JPH1019882A - Method for evaluating adhesive applied copper foil - Google Patents
Method for evaluating adhesive applied copper foilInfo
- Publication number
- JPH1019882A JPH1019882A JP17357596A JP17357596A JPH1019882A JP H1019882 A JPH1019882 A JP H1019882A JP 17357596 A JP17357596 A JP 17357596A JP 17357596 A JP17357596 A JP 17357596A JP H1019882 A JPH1019882 A JP H1019882A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- copper foil
- solvent
- amount
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 59
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 59
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 32
- 239000011889 copper foil Substances 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title description 8
- 239000002904 solvent Substances 0.000 claims abstract description 15
- 238000011156 evaluation Methods 0.000 claims abstract description 4
- 238000004090 dissolution Methods 0.000 abstract description 13
- 238000005259 measurement Methods 0.000 abstract description 2
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000002966 varnish Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000005011 phenolic resin Substances 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004640 Melamine resin Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、銅張り積層板に用
いられる接着剤付き銅はくの評価方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for evaluating copper foil with an adhesive used for a copper-clad laminate.
【０００２】[0002]
【従来の技術】銅張り積層板は、熱硬化性樹脂ワニスを
繊維基材に含浸乾燥してＢステージ状態のプリプレグと
し、このプリプレグを所定枚数重ね（プリプレグの枚数
は、製造しようとする積層板の厚さ及び基材の厚さで決
まる）、表面（片面又は両面）に銅はくを重ね、加熱加
圧して製造されている。熱硬化性樹脂としてフェノール
樹脂を用いるときには、接着剤をあらかじめ塗布してＢ
ステージまで硬化させた接着剤付き銅はくが用いられて
いる。銅はくの接着が悪いと、プリント配線板とした
後、はんだ処理などの加熱により銅はくが剥がれたりふ
くれたりする。はんだ処理などの加熱に対する特性、す
なわち、耐熱性は、銅はくに塗布した接着剤のＢステー
ジ状態、接着剤成分等に起因するところが大きい。2. Description of the Related Art A copper-clad laminate is prepared by impregnating a thermosetting resin varnish into a fiber base material and drying to prepare a B-stage prepreg. The thickness is determined by the thickness of the substrate and the thickness of the base material), and copper foil is laminated on the surface (one or both sides) and heated and pressed. When using a phenolic resin as the thermosetting resin, apply an adhesive in advance and
Copper foil with an adhesive cured to the stage is used. If the adhesion of the copper foil is poor, the copper foil is peeled off or swollen by heating such as soldering after the printed wiring board is formed. The properties to heat such as soldering, that is, the heat resistance are largely due to the B-stage state of the adhesive applied to the copper foil, the adhesive component, and the like.
【０００３】接着剤は、塗布後に加熱することにより、
接着剤成分が半硬化し、Ｂステージ状態を形成する。こ
のとき、未硬化成分が多すぎると、その後の加熱加圧工
程での硬化後も未硬化成分が多く残存し、耐熱性が低下
する。また、未硬化成分が少なすぎると、その後の加熱
加圧工程での硬化にあずかる成分が少ないため、プリプ
レグの基材に含浸した熱硬化性樹脂との反応が不充分と
なり耐熱性が低下する原因となる。[0003] The adhesive is heated after being applied,
The adhesive component is semi-cured to form a B-stage state. At this time, if the amount of the uncured component is too large, a large amount of the uncured component remains even after curing in the subsequent heating and pressurizing step, and the heat resistance is reduced. Also, if the uncured component is too small, there are few components involved in curing in the subsequent heating and pressurizing step, so the reaction with the thermosetting resin impregnated in the base material of the prepreg is insufficient and the heat resistance is reduced. Becomes
【０００４】接着剤のＢステージ状態を管理、評価する
方法としては、接着剤塗布量及び揮発分の測定がある。
この方法は、ＪＩＳ Ｃ ６５１１『プリント配線板用
銅はく試験方法』に規定されている。As a method of managing and evaluating the B-stage state of the adhesive, there is a method of measuring an applied amount of an adhesive and a volatile component.
This method is specified in JIS C 6511 “Testing method for copper foil for printed wiring boards”.
【０００５】[0005]
【発明が解決しようとする課題】ところが、接着剤塗布
量及び揮発分が同一であっても、銅張り積層板の耐熱性
レベルに差が発生することがある。これは、接着剤付銅
はくのＢステージ状態、すなわち、接着剤の硬化状態
を、接着剤塗布量、揮発分測定だけでは測定、管理でき
ないことがあることを意味する。本発明は、接着剤付銅
はくの接着剤ついて、Ｂステージ状態をより正確に評価
できる方法を提供することを目的とする。However, even if the amount of adhesive applied and the volatile content are the same, a difference may occur in the heat resistance level of the copper clad laminate. This means that the B-stage state of the copper foil with the adhesive, that is, the cured state of the adhesive, may not be measured and managed only by measuring the amount of the applied adhesive and the volatile content. SUMMARY OF THE INVENTION It is an object of the present invention to provide a method capable of more accurately evaluating the B-stage state of an adhesive of copper foil with an adhesive.
【０００６】[0006]
【課題を解決するための手段】本発明は、所定の寸法に
切断された接着剤付銅はくを、溶剤に一定時間浸漬し、
溶剤に溶解した接着剤成分の量を測定することを特徴と
する接着剤付銅はくの評価方法である。According to the present invention, a copper foil with an adhesive cut to a predetermined size is immersed in a solvent for a predetermined time,
This is a method for evaluating copper foil with an adhesive, which comprises measuring the amount of an adhesive component dissolved in a solvent.
【０００７】[0007]
【発明の実施の形態】以下にその方法を詳細に説明す
る。まず、接着剤付銅はくを一定の大きさに切断した試
料を２枚用意する。例えば、１枚目は、５０×１００ｍ
ｍに切断し、２枚目は、前記ＪＩＳに規定する接着剤塗
布量及び揮発分を測定するため、１００×１００ｍｍに
切断する。なお、試料の寸法は任意であり、特に制限は
なく、以下に説明する操作に便宜なように定めればよ
い。次に、５０×１００ｍｍに切断した試料の重量（＝
Ｗ１）を測定する。重量測定後、一定容積の容器に入
れ、一定量の溶剤を注入し、一定時間室内に静置後、試
料を取り出し、風乾後、重量（＝Ｗ２）を測定する。こ
こで、静置する時間については、溶剤に可溶な成分が一
定量溶解できる時間であればよく、他に制限はない。ま
た、容器の容積、溶剤の量についても他の試料と比較す
るため、一定であればよく、主として操作上の便宜で定
めればよい。また、使用する溶剤としては、テトラヒド
ロフラン、メチルエチルケトン、メタノール、トルエン
等が用いられ、接着剤成分の溶解性があればよく特に制
限はない。以上の操作とは別に、１００×１００ｍｍに
切断した、２枚目の試料について、前記のＪＩＳに準拠
して、接着剤付き銅はく１平方メートルあたりの接着剤
塗布量（＝Ｗ３）を求めておく。以上の各試験は、ＪＩ
Ｓ Ｃ ６５１１に規定の標準状態（温度：１５〜３５
℃、相対湿度：４５〜８５％）で行うのが好ましい。DESCRIPTION OF THE PREFERRED EMBODIMENTS The method will be described below in detail. First, two samples of copper foil with an adhesive cut into a predetermined size are prepared. For example, the first sheet is 50 × 100m
m, and the second sheet is cut into 100 × 100 mm in order to measure the amount of adhesive applied and volatile matter specified in the JIS. The size of the sample is arbitrary and is not particularly limited, and may be determined so as to be convenient for the operation described below. Next, the weight of the sample cut into 50 × 100 mm (=
Measure W1). After the weight measurement, the sample is put into a container of a fixed volume, a fixed amount of a solvent is injected, the sample is left in a room for a fixed time, a sample is taken out, air-dried, and the weight (= W2) is measured. Here, the standing time is not particularly limited as long as a fixed amount of the component soluble in the solvent can be dissolved. Further, the volume of the container and the amount of the solvent may be constant so as to be compared with other samples, and may be determined mainly for convenience in operation. As the solvent to be used, tetrahydrofuran, methyl ethyl ketone, methanol, toluene or the like is used, and there is no particular limitation as long as it has solubility of the adhesive component. Separately from the above operations, the amount of adhesive applied per square meter of copper foil with adhesive (= W3) was determined for the second sample cut into 100 × 100 mm in accordance with the above JIS. deep. Each of the above tests was conducted by JI
Standard conditions (temperature: 15 to 35) specified in SC6511
C., relative humidity: 45 to 85%).
【０００８】次に、以下の数１に示す算式により、溶解
率を求める。Next, the dissolution rate is determined by the following equation (1).
【０００９】[0009]
【数１】溶解率（％）＝１００×（Ｗ１−Ｗ２）／接着
剤塗布量／２００## EQU1 ## Dissolution rate (%) = 100 × (W1−W2) / Amount of adhesive applied / 200
【００１０】求められた溶解率が大であれば、未硬化成
分が多く、逆に溶解率が小であれば、未硬化成分が少な
いと判定される。If the obtained dissolution rate is large, it is determined that the uncured component is large, while if the dissolution rate is small, it is determined that the uncured component is small.
【００１１】[0011]
実施例１ 接着剤ワニスＡの調製 ポリビニルブチラール（電気化学工業株式会社製、６０
００Ｃ（商品名）を使用した）１００重量部、メラミン
樹脂（日立化成工業株式会社製、メラン２０００（商品
名）を使用した）６０重量部、エポキシ樹脂（住友化学
工業株式会社製、ＥＳＣＮ１９５−１０（商品名）を使
用した）２０重量部からなる樹脂組成物を、メチルエチ
ルケトン３０重量％、メタノール４０重量％、トルエン
３０重量％からなる混合溶媒に、樹脂固形分が２５重量
％となるように均一に溶解して接着剤ワニスＡを調製し
た。Example 1 Preparation of Adhesive Varnish A Polyvinyl butyral (manufactured by Denki Kagaku Kogyo KK, 60
100C by weight (using 00C (trade name)), 60 parts by weight of melamine resin (using Melan 2000 (trade name) manufactured by Hitachi Chemical Co., Ltd.), epoxy resin (ESCN195-10 manufactured by Sumitomo Chemical Co., Ltd.) A resin composition composed of 20 parts by weight (using trade name) was uniformly mixed with a mixed solvent composed of 30% by weight of methyl ethyl ketone, 40% by weight of methanol and 30% by weight of toluene so that the resin solid content was 25% by weight. To prepare an adhesive varnish A.
【００１２】得られた接着剤ワニスＡを、塗布乾燥条件
を変えて、厚さ３５μｍの銅はくに塗布乾燥して、３種
類の接着剤付き銅はく、＃１、＃２及び＃３を得た。塗
布乾燥条件を表１に示す。そして、各接着剤付き銅はく
から、縦１００ｍｍ、横１００ｍｍの試料を切取り、Ｊ
ＩＳ Ｃ ６５１１に準拠して、接着剤塗布量及び揮発
分を調べた。その結果、＃１、＃２及び＃３何れも、接
着剤塗布量は、３５ｇ／ｍ2 、揮発分は、４重量％であ
った。次に、各接着剤付き銅はくから、縦５０ｍｍ、横
１００ｍｍの試料を切取り、その重量を測定したのち、
内径３５ｍｍ、６０ｍｌの容器（＃１、＃２及び＃３を
それぞれ別個の容器）にいれ、テトラヒドロフラン１０
ｍｌを注入密封して、温度２５℃、湿度６５％に保たれ
た室内に放置した。１２時間経過後、試料を取り出して
風乾し、重量を測定した。これらの結果から求めた溶解
率を表１に示す。The obtained adhesive varnish A was coated and dried on a 35 μm-thick copper foil by changing the coating and drying conditions, and three types of copper foils with adhesive, # 1, # 2 and # 3, were removed. Obtained. Table 1 shows the coating and drying conditions. Then, a sample of 100 mm long and 100 mm wide was cut out from the copper foil with each adhesive, and J
In accordance with IS C 6511, the amount of the adhesive applied and the volatile content were examined. As a result, in all of # 1, # 2, and # 3, the amount of adhesive applied was 35 g / m 2 , and the volatile content was 4% by weight. Next, from the copper foil with the adhesive, a sample of 50 mm in length and 100 mm in width was cut out, and the weight was measured.
In a container with an inner diameter of 35 mm and 60 ml (# 1, # 2 and # 3 are each separate containers), tetrahydrofuran 10
Then, the mixture was sealed and left in a room maintained at a temperature of 25 ° C. and a humidity of 65%. After a lapse of 12 hours, the sample was taken out, air-dried, and weighed. Table 1 shows the dissolution rates determined from these results.
【００１３】[0013]
【表１】 [Table 1]
【００１４】厚さ０．２ｍｍのクラフト紙に、樹脂付着
量が２０重量％となるようにして水溶性フェノール樹脂
を含浸し、次に、樹脂付着量が水溶性フェノール樹脂と
合計で５４重量％となるようにして桐油変性率３５重量
％のレゾールフェノール樹脂を含浸乾燥して、プリプレ
グを得た。＃１、＃２及び＃３の接着剤付き銅はくをお
のおの前記プリプレグ８枚と重ね合わせ、温度１６０
℃、圧力９．８ＭＰａで６０分間加熱加圧して、厚さ
１．６ｍｍの銅張り積層板を製造した。A 0.2 mm thick kraft paper is impregnated with a water-soluble phenol resin so that the resin adhesion amount is 20% by weight, and then the resin adhesion amount is 54% by weight in total with the water-soluble phenol resin. A prepreg was obtained by impregnating and drying a resole phenol resin having a tung oil modification rate of 35% by weight. The copper foils with adhesive of # 1, # 2 and # 3 were superimposed on each of the eight prepregs, and the temperature was 160
Heating and pressurizing was performed at a temperature of 9.8 MPa for 60 minutes to produce a 1.6 mm-thick copper-clad laminate.
【００１５】実施例２ 接着剤ワニスＢの調製 ポリビニルブチラール（電気化学工業株式会社製、５０
００Ａ（商品名）を使用した）１００重量部、メラミン
樹脂（日立化成ポリマー株式会社製、テスアジン３０２
４（商品名）を使用した）６０重量部、エポキシ樹脂
（住友化学工業株式会社製、ＥＳＣＮ１９５−１０（商
品名）を使用した）２０重量部、フェノール樹脂（大日
本インキ化学工業株式会社製、フェノライト５０１０
（商品名）を使用した）からなる樹脂組成物を、メチル
エチルケトン４０重量％、メタノール４０重量％、トル
エン２０重量％からなる混合溶媒に、樹脂固形分が２５
重量％となるように均一に溶解して接着剤ワニスＢを調
製した。Example 2 Preparation of adhesive varnish B Polyvinyl butyral (produced by Denki Kagaku Kogyo KK, 50
00A (trade name), melamine resin (manufactured by Hitachi Chemical Polymer Co., Ltd., Tesazine 302)
4 (using trade name), 20 parts by weight of epoxy resin (manufactured by Sumitomo Chemical Co., Ltd., using ESCN195-10 (product name)), phenol resin (manufactured by Dainippon Ink and Chemicals, Inc.) Fenolite 5010
(Trade name) was mixed with a mixed solvent of methyl ethyl ketone (40% by weight), methanol (40% by weight) and toluene (20% by weight) in a mixed solvent having a resin solid content of 25%.
The adhesive varnish B was prepared by uniformly dissolving the adhesive varnish B so as to obtain a weight%.
【００１６】得られた接着剤ワニスＢを、塗布乾燥条件
を変えて、厚さ３５μｍの銅はくに塗布乾燥して、３種
類の接着剤付き銅はく、＃４、＃５及び＃６を得た。塗
布乾燥条件を表２に示す。＃４、＃５及び＃６何れも、
接着剤塗布量は、３５ｇ／ｍ2 、揮発分は、４重量％で
あった。以下実施例１と同様にして、溶解率を求めた。
その結果を表２に示す。The obtained adhesive varnish B was coated and dried on a 35 μm-thick copper foil under different coating and drying conditions, and three types of copper foils with adhesive, # 4, # 5 and # 6, were removed. Obtained. Table 2 shows the coating and drying conditions. # 4, # 5 and # 6 are all
The amount of the adhesive applied was 35 g / m 2 , and the volatile content was 4% by weight. Thereafter, the dissolution rate was determined in the same manner as in Example 1.
Table 2 shows the results.
【００１７】[0017]
【表２】 [Table 2]
【００１８】以下実施例１と同様にして銅張り積層板を
製造した。Thereafter, a copper-clad laminate was manufactured in the same manner as in Example 1.
【００１９】実施例３ 実施例１で得られた接着剤ワニスＡを、実施例１と塗布
乾燥条件を変えて、厚さ３５μｍの銅はくに塗布乾燥し
て、３種類の接着剤付き銅はく、＃７、＃８及び＃９を
得た。塗布乾燥条件を表３に示す。実施例１と同様にし
て接着剤塗布量及び揮発分を調べた。その結果、＃７、
＃８及び＃９何れも、接着剤塗布量は、３５ｇ／ｍ2 、
揮発分は、４重量％であった。次に、各接着剤付き銅は
くから、縦５０ｍｍ、横１００ｍｍの試料を切取り、そ
の重量を測定したのち、内径３５ｍｍ、６０ｍｌの容器
（＃７、＃８及び＃９をそれぞれ別個の容器）にいれ、
メチルエチルケトン１０ｍｌを注入密封して、温度２５
℃、湿度６５％に保たれた室内に放置した。１時間経過
後、試料を取り出して風乾し、重量を測定した。これら
の結果から求めた溶解率を表３に示す。Example 3 The adhesive varnish A obtained in Example 1 was coated and dried on a 35 μm-thick copper foil by changing the coating and drying conditions as in Example 1 to obtain three types of copper with adhesive. # 7, # 8 and # 9 were obtained. Table 3 shows the coating and drying conditions. In the same manner as in Example 1, the amount of adhesive applied and the volatile content were examined. As a result, # 7,
For both # 8 and # 9, the amount of adhesive applied was 35 g / m 2 ,
Volatile content was 4% by weight. Next, a sample of 50 mm in length and 100 mm in width was cut out from each copper foil with an adhesive, and the weight was measured. Enter,
Inject and seal 10 ml of methyl ethyl ketone,
It was left in a room maintained at 65 ° C. and a humidity of 65%. One hour later, the sample was taken out, air-dried, and weighed. Table 3 shows the dissolution rates determined from these results.
【００２０】[0020]
【表３】 [Table 3]
【００２１】以下実施例１と同様にして銅張り積層板を
製造した。Thereafter, a copper-clad laminate was manufactured in the same manner as in Example 1.
【００２２】得られた各銅張り積層板について、はんだ
耐熱性及び気中耐熱性を調べた。その結果を表４に示
す。なお、試験法は以下の通りである。 はんだ耐熱性：２５ｍｍ角の試験片を２６０℃に保たれ
たはんだに浮かせ、銅はくのふくれを生ずるまでの時間
を調べた。 気中耐熱性：５０ｍｍ角の試験片を２００℃に保たれた
恒温槽にいれ、所定時間後に銅はくのふくれの有無を観
察した。その結果、ふくれのないものを○で、ふくれの
発生したものを×で示した。Each of the obtained copper-clad laminates was examined for solder heat resistance and air heat resistance. Table 4 shows the results. The test method is as follows. Solder heat resistance: A test piece of 25 mm square was floated on a solder kept at 260 ° C., and the time required for blistering of the copper foil was examined. Aerial heat resistance: A 50 mm square test piece was placed in a thermostat kept at 200 ° C., and after a predetermined time, the presence or absence of blistering of the copper foil was observed. As a result, a sample without blisters was indicated by a circle, and a sample with blisters was indicated by a cross.
【００２３】[0023]
【表４】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ＃１ ＃２ ＃３ ＃４ ＃５ ＃６ ＃７ ＃８ ＃９ ──────────────────────────────────── はんだ耐熱性（秒） ８ ３８ １６ １８ ２６ ５１ １０ ３２ １３ 気中耐熱性 ２０分 ○ ○ ○ ○ ○ ○ ○ ○ ○ ３０分 × ○ ○ × ○ ○ × ○ × ４０分 × ○ × × ○ ○ × × × ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 4] ＃ # 1 # 2 # 3 # 4 # 5 # 6 # 7 # 8 # 9 ──────────────────────────────────── Solder heat resistance (sec) 838 16 18 26 51 10 32 13 Aerial heat resistance 20 minutes ○ ○ ○ ○ ○ ○ ○ ○ ○ 30 minutes × ○ ○ × × ○ ○ × ○ × 40 minutes × ○ × × ○ ○ × × × ━━━━ ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━
【００２４】以上の結果から、接着剤塗布量及び揮発分
が同一であるにもかかわらず、接着剤ワニスＡについて
は、＃２の製造条件により耐熱性に優れた銅張り積層板
が得られ、接着剤ワニスＢについては、＃５及び＃６の
製造条件により耐熱性に優れた銅張り積層板が得られる
ことがわかる。From the above results, a copper-clad laminate having excellent heat resistance was obtained with the adhesive varnish A under the production conditions of # 2, despite the same amount of adhesive applied and the same volatile content. Regarding the adhesive varnish B, it can be seen that a copper-clad laminate excellent in heat resistance can be obtained by the production conditions of # 5 and # 6.
【００２５】[0025]
【発明の効果】本発明によれば、銅はくに塗布されＢス
テージまで硬化された接着剤について溶剤に対する溶解
率を測定することにより、接着剤のＢステージ状態を、
的確に、管理評価することができる。According to the present invention, the B stage state of the adhesive is measured by measuring the dissolution rate of the adhesive applied to the copper foil and cured to the B stage in the solvent.
Management and evaluation can be performed accurately.
Claims (1)
を、溶剤に一定時間浸漬し、溶剤に溶解した接着剤成分
の量を測定することを特徴とする接着剤付銅はくの評価
方法。An adhesive copper foil cut into a predetermined size is immersed in a solvent for a certain period of time, and the amount of the adhesive component dissolved in the solvent is measured. Evaluation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17357596A JPH1019882A (en) | 1996-07-03 | 1996-07-03 | Method for evaluating adhesive applied copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17357596A JPH1019882A (en) | 1996-07-03 | 1996-07-03 | Method for evaluating adhesive applied copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1019882A true JPH1019882A (en) | 1998-01-23 |
Family
ID=15963114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17357596A Pending JPH1019882A (en) | 1996-07-03 | 1996-07-03 | Method for evaluating adhesive applied copper foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1019882A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000239640A (en) * | 1998-12-22 | 2000-09-05 | Hitachi Chem Co Ltd | Adhesive-adhering copper leaf and copper-spreading laminating plate and wiring plate for plinting by use thereof |
-
1996
- 1996-07-03 JP JP17357596A patent/JPH1019882A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000239640A (en) * | 1998-12-22 | 2000-09-05 | Hitachi Chem Co Ltd | Adhesive-adhering copper leaf and copper-spreading laminating plate and wiring plate for plinting by use thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100538710B1 (en) | Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them | |
| US5800874A (en) | Technique for forming resin-impregnated fiberglass sheets | |
| KR101113389B1 (en) | Heat curable resin composition, dry film and printed wiring board and method for preparing the same | |
| JPH11140281A (en) | Resin composition for copper clad laminate, copper foil with resin, multilayer copper clad laminate and multilayer printed wiring board | |
| TW400460B (en) | Photosensitive resin composition and the use thereof | |
| US3600247A (en) | Method of laminating employing measuring the electrical impedance of a thermosetting resin | |
| KR20050027775A (en) | Composition for resin coated copper and method for preparing a resin coated copper using the same | |
| Ma et al. | Effect of moisture on thermal properties of halogen-free and halogenated printed-circuit-board laminates | |
| JPH1058593A (en) | Copper-clad laminate | |
| JPH0219868B2 (en) | ||
| JP3261775B2 (en) | Metal foil clad laminate | |
| JPH09124806A (en) | Production of prepreg | |
| JP2001003027A (en) | Copper foil with adhesive, copper-clad laminate and printed wiring board | |
| JPS5866385A (en) | Method of producing printed circuit board | |
| JP2003012836A (en) | Prepreg and laminate using the same | |
| JPH0294491A (en) | Copper-clad laminated plate for printed-wiring board | |
| JPS6079080A (en) | Adhesive composition | |
| JP2005281488A (en) | Resin composition, prepreg and laminated plate | |
| JPH01146928A (en) | Phenol resin/copper foil laminate | |
| JPH11279508A (en) | Production of adhesive-coated copper foil and production of copper-clad laminate | |
| JPH0592423A (en) | Manufacture for prepreg and copper plated laminated sheet | |
| JP2001089733A (en) | Insulating resin adhesive for multilayer printed circuit board | |
| JPH04318057A (en) | Epoxy resin composition for laminate and laminate using the same resin composition | |
| JPH06337B2 (en) | Method for measuring dryness of prepreg for laminated board | |
| JP2003213017A (en) | Method for producing prepreg |