JPH10180726A - Manufacture of particle board - Google Patents
Manufacture of particle boardInfo
- Publication number
- JPH10180726A JPH10180726A JP35597496A JP35597496A JPH10180726A JP H10180726 A JPH10180726 A JP H10180726A JP 35597496 A JP35597496 A JP 35597496A JP 35597496 A JP35597496 A JP 35597496A JP H10180726 A JPH10180726 A JP H10180726A
- Authority
- JP
- Japan
- Prior art keywords
- formaldehyde
- wood
- chips
- particle board
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 89
- 239000002023 wood Substances 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 239000002699 waste material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は放出ホルムアルデヒ
ドの少ないパーティクルボードに関する。The present invention relates to a particle board that emits less formaldehyde.
【０００２】[0002]
【従来の技術】木片にユリア樹脂やメラミン樹脂等の熱
硬化性樹脂からなる接着剤を塗布してフォーミングし、
板状に熱圧締成形したパーティクルボードがあり、家具
や建材に広く使用されている。2. Description of the Related Art An adhesive made of a thermosetting resin such as a urea resin or a melamine resin is applied to a piece of wood and formed.
There is a particle board that is hot pressed in a plate shape, and is widely used for furniture and building materials.
【０００３】[0003]
【発明が解決すべき課題】ところが、このパーティクル
ボードはホルムアルデヒドを有する接着剤で製造されて
いるため、人体に悪影響を及ぼすホルムアルデヒドが放
散する。そこで、ホルムアルデヒドを有しないフェノー
ル樹脂やイソシアネート系樹脂を接着剤として採用する
ことが提案され、接着剤組成物からのホルムアルデヒド
の放散は確かに低減された。However, since this particle board is manufactured with an adhesive containing formaldehyde, formaldehyde which has an adverse effect on the human body is emitted. Therefore, it has been proposed to use a phenol resin or an isocyanate resin having no formaldehyde as the adhesive, and the emission of formaldehyde from the adhesive composition was certainly reduced.
【０００４】しかし、木片に工場内のリサイクルチップ
や建築木質廃材、木片に加熱によりホルムアルデヒドの
発生が多いイエローラワン等の樹種を用いると、結果的
に接着剤の変更だけでは低ホルマリンボードを得ること
は困難であった。[0004] However, if wood chips such as recycled chips in a factory or building waste wood, and wood chips such as Yellow Lawan, which generates a lot of formaldehyde by heating, are used as wood pieces, a low formalin board can be obtained only by changing the adhesive. Was difficult.
【０００５】[0005]
【問題を解決するための手段】本発明の請求項１記載の
構成は、木片に予めホルムアルデヒドと反応する化合物
を散布した後、ホルムアルデヒドを有しない接着剤を塗
布してフォーミングし、熱圧締成形することを特徴とす
る。According to a first aspect of the present invention, a compound which reacts with formaldehyde is sprayed on a piece of wood in advance, and then an adhesive having no formaldehyde is applied to form the product, followed by hot pressing. It is characterized by doing.
【０００６】本発明によれば、木片に予めホルムアルデ
ヒドと反応する化合物を散布するから、木片に工場内の
リサイクルチップや建築木質廃材、木片に加熱によりホ
ルムアルデヒドの発生が多いイエローラワン等の樹種を
用いても原料の段階でホルムアルデヒドが低減され、つ
づいてホルムアルデヒドを有しない接着剤を塗布して熱
圧成形するから、ホルムアルデヒドがきわめて少ないパ
ーティクルボードを得ることができる。According to the present invention, since a compound that reacts with formaldehyde is sprayed on a piece of wood in advance, a wood chip such as a recycled chip in a factory or waste wood from building materials is used for the piece of wood, and a kind of wood such as Yellow Lawan which generates a lot of formaldehyde by heating is used for the piece of wood. However, since formaldehyde is reduced at the raw material stage, and subsequently, an adhesive having no formaldehyde is applied and hot-pressed, a particle board containing extremely little formaldehyde can be obtained.
【０００７】[0007]
【発明の実施の形態】木片は工場内のリサイクルチップ
や建築木質廃材等が用いられ、木片に加熱によりホルム
アルデヒドの発生が多いイエローラワン等の樹種も用い
ることができる。これらの原料はホルムアルデヒドを有
している。DETAILED DESCRIPTION OF THE INVENTION Recycled chips and waste wood from buildings are used as wood chips, and tree species such as yellow lauan, which often generate formaldehyde when heated, can be used. These raw materials have formaldehyde.
【０００８】これらのチップに接着剤を塗布する前に、
予めホルムアルデヒドと反応してホルムアルデヒドを低
減させる化合物を塗布しておく。化合物としてはアンモ
ニア、塩化ナトリウム、硫酸ナトリウムがある。これら
の化合物を木片の絶乾重量当り０．０００３〜０．００
３ｇ散布して乾燥する。Before applying an adhesive to these chips,
A compound that reacts with formaldehyde to reduce formaldehyde is applied in advance. Compounds include ammonia, sodium chloride, and sodium sulfate. These compounds are used in an amount of 0.0003 to 0.00
Spray 3 g and dry.
【０００９】つづいて、この木片に接着剤を塗布して熱
圧成形するが、接着剤としてもホルムアルデヒドを有し
ないものを用いる。例えばフェノール樹脂やイソシアネ
ート系樹脂などが用いられる。塗布量は木片の絶乾重量
当り７〜１３％程度塗布する。なお、接着剤中に予めワ
ックス、その他添加剤を加えてパーティクルボードの諸
性能を向上させてもよい。Subsequently, an adhesive is applied to the piece of wood and hot-pressed. An adhesive having no formaldehyde is used as the adhesive. For example, a phenol resin or an isocyanate resin is used. The application amount is about 7 to 13% based on the absolute dry weight of a piece of wood. Incidentally, wax and other additives may be added in advance to the adhesive to improve various performances of the particle board.
【００１０】熱圧成形は常法に基づく。接着剤を塗布し
た木片をフォーミングしてホットプレスで温度１８０〜
２００℃、時間１０〜２０分、圧力１５〜２５ｋｇ／ｃ
ｍ２で熱圧成形し、求めるパーティクルボードを得る。[0010] Hot pressing is based on conventional methods. Forming a piece of wood coated with adhesive and hot pressing at a temperature of 180 ~
200 ° C, time 10-20 minutes, pressure 15-25kg / c
hot-press molding with m2 to obtain the desired particle board.
【００１１】[0011]
【発明の効果】本発明によれば、木片に予めホルムアル
デヒドと反応する化合物を散布するから、木片に工場内
のリサイクルチップや建築木質廃材、木片に加熱により
ホルムアルデヒドの発生が多いイエローラワン等の樹種
を用いても材料の段階でホルムアルデヒドが低減され、
つづいてホルムアルデヒドを有しない接着剤を塗布して
熱圧成形するから、ホルムアルデヒドがきわめて少ない
パーティクルボードを得ることができる。According to the present invention, since a compound that reacts with formaldehyde is sprayed on a piece of wood in advance, wood chips such as recycled chips or waste wood from buildings in a factory, and a kind of wood such as Yellow Lawan, which generates a lot of formaldehyde when heated on a piece of wood. Formaldehyde is reduced at the material stage even if is used,
Subsequently, an adhesive having no formaldehyde is applied and hot-pressed, so that a particle board containing extremely little formaldehyde can be obtained.
Claims (1)
化合物を散布した後、ホルムアルデヒドを有しない接着
剤を塗布してフォーミングし、熱圧締成形することを特
徴とするパーティクルボードの製造方法。1. A method for producing a particle board, comprising spraying a compound which reacts with formaldehyde on a piece of wood in advance, applying an adhesive having no formaldehyde thereto, forming the same, and hot pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35597496A JPH10180726A (en) | 1996-12-26 | 1996-12-26 | Manufacture of particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35597496A JPH10180726A (en) | 1996-12-26 | 1996-12-26 | Manufacture of particle board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10180726A true JPH10180726A (en) | 1998-07-07 |
Family
ID=18446686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35597496A Pending JPH10180726A (en) | 1996-12-26 | 1996-12-26 | Manufacture of particle board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10180726A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438986C (en) * | 2007-05-16 | 2008-12-03 | 湖北东森木业有限公司 | Spraying process of spraying formaldehyde scavenger on the surface of block board |
-
1996
- 1996-12-26 JP JP35597496A patent/JPH10180726A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100438986C (en) * | 2007-05-16 | 2008-12-03 | 湖北东森木业有限公司 | Spraying process of spraying formaldehyde scavenger on the surface of block board |
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