JPH10199841A - シリコンウェハーの等温研磨処理の促進方法 - Google Patents

シリコンウェハーの等温研磨処理の促進方法

Info

Publication number
JPH10199841A
JPH10199841A JP35171697A JP35171697A JPH10199841A JP H10199841 A JPH10199841 A JP H10199841A JP 35171697 A JP35171697 A JP 35171697A JP 35171697 A JP35171697 A JP 35171697A JP H10199841 A JPH10199841 A JP H10199841A
Authority
JP
Japan
Prior art keywords
slurry
polishing
temperature
polishing slurry
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35171697A
Other languages
English (en)
Japanese (ja)
Inventor
Mohendra S Bawa
エス．バワ モヘンドラ
Vikki Sue Simpson
スー シンプソン ビッキ
Michael H Grimes
エィチ．グリムス マイケル
Franklin Louis Allen
ルイス アレン フランクリン
Anglois Kenneth John L
ジョン ラングロワ ケネス
Palmer Arthur Miller
アーサー ミラー パーマー
Gary Lee Etheridge
リー エザーリッジ ゲイリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPH10199841A publication Critical patent/JPH10199841A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP35171697A 1996-12-19 1997-12-19 シリコンウェハーの等温研磨処理の促進方法 Pending JPH10199841A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US033678 1993-03-16
US3367896P 1996-12-19 1996-12-19

Publications (1)

Publication Number Publication Date
JPH10199841A true JPH10199841A (ja) 1998-07-31

Family

ID=21871801

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35171697A Pending JPH10199841A (ja) 1996-12-19 1997-12-19 シリコンウェハーの等温研磨処理の促進方法

Country Status (4)

Country Link
EP (1) EP0849041A3 (de)
JP (1) JPH10199841A (de)
KR (1) KR19980064180A (de)
TW (1) TW400265B (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003019659A (ja) * 2001-07-06 2003-01-21 Nec Kyushu Ltd 化学機械研磨装置および化学機械研磨方法
JP2013219133A (ja) * 2012-04-06 2013-10-24 Shin Etsu Handotai Co Ltd ウエーハの研磨方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1052060A3 (de) * 1999-05-03 2001-04-18 Applied Materials, Inc. Verfahren zum chemisch-mechanischen Planarisieren
EP1175964A3 (de) * 2000-07-27 2003-07-23 Agere Systems Guardian Corporation Sytem zum Steuern der Temperatur der Oberfläche bei dem Polieren in einer chemisch-mechanischen Planschleifvorrichtung
US6679769B2 (en) 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
KR100840655B1 (ko) * 2006-12-29 2008-06-24 동부일렉트로닉스 주식회사 화학기계적 연마장치
CN102303281A (zh) * 2011-09-16 2012-01-04 北京通美晶体技术有限公司 一种减少晶片表面缺陷的方法
JP7059117B2 (ja) * 2017-10-31 2022-04-25 株式会社荏原製作所 研磨パッドの研磨面の温度を調整するための熱交換器、該熱交換器を備えた研磨装置、該熱交換器を用いた基板の研磨方法、および研磨パッドの研磨面の温度を調整するためのプログラムを記録したコンピュータ読み取り可能な記録媒体
CN109822428B (zh) * 2019-03-29 2024-05-14 湖南科技大学 主动控制剪切作用与温度诱导梯度增稠抛光加工装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU637087B2 (en) * 1989-03-24 1993-05-20 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer
US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system
US5664990A (en) * 1996-07-29 1997-09-09 Integrated Process Equipment Corp. Slurry recycling in CMP apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003019659A (ja) * 2001-07-06 2003-01-21 Nec Kyushu Ltd 化学機械研磨装置および化学機械研磨方法
JP2013219133A (ja) * 2012-04-06 2013-10-24 Shin Etsu Handotai Co Ltd ウエーハの研磨方法

Also Published As

Publication number Publication date
EP0849041A2 (de) 1998-06-24
KR19980064180A (ko) 1998-10-07
EP0849041A3 (de) 2000-02-23
TW400265B (en) 2000-08-01

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