JPH10197856A - Method of cutting substrate for liquid crystal display device - Google Patents

Abstract

(57) [Summary] [Problem] To consider a process constraint in a cell assembly process,
Establish basic design rules. SOLUTION: When cutting out array chips having n screen sizes, a cutting line between a plurality of array chips is the same as at least one of the X-axis direction and the Y-axis direction on the substrate. Arrange a plurality of array chips. The screen size is A1, A2,... An (n ≧ 2,
An> 0) When cutting out a plurality of array chips having the size relationship of A1> A2 >>...> An, between the plurality of array chips, between An when the An array chips are cut and panelized. Of the screen size is A
Arrange a plurality of array chips so that they do not come in contact with array chips of n + 1 or less. The array chips are arranged so that at least one of the conductive particle applied portion and the seal adhesive applied portion of each chip has the same pitch.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a substrate for a liquid crystal display device.

[0002]

2. Description of the Related Art A liquid crystal display device is required to have a significant cost reduction with an increase in the use value and purpose of use and an increase in demand. Recent efforts to reduce costs include reducing the cost of materials used, increasing the yield, and increasing the size of the mother glass substrate. Among them, regarding the size of the mother glass substrate, each company has started up a large format production line so that more array chips can be arranged, and the number of liquid crystal panel chips produced from one mother glass substrate has increased. And cost reduction by improving productivity.

[0003] The array chip referred to here is a chip in which a signal line group arranged in an XY matrix and a thin film transistor group electrically connected to the signal line group are formed. A so-called TFT array chip to be operated, or a chip in which data electrode line groups are formed in a matrix arrangement of X and Y with respect to the scan electrode line groups on the opposite substrate, and signals are sequentially scanned from the scan lines. So-called STN-type array chip or the like that operates liquid crystal.

In general, when mass-producing array chips,
The number of array chips of the same size that can be mainstream is
The mother glass substrate size is determined so that more can be obtained. Therefore, if the size of the mainstream liquid crystal panel becomes small even if it is small, the number of arrangements on the mother glass substrate is drastically reduced, and the productivity may be greatly reduced.

For example, when the size of the mother glass substrate is 370 m
In the case of mx 470 mm, four arrangement numbers can be obtained with a 10.4 inch array chip, but when it is 11.3 inches, only two arrangement numbers can be obtained, and unnecessary portions unnecessary on the mother glass substrate increase. In such a case, as an effective use of the invalid portion on the mother glass substrate, a method of reducing the invalid portion on the mother glass substrate by arranging an array chip having a screen size different from that of the main array chip is used.

There are various design and process restrictions for arranging a plurality of array chips of the same size and different sizes on a mother glass substrate. In particular, the alignment film is printed on the mother glass substrate on which the array chip is arranged and the counter electrode substrate, rubbing treatment, application of a seal adhesive, application of conductive particle paste are performed, and after the former two glass substrates are bonded together, they are cut. There are many restrictions in a cell assembly process for completing a plurality of panel chips.

[0007] For example, in order to print a glass substrate and a counter electrode substrate on the same alignment film printing plate, a plurality of array chips are symmetrical in the X-axis direction or the Y-axis direction on the glass substrate. Need to be placed. Further, since the rubbing direction in one glass substrate can be taken in only one direction, it is necessary to arrange the array chips so that the rubbing directions of a plurality of array chips are the same or opposite.

[0008] The process restrictions on the arrangement of such array chips are generally set as design rules. However, there is no special design rule in the cell process from the rubbing treatment to the application of the seal adhesive, the application of the conductive particle paste, and the cleaving.

[0009] Therefore, in the seal adhesive application and the conductive particle paste application process performed by two and three heads, one head process is performed because the pitch is different. In addition, in the cutting step of cutting the substrate from end to end in the X-axis direction and the Y-axis direction, the inside of the screen of the arranged array chips must be cut, and the productivity of the liquid crystal display panel and the invalid portion of the mother glass substrate are reduced. There was a problem in terms of effective utilization of

[0010]

As described above, as one of the methods for reducing the cost of a liquid crystal display device, a plurality of array chips of the same type or different types are arranged on a mother glass substrate. In some cases, the ineffective portion of the glass substrate is effectively used.

In such a case, it is necessary to establish a basic layout design rule of the array chip, in which the process restrictions in the cell assembling process are sufficiently considered. SUMMARY OF THE INVENTION The present invention solves the above problems and establishes a basic design rule in an arrangement design in which a plurality of array chips of the same type or different sizes are arranged on a glass substrate, particularly considering process constraints in a cell assembly process. It is an object of the present invention to provide a method of cutting a substrate for a liquid crystal display device, which can be performed.

[0012]

According to the present invention, in a configuration in which a plurality of array chips are arranged on a mother glass substrate, when the screen size of each array chip is the same or different, the array chips are formed into a panel. Of the X on the mother glass substrate between a plurality of array chips
The layout design of the array chip is performed so that the same line is formed in either the axial direction or the Y-axis direction. If the screen size of each array chip is different and the cutting line of each array chip is not the same line in both the X-axis direction and the Y-axis direction on the mother glass substrate, an array chip having a large screen size The layout design is performed so that the cutting line does not contact other array chips.

According to the present invention, a basic layout design rule of a plurality of array chips on a mother glass substrate in consideration of a cell assembling process can be obtained.

[0014]

According to a first aspect of the present invention, there is provided a method of cutting a substrate for a liquid crystal display device, wherein a plurality of array chips are divided into a plurality of array chips at the time of cutting out array chips having n screen sizes from one substrate. A plurality of array chips are arranged and cleaved such that the same line is formed in at least one of the X-axis direction and the Y-axis direction on the substrate.

According to this structure, when the screen size of a plurality of array chips arranged on the mother glass substrate is the same or different, the basic layout design rule of the plurality of array chips in consideration of the cutting process restriction of the cell assembling process is set. Once established, the productivity of liquid crystal display devices can be improved.

According to a second aspect of the present invention, there is provided a method of cutting a substrate for a liquid crystal display device, wherein a screen size is A1, A2,.
An (n ≧ 2, An> 0), and A1>A2>...> A
In cutting out a plurality of array chips having a size relationship of n, a cutting line between An when cutting the array chip of An into a panel among the plurality of array chips is as follows:
A plurality of array chips are arranged and cut so as not to contact an array chip having a screen size of An + 1 or less.

According to this configuration, when a plurality of array chips arranged on the mother glass substrate have different screen sizes, a basic layout design rule for the plurality of array chips is established in consideration of the process restriction of the cell assembly process. Thus, the productivity of the liquid crystal display device can be improved.

According to a third aspect of the present invention, in the method of cutting a substrate for a liquid crystal display device, when cutting out array chips having n screen sizes from one substrate, a conductive particle coated portion of each chip or a sealing adhesive is used. At least one of the applied portions is characterized by arranging and cutting array chips so as to have the same pitch.

According to this configuration, the basic layout design rules of a plurality of array chips are established in consideration of the restrictions on the conductive particle application cutting process and the sealing adhesive application process in the cell assembly process, and the production of the liquid crystal display device is started. Performance can be improved.

Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 4. (Embodiment 1) FIG.
A process of cutting out a plurality of array chips 1-1, 1-2,..., 1-4 is shown. Here, a case where n = 1 is shown.

That is, a schematic diagram in which array chips 1-1, 1-2, 1-3, and 1-4 chips having a screen size of 10.4 inches are arranged on a 370 mm × 470 mm glass substrate 1-5. It is. Each array chip has the same outer dimensions and area.

The arrangement of adjacent array chips 1-1, 1-2, 1-3, 1-4, 1-1, 1-3 and 1-2, 1-4 on the mother glass substrate is as follows. The cutting lines 1-6, 1-7, 1-8 and 1-9 are formed as shared lines in the X-axis direction or the Y-axis direction on the glass substrate. Productivity is improved.

(Embodiment 2) FIG. 2 shows a plurality of array chips 2-1, 2-2,.
The step of cutting out 2-4 is shown. Here, the case where n = 2 is shown.

That is, on a mother glass substrate of 370 mm × 470 mm, the external dimensions and area are equal to each other, and
Array chip 2-1 having a screen size of 2.1 inches
2-2 and array chips 2-3 and 2 having different screen sizes
4 shows a schematic diagram in which chips are arranged.

The arrangement of the adjacent array chips 2-1 and 2-2, 2-3 and 2-4, 2-1 and 2-3 and 2-2 and 2-4 on the mother glass substrate is as follows. By dividing the cutting lines 2-5, 2-6, 2-7, and 2-8 in the X-axis direction or the Y-axis direction on the mother glass substrate so as to be shared as the same line, the cutting is performed. The productivity in the process is improved.

(Embodiment 3) FIG. 3 shows a case where a plurality of array chips 3-1, 3-2,.
The step of cutting out 3-4 is shown. Here, the case where n = 2 is shown.

That is, on a mother glass substrate of 370 mm × 470 mm, external dimensions and area are equal to each other and 1
Array chip 3-1 having a screen size of 2.1 inches
3-2 and array chips 3-3 and 3 having different screen sizes
FIG. 4 shows a schematic view in which -4 is arranged.

The arrangement of each array chip on the mother glass substrate is based on array chips 3-1 and 3-1 having a large screen size.
3-5, a cutting line when panelizing 3-2
An array chip 3-7 having a small screen size in the X-axis direction or the Y-axis direction on the mother glass substrate.
By arranging so as not to contact with 4, the productivity in the cleaving process is improved.

(Embodiment 4) FIG. 4 shows a plurality of array chips 4-1, 4-2,.
The step of cutting out 4-6 is shown. Here, the case where n = 2 is shown.

That is, array chips 4-1 and 4-2 having the same outer dimensions and area are arranged on a mother glass substrate.
And array chips 4-3, 4-4 with different screen sizes
The schematic diagram in which 4-5 and 4-6 are arranged is shown.

The arrangement of the plurality of array chips 4-1, 4-2, 4-3, 4-4, 4-5, and 4-6 on the mother glass substrate is such that the array chips 4-1 and 4-1 having the same screen size are arranged. 4-
The arrangement pitch 4-7 between the two is different from the area of the array chip, and the arrangement pitch 4-8 of the array chips 4-3, 4-4 and 4-5, 4-6 each having the same screen size.
When the seal adhesive application step and the conductive adhesive application step are, for example, two heads, the step is performed without changing the pitch between the heads or changing to one head application. Can flow. Therefore, the conventional function of maintaining the productivity or improving the productivity is performed.

[0032]

As described above, according to the method for cutting a substrate for a liquid crystal display device of the present invention, in a configuration in which a plurality of array chips are arranged on a mother glass substrate, the screen size of each array chip is the same or different. In this case, productivity can be improved by designing the layout of array chips so that the cutting lines for panelizing the array chips are the same in either the X-axis direction or the Y-axis direction on the mother glass substrate. improves.

If the screen size of each array chip is different and the cutting line of each array chip is not the same line in both the X-axis direction and the Y-axis direction on the mother glass substrate, the screen size By designing the layout so that the cutting line of the array chip having a large size does not come into contact with other array chips, the productivity is similarly improved.

When the screen size of each array chip is different and each array chip is arranged at the same pitch, the conductive particle application cutting process and the seal adhesive application process in the cell assembly process are performed. Thus, a basic layout design rule for a plurality of array chips can be established in consideration of the above restrictions, and the productivity of the liquid crystal display device can be improved.

Therefore, according to the present invention, in a design in which a plurality of array chips of the same size or different sizes are arranged on a mother glass substrate, it is necessary to establish a basic design rule in consideration of a process constraint in a cell assembling process. Thus, the glass substrate can be effectively used to the maximum, and the productivity of the liquid crystal display device can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a cutting line of a substrate according to Embodiment 1;

FIG. 2 is a schematic view showing a cutting line of a substrate according to (Embodiment 2).

FIG. 3 is a schematic view showing a cutting line of a substrate according to (Embodiment 3).

FIG. 4 is a schematic view showing a cutting line of a substrate according to a fourth embodiment.

[Explanation of symbols]

1-1, 1-2, 1-4 Array chip with equal screen size 1-5 Glass substrate 1-6, 1-7 X on glass substrate
Axial cutting line 1-8, 1-9 Y on glass substrate
Axial cutting line 2-1, 2-2 Array chip with equal screen size 2-3, 2-4 Array chip with equal screen size 2-5, 2-6 X-axis cutting line on glass substrate 2-7, 2-8 Y on glass substrate
Axial cutting line 3-1 and 3-2 Array chips with equal screen size 3-3 and 3-4 Array chips with equal screen size 3-5 and 3-6 X on glass substrate
Axial cutting line 3-7 Y on glass substrate
Axial cutting lines 4-1 and 4-2 Array chips having the same screen size 4-3, 4-4 to 4-6 Array chips having the same screen size 4-7 and 4-8 Arrays on a glass substrate Chip arrangement pitch

Claims (3)

[Claims] 1. A method for cutting an array chip having n screen sizes from one substrate, wherein a cutting line is provided between a plurality of array chips in at least one of the X-axis direction and the Y-axis direction on the substrate. A method of cutting a liquid crystal display substrate, in which a plurality of array chips are arranged and cut so as to be on the same line as in FIG. 2. The screen size is A1, A2 from one substrate.
2,... An (n ≧ 2, An> 0), A1>A2>
…> When cutting out a plurality of array chips having a size relationship of An, a cutting line between An when dividing the array chip of An into a panel among the plurality of array chips has a screen size of An + 1 A method of cutting a substrate for a liquid crystal display device in which a plurality of array chips are arranged and cut so as not to contact the following array chips. 3. When an array chip having a screen size of n kinds is cut out from one substrate, at least one of a conductive particle application portion and a seal adhesive application portion of each chip has the same pitch. A method for cleaving a substrate for a liquid crystal display device, in which an array chip is arranged and cleaved.