JPH10173009A - TAB tape and method of manufacturing semiconductor device using the same - Google Patents

Abstract

(57) Abstract: The most important feature of the present invention is to make it possible to improve the positional accuracy of inner leads during tape manufacturing in a TAB tape used for manufacturing TCP. For example, a Cu thin film pattern is formed on a polyimide tape 12 with an adhesive layer 13 interposed therebetween. Then, it is etched to form a plurality of leads 14. At this time, the tip of each inner lead 14a extending into the device hole 12a is connected to the flat connecting member 2a.
1 to be connected to each other. In this way, by connecting the tips of the inner leads 14a to each other, the inner leads 14a are protected from damage due to conveyance or transportation during tape manufacturing, and the deformation such as bending or bowing of the inner leads 14a is reduced. I have.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a TAB (Tape A).
The present invention relates to a method for manufacturing a semiconductor device using the same, and particularly to a TCP (Tape-Car
(rier package) type semiconductor device.

[0002]

2. Description of the Related Art Conventionally, in the field of manufacturing semiconductor devices, there has been known a method of connecting a pad on a chip to an inner lead of a TAB tape using, for example, TAB technology.

FIG. 4 shows a schematic configuration of the above TAB tape. For example, a conventional TAB tape 1
In FIG. 1, a plurality of leads 4 are formed by etching or punching out a Cu thin film pattern formed on a polyimide tape 2 via an adhesive layer 3.

Each of the leads 4 is provided such that the tip of the inner lead 4a extends into the device hole 2a. Also, the outer lead 4b is
They are arranged so as to cross the outer lead holes 2b, respectively.

Now, the TAB tape 1 having such a configuration will be described.
For example, as shown in FIG. 5, a chip 5 is made to correspond to the device hole 2a, and each of the inner leads 4a is pressed by using a bonding tool 6 having a flat pressing portion. Lead 4a
Are connected to the pads of the chip 5 via the bumps 7 respectively, so-called ILB (inner lead bonding) is performed.

However, the above TAB tape 1
The tip of the inner lead 4a of each of the leads 4 projects independently into the device hole 2a.

Therefore, when the tape 1 is manufactured, the tape 1 is susceptible to damage due to conveyance or conveyance.
This causes a large number of bonding failures during LB.

As shown in FIG. 6, for example, if the inner lead 4a bends right and left (horizontally), it is deviated from the position of the original pad 5a to be connected, and sufficient connection cannot be made. , Is connected to the adjacent pad 5a, or contacts the adjacent inner lead 4a.

Further, as shown in FIG. 7, for example, if the inner lead 4a bends up and down (vertically), the load on each inner lead 4a by the bonding tool 6 becomes non-uniform. Connection varies. As described above, the deterioration of the positional accuracy of the inner lead is a very important issue in a semiconductor device in which the pitch is increasingly narrowed in the future.

[0010]

As described above, in the prior art, the tips of the inner leads of each lead are projected independently into the device hole one by one. There is a problem in that it is susceptible to damage due to transportation or transportation, and the deterioration of the positional accuracy of the inner leads lowers the yield of ILB.

Accordingly, the present invention provides a TAB tape which can prevent the positional accuracy of inner leads from deteriorating and can improve the yield of inner lead bonding, and a method of manufacturing a semiconductor device using the same. It is intended to be.

[0012]

In order to achieve the above object, in a TAB tape according to the present invention, an insulating member having an opening and an adhesive layer are provided on one main surface of the insulating member via an adhesive layer. A plurality of lead terminals, each of which is provided with a respective one of the leading ends extending into the opening, and a leading end of each of the lead terminals, and each of the leading terminals is provided with a detail at a boundary with the leading end. And a connecting member provided with.

In the method of manufacturing a semiconductor device according to the present invention, the TAB tape and the semiconductor chip are aligned, and the TAB tape is extended into the opening of the insulating member of the TAB tape by using a tool. The tip of each lead terminal,
The method includes a step of connecting each pad on the semiconductor chip, and a step of removing a connecting member for connecting each of the leading ends, which is provided in advance at the leading end of each of the lead terminals.

According to the TAB tape and the method of manufacturing a semiconductor device using the same according to the present invention, it is possible to alleviate damage to the leading end of the lead terminal due to transport or transport during tape manufacture. This makes it possible to prevent the tip of the lead terminal from being deformed before the ILB.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a TAB tape according to an embodiment of the present invention. 2A is a plan view of the TAB tape, and FIG. 2B is a cross-sectional view taken along line 1a-1a in FIG.

That is, the TAB tape 11 is formed by, for example, etching or punching out a Cu thin film (conductive member) pattern formed on a polyimide tape (insulating member) 12 with an adhesive layer 13 interposed therebetween to form a plurality of leads. 14, the inner lead 14a of each lead 14
Are formed to have a flat plate-like connecting member (connecting member) 21 for connecting the leading ends of the two.

The above-mentioned POLYMID tape 12 has a rectangular device hole (opening) 12a having a size substantially corresponding to the size of a semiconductor chip to be mounted, and a rectangular shape along each side of the device hole 12a. Outer lead hole 12b is provided.

Each of the leads 14 is an inner lead 14
a of each of the device holes 12a extends in the device hole 12a, and the outer leads 14b cross the outer lead holes 12b, respectively, so as to be orthogonal to respective sides of the device holes 12a. It is arranged.

The connecting member 21 is provided integrally with each of the leads 14, for example, and details 21a are formed at the boundaries between the leads 14 and the tips of the inner leads 14a.

That is, the connecting member 21 is for protecting the inner leads 14a of the respective leads 14 from damage due to transportation or transportation during tape manufacture. For example, the connecting members 21 are provided for the inner leads 14 of the respective leads 14.
After the ILB connecting a to each pad on the semiconductor chip, the lead 21 is detached from the tip of the inner lead 14a of each lead 14 by the above-mentioned details 21a and can be easily removed.

Here, the details 21a are formed to facilitate the detachment of the connection member 21 from the tip of the inner lead 14a of each of the leads 14. For example, the details 21a include the leads 14
However, in the case where the thickness is 17 μm, the width is 17 μm, and the pitch width is 60 μm, the width of the thinnest portion may be about 17 μm or less.

These connecting members 21 and details 21a
Device hole 12a or outer lead hole 12
On the polyimide tape 12 after b is formed, a Cu thin film pattern formed via the adhesive layer 13 is etched to form a mask for forming each lead 14 or a shape of a die for punching. By doing so, it can be easily formed.

According to the TAB tape 11 having such a structure, each of the distal ends of the inner leads 14a connects the connecting member 21 at least until the inner leads 14a of the leads 14 are connected to each pad on the semiconductor chip. Are connected to each other via the

For this reason, it is possible to reduce the damage to the inner leads 14a of the leads 14 due to the transportation or transportation during tape production, and to reduce the deformation of the inner leads 14a of the leads 14 due to the damage. Become like

Therefore, it is possible to suppress the occurrence of the ILB defect due to the deterioration of the positional accuracy of the inner lead 14a, and to significantly improve the yield of the ILB. Next, using the TAB tape 11 having the above configuration,
A method for manufacturing a semiconductor device will be described.

FIG. 2 schematically shows an apparatus for manufacturing a semiconductor device. FIG. 1A is a cross-sectional view of a main part, and FIG. 1B is a plan view of the same. As an apparatus for manufacturing a semiconductor device, for example, by pressing each of the inner leads 14a of each lead 14, the inner leads 14a are connected to the semiconductor chip 41.
Bonding tool 31 for connecting to each of the pads via bumps 42, and each inner lead 14
and a vacuum collet 32 for removing the connecting member 21 for connecting the distal end portions of the two to each other.

In this case, the bonding tool 31
For example, it has a mouth-shaped pressing portion 31a corresponding to at least the position of each pad of the semiconductor chip 41.

The vacuum collet 32 is
For example, the inside of the collet 31 can be moved up and down. When manufacturing a semiconductor device using the TAB tape 11, first, the TAB tape 11 is used.
The semiconductor chip 41 is made to correspond to the device hole 12a of the tape 11, and the TAB tape 11 and the semiconductor chip 41
And position.

In this state, the bonding tool 31 is lowered, and only the inner leads 14a of the leads 14 are pressed by the pressing portions 31a (see FIG. 2). Thus, the inner leads 14 a of the respective leads 14 are formed and connected to the respective pads on the semiconductor chip 41 via the bumps 42.

At this time, since each of the inner leads 14a is connected to each other via the connecting member 21,
The positional accuracy is determined only by the etching or punching accuracy.

Accordingly, the inner leads 14a of each lead 14 are reliably connected to each of the corresponding pads on the semiconductor chip 41. Next, the connection member 21 is sucked by the vacuum collet 32 while the inner lead 14a of each lead 14 is pressed by the tool 31. Then, by raising the collet 32, the connecting member 21 is detached from the detail 21a and removed (see FIG. 3A).

In this case, since the tool 31 is present on each of the inner leads 14a, it is possible to prevent each of the inner leads 14a from floating when the connecting member 21 is detached.

By performing a series of ILB steps including the removal of the connecting member 21, the TAB tape 1
A semiconductor device having substantially the same configuration as the conventional one is obtained in which the inner leads 14a of the respective leads 14 are connected to the respective pads on the semiconductor chip 41 via the bumps 42 (see FIG. 3B). ).

A semiconductor device of this type will be described later, for example.
The surface of the semiconductor chip 41 including the connection point between each pad and each inner lead 14a is sealed with a potting resin or the like, and the outer lead 14b of each lead 14 is formed and trimmed to reduce its thickness. A well-known TCP suitable for narrowing the pitch is manufactured.

As described above, it is possible to alleviate the damage to the inner leads of each lead due to the conveyance or conveyance during tape production. That is, at least until each of the inner leads is connected to each pad on the semiconductor chip, the tips of the inner leads are connected to each other by the connection member. This makes it possible to improve the stress applied to the inner leads during tape production, thereby preventing the inner leads from being deformed before ILB. Therefore, it is possible to prevent the positional accuracy of the inner lead from deteriorating, and it is possible to improve the yield of ILB.

Moreover, since the connecting members are provided corresponding to the device holes, the positions of the opposed inner leads are shifted due to, for example, release of residual stress when a Cu thin film pattern is formed on a polyimide tape. That is, it is also possible to prevent so-called opposite side displacement.

In the above-described embodiment of the present invention, the case where the connecting member is formed in a flat plate shape for suction by the collet has been described as an example. However, the present invention is not limited to this. If it is not something,
It is also possible to easily make the shape such that the connecting member is not deformed by the forming of the inner lead at the time of ILB.

Further, the connection member is not limited to being removed by suction with a collet, but may be removed by a method other than the collet. Further, the details are not limited to the case of being provided in the side direction of the inner lead, and may be provided, for example, in the upper and lower direction of the inner lead, or in both the upper and lower direction and the side direction of the inner lead as necessary. It is also possible to provide.

Further, the connection member may be formed of a flat member having an insulating property. Or
By attaching an insulating flat plate such as a polyimide tape to the tip of each inner lead, almost the same effect as in the case where the tips of the inner leads are connected to each other via the above-described connecting members is obtained. Can be expected. In addition, as long as the gist of the present invention is not changed,
Needless to say, various modifications can be made.

[0040]

As described in detail above, according to the present invention, it is possible to prevent the positional accuracy of the inner leads from being deteriorated and to improve the yield of the inner lead bonding, and to use the TAB tape. A method for manufacturing a semiconductor device.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a configuration of a TAB tape according to an embodiment of the present invention.

FIG. 2 is a configuration diagram schematically showing an apparatus for manufacturing a semiconductor device.

FIG. 3 is also a schematic cross-sectional view for explaining the method for manufacturing the semiconductor device.

FIG. 4 is a diagram showing a conventional technology and T shown to explain the problem.
The schematic block diagram of AB tape.

FIG. 5 is a schematic view similarly illustrating a conventional method for manufacturing a semiconductor device.

FIG. 6 is a schematic plan view similarly illustrating a conventional method for manufacturing a semiconductor device.

FIG. 7 is a schematic cross-sectional view for explaining a conventional method for manufacturing a semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... TAB tape 12 ... Polyimide tape 12a ... Device hole 12b ... Outer lead hole 13 ... Adhesive layer 14 ... Lead 14a ... Inner lead 14b ... Outer lead 21 ... Connection member 21a ... Detail 31 ... Bonding tool 31a ... Pressing Part 32: Vacuum collet 41: Semiconductor chip 42: Bump

Claims (13)

[Claims] An insulating member having an opening, provided on one main surface of the insulating member via an adhesive layer, and each of the tip portions is arranged to extend into the opening. A TAB tape comprising: a plurality of lead terminals; and a connecting member that connects the leading end of each of the lead terminals and has a detail provided at a boundary with the leading end. 2. The TAB tape according to claim 1, wherein the connecting member is formed so as to be removed after connecting the tip of each of the lead terminals to each of the pads on the semiconductor chip. . 3. The TAB tape according to claim 1, wherein the connecting member is a flat plate that connects leading ends of the lead terminals to each other. 4. The TAB tape according to claim 1, wherein the connecting member is formed integrally with each of the lead terminals by a conductive member. 5. The TAB tape according to claim 1, wherein the connecting member is an insulating flat plate that connects the leading ends of the lead terminals to each other. 6. A step of aligning the TAB tape with the semiconductor chip, using a tool, a tip end of each lead terminal extending into an opening of the insulating member of the TAB tape, and Manufacturing a semiconductor device, comprising: a step of connecting each pad; and a step of removing a connecting member for connecting each of the leading ends, which is provided in advance at the leading end of each of the lead terminals. Method. 7. The method according to claim 6, wherein the step of removing the connecting member is performed in a state in which a tip of each of the lead terminals is pressed against each pad on the semiconductor chip by the tool. A method for manufacturing a semiconductor device. 8. The method according to claim 6, wherein the semiconductor chip has a substantially square shape, and a plurality of pads are provided along a peripheral portion thereof. 9. The TAB tape includes an insulating member having a substantially rectangular opening corresponding to the semiconductor chip, and a plurality of leads arranged such that respective tips extend into the opening. 7. The method of manufacturing a semiconductor device according to claim 6, comprising a terminal and a plate-shaped connecting member for connecting the tips of the terminals to each other. 10. The connecting member is provided with details for detachment at a boundary with the tip of each of the lead terminals, and the details are cut off to remove the connecting member. The method for manufacturing a semiconductor device according to claim 6. 11. The TAB tape comprises: an insulating member having a substantially rectangular opening corresponding to the semiconductor chip;
A plurality of lead terminals disposed so that respective tips extend in the opening, and a connecting member formed of an insulating flat plate for interconnecting the tips. The method for manufacturing a semiconductor device according to claim 6. 12. The method of manufacturing a semiconductor device according to claim 6, wherein the step of removing the connecting member is performed by sucking and removing the connecting member by a collet. 13. The tool, wherein a pressing portion for pressing a tip portion of each of the lead terminals against each pad on the semiconductor chip is provided corresponding to at least each pad on the semiconductor chip. 8. The method of manufacturing a semiconductor device according to claim 6, wherein the connection member is formed in a substantially mouth shape so that the connection member can be removed by a collet.