JPH10173473A - Electric parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide new electric parts capable of miniaturizing without deteriorating characteristics. SOLUTION: A case 1 and circuit elements 2 and 3 are included. The case 1 has a storage part 11 opening one side. The circuit element 2 has electrodes 21 to 26 which are to be circuit elements on a substrate 20. An electrode 23 needed to be mutually connected with the circuit element 3 is provided on one face of the substrate 20. The circuit element 3 has electrodes 31 and 32 which are to be circuit elements on a substrate 30. In the electrodes 31 and 32, the electrode 32 which is formed on one face of the substrate 30 is used as an electrode needed to be mutually connected with the circuit element 2. Each of the circuit elements 2 and 3 is laminated so that one face is faced to each other, and electrodes 23 to 32 are mutually connected by connecting and forming an assembly. The assemblies 2 and 3 are disposed in the storage part 11 of the case 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component. A typical example of the electronic component included in the present invention is a piezoelectric component used for a piezoelectric filter, a resonator, or the like.

[0002]

2. Description of the Related Art As piezoelectric components used in piezoelectric filters and resonators, for example, Japanese Patent Application Laid-Open No. Sho 62-281505,
As disclosed in Japanese Utility Model Laid-Open No. 4-103722, a type in which a dielectric substrate constituting a piezoelectric vibrator and a capacitor is housed in a housing portion of a case is known. In these prior arts, in supporting the piezoelectric vibrator and the dielectric substrate, two steps are provided inside the housing of the case, the piezoelectric vibrator is supported in the lower step, and the upper The step supported the dielectric substrate.

In recent years, as electronic devices have become smaller and more portable,
There is a strong demand for miniaturization of piezoelectric components. In general, in a piezoelectric component, as the size of the piezoelectric vibrator is reduced, the vibration characteristics tend to be impaired. Therefore, the piezoelectric vibrator must be downsized without being reduced in size.

[0004] However, two steps are provided inside the storage portion of the case, and the piezoelectric vibrator is supported at the lower step,
In the prior art in which the dielectric substrate is supported by the upper step,
It is difficult to satisfy such requirements. That is, when the case is reduced in size, the width and the height of the space surrounded by the step receiving the dielectric substrate must be reduced in accordance with the reduction in size. As the step receiving the dielectric substrate is reduced in size, the horizontal and vertical widths of the space surrounded by the step receiving the piezoelectric vibrator are affected by the reduction, so that the space is inevitably reduced. Therefore, when the case is miniaturized under the conventional two-stage structure, the piezoelectric vibrator has to be miniaturized. Therefore, from the viewpoint of securing desired vibration characteristics, for example, L = 3.7 mm, W = 3.1 mm, and T = 1.
It was extremely difficult to realize a piezoelectric component with an outer width dimension of 2 mm or less.

Moreover, the demand for miniaturization of piezoelectric components has already exceeded the limit of miniaturization possible with the prior art, and L = 1.
It has progressed to minute dimensions of 8 mm and W = 0.9 mm. The prior art cannot meet this demand.

[0006]

An object of the present invention is to provide a novel electronic component which can be reduced in size without deteriorating its characteristics.

Another object of the present invention is to provide an electronic component which can reduce the number of wiring connection steps between circuit elements.

[0008]

In order to solve the above-mentioned problems, an electronic component according to the present invention includes a case and a plurality of circuit elements. The case has a storage part with one side open. The circuit element has an electrode serving as a circuit element on a substrate. Among the electrodes, electrodes formed on one surface of the substrate include electrodes that need to be connected to other circuit elements.

[0009] Each of the circuit elements is stacked on each other with the one surface facing each other. Then, the electrodes that need to be connected to other circuit elements are connected and fixed to each other to form an assembly. The assembly is disposed in the storage portion of the case.

As described above, each of the circuit elements is:
The assembly is configured by being stacked and fixed with one surface facing each other. This assembly has a structure that minimizes the thickness when circuit elements are combined. Therefore, the thickness (height) of the case can be reduced and the case can be reduced in thickness.

[0011] Each of the circuit elements is stacked on top of one another with the electrodes that need to be connected to each other. Then, when stacked, the electrodes that need to be connected between the circuit elements are connected to each other. Therefore, between the circuit elements, the electrical connection is completed at the same time as the lamination and assembly. Therefore, the number of wiring connection steps between circuit elements can be reduced.

[0012] This assembly is arranged in the storage portion of the case. The case need only have one step supporting the assembly. For this reason, the thickness (height) of the case is reduced,
The thickness can be reduced.

Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings which are embodiments.

[0014]

FIG. 1 is an exploded perspective view of an electronic component according to the present invention, FIG. 2 is a plan view of the electronic component shown in FIG. 1 in an assembled state, and FIG. 3 is a view taken along line 3-3 in FIG. FIG. 4 is a sectional view taken along line 4-4 of FIG. 2, and FIG. 5 is a partial sectional view taken along line 5-5 of FIG. The illustrated electronic component is a ceramic filter as a surface mount type chip component, and includes a case 1, a piezoelectric element 2 as a circuit element, and a capacitor element 3 as a circuit element.

[0015] The case 1 has a storage portion 1 having an open side.
One. The piezoelectric element 2 has electrodes 21 to 26 as circuit elements on a surface of a substrate 20 made of piezoelectric ceramic.
Among the electrodes 21 to 26, the electrodes 21 to 25 formed on one surface of the substrate 20 include the electrodes 23 that need to be connected to the capacitor element 3.

The capacitor element 3 is a substrate 30 made of a dielectric material.
Have electrodes 31 and 32 serving as circuit elements. Of the electrodes 31 and 32, the electrode 32 formed on one surface of the substrate 30 constitutes an electrode that needs to be connected to the piezoelectric element 2.

The piezoelectric vibrator 2 and the capacitor element 3 are stacked on each other with one surface facing each other.
The two are connected and fixed to each other to form an assembly.
The electrodes 23 and 32 are solder or conductive adhesive 63 (FIG. 3).
Reference). Since there is an interval S1 between the piezoelectric element 2 and the capacitor element 3 due to the thickness of the conductive adhesive 63, the piezoelectric element 2 can perform a vibration operation.

The assembly of the piezoelectric vibrator 2 and the capacitor element 3 is disposed inside the housing 11 of the case 1. The opening of the storage section 11 provided in the case 1 is sealed by the sealing section 4.

As described above, the piezoelectric element 2 and the capacitor element 3 are stacked face-to-face and fixed to form an assembly. This assembly has a structure that minimizes the thickness when the piezoelectric element 2 and the capacitor element 3 are combined. Therefore, the thickness (height) of the case 1 can be reduced and the case 1 can be made thinner. For example, L = 1.8 mm and W = 0.9 mm, which were considered impossible in the past.
It can be realized even with an electronic component having such a small dimension.

In addition, the capacitor element 3 and the piezoelectric element 2
Are integrated as an assembly, so that the thickness (height) of the case 1 can be reduced and the case 1 can be made thinner.

The piezoelectric element 2 and the capacitor element 3 are stacked on each other with one surface on which the electrodes 23 and 32 that need to be connected to each other face each other. Then, when stacked, the electrodes 23 and 32 that need to be connected between the circuit elements are connected to each other. Therefore, the electrical connection between the piezoelectric element 2 and the capacitor element 3 is completed simultaneously with the lamination assembly. Therefore, the number of wiring connection steps in the piezoelectric element 2 and the capacitor element 3 can be reduced.

An assembly composed of the piezoelectric element 2 and the capacitor element 3 is disposed inside the storage section 11 of the case 1.
In this case, the case 1 includes the piezoelectric element 2 and the capacitor element 3
Need only have one step 12 to support the assembly of FIG. Therefore, the thickness (height) of the case can be reduced and the case can be made thinner. The stepped portion 12 has a bottom portion 10 that is recessed in the center.
Are formed around it. The material of the case 1 is a material that can withstand heat during reflow, for example,
It is desirable to use a liquid crystal polymer or an epoxy resin.

On the other side of the piezoelectric element 2, a cavity S2 is formed by the step 12. Therefore, the piezoelectric element 2
On the other side, without any vibration interference,
It can vibrate with its own vibration characteristics.

The piezoelectric element 2 is composed of two sets of vibrating electrode pairs 21 and 22, a lead electrode 23, an input lead electrode 25, and an output lead electrode 2 on one surface of a substrate 20 made of piezoelectric ceramic.
6 and a common electrode 24 on the other surface side. The vibrating electrode pair 21 has a structure in which an electrode 211 and an electrode 212 are opposed to each other at an interval. The vibrating electrode pair 22 is an electrode 221
And the electrode 22 are opposed to each other with an interval. The lead electrode 23 is the electrode 2 constituting the vibration electrode pair 21.
11 is formed on one surface of the substrate 20 so as to connect between the electrode piece 221 constituting the vibration electrode pair 22.

The case 1 is provided with an input terminal conductor 51, an output terminal conductor 52, and ground conductors 53 and 54. These terminal conductors 51 to 54 are metallized conductors. The input terminal conductor 51 is formed at one end of the housing 11 so as to cover the step 12 and the inner surface 13, and both ends are guided to the outer surface of the case 1 through the inner surface 13.

The output terminal conductor 52 is formed on the other end side of the housing portion 11 so as to cover the step portion 12 and the inner side surface 13, and both ends are guided to the outer surface of the case 1 through the inner side surface 13. Has been.

The ground conductors 53 and 54 are connected to the input terminal conductor 5
1 and the output terminal conductor 52 are provided at an intermediate portion of the storage section 11 as viewed in the arrangement direction. These ground conductors 53, 54
Are formed so as to cover the step portion 12 and the inner side surface 13, and both ends are guided to the outer surface of the case 1 through the inner side surface 13.

In the piezoelectric element 2, the lead electrode 25 derived from the electrode 212 constituting the vibration electrode pair 21 is connected to the input terminal conductor 51 by solder or a conductive adhesive 61 to form the vibration electrode pair 22. The lead electrode 26 led out from the electrode 222 is connected to the output terminal conductor 52 by solder or a conductive adhesive 62. Further, the common electrode 24 on the back side is formed of solder or conductive adhesive 6.
0 is connected to the ground conductor 53.

In the capacitor element 3, the electrode 31
It is conductively connected to the ground conductors 53 and 54 using a conductive adhesive or solder 64 or 65 or the like. The electrode 32 is connected and fixed to the lead electrode 23 and forms an assembly together with the piezoelectric element 2.

Here, the piezoelectric element 2 and the capacitor element 3
Since the terminal conductors 51 to 54 connected to the respective electrodes are guided to the outer surface of the case 1, they can be used as surface mount chip components.

FIG. 6 is an electric circuit diagram of the electronic component shown in FIGS. Two sets of vibration electrode pairs 21 and 2 of the piezoelectric element 2
This is a ceramic filter circuit in which a capacitor C1 of a capacitor element 3 is connected between the vibrating sections constituted by the two.

Further, in the embodiment, the sealing portion 4 seals the opening of the case 1. The assembly of the piezoelectric element 2 and the capacitor element 3 is placed above the capacitor element 3 in the housing 1.
1 is arranged in the storage portion 11 of the case 1 so that an internal space 1 is formed, and the upper portion thereof is sealed by the sealing portion 4. According to this structure, the assembly of the piezoelectric element 2 and the capacitor element 3 is sealed from the outside inside the accommodating portion 11 of the case 1, and predetermined operating characteristics and moisture resistance are secured. It is desirable that the sealing portion 4 is made of a thermosetting resin from the viewpoint of heat resistance.

The inner surface 13 of the case 1 is
And the capacitor element 3 is configured with an upwardly sloped surface from the step portion 12 toward the open side so that the capacitor element 3 can be easily assembled. The sealing portion 4 is formed in a rectangular flat plate shape that fits inside the case 1.

Next, a process of manufacturing an electronic component according to the present invention will be described with reference to FIGS. First, FIG.
The conductive adhesive 60 is applied to the terminal portion of the ground conductor 53 as shown by. The conductive adhesive 60 connects the common electrode 24 of the piezoelectric element 2 to either the ground conductor 53 or the ground conductor 54, and may be applied to one side of the ground conductor 53 or the ground conductor 54.

After application of the conductive adhesive 60, FIGS.
As shown by the arrow, the piezoelectric element 2 is placed on the step portion 12 on the side where the common electrode 24 is formed, and the common electrode 24 is connected to the ground conductor 53.

Next, as shown in FIG. 11, a conductive adhesive 61 is applied between the input lead electrode 25 and the input terminal conductor 51 formed on the step portion 12 of the case 1, and the output lead electrode 26 is A conductive adhesive 62 is applied between the output terminal conductor 52 formed on the step 12 of the case 1 and the lead electrode 2.
A conductive adhesive 63 is applied to the central portion of 3. Thus, the electrode 25 is connected to the input terminal conductor 51, the electrode 26 is connected to the output terminal conductor 52, and the piezoelectric element 2 is fixed to the case 1.

Next, as shown in FIGS. 12 to 14, the capacitor element 3 is mounted on the piezoelectric element 2. that time,
The electrode 32 (see the dashed line) is connected to the lead electrode 23 with a conductive adhesive 63, and the capacitor element 3 and the piezoelectric element 2
Constitute an assembly. This assembly is received and supported by the step 12.

Next, as shown in FIG. 15, a conductive adhesive 64 is applied between the electrode 31 and the ground conductor 53, and
A conductive adhesive 65 is applied between the first conductor 1 and the ground conductor 54. Thereby, the capacitor element 3 is connected to the ground conductors 53, 5
Connect to 4.

Finally, the sealing portion 4 is fitted and fixed inside the case 1 (see FIGS. 2 to 4). Thereby, the airtightness inside the case 1 is maintained.

When the ceramic filter is assembled in this manner, the piezoelectric element 2 and the capacitor element 3 necessary for forming the ceramic filter are separated from the ceramic substrate 2
Since the ceramic substrates 20 and 30 are formed separately from each other, the ceramic substrates 20 and 30 may be small in area, and the case 1 for accommodating the ceramic substrates 20 and 30 may be assembled in a small plane area. Therefore, the mounting area on the printed circuit board can be reduced, so that high-density mounting can be supported.

In the embodiment, the ceramic filter is shown. However, the present invention can be widely applied to a surface mount type chip component in which a required number of circuit elements are provided on a board surface of a substrate.

[0042]

As described above, according to the present invention, the following effects can be obtained. (A) It is possible to provide a novel electronic component that can be reduced in size without deteriorating characteristics. (B) An electronic component capable of reducing the number of wiring connection steps between circuit elements can be provided.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an electronic component according to the present invention.

FIG. 2 is a plan view of the electronic component shown in FIG. 1 in an assembled state.

FIG. 3 is a sectional view taken along line 3-3 in FIG. 2;

FIG. 4 is a sectional view taken along line 4-4 in FIG. 2;

FIG. 5 is a partial sectional view taken along line 5-5 in FIG. 3;

FIG. 6 is an electric circuit diagram of the electronic component shown in FIGS.

FIG. 7 is a diagram showing a manufacturing process of the electronic component according to the present invention.

FIG. 8 is a diagram showing a manufacturing process after the process shown in FIG. 7;

FIG. 9 is a sectional view taken along line 9-9 in FIG. 8;

FIG. 10 is a sectional view taken along the line 10-10 in FIG. 8;

FIG. 11 is a diagram showing a manufacturing process after that shown in FIG. 8;

FIG. 12 is a diagram showing a manufacturing process after that shown in FIG. 11;

FIG. 13 is a sectional view taken along the line 13-13 in FIG. 12;

FIG. 14 is a sectional view taken along the line 14-14 in FIG. 12;

FIG. 15 is a diagram showing the manufacturing process after that shown in FIG. 12;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case 2 Piezoelectric element 3 Capacitor element 4 Sealing part

Claims (5)

[Claims] 1. An electronic component including a case and a plurality of circuit elements, wherein the case has a storage portion having an opening on one surface side, and the circuit element has a circuit element and a circuit element on a substrate. Electrodes, and among the electrodes, electrodes formed on one surface of the substrate include electrodes that need to be connected to each other with another circuit element, and each of the circuit elements Are stacked with the one surface facing each other, and the electrodes that need to be connected to other circuit elements are connected and fixed to each other to form an assembly, wherein the assembly is the case. An electronic component disposed in the storage section. 2. The electronic component according to claim 1, wherein the case has a terminal conductor extending from the inside of the housing to the outside, and the circuit element has a part of the electrode. An electronic component connected to the terminal conductor. 3. The electronic component according to claim 1, wherein the circuit element includes a piezoelectric element and a capacitor element, and the piezoelectric element is provided on at least one set of one surface of the substrate made of piezoelectric ceramic. And a lead electrode extending from one electrode of the vibrating electrode pair, and a common electrode facing the vibrating electrode pair on the other surface, and the capacitor element is made of a dielectric material. An electronic component having electrodes on both sides of the substrate, one of the electrodes being connected and fixed to the lead electrode, and constituting the assembly together with the piezoelectric element. 4. The electronic component according to claim 3, wherein the case has a terminal conductor extending from the inside of the housing to the outside, wherein the terminal conductor is an input terminal conductor,
An output terminal conductor, and a ground terminal conductor, wherein the piezoelectric element has the other electrode of the vibrating electrode pair connected to one of the input terminal conductor or the output terminal conductor, and the capacitor element Is an electronic component in which an electrode formed on the other surface of the substrate is connected to the ground conductor. 5. The electronic component according to claim 1, wherein the case has a step on an inner surface, and the assembly is supported by the step.