JPH10190208A - 構成要素リード用レジスタ特質を有する印刷回路板パッドの方法と装置 - Google Patents

構成要素リード用レジスタ特質を有する印刷回路板パッドの方法と装置

Info

Publication number
JPH10190208A
JPH10190208A JP9252868A JP25286897A JPH10190208A JP H10190208 A JPH10190208 A JP H10190208A JP 9252868 A JP9252868 A JP 9252868A JP 25286897 A JP25286897 A JP 25286897A JP H10190208 A JPH10190208 A JP H10190208A
Authority
JP
Japan
Prior art keywords
solder
pad
arm
fill
inch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9252868A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10190208A5 (2
Inventor
Richenwalter Gay
ガイ・リッチェンウオルター
D Marsk Norman
ノーマン・ディー・マースク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH10190208A publication Critical patent/JPH10190208A/ja
Publication of JPH10190208A5 publication Critical patent/JPH10190208A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0015—Orientation; Alignment; Positioning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP9252868A 1996-09-06 1997-09-02 構成要素リード用レジスタ特質を有する印刷回路板パッドの方法と装置 Withdrawn JPH10190208A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US709,354 1996-09-06
US08/709,354 US6612023B1 (en) 1996-09-06 1996-09-06 Method for registering a component lead with a U-shaped metalized pad

Publications (2)

Publication Number Publication Date
JPH10190208A true JPH10190208A (ja) 1998-07-21
JPH10190208A5 JPH10190208A5 (2) 2005-06-02

Family

ID=24849515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9252868A Withdrawn JPH10190208A (ja) 1996-09-06 1997-09-02 構成要素リード用レジスタ特質を有する印刷回路板パッドの方法と装置

Country Status (2)

Country Link
US (2) US6612023B1 (2)
JP (1) JPH10190208A (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243414A (ja) * 2008-06-18 2013-12-05 Semiconductor Energy Lab Co Ltd プリント基板
WO2024195443A1 (ja) * 2023-03-17 2024-09-26 株式会社オートネットワーク技術研究所 リード端子およびコネクタ
WO2024195444A1 (ja) * 2023-03-17 2024-09-26 株式会社オートネットワーク技術研究所 リード端子およびコネクタ

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6805277B1 (en) * 2003-04-16 2004-10-19 Lotes Co., Ltd. Process for soldering electric connector onto circuit board
JP4734995B2 (ja) * 2005-03-29 2011-07-27 ミツミ電機株式会社 ランド構造及びプリント配線板並びに電子装置
US7622560B2 (en) * 2005-05-11 2009-11-24 Dinona Inc. Monoclonal antibody specific for CD43 epitope
US7967184B2 (en) * 2005-11-16 2011-06-28 Sandisk Corporation Padless substrate for surface mounted components
US8522425B2 (en) * 2008-09-29 2013-09-03 Apple Inc. Assembly techniques for electronic devices having compact housing
US8210422B2 (en) * 2009-09-30 2012-07-03 Apple Inc. Solder containment brackets
US8372502B2 (en) 2010-04-01 2013-02-12 Apple Inc. Structures for containing liquid materials and maintaining part alignment during assembly operations
CN102064402B (zh) * 2010-10-22 2014-07-09 番禺得意精密电子工业有限公司 电子元件及其与电路板的组装方法
US9266310B2 (en) 2011-12-16 2016-02-23 Apple Inc. Methods of joining device structures with adhesive
US8851933B2 (en) 2013-03-11 2014-10-07 Kerdea Technologies, Inc. Releasable electrical connection
US9472904B2 (en) 2014-08-18 2016-10-18 Amphenol Corporation Discrete packaging adapter for connector
US20260188932A1 (en) * 2024-12-26 2026-07-02 Raytheon Company Self-centering electrical contacts

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034149A (en) * 1975-10-20 1977-07-05 Western Electric Company, Inc. Substrate terminal areas for bonded leads
US4303291A (en) * 1980-11-24 1981-12-01 Western Electric Company, Inc. Method of seating connector terminals on circuit board contact pads
FR2625040B1 (fr) * 1987-12-22 1991-01-04 Cit Alcatel Plot de report de connexion pour la fixation d'une broche a griffes sur la tranche d'un substrat de circuit hybride
US5441429A (en) * 1990-04-13 1995-08-15 North American Specialties Corporation Solder-bearing land
US5245750A (en) * 1992-02-28 1993-09-21 Hughes Aircraft Company Method of connecting a spaced ic chip to a conductor and the article thereby obtained
US5239748A (en) * 1992-07-24 1993-08-31 Micro Control Company Method of making high density connector for burn-in boards
JP3166460B2 (ja) * 1993-12-24 2001-05-14 松下電器産業株式会社 コネクタの実装方法
US5457879A (en) * 1994-01-04 1995-10-17 Motorola, Inc. Method of shaping inter-substrate plug and receptacles interconnects
US5468920A (en) * 1994-07-22 1995-11-21 Apple Computer, Inc. Printed circuit board having raised conductor pads
US5541367A (en) * 1994-10-31 1996-07-30 Dell Usa, L.P. Printed circuit board having a land with an inwardly facing surface and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013243414A (ja) * 2008-06-18 2013-12-05 Semiconductor Energy Lab Co Ltd プリント基板
US9095066B2 (en) 2008-06-18 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Printed board
WO2024195443A1 (ja) * 2023-03-17 2024-09-26 株式会社オートネットワーク技術研究所 リード端子およびコネクタ
WO2024195444A1 (ja) * 2023-03-17 2024-09-26 株式会社オートネットワーク技術研究所 リード端子およびコネクタ

Also Published As

Publication number Publication date
US6867504B2 (en) 2005-03-15
US20040026120A1 (en) 2004-02-12
US6612023B1 (en) 2003-09-02

Similar Documents

Publication Publication Date Title
US7186123B2 (en) High density connector and method of manufacture
US6773269B1 (en) Circuit board assembly which utilizes a pin assembly and techniques for making the same
JP4025885B2 (ja) コネクタチップ及びテーピングコネクタチップ
US5172852A (en) Soldering method
US6612023B1 (en) Method for registering a component lead with a U-shaped metalized pad
US9106005B2 (en) Surface mount device
US6175086B1 (en) Method for mounting terminal on circuit board and circuit board
CN1765160B (zh) 用于使两个电路板电和机械连接的方法
JPH11163044A (ja) プリント配線板および電子部品実装方法
US20040203237A1 (en) Mounting electronic components
JPH07131139A (ja) 電子部品用配線基板
JPH1154901A (ja) 半田付け方法及び半田付け用治具
JPS60163496A (ja) 印刷回路基板
JP4112118B2 (ja) コンタクトの製造方法及びコネクタ
JP4381657B2 (ja) 回路基板および電子部品実装方法
JP3079972B2 (ja) 電子部品のはんだ接続方法
JP3214009B2 (ja) 半導体素子の実装基板および方法
JPH0738225A (ja) 半導体装置及びその製造方法
JP2687899B2 (ja) 表面実装型端子
JPS61294889A (ja) 可撓性プリント基板の接続構造
JPH0918123A (ja) プリント基板と電子部品の実装方法及び実装構造
JP2005203664A (ja) 半導体装置の実装方法
JPH09331147A (ja) リフローソルダリング用プリント配線板
JP2002270649A (ja) 半導体装置およびその製造方法
JPH05206693A (ja) 接続用端子付き電子部品およびその実装方法

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20040420

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20040421

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040809

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040809

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20060322