFFFAOYSA-L 0.000 description 1
- GOMCKELMLXHYHH-UHFFFAOYSA-L dipotassium;phthalate Chemical compound [K+].[K+].[O-]C(=O)C1=CC=CC=C1C([O-])=O GOMCKELMLXHYHH-UHFFFAOYSA-L 0.000 description 1
- HCDITHVDEPPNIL-UHFFFAOYSA-L dipotassium;propanedioate Chemical compound [K+].[K+].[O-]C(=O)CC([O-])=O HCDITHVDEPPNIL-UHFFFAOYSA-L 0.000 description 1
- ZUDYLZOBWIAUPC-UHFFFAOYSA-L disodium;pentanedioate Chemical compound [Na+].[Na+].[O-]C(=O)CCCC([O-])=O ZUDYLZOBWIAUPC-UHFFFAOYSA-L 0.000 description 1
- HQWKKEIVHQXCPI-UHFFFAOYSA-L disodium;phthalate Chemical compound [Na+].[Na+].[O-]C(=O)C1=CC=CC=C1C([O-])=O HQWKKEIVHQXCPI-UHFFFAOYSA-L 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229940014259 gelatin Drugs 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 235000010417 guar gum Nutrition 0.000 description 1
- 239000000665 guar gum Substances 0.000 description 1
- 229960002154 guar gum Drugs 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 description 1
- 229940071826 hydroxyethyl cellulose Drugs 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- QTWJUFWTDYVHOM-UHFFFAOYSA-L lead(2+) propanedioate Chemical compound [Pb+2].[O-]C(=O)CC([O-])=O QTWJUFWTDYVHOM-UHFFFAOYSA-L 0.000 description 1
- YJOMWQQKPKLUBO-UHFFFAOYSA-L lead(2+);phthalate Chemical compound [Pb+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O YJOMWQQKPKLUBO-UHFFFAOYSA-L 0.000 description 1
- FYDIWJWWROEQCB-UHFFFAOYSA-L lead(2+);propanoate Chemical compound [Pb+2].CCC([O-])=O.CCC([O-])=O FYDIWJWWROEQCB-UHFFFAOYSA-L 0.000 description 1
- XIXADJRWDQXREU-UHFFFAOYSA-M lithium acetate Chemical compound [Li+].CC([O-])=O XIXADJRWDQXREU-UHFFFAOYSA-M 0.000 description 1
- 229940071257 lithium acetate Drugs 0.000 description 1
- WAHQBNXSPALNEA-UHFFFAOYSA-L lithium succinate Chemical compound [Li+].[Li+].[O-]C(=O)CCC([O-])=O WAHQBNXSPALNEA-UHFFFAOYSA-L 0.000 description 1
- 229960004254 lithium succinate Drugs 0.000 description 1
- WIAVVDGWLCNNGT-UHFFFAOYSA-M lithium;butanoate Chemical compound [Li+].CCCC([O-])=O WIAVVDGWLCNNGT-UHFFFAOYSA-M 0.000 description 1
- XKPJKVVZOOEMPK-UHFFFAOYSA-M lithium;formate Chemical compound [Li+].[O-]C=O XKPJKVVZOOEMPK-UHFFFAOYSA-M 0.000 description 1
- AXMOZGKEVIBBCF-UHFFFAOYSA-M lithium;propanoate Chemical compound [Li+].CCC([O-])=O AXMOZGKEVIBBCF-UHFFFAOYSA-M 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- CQQJGTPWCKCEOQ-UHFFFAOYSA-L magnesium dipropionate Chemical compound [Mg+2].CCC([O-])=O.CCC([O-])=O CQQJGTPWCKCEOQ-UHFFFAOYSA-L 0.000 description 1
- UHNWOJJPXCYKCG-UHFFFAOYSA-L magnesium oxalate Chemical compound [Mg+2].[O-]C(=O)C([O-])=O UHNWOJJPXCYKCG-UHFFFAOYSA-L 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 239000004137 magnesium phosphate Substances 0.000 description 1
- 229910000157 magnesium phosphate Inorganic materials 0.000 description 1
- 229960002261 magnesium phosphate Drugs 0.000 description 1
- 235000010994 magnesium phosphates Nutrition 0.000 description 1
- GMDNUWQNDQDBNQ-UHFFFAOYSA-L magnesium;diformate Chemical compound [Mg+2].[O-]C=O.[O-]C=O GMDNUWQNDQDBNQ-UHFFFAOYSA-L 0.000 description 1
- NKBDSFGVUTVKAD-UHFFFAOYSA-L magnesium;pentanedioate Chemical compound [Mg+2].[O-]C(=O)CCCC([O-])=O NKBDSFGVUTVKAD-UHFFFAOYSA-L 0.000 description 1
- APLYTANMTDCWTA-UHFFFAOYSA-L magnesium;phthalate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O APLYTANMTDCWTA-UHFFFAOYSA-L 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- BHVPEUGTPDJECS-UHFFFAOYSA-L manganese(2+);diformate Chemical compound [Mn+2].[O-]C=O.[O-]C=O BHVPEUGTPDJECS-UHFFFAOYSA-L 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- RGVLTEMOWXGQOS-UHFFFAOYSA-L manganese(2+);oxalate Chemical compound [Mn+2].[O-]C(=O)C([O-])=O RGVLTEMOWXGQOS-UHFFFAOYSA-L 0.000 description 1
- ZGIHUCQOMWIMKH-UHFFFAOYSA-L manganese(2+);propanoate Chemical compound [Mn+2].CCC([O-])=O.CCC([O-])=O ZGIHUCQOMWIMKH-UHFFFAOYSA-L 0.000 description 1
- ILOWUJWAQMHSRV-UHFFFAOYSA-N manganese;phthalic acid Chemical compound [Mn].OC(=O)C1=CC=CC=C1C(O)=O ILOWUJWAQMHSRV-UHFFFAOYSA-N 0.000 description 1
- YZDKJTBRCYOBDE-UHFFFAOYSA-N manganese;propanedioic acid Chemical compound [Mn].OC(=O)CC(O)=O YZDKJTBRCYOBDE-UHFFFAOYSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000019426 modified starch Nutrition 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 description 1
- IOYUNCMNNUDMOJ-UHFFFAOYSA-N nickel;pentanedioic acid Chemical compound [Ni].OC(=O)CCCC(O)=O IOYUNCMNNUDMOJ-UHFFFAOYSA-N 0.000 description 1
- YOQIGCBZXAYLBT-UHFFFAOYSA-N nickel;phthalic acid Chemical compound [Ni].OC(=O)C1=CC=CC=C1C(O)=O YOQIGCBZXAYLBT-UHFFFAOYSA-N 0.000 description 1
- GBIHADTXLFMYDT-UHFFFAOYSA-N nickel;propanedioic acid Chemical compound [Ni].OC(=O)CC(O)=O GBIHADTXLFMYDT-UHFFFAOYSA-N 0.000 description 1
- NAVSKFYJNZQECG-UHFFFAOYSA-N nickel;propanoic acid Chemical compound [Ni].CCC(O)=O NAVSKFYJNZQECG-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229940039748 oxalate Drugs 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- SCRKTTJILRGIEY-UHFFFAOYSA-N pentanedioic acid;zinc Chemical compound [Zn].OC(=O)CCCC(O)=O SCRKTTJILRGIEY-UHFFFAOYSA-N 0.000 description 1
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000011056 potassium acetate Nutrition 0.000 description 1
- 229960004109 potassium acetate Drugs 0.000 description 1
- 239000011698 potassium fluoride Substances 0.000 description 1
- 235000003270 potassium fluoride Nutrition 0.000 description 1
- WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 description 1
- BWILYWWHXDGKQA-UHFFFAOYSA-M potassium propanoate Chemical compound [K+].CCC([O-])=O BWILYWWHXDGKQA-UHFFFAOYSA-M 0.000 description 1
- 239000004331 potassium propionate Substances 0.000 description 1
- 235000010332 potassium propionate Nutrition 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- RWMKSKOZLCXHOK-UHFFFAOYSA-M potassium;butanoate Chemical compound [K+].CCCC([O-])=O RWMKSKOZLCXHOK-UHFFFAOYSA-M 0.000 description 1
- TVOIPJPTFTYKQM-UHFFFAOYSA-N propanedioic acid;zinc Chemical compound [Zn].OC(=O)CC(O)=O TVOIPJPTFTYKQM-UHFFFAOYSA-N 0.000 description 1
- 239000010731 rolling oil Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229960004249 sodium acetate Drugs 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- MFBOGIVSZKQAPD-UHFFFAOYSA-M sodium butyrate Chemical compound [Na+].CCCC([O-])=O MFBOGIVSZKQAPD-UHFFFAOYSA-M 0.000 description 1
- HLBBKKJFGFRGMU-UHFFFAOYSA-M sodium formate Chemical compound [Na+].[O-]C=O HLBBKKJFGFRGMU-UHFFFAOYSA-M 0.000 description 1
- 235000019254 sodium formate Nutrition 0.000 description 1
- PRWXGRGLHYDWPS-UHFFFAOYSA-L sodium malonate Chemical compound [Na+].[Na+].[O-]C(=O)CC([O-])=O PRWXGRGLHYDWPS-UHFFFAOYSA-L 0.000 description 1
- JXKPEJDQGNYQSM-UHFFFAOYSA-M sodium propionate Chemical compound [Na+].CCC([O-])=O JXKPEJDQGNYQSM-UHFFFAOYSA-M 0.000 description 1
- 239000004324 sodium propionate Substances 0.000 description 1
- 235000010334 sodium propionate Nutrition 0.000 description 1
- 229960003212 sodium propionate Drugs 0.000 description 1
- 229940074404 sodium succinate Drugs 0.000 description 1
- ZDQYSKICYIVCPN-UHFFFAOYSA-L sodium succinate (anhydrous) Chemical compound [Na+].[Na+].[O-]C(=O)CCC([O-])=O ZDQYSKICYIVCPN-UHFFFAOYSA-L 0.000 description 1
- 241000894007 species Species 0.000 description 1
- KQAGKTURZUKUCH-UHFFFAOYSA-L strontium oxalate Chemical compound [Sr+2].[O-]C(=O)C([O-])=O KQAGKTURZUKUCH-UHFFFAOYSA-L 0.000 description 1
- CRLDSNGPLRRUQU-UHFFFAOYSA-L strontium;butanedioate Chemical compound [Sr+2].[O-]C(=O)CCC([O-])=O CRLDSNGPLRRUQU-UHFFFAOYSA-L 0.000 description 1
- ITUCOQTVTSFGRJ-UHFFFAOYSA-L strontium;butanoate Chemical compound [Sr+2].CCCC([O-])=O.CCCC([O-])=O ITUCOQTVTSFGRJ-UHFFFAOYSA-L 0.000 description 1
- RXSHXLOMRZJCLB-UHFFFAOYSA-L strontium;diacetate Chemical compound [Sr+2].CC([O-])=O.CC([O-])=O RXSHXLOMRZJCLB-UHFFFAOYSA-L 0.000 description 1
- FXWRHZACHXRMCI-UHFFFAOYSA-L strontium;diformate Chemical compound [Sr+2].[O-]C=O.[O-]C=O FXWRHZACHXRMCI-UHFFFAOYSA-L 0.000 description 1
- AYNNBBQUOJKZJU-UHFFFAOYSA-L strontium;pentanedioate Chemical compound [Sr+2].[O-]C(=O)CCCC([O-])=O AYNNBBQUOJKZJU-UHFFFAOYSA-L 0.000 description 1
- KGCOMQDJRDGWDD-UHFFFAOYSA-L strontium;phthalate Chemical compound [Sr+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O KGCOMQDJRDGWDD-UHFFFAOYSA-L 0.000 description 1
- LVZZABGEQTZXHP-UHFFFAOYSA-L strontium;propanedioate Chemical compound [Sr+2].[O-]C(=O)CC([O-])=O LVZZABGEQTZXHP-UHFFFAOYSA-L 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- OKUCEQDKBKYEJY-UHFFFAOYSA-N tert-butyl 3-(methylamino)pyrrolidine-1-carboxylate Chemical compound CNC1CCN(C(=O)OC(C)(C)C)C1 OKUCEQDKBKYEJY-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 235000010493 xanthan gum Nutrition 0.000 description 1
- 239000000230 xanthan gum Substances 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
- 229940082509 xanthan gum Drugs 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229960000314 zinc acetate Drugs 0.000 description 1
- SRWMQSFFRFWREA-UHFFFAOYSA-M zinc formate Chemical compound [Zn+2].[O-]C=O SRWMQSFFRFWREA-UHFFFAOYSA-M 0.000 description 1
- WDHVIZKSFZNHJB-UHFFFAOYSA-L zinc;butanoate Chemical compound [Zn+2].CCCC([O-])=O.CCCC([O-])=O WDHVIZKSFZNHJB-UHFFFAOYSA-L 0.000 description 1
- ZPEJZWGMHAKWNL-UHFFFAOYSA-L zinc;oxalate Chemical compound [Zn+2].[O-]C(=O)C([O-])=O ZPEJZWGMHAKWNL-UHFFFAOYSA-L 0.000 description 1
- UXDZLUCNRYCZCG-UHFFFAOYSA-L zinc;phthalate Chemical compound [Zn+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O UXDZLUCNRYCZCG-UHFFFAOYSA-L 0.000 description 1
- XDWXRAYGALQIFG-UHFFFAOYSA-L zinc;propanoate Chemical compound [Zn+2].CCC([O-])=O.CCC([O-])=O XDWXRAYGALQIFG-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、感光性平版印刷版
の支持体の製造方法に関し、詳しくはストップ汚れ、感
光体残り性、消去性、フリンジ汚れ、スラッジ、耐刷性
に優れたポジ型感光性平版印刷版が得られるようなポジ
型感光性平版印刷版の支持体の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a support for a photosensitive lithographic printing plate, and more particularly to a positive type excellent in stop stain, photoreceptor residual property, erasability, fringe stain, sludge, and printing durability. The present invention relates to a method for producing a support for a positive photosensitive lithographic printing plate capable of obtaining a photosensitive lithographic printing plate.
【0002】[0002]
【従来の技術】従来、感光性平版印刷版に用いられる支
持体としては、印刷適性の面から親水性、保水性、感光
層との接着性に優れたものが要求され、このような観点
から通常、表面を砂目立てといわれる粗面化処理を施さ
れたアルミニウム版が用いられている。粗面化処理は、
ボール研磨、ブラシ研磨、ブラスト研磨、バフ研磨、ホ
ーニング研磨等の機械的粗面化法、また塩酸、硝酸等の
酸性電解液中で交流或いは直流によって支持体表面を電
解処理する電気化学的粗面化法等が知られている。2. Description of the Related Art Conventionally, a support used for a photosensitive lithographic printing plate is required to be excellent in hydrophilicity, water retention and adhesion to a photosensitive layer from the viewpoint of printability. Usually, an aluminum plate subjected to a surface roughening treatment called graining is used. The surface roughening process
Mechanical surface roughening methods such as ball polishing, brush polishing, blast polishing, buff polishing, and honing polishing, and electrochemically roughening the surface of the support by AC or DC in an acidic electrolyte such as hydrochloric acid or nitric acid Chemical conversion methods are known.
【0003】このような方法で砂目立て処理したアルミ
ニウム版はそのままでは印刷適性、耐摩耗性に劣るの
で、次いで陽極酸化処理を施し、酸化皮膜を形成する。
更に、現像性能、製版性能や印刷性能を満足させる事を
目的として陽極酸化皮膜の親水化処理を行う。親水化処
理としては、米国特許第2,714,066号、第3,
181,461号、第3,280,734号、第3,9
02,734号に開示されているようなアルカリ金属シ
リケート(例えば珪酸ナトリウム水溶液)法、特公昭3
6−22063号に開示されているフッ化ジルコン酸カ
リウム、米国特許第3,276,868号、第4,15
3,461号、第4,689,272号に開示されてい
るポリビニルスルホン酸で処理する方法、特開昭56−
21126号に開示されている親水性樹脂と水溶性塩か
らなる下塗層を設ける方法、特開昭64−14090号
で開示されているカルボン酸塩からなる下塗層を設ける
方法、特開昭63−130391号で開示されている少
なくとも1つのアミノ基と、カルボキシル基及びスルホ
基から選ばれた少なくとも1つの基とを有する化合物の
無機酸塩及び有機酸塩から選ばれた少なくとも1つから
なる親水層を設ける方法、特開昭63−165183号
で開示されている少なくとも1つのアミノ基と、ホスホ
ン基又はホスホン基の塩を含む親水層を設ける方法等、
数多くの提案がなされているが、何れも印刷時に見当合
わせや休憩等でしばらく印刷機を停止した後、印刷再開
時に発生する微点状の汚れ(以下、ストップ汚れと記
す。)、感光体残り性、消去性、フリンジ汚れ、スラッ
ジ、耐刷性等を同時に満たす事はできなかった。An aluminum plate grained by such a method is inferior in printability and abrasion resistance as it is, and is then subjected to an anodic oxidation treatment to form an oxide film.
Further, for the purpose of satisfying the developing performance, plate making performance and printing performance, the anodized film is subjected to a hydrophilic treatment. U.S. Pat. Nos. 2,714,066 and 3,
No. 181,461, No. 3,280,734, No. 3,9
No. 02,734, an alkali metal silicate (for example, sodium silicate aqueous solution) method.
Potassium fluoride zirconate disclosed in U.S. Patent No. 6,276,868;
No. 3,461,4,689,272, a method of treating with polyvinyl sulfonic acid.
JP-A-21126 discloses a method for providing an undercoat layer comprising a hydrophilic resin and a water-soluble salt, JP-A-64-14090 discloses a method for providing an undercoat layer comprising a carboxylate, No. 63-130391, which comprises at least one selected from inorganic acid salts and organic acid salts of a compound having at least one amino group and at least one group selected from a carboxyl group and a sulfo group. A method of providing a hydrophilic layer, a method of providing a hydrophilic layer containing at least one amino group and a phosphon group or a salt of a phosphon group disclosed in JP-A-63-165183,
Although many proposals have been made, in any case, after the printing press has been stopped for a while for registration or a break during printing, fine dot-like stains (hereinafter referred to as stop stains) that occur when printing is resumed, and the photosensitive member remains. , Erasability, fringe stain, sludge, printing durability, etc. could not be satisfied at the same time.
【0004】更に、粗面形状では、米国特許第4,30
1,229号ではピット径の累積度数分布と中心線平均
粗さを規定、米国特許第3,861,917号では粗面
の深さを規定、カナダ特許第955,449号では粗面
の山の高さと直径を規定、ドイツ特許第1,813,4
43号では粗面の高低差を規定、特開昭55−1322
94号では平均深さを規定、特開平5−24376号で
はピット径と径に垂直な方向の最大深さを規定等が提案
されているがこれらの形状でも、ストップ汚れ、スラッ
ジ等の改善には不十分であった。Further, in the case of a rough surface, US Pat.
No. 1,229 specifies the cumulative frequency distribution of the pit diameter and the center line average roughness, US Pat. No. 3,861,917 specifies the depth of the rough surface, and Canadian Patent No. 955,449 describes the peak of the rough surface. Height and diameter, German Patent No. 1,813,4
No. 43 specifies the height difference of a rough surface.
No. 94 specifies an average depth, and JP-A-5-24376 proposes a specification of a pit diameter and a maximum depth in a direction perpendicular to the diameter. However, even with these shapes, stop dirt and sludge can be improved. Was inadequate.
【0005】[0005]
【発明が解決しようとする課題】上記のような問題に対
して、本発明の課題は、ストップ汚れ性、感光体残り
性、消去性、フリンジ汚れ、スラッジ、耐刷性を同時に
満足させるポジ型感光性平版印刷版が得られるようなポ
ジ型平版印刷版の支持体の製造方法を提供することにあ
る。SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a positive type which simultaneously satisfies stop stain property, photoreceptor remaining property, erasability, fringe stain, sludge, and printing durability. It is an object of the present invention to provide a method for producing a support for a positive type lithographic printing plate capable of obtaining a photosensitive lithographic printing plate.
【0006】[0006]
【課題を解決するための手段】本発明の上記課題は、下
記手段により達成される。The above object of the present invention is achieved by the following means.
【0007】 塩酸水溶液中での電解粗面化処理、陽
極酸化処理、親水化処理をこの順で施したアルミニウム
支持体上に感光層を設けてなるポジ型感光性平版印刷版
の支持体の製造方法において、該親水化処理がカルボン
酸塩水溶液による親水化処理を行う前又は後に、SiO
2/M2O(Mはアルカリ金属を表す)のモル比が3.0
〜4.0、アルカリ金属ケイ酸塩濃度が0.05〜0.
5wt%であるアルカリ金属ケイ酸塩水溶液による親水
化処理を行う事を特徴とするポジ型感光性平版印刷版の
支持体の製造方法。Production of a positive photosensitive lithographic printing plate support comprising a photosensitive layer provided on an aluminum support which has been subjected to electrolytic surface roughening treatment, anodic oxidation treatment and hydrophilic treatment in an aqueous hydrochloric acid solution in this order. In the method, before or after the hydrophilization treatment is performed with an aqueous solution of a carboxylate, the hydrophilization treatment is performed using SiO 2.
The molar ratio of 2 / M 2 O (M represents an alkali metal) is 3.0
-4.0, alkali metal silicate concentration 0.05-0.4.
A method for producing a support for a positive photosensitive lithographic printing plate, characterized by performing a hydrophilization treatment with an aqueous solution of an alkali metal silicate of 5 wt%.
【0008】 塩酸水溶液中での電解粗面化処理、陽
極酸化処理、親水化処理をこの順で施したアルミニウム
支持体上に感光層を設けてなるポジ型感光性平版印刷版
の支持体の製造方法において、該親水化処理がカルボン
酸塩水溶液による親水化処理を行い、次いで親水性高分
子水溶液による親水化処理を行う事を特徴とするポジ型
感光性平版印刷版の支持体の製造方法。Production of a positive type photosensitive lithographic printing plate support comprising a photosensitive layer provided on an aluminum support which has been subjected to electrolytic surface roughening treatment, anodic oxidation treatment and hydrophilic treatment in an aqueous hydrochloric acid solution in this order. The method for producing a support of a positive photosensitive lithographic printing plate, wherein the hydrophilic treatment is performed by a hydrophilic treatment with an aqueous solution of a carboxylate, followed by a hydrophilic treatment with an aqueous solution of a hydrophilic polymer.
【0009】以下、本発明について詳細に説明する。Hereinafter, the present invention will be described in detail.
【0010】本発明に使用されるアルミニウム支持体に
は、純アルミニウム及びアルミニウム合金よりなる支持
体が含まれる。アルミニウム合金としては種々のものが
使用でき、例えば珪素、銅、マンガン、マグネシウム、
クロム、亜鉛、鉛、ビスマス、ニッケル、チタン、ナト
リウム、鉄等の金属とアルミニウムの合金が用いられ
る。本発明に使用されるアルミニウム支持体は、組成を
特に限定するものではなく、公知、公用のものを適用す
る事ができる。好ましい素材としてはJIS規格A10
50、同1100に規定されるものである。The aluminum support used in the present invention includes a support made of pure aluminum and an aluminum alloy. Various aluminum alloys can be used, for example, silicon, copper, manganese, magnesium,
An alloy of aluminum with a metal such as chromium, zinc, lead, bismuth, nickel, titanium, sodium and iron is used. The composition of the aluminum support used in the present invention is not particularly limited, and any known or publicly available one can be used. A preferred material is JIS A10
50 and 1100.
【0011】アルミニウム支持体は、粗面化に先立って
アルミニウム表面の圧延油を除去するために脱脂処理を
施すことが好ましい。脱脂処理としては、トリクレン、
シンナー等の溶剤を用いる脱脂処理、ケロシン、トリエ
タノール等のエマルジョンを用いたエマルジョン脱脂処
理等が用いられる。また、脱脂処理には、苛性ソーダ等
のアルカリの水溶液を用いることもできる。脱脂処理に
苛性ソーダ等のアルカリ水溶液を用いた場合、上記脱脂
処理のみでは除去できない汚れや酸化皮膜も除去するこ
とができる。脱脂処理に苛性ソーダ等のアルカリ水溶液
を用いた場合、支持体の表面にはスマットが生成するの
で、この場合には、燐酸、硝酸、硫酸、クロム酸等の
酸、又はそれらの混酸に浸漬しデスマット処理を施すこ
とが好ましい。The aluminum support is preferably subjected to a degreasing treatment to remove rolling oil on the aluminum surface prior to roughening. As the degreasing treatment, trichlene,
A degreasing treatment using a solvent such as a thinner, an emulsion degreasing treatment using an emulsion of kerosene, triethanol, or the like is used. In the degreasing treatment, an aqueous solution of an alkali such as caustic soda can be used. When an alkaline aqueous solution such as caustic soda is used for the degreasing treatment, dirt and oxide film that cannot be removed by the above degreasing treatment alone can also be removed. When an alkaline aqueous solution such as caustic soda is used for the degreasing treatment, smut is formed on the surface of the support. In this case, the smut is immersed in an acid such as phosphoric acid, nitric acid, sulfuric acid, chromic acid, or a mixed acid thereof and desmutted. Preferably, a treatment is applied.
【0012】次に本発明の感光性平版印刷版の支持体の
製造における粗面化処理について説明する。Next, the surface roughening treatment in the production of the photosensitive lithographic printing plate support of the present invention will be described.
【0013】本発明においては、塩酸水溶液中での電解
粗面化処理を前提条件とする。In the present invention, it is assumed that electrolytic surface roughening treatment in an aqueous hydrochloric acid solution is a precondition.
【0014】塩酸水溶液中での電解条件は特に規定はな
いが、例えば塩酸の濃度が1〜10wt%、液温5〜5
0℃、電流密度20〜100A/dm2、電気量100
〜800C/dm2の範囲で行うことが好ましい。The electrolysis conditions in the aqueous hydrochloric acid solution are not particularly limited. For example, the concentration of hydrochloric acid is 1 to 10% by weight, and the liquid temperature is 5 to 5%.
0 ° C., current density 20 to 100 A / dm 2 , electric quantity 100
It is preferable to carry out in the range of -800 C / dm 2 .
【0015】そして、上記塩酸水溶液による電解粗面化
処理を行った後には酸又は塩基による化学的な処理を行
う。この目的は、電解粗面化処理でできた表面に残存し
ているスマット等を取り除くためである。After performing the electrolytic surface roughening treatment with the hydrochloric acid aqueous solution, a chemical treatment with an acid or a base is performed. The purpose is to remove smut and the like remaining on the surface formed by the electrolytic surface roughening treatment.
【0016】酸としては、例えば硫酸、過硫酸、弗酸、
燐酸、硝酸、塩酸等が含まれ、塩基としては、例えば、
水酸化ナトリウム、水酸化カリウム等が含まれる。これ
らの中でもアルカリの水溶液を用いるのが好ましい。上
記処理をアルカリの水溶液で行った場合、支持体の表面
にはスマットが生成するので、この場合には、燐酸、硝
酸、硫酸、クロム酸等の酸、或いはそれらの混酸に浸漬
しデスマット処理を施すことが好ましい。Examples of the acid include sulfuric acid, persulfuric acid, hydrofluoric acid,
Phosphoric acid, nitric acid, hydrochloric acid, etc. are included, and as the base, for example,
Sodium hydroxide, potassium hydroxide and the like are included. Among these, it is preferable to use an aqueous alkali solution. When the above treatment is performed with an aqueous alkali solution, smut is formed on the surface of the support. In this case, the substrate is immersed in an acid such as phosphoric acid, nitric acid, sulfuric acid, chromic acid, or a mixed acid thereof to be desmutted. It is preferable to apply.
【0017】陽極酸化は従来よりこの分野で行われてい
る手法で行う事ができる。具体的には、硫酸、りん酸、
クロム酸、しゅう酸、スルファミン酸或いはこれらの2
種以上を組み合わせ、水溶液中でアルミニウムに直流電
流を流してアルミニウム支持体表面に陽極酸化皮膜を形
成させる。陽極酸化の条件は使用される電解液によって
種々変化するが、一般的には電解液の濃度が1〜50w
t%、液温5〜50℃、電流密度2〜10A/dm2、
電圧5〜50V、電解時間1〜100秒の範囲で0.5
〜5g/m2の酸化皮膜量とするのが適当である。ま
た、これらの陽極酸化処理で硫酸、りん酸の電解液を用
いる手法が一般的である。The anodic oxidation can be performed by a method conventionally used in this field. Specifically, sulfuric acid, phosphoric acid,
Chromic acid, oxalic acid, sulfamic acid or their two
A combination of the above species is used, and a direct current is applied to aluminum in an aqueous solution to form an anodized film on the surface of the aluminum support. Anodizing conditions vary depending on the electrolytic solution used, but generally, the concentration of the electrolytic solution is 1 to 50 watts.
t%, liquid temperature 5 to 50 ° C., current density 2 to 10 A / dm 2 ,
Voltage 5 to 50 V, electrolysis time 1 to 100 seconds in a range of 0.5
It is appropriate to set the amount of the oxide film to 55 g / m 2 . In addition, a technique of using an electrolytic solution of sulfuric acid or phosphoric acid in these anodizing treatments is generally used.
【0018】続いて本発明の特徴であるアルミニウム陽
極酸化皮膜上に行う親水化処理について説明する。Next, the hydrophilizing treatment performed on the aluminum anodic oxide film, which is a feature of the present invention, will be described.
【0019】本発明の効果を達成するためには カルボン酸塩水溶液による親水化処理を行う前又は
後に、SiO2/M2O(Mはアルカリ金属を表す)のモ
ル比が3.0〜4.0、アルカリ金属ケイ酸塩の濃度が
0,05〜0.5wt%である金属ケイ酸塩水溶液によ
る親水化処理を行うこと、カルボン酸塩水溶液による
親水化処理を行い、次いで親水性高分子水溶液による親
水化処理を行うことが必要である。In order to achieve the effects of the present invention, the molar ratio of SiO 2 / M 2 O (M represents an alkali metal) is 3.0 to 4 before or after the hydrophilization treatment with an aqueous carboxylate solution. 0.0, a hydrophilization treatment with an aqueous metal silicate solution having an alkali metal silicate concentration of 0.05 to 0.5 wt%, a hydrophilization treatment with a carboxylate aqueous solution, and then a hydrophilic polymer It is necessary to perform a hydrophilization treatment with an aqueous solution.
【0020】本発明の親水化処理に用いられるカルボン
酸塩は以下の構造式(I)〜(III)を有する化合物
である。The carboxylate used in the hydrophilization treatment of the present invention is a compound having the following structural formulas (I) to (III).
【0021】(I) (R1COO)nZ (II) R2COO−Z−OOCR3 又は (III) R4(COO)2Z 但し、R1、R2、R3はそれぞれ同一でも異なっていて
もよい水素又は1〜10個の炭素原子を有する脂肪族
基、脂環式又は芳香族基を表し、R4は炭素数0〜10
個の脂肪族基、脂環式又は芳香族基の2価の基である。(I) (R 1 COO) n Z (II) R 2 COO-Z-OOCR 3 or (III) R 4 (COO) 2 Z where R 1 , R 2 and R 3 are the same or different. Represents hydrogen or an aliphatic group having 1 to 10 carbon atoms, an alicyclic or aromatic group, and R 4 has 0 to 10 carbon atoms.
Aliphatic groups, alicyclic or aromatic groups.
【0022】Zは水素イオン、NH4イオン、Ia族金
属イオンもしくはIIa族、VIIa族、VIII族、IIb族又
はIVb族金属から選ばれる1価又は2価のイオンであ
る。そして、nは1又は2の整数を表す。Z is a hydrogen ion, NH 4 ion, Group Ia metal ion or monovalent or divalent ion selected from Group IIa, VIIa, VIII, IIb or IVb metal. And n represents the integer of 1 or 2.
【0023】好ましくは、以下の構造式を有する化合物
の少なくとも1つを含む親水性化合物である。Preferably, it is a hydrophilic compound containing at least one compound having the following structural formula.
【0024】[0024]
【化1】 Embedded image
【0025】但し、R1、R2、R3はそれぞれ同一でも
異なってもよい水素又は1〜10個の炭素数を有する脂
肪族、脂環式又は芳香族基である。However, R 1 , R 2 and R 3 are each the same or different hydrogen or an aliphatic, alicyclic or aromatic group having 1 to 10 carbon atoms.
【0026】R4は脂肪族、脂環式又は芳香族化合物か
ら誘導される2価の基であり、X1はNH4イオン又はア
ルカリ金属イオンから選ばれ(但し、X2、X3が同時に
水素であることはない)、そしてYはIIa族、VIIa
族、VII族、IIb族又はIVb族金属から選ばれる2価の
金属イオンである。R 4 is a divalent group derived from an aliphatic, alicyclic or aromatic compound, and X 1 is selected from NH 4 ions or alkali metal ions (provided that X 2 and X 3 are simultaneously And cannot be hydrogen), and Y is group IIa, VIIa
It is a divalent metal ion selected from metals of Group IV, VII, IIb or IVb.
【0027】これらの化合物のうち本発明で用いられる
有用な化合物は、ギ酸アンモニウム、ギ酸ナトリウム、
ギ酸カリウム、ギ酸リチウム、ギ酸カルシウム、ギ酸バ
リウム、ギ酸マグネシウム、ギ酸亜鉛、ギ酸マンガン、
ギ酸ニッケル、ギ酸ストロンチウム、ギ酸鉛、酢酸アン
モニウム、酢酸ナトリウム、酢酸カリウム、酢酸リチウ
ム、酢酸カルシウム、酢酸バリウム、酢酸マグネシウ
ム、酢酸亜鉛、酢酸ニッケル、酢酸ストロンチウム、酢
酸鉛、プロピオン酸アンモニウム、プロピオン酸ナトリ
ウム、プロピオン酸カリウム、プロピオン酸リチウム、
プロピオン酸カルシウム、プロピオン酸バリウム、プロ
ピオン酸マグネシウム、プロピオン酸亜鉛、プロピオン
酸マンガン、プロピオン酸ニッケル、プロピオン酸スト
ロンチウム、プロピオン酸鉛、酪酸アンモニウム、酪酸
ナトリウム、酪酸カリウム、酪酸リチウム、酪酸カルシ
ウム、酪酸バリウム、酪酸マグネシウム、酪酸亜鉛、酪
酸マンガン、酪酸ニッケル、酪酸ストロンチウム、酪酸
鉛、蓚酸アンモニウム、蓚酸ナトリウム、蓚酸カリウ
ム、蓚酸リチウム、蓚酸カルシウム、蓚酸バリウム、蓚
酸マグネシウム、蓚酸亜鉛、蓚酸マンガン、蓚酸ニッケ
ル、蓚酸ストロンチウム、蓚酸鉛、マロン酸アンモニウ
ム、マロン酸ナトリウム、マロン酸カリウム、マロン酸
リチウム、マロン酸バリウム、マロン酸カルシウム、マ
ロン酸ニッケル、マロン酸マグネシウム、マロン酸マン
ガン、マロン酸亜鉛、マロン酸ストロンチウム、マロン
酸鉛、コハク酸アンモニウム、コハク酸ナトリウム、コ
ハク酸カリウム、コハク酸リチウム、コハク酸カルシウ
ム、コハク酸バリウム、コハク酸マグネシウム、コハク
酸亜鉛、コハク酸マンガン、コハク酸ニッケル、コハク
酸ストロンチウム、コハク鉛、グルタル酸アンモニウ
ム、グルタル酸ナトリウム、グルタル酸カリウム、グル
タル酸リチウム、グルタル酸カルシウム、グルタル酸バ
リウム、グルタル酸マグネシウム、グルタル酸亜鉛、グ
ルタル酸マンガン、グルタル酸ニッケル、グルタル酸ス
トロンチウム、グルタル酸鉛、フタル酸アンモニウム、
フタル酸ナトリウム、フタル酸カリウム、フタル酸リチ
ウム、フタル酸カルシウム、フタル酸バリウム、フタル
酸マグネシウム、フタル酸亜鉛、フタル酸マンガン、フ
タル酸ニッケル、フタル酸ストロンチウム、フタル酸鉛
などである。Among these compounds, useful compounds used in the present invention include ammonium formate, sodium formate,
Potassium formate, lithium formate, calcium formate, barium formate, magnesium formate, zinc formate, manganese formate,
Nickel formate, strontium formate, lead formate, ammonium acetate, sodium acetate, potassium acetate, lithium acetate, calcium acetate, barium acetate, magnesium acetate, zinc acetate, nickel acetate, strontium acetate, lead acetate, ammonium propionate, sodium propionate, Potassium propionate, lithium propionate,
Calcium propionate, barium propionate, magnesium propionate, zinc propionate, manganese propionate, nickel propionate, strontium propionate, lead propionate, ammonium butyrate, sodium butyrate, potassium butyrate, lithium butyrate, calcium butyrate, barium butyrate, Magnesium butyrate, zinc butyrate, manganese butyrate, nickel butyrate, strontium butyrate, lead butyrate, ammonium oxalate, sodium oxalate, potassium oxalate, lithium oxalate, calcium oxalate, barium oxalate, magnesium oxalate, zinc oxalate, manganese oxalate, nickel oxalate, strontium oxalate , Lead oxalate, ammonium malonate, sodium malonate, potassium malonate, lithium malonate, barium malonate, calcium malonate, nickel malonate, Magnesium phosphate, manganese malonate, zinc malonate, strontium malonate, lead malonate, ammonium succinate, sodium succinate, potassium succinate, lithium succinate, calcium succinate, barium succinate, magnesium succinate, succinic acid Zinc, manganese succinate, nickel succinate, strontium succinate, lead succinate, ammonium glutarate, sodium glutarate, potassium glutarate, lithium glutarate, calcium glutarate, barium glutarate, magnesium glutarate, zinc glutarate, glutar Manganese acid, nickel glutarate, strontium glutarate, lead glutarate, ammonium phthalate,
Examples include sodium phthalate, potassium phthalate, lithium phthalate, calcium phthalate, barium phthalate, magnesium phthalate, zinc phthalate, manganese phthalate, nickel phthalate, strontium phthalate, lead phthalate, and the like.
【0028】上記のような親水性化合物を、濃度0.0
01〜10wt%、温度30℃〜95℃の水溶液として
アルミニウム支持体の浸漬に用いる。浸漬時間は1〜6
0秒の範囲が適当である。The above hydrophilic compound is added at a concentration of 0.0
It is used for immersion of an aluminum support as an aqueous solution having a temperature of 30 to 95 ° C. at a temperature of 01 to 10% by weight. Immersion time is 1-6
A range of 0 seconds is appropriate.
【0029】カルボン酸塩水溶液の親水化処理の前又は
後に、SiO2/M2O(Mはアルカリ金属を表す)のモ
ル比が3.0〜4.0、アルカリ金属ケイ酸塩の濃度が
0.05〜0.5wt%であるアルカリ金属ケイ酸塩水
溶液による親水化処理の浸漬条件は、例えば、25℃で
のpHが9〜12であるアルカリ金属ケイ酸塩水溶液
に、20〜60℃で1〜90秒間浸漬するのが好まし
い。アルカリ金属ケイ酸塩としては、ケイ酸ナトリウ
ム、ケイ酸カリウムなどが使用される。また、pHを調
整するために水酸化物を微量添加しても良い。Before or after the hydrophilization treatment of the carboxylate aqueous solution, the molar ratio of SiO 2 / M 2 O (M represents an alkali metal) is 3.0 to 4.0, and the concentration of the alkali metal silicate is The immersion conditions for the hydrophilization treatment with the aqueous alkali metal silicate solution of 0.05 to 0.5 wt% are, for example, the following: an alkali metal silicate aqueous solution having a pH of 9 to 12 at 25 ° C. For 1 to 90 seconds. As the alkali metal silicate, sodium silicate, potassium silicate and the like are used. Also, a small amount of hydroxide may be added to adjust the pH.
【0030】カルボン酸塩水溶液による親水化処理後に
行う親水性高分子水溶液による親水化処理に用いられる
親水性高分子は、水又は水を主体とする溶剤に溶解し、
かつ皮膜形成能を有するものから選ばれる。The hydrophilic polymer used for the hydrophilic treatment with the aqueous hydrophilic polymer solution after the hydrophilic treatment with the aqueous carboxylate solution is dissolved in water or a solvent mainly composed of water,
In addition, it is selected from those having a film forming ability.
【0031】本発明で用いられる親水性高分子化合物
は、ポリアクリル酸、ポリアクリルアミド、ポリビニル
アルコール、ポリヒドロキシエチルアクリレート、ポリ
ビニルピロリドンなどのアクリル酸共重合体;ポリエチ
レンイミン、ジアクリルジメチルアルミニウムクロライ
ド、ポリビニルイミダゾリン、ポリアルキルアミノエチ
ルアクリレートなどのマレイン酸共重合体;またポリエ
チレングリコールポリオキシエチレン、ポリプロピレン
グリコール、エチレンジアミン、ヘキサエチレンジアミ
ン、ポリウレタン樹脂、ポリヒドロキシメチル尿素、ポ
リヒドロキシメチルメラミン樹脂、更に変性デンプン、
デキストリン、CMC(カルボキシメチルセルロー
ス)、CEC(カルボキシエチルセルロース)、ヒドロ
キシエチルセルロース、グアーガム、トラガカントガ
ム、アラビアガム、キサンタンガム、アルギン酸ソー
ダ、ゼラチンなどの水溶性高分子が挙げられる。The hydrophilic polymer compound used in the present invention includes acrylic acid copolymers such as polyacrylic acid, polyacrylamide, polyvinyl alcohol, polyhydroxyethyl acrylate, and polyvinylpyrrolidone; polyethyleneimine, diacryldimethylaluminum chloride, polyvinyl Maleic acid copolymers such as imidazoline and polyalkylaminoethyl acrylate; polyethylene glycol polyoxyethylene, polypropylene glycol, ethylenediamine, hexaethylenediamine, polyurethane resin, polyhydroxymethylurea, polyhydroxymethylmelamine resin, and modified starch;
Water-soluble polymers such as dextrin, CMC (carboxymethylcellulose), CEC (carboxyethylcellulose), hydroxyethylcellulose, guar gum, tragacanth gum, gum arabic, xanthan gum, sodium alginate, and gelatin.
【0032】上記高分子を1wt%以下、好ましくは
0.001〜0.1wt%を含む水溶液を好ましくはp
H9以下、温度30〜95℃、浸漬時間1〜90秒間の
条件で支持体の浸漬に用いる。An aqueous solution containing 1% by weight or less, preferably 0.001 to 0.1% by weight of the above polymer is preferably p
It is used for immersion of the support under the conditions of H9 or less, a temperature of 30 to 95 ° C, and an immersion time of 1 to 90 seconds.
【0033】本発明に用いられる感光液としては公知の
ポジ型平版印刷版用の感光液を使用することができる。As the photosensitive liquid used in the present invention, known photosensitive liquids for positive planographic printing plates can be used.
【0034】[0034]
【実施例】以下、実施例により本発明の効果を例証す
る。EXAMPLES The effects of the present invention will now be illustrated by examples.
【0035】実施例1 厚さ0.3mmのアルミニウム版(材質1050、調質
H16)を、85℃に保たれた10%水酸化ナトリウム
水溶液中に浸漬し、30秒間脱脂処理を行った後水洗し
た。この脱脂したアルミニウム版を、25℃に保たれた
10%硫酸水溶液中に1分間浸漬し、デスマット処理し
た後水洗した。次いでこのアルミニウム版を、1.0%
の塩酸水溶液中において、温度30℃、電流密度60A
/dm2の条件で50Hzの正弦波交流電流により30
秒間電解粗面化した。その後、60℃に保たれた10%
水酸化ナトリウム水溶液中に10秒間浸漬し、次いで2
5℃に保たれた10%硫酸水溶液中に20秒間浸漬し、
デスマット処理した後、水洗した。続いて、20%硫酸
水溶液中で温度35℃、電流密度3A/dm2の条件で
60秒間陽極酸化処理を行った。その後濃度0.05w
t%、温度95℃のシュウ酸ナトリウム水溶液に15秒
間浸漬し第一の親水化処理を行った。10秒間流水で水
洗した後、SiO2/Na2Oのモル比が3.7のケイ酸
ナトリウムを用いて濃度0.2wt%、温度30℃の水
溶液に30秒間浸漬し、第二の親水化処理を行った。1
0秒間の水洗後、80℃で5分間乾燥してアルミニウム
支持体1を得た。Example 1 An aluminum plate (material: 1050, tempered H16) having a thickness of 0.3 mm was immersed in a 10% aqueous sodium hydroxide solution maintained at 85 ° C., subjected to a degreasing treatment for 30 seconds, and then washed with water. did. The degreased aluminum plate was immersed in a 10% sulfuric acid aqueous solution maintained at 25 ° C. for 1 minute, subjected to desmut treatment, and washed with water. Then, the aluminum plate was added 1.0%
In hydrochloric acid aqueous solution at a temperature of 30 ° C. and a current density of 60 A
/ Dm 2 and 50 Hz sine wave AC current
Electrolytic surface roughening was performed for seconds. Then, 10% kept at 60 ° C
Immerse in sodium hydroxide aqueous solution for 10 seconds, then
Immersed in a 10% sulfuric acid aqueous solution maintained at 5 ° C. for 20 seconds,
After the desmut treatment, it was washed with water. Subsequently, an anodic oxidation treatment was performed in a 20% aqueous sulfuric acid solution at a temperature of 35 ° C. and a current density of 3 A / dm 2 for 60 seconds. After that, concentration 0.05w
The sample was immersed in an aqueous solution of sodium oxalate at a temperature of 95% for 15 seconds to perform a first hydrophilic treatment. After rinsing with running water for 10 seconds, it is immersed for 30 seconds in an aqueous solution having a concentration of 0.2 wt% and a temperature of 30 ° C. for 30 seconds using sodium silicate having a molar ratio of SiO 2 / Na 2 O of 3.7 to form a second hydrophilic treatment. Processing was performed. 1
After washing with water for 0 second and drying at 80 ° C. for 5 minutes, aluminum support 1 was obtained.
【0036】次に、下記組成の感光性組成物塗布液をワ
イヤーバーを用いて塗布し、80℃で2分間乾燥し、感
光性平版印刷版を得た。このとき、感光性組成物塗布液
は乾燥重量として2.0g/m2となるようにした。Next, a photosensitive composition coating solution having the following composition was applied using a wire bar and dried at 80 ° C. for 2 minutes to obtain a photosensitive lithographic printing plate. At this time, the photosensitive composition coating solution was adjusted to have a dry weight of 2.0 g / m 2 .
【0037】 ノボラック樹脂(フェノール/m−クレゾール/p−クレゾール のモル比が10/54/36でMwが4000) 6.70g ピロガロールアセトン樹脂(Mw:3000)とo−ナフトキノンジアジド− 5−スルホニルクロリドの縮合物(エステル化率30%) 1.50g ポリエチレングリコール#2000 0.20g ビクトリアピュアブルーBOH(保土ヶ谷化学[株]製) 0.08g 2、4−ビス(トリクロロメチル)−6−(p−メトキシスチリル) −S−トリアジン 0.15g FC−430(住友3M[株]製) 0.03g cis−1,2−シクロヘキサンジカルボン酸 0.02g メチルセロソルブ 100ml 得られた感光性平版印刷版を80cm×60cmに切断
し、光源として4kWメタルハライドランプを使用し、
8mW/cm2、60秒間照射することにより露光し
た。この露光済みの感光性平版印刷版を、市販されてい
る現像液SDR−1(コニカ[株]製)を6倍に希釈、
現像時間40秒、現像温度30℃で現像した。Novolak resin (phenol / m-cresol / p-cresol molar ratio: 10/54/36, Mw: 4000) 6.70 g pyrogallol acetone resin (Mw: 3000) and o-naphthoquinonediazide-5-sulfonyl chloride 1.50 g Polyethylene glycol # 2000 0.20 g Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Co., Ltd.) 0.08 g 2,4-bis (trichloromethyl) -6- (p- Methoxystyryl) -S-triazine 0.15 g FC-430 (manufactured by Sumitomo 3M Ltd.) 0.03 g cis-1,2-cyclohexanedicarboxylic acid 0.02 g methylcellosolve 100 ml The obtained photosensitive lithographic printing plate was 80 cm × Cut to 60cm, 4kW metal halide light as light source Using a pump
Exposure was performed by irradiating at 8 mW / cm 2 for 60 seconds. The exposed photosensitive lithographic printing plate was diluted 6 times with a commercially available developer SDR-1 (manufactured by Konica Corporation).
Development was performed at a development temperature of 30 ° C. for a development time of 40 seconds.
【0038】支持体1を用いて得られたポジ型平版印刷
版について下記方法でストップ汚れ性、感光体残り性、
消去性、フリンジ汚れ性、スラッジ、耐刷性を評価し
た。For the positive type lithographic printing plate obtained using the support 1, stop stain property, photoreceptor remaining property,
Erasability, fringe stain, sludge, and printing durability were evaluated.
【0039】(ストップ汚れ性)耐刷性の評価と同様の
条件で印刷を行い、5000枚刷った時点でいったん印
刷機を停止し、1時間放置した後印刷を開始し、発生し
た微点状の汚れを100cm2内の個数で評価した。(Stop smearing property) Printing was performed under the same conditions as in the evaluation of the printing durability. When the 5000 sheets had been printed, the printing press was stopped once, allowed to stand for 1 hour, and then started printing. Was evaluated by the number within 100 cm 2 .
【0040】(感光体残り性)現像処理後に支持体につ
いて、以下の様に評価を行った。(Photoreceptor Remaining Property) After the development processing, the support was evaluated as follows.
【0041】 ○:感光体が検出されない(UV測定で基準に対する吸
光度差が0.006以下) △:僅かに感光体が検出される(UV測定で基準に対す
る吸光度差が0.015未満) ×:明らかに感光体が検出される(UV測定で基準に対
する吸光度差が0.015以上) (消去性)画像部に修正液を塗布し、一定時間経過後修
正液を水洗除去する消去作業において、上記経過時間を
10秒間〜60秒間で10秒きざみで変えた場合に何秒
間で画像部の消去が完了するかを測定し、下記の基準で
評価した。:: No photoconductor is detected (absorbance difference with respect to reference in UV measurement is 0.006 or less) Δ: Slight photoconductor is detected (absorbance difference with reference in UV measurement is less than 0.015) ×: The photoreceptor is clearly detected (absorbance difference with respect to the reference in UV measurement is 0.015 or more). (Erasing property) In the erasing operation of applying the correcting liquid to the image area and washing the correcting liquid with water after a lapse of a certain time, When the elapsed time was changed from 10 seconds to 60 seconds in increments of 10 seconds, the number of seconds required to complete the erasure of the image area was measured, and evaluated according to the following criteria.
【0042】 A:10秒間以内 B:10秒より長く20秒間以内 C:20秒より長く30秒以内 D:30秒間より長い (フリンジ状汚れ)消去液を毛筆に含ませてステップ画
像の上に塗布し、30秒、5分、10分、15分放置後
水で洗い流して、消去部の周りの汚れを、ルーペを用い
て下記の基準で判断した。A: within 10 seconds B: more than 10 seconds and within 20 seconds C: more than 20 seconds and within 30 seconds D: more than 30 seconds (fringe-like dirt) It was applied, left for 30 seconds, 5 minutes, 10 minutes, and 15 minutes, rinsed with water, and stains around the erased portion were determined using a loupe according to the following criteria.
【0043】 ○:フリンジ状の汚れはみられない △:ルーペを用いるとフリンジ状の汚れが認められる ×:目視でもフリンジ状の汚れが認められる (スラッジ)現像液1リットルに対し、10m2のアル
ミニウム支持体の現像処理を行い、現像液中に発生した
カスの状態を以下の様に判定した。:: No fringe-like stains are observed. Δ: Fringe-like stains are observed using a loupe. X: Fringe-like stains are visually observed. (Sludge) 10 m 2 of 1 liter of developer The aluminum support was developed, and the state of scum generated in the developer was determined as follows.
【0044】 ○:カスが全く生じなかった △:カスが僅かに発生した ×:カスが発生した (耐刷性)得られた平版印刷版を、印刷機(三菱重工業
[株]製DAIYA1Fー1)にかけコート紙、湿し水
(東京インキ[株]製エッチ液SG−51 濃度1.5
%)、インキ(東洋インキ製造[株]製ハイプラスM紅)
を使用して印刷を行い、印刷物の画像部にインキ着肉不
良が現れるか、又は非画像部にインキが付着するまで印
刷を行い、その時の印刷枚数を耐刷性として評価した。:: No scum was generated at all △: Scum was slightly generated ×: Scum was generated (printing durability) The obtained lithographic printing plate was printed on a printing machine (Mitsubishi Heavy Industries, Ltd.).
Coated paper, dampening solution (etch solution SG-51, Tokyo Ink Co., Ltd., concentration 1.5)
%), Ink (High Plus M Red, manufactured by Toyo Ink Manufacturing Co., Ltd.)
And printing was performed until an ink deposition defect appeared on the image portion of the printed matter or ink adhered to the non-image portion, and the number of printed sheets at that time was evaluated as printing durability.
【0045】評価結果を表1に示す。Table 1 shows the evaluation results.
【0046】実施例2 第一の親水化処理において、濃度0.1wt%、90℃
の酢酸ニッケル水溶液に15秒間浸漬した以外は実施例
1と同様にして支持体2を得た。Example 2 In the first hydrophilization treatment, a concentration of 0.1 wt% and 90 ° C.
Support 2 was obtained in the same manner as in Example 1 except that the sample was immersed in an aqueous nickel acetate solution for 15 seconds.
【0047】支持体2を用いて得られたポジ型平版印刷
版について実施例1記載の方法でストップ汚れ性、感光
体残り性、消去性、フリンジ汚れ性、スラッジ、耐刷性
を調べたところ、表1に示した結果が得られた。The positive type lithographic printing plate obtained using the support 2 was examined for stop stain property, photoreceptor residual property, erasability, fringe stain property, sludge, and printing durability by the method described in Example 1. The results shown in Table 1 were obtained.
【0048】実施例3 親水化処理において、ケイ酸ナトリウムによる親水化処
理後にシュウ酸ナトリウムによる親水化処理を行った以
外は実施例1と同様にして支持体3を得た。Example 3 A support 3 was obtained in the same manner as in Example 1 except that in the hydrophilization treatment, the hydrophilization treatment with sodium silicate was performed after the hydrophilization treatment with sodium silicate.
【0049】支持体3を用いて得られたポジ型平版印刷
版について実施例1記載の評価方法でストップ汚れ性、
感光体残り性、消去性、フリンジ汚れ性、スラッジ、耐
刷性を調べたところ、表1に示した結果が得られた。The positive lithographic printing plate obtained by using the support 3 was evaluated by the evaluation method described in Example 1 for stopping stain resistance,
When the photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability were examined, the results shown in Table 1 were obtained.
【0050】比較例1 第二の親水化処理においてSiO2/M2O比が2.5、
濃度1.5wt%のケイ酸ナトリウム水溶液を用いた以
外は実施例1と同様にして支持体4を得た。支持体4を
用いて得られたポジ型平版印刷版について実施例1記載
の評価方法でストップ汚れ性、感光体残り性、消去性、
フリンジ汚れ性、スラッジ、耐刷性を調べたところ、表
1に示した結果が得られた。Comparative Example 1 In the second hydrophilization treatment, the SiO 2 / M 2 O ratio was 2.5,
A support 4 was obtained in the same manner as in Example 1 except that an aqueous solution of sodium silicate having a concentration of 1.5 wt% was used. The positive lithographic printing plate obtained using the support 4 was evaluated for stop smearing property, photoreceptor remaining property, erasability, and the like by the evaluation method described in Example 1.
When the fringe stain property, sludge, and printing durability were examined, the results shown in Table 1 were obtained.
【0051】比較例2 第二のケイ酸ナトリウム水溶液の親水化処理を行わなか
った以外は実施例1と同様にして支持体5を得た。Comparative Example 2 A support 5 was obtained in the same manner as in Example 1 except that the second aqueous solution of sodium silicate was not subjected to the hydrophilic treatment.
【0052】支持体5を用いて得られたポジ型平版印刷
版について実施例1記載の評価方法でストップ汚れ性、
感光体残り性、消去性、フリンジ汚れ性、スラッジ、耐
刷性を調べたところ、表1に示した結果が得られた。The positive lithographic printing plate obtained using the support 5 was evaluated by the evaluation method described in Example 1 for stopping stain resistance,
When the photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability were examined, the results shown in Table 1 were obtained.
【0053】比較例3 第一、第二の親水化処理を行わなかった以外は実施例1
と同様にして支持体6を得た。支持体6を用いて得られ
たポジ型平版印刷版について実施例1記載の評価方法で
ストップ汚れ性、感光体残り性、消去性、フリンジ汚れ
性、スラッジ、耐刷性を調べたところ、表1に示した結
果が得られた。Comparative Example 3 Example 1 except that the first and second hydrophilizing treatments were not performed.
In the same manner as in the above, a support 6 was obtained. The positive lithographic printing plate obtained using the support 6 was examined for stop stain property, photoreceptor residual property, erasability, fringe stain property, sludge, and printing durability by the evaluation method described in Example 1. The results shown in FIG.
【0054】比較例4 電解粗面化処理において2.0%の硝酸水溶液を使用
し、温度30℃、電流密度100A/dm2の条件で5
0Hzの正弦波交流電流により60秒間電解を行った以
外は実施例1と同様にして支持体7を得た。Comparative Example 4 In an electrolytic surface roughening treatment, a 2.0% aqueous nitric acid solution was used at a temperature of 30 ° C. and a current density of 100 A / dm 2.
A support 7 was obtained in the same manner as in Example 1 except that electrolysis was performed for 60 seconds with a sine wave alternating current of 0 Hz.
【0055】支持体7を用いて得られたポジ型平版印刷
版について実施例1記載の評価方法でストップ汚れ性、
感光体残り性、消去性、フリンジ汚れ性、スラッジ、耐
刷性を調べたところ、表1に示した結果が得られた。The positive lithographic printing plate obtained by using the support 7 was evaluated by the evaluation method described in Example 1 for stopping stain resistance,
When the photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability were examined, the results shown in Table 1 were obtained.
【0056】[0056]
【表1】 [Table 1]
【0057】表1の結果から本発明の印刷版は何れもス
トップ汚れ性、感光体残り性、消去性、フリンジ汚れ
性、スラッジ、耐刷性に優れていることがわかる。From the results shown in Table 1, it can be seen that all the printing plates of the present invention are excellent in stop stain property, photoreceptor residual property, erasability, fringe stain property, sludge, and printing durability.
【0058】実施例4 親水化処理において、濃度0.01wt%、95℃のシ
ュウ酸ニッケル水溶液に20秒間浸漬し、続いて濃度
0.01wt%、80℃のデキストリン水溶液に30秒
間浸漬した以外は実施例1と同様にして支持体8を得
た。Example 4 In the hydrophilization treatment, the substrate was immersed in a nickel oxalate aqueous solution having a concentration of 0.01 wt% and 95 ° C. for 20 seconds, and then immersed in a 0.01 wt% aqueous dextrin solution having a concentration of 80 ° C. for 30 seconds. A support 8 was obtained in the same manner as in Example 1.
【0059】支持体8を用いて得られたポジ型平版印刷
版について実施例1記載の評価方法でストップ汚れ性、
感光体残り性、消去性、フリンジ汚れ性、スラッジ、耐
刷性を調べたところ、表2に示した結果が得られた。The positive lithographic printing plate obtained by using the support 8 was evaluated by the evaluation method described in Example 1 for stopping stain resistance,
When the photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability were examined, the results shown in Table 2 were obtained.
【0060】実施例5 第一の親水化処理において、濃度0.05wt%、95
℃の酢酸アンモニウム水溶液に15秒間浸漬し、第二の
親水化処理において濃度0.01wt%、80℃のカル
ボキシメチルセルロース水溶液に15秒間浸漬した以外
は実施例1と同様にして支持体9を得た。Example 5 In the first hydrophilization treatment, a concentration of 0.05 wt%
Support 9 was obtained in the same manner as in Example 1 except that the substrate was immersed in an aqueous solution of ammonium acetate at 15 ° C. for 15 seconds, and then immersed in an aqueous solution of carboxymethyl cellulose at a concentration of 0.01 wt% and 80 ° C. for 15 seconds in the second hydrophilic treatment. .
【0061】支持体9を用いて得られたポジ型平版印刷
版について実施例1記載の評価方法でストップ汚れ性、
感光体残り性、消去性、フリンジ汚れ性、スラッジ、耐
刷性を調べたところ、表2に示した結果が得られた。The positive lithographic printing plate obtained by using the support 9 was evaluated for the stop smearing property by the evaluation method described in Example 1.
When the photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability were examined, the results shown in Table 2 were obtained.
【0062】比較例5 第一の親水化処理において濃度0.05wt%、95℃
の酢酸アンモニウム水溶液に15秒間浸漬し、第二の親
水化処理を行わなかった以外は実施例1と同様にして支
持体10を得た。Comparative Example 5 In the first hydrophilization treatment, the concentration was 0.05 wt% and the temperature was 95 ° C.
Was immersed in an aqueous solution of ammonium acetate for 15 seconds to obtain a support 10 in the same manner as in Example 1 except that the second hydrophilic treatment was not performed.
【0063】支持体10を用いて得られたポジ型平版印
刷版について実施例1記載の評価方法でストップ汚れ
性、感光体残り性、消去性、フリンジ汚れ性、スラッ
ジ、耐刷性を調べたところ、表2に示した結果が得られ
た。The positive lithographic printing plate obtained by using the support 10 was evaluated for stop stain property, photoreceptor residual property, erasability, fringe stain property, sludge, and printing durability by the evaluation method described in Example 1. However, the results shown in Table 2 were obtained.
【0064】比較例6 第一の親水化処理を行わなかった以外は実施例4と同様
にして支持体11を得た。Comparative Example 6 A support 11 was obtained in the same manner as in Example 4 except that the first hydrophilic treatment was not performed.
【0065】支持体11を用いて得られたポジ型平版印
刷版について実施例1記載の評価方法でストップ汚れ
性、感光体残り性、消去性、フリンジ汚れ性、スラッ
ジ、耐刷性を調べたところ、表2に示した結果が得られ
た。The positive lithographic printing plate obtained by using the support 11 was evaluated for stop stain property, photoreceptor residual property, erasability, fringe stain property, sludge, and printing durability by the evaluation method described in Example 1. However, the results shown in Table 2 were obtained.
【0066】比較例7 電解粗面化処理において2.0%の硝酸水溶液を使用
し、温度30℃、電流密度100A/dm2の条件で5
0Hzの正弦波交流電流により60秒間電解を行った以
外は実施例4と同様にして支持体12を得た。Comparative Example 7 In the electrolytic surface roughening treatment, a 2.0% aqueous nitric acid solution was used at a temperature of 30 ° C. and a current density of 100 A / dm 2.
A support 12 was obtained in the same manner as in Example 4, except that electrolysis was performed for 60 seconds with a sine wave alternating current of 0 Hz.
【0067】支持体12を用いて得られたポジ型平版印
刷版について実施例1記載の評価方法でストップ汚れ
性、感光体残り性、消去性、フリンジ汚れ性、スラッ
ジ、耐刷性を調べたところ、表2に示した結果が得られ
た。The positive lithographic printing plate obtained by using the support 12 was evaluated for stop stain property, photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability by the evaluation method described in Example 1. However, the results shown in Table 2 were obtained.
【0068】[0068]
【表2】 [Table 2]
【0069】表2の結果から本発明の印刷版は何れもス
トップ汚れ性、感光体残り性、消去性、フリンジ汚れ
性、スラッジ、耐刷性に優れていることがわかる。From the results shown in Table 2, it can be seen that all the printing plates of the present invention are excellent in stop stain property, photoreceptor remaining property, erasability, fringe stain property, sludge, and printing durability.
【0070】[0070]
【発明の効果】本発明により、ストップ汚れ性、感光体
残り性、消去性、フリンジ汚れ、スラッジ、耐刷性を同
時に満足させるポジ型感光性平版印刷版が得られるよう
なポジ型感光性平版印刷版の支持体の製造方法を提供す
ることができた。According to the present invention, a positive photosensitive lithographic printing plate capable of obtaining a positive photosensitive lithographic printing plate which simultaneously satisfies stop stain property, photoreceptor residual property, erasability, fringe stain, sludge, and printing durability is obtained. A method for producing a printing plate support can be provided.
Claims (2)
酸化処理、親水化処理をこの順で施したアルミニウム支
持体上に感光層を設けてなるポジ型感光性平版印刷版の
支持体の製造方法において、該親水化処理が、カルボン
酸塩水溶液による親水化処理を行う前又は後に、SiO
2/M2O(Mはアルカリ金属を表す)のモル比が3.0
〜4.0、アルカリ金属ケイ酸塩濃度が0.05〜0.
5wt%であるアルカリ金属ケイ酸塩水溶液による親水
化処理を行う事を特徴とするポジ型感光性平版印刷版の
支持体の製造方法。1. A positive photosensitive lithographic printing plate support comprising a photosensitive layer provided on an aluminum support which has been subjected to electrolytic surface roughening treatment, anodic oxidation treatment and hydrophilic treatment in an aqueous hydrochloric acid solution in this order. In the method of producing, before or after performing the hydrophilization treatment with the carboxylate aqueous solution,
The molar ratio of 2 / M 2 O (M represents an alkali metal) is 3.0
-4.0, alkali metal silicate concentration 0.05-0.4.
A method for producing a support for a positive photosensitive lithographic printing plate, characterized by performing a hydrophilization treatment with an aqueous solution of an alkali metal silicate of 5 wt%.
酸化処理、親水化処理をこの順で施したアルミニウム支
持体上に感光層を設けてなるポジ型感光性平版印刷版の
支持体の製造方法において、該親水化処理がカルボン酸
塩水溶液による親水化処理を行い、次いで親水性高分子
水溶液による親水化処理を行う事を特徴とするポジ型感
光性平版印刷版の支持体の製造方法。2. A positive photosensitive lithographic printing plate support comprising a photosensitive layer provided on an aluminum support which has been subjected to electrolytic surface roughening treatment, anodic oxidation treatment, and hydrophilic treatment in an aqueous hydrochloric acid solution in this order. The method for producing a support for a positive photosensitive lithographic printing plate according to the above method, wherein the hydrophilizing treatment is performed by performing a hydrophilizing treatment with a carboxylate aqueous solution, and then performing a hydrophilizing treatment with a hydrophilic polymer aqueous solution. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33577096A JPH10171104A (en) | 1996-12-16 | 1996-12-16 | Production of base for positive type photosensitive planographic printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33577096A JPH10171104A (en) | 1996-12-16 | 1996-12-16 | Production of base for positive type photosensitive planographic printing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10171104A true JPH10171104A (en) | 1998-06-26 |
Family
ID=18292267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33577096A Pending JPH10171104A (en) | 1996-12-16 | 1996-12-16 | Production of base for positive type photosensitive planographic printing plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10171104A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1348570A2 (en) | 2002-03-26 | 2003-10-01 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate |
| JP2006251243A (en) * | 2005-03-09 | 2006-09-21 | Fuji Photo Film Co Ltd | Lithographic printing original plate |
-
1996
- 1996-12-16 JP JP33577096A patent/JPH10171104A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1348570A2 (en) | 2002-03-26 | 2003-10-01 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate |
| EP1348570A3 (en) * | 2002-03-26 | 2005-08-24 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate |
| US7063935B2 (en) | 2002-03-26 | 2006-06-20 | Fuji Photo Film Co., Ltd. | Support for lithographic printing plate and presensitized plate and method of producing lithographic printing plate |
| JP2006251243A (en) * | 2005-03-09 | 2006-09-21 | Fuji Photo Film Co Ltd | Lithographic printing original plate |
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