JPH10199846A5 - - Google Patents

Info

Publication number
JPH10199846A5
JPH10199846A5 JP1997014522A JP1452297A JPH10199846A5 JP H10199846 A5 JPH10199846 A5 JP H10199846A5 JP 1997014522 A JP1997014522 A JP 1997014522A JP 1452297 A JP1452297 A JP 1452297A JP H10199846 A5 JPH10199846 A5 JP H10199846A5
Authority
JP
Japan
Prior art keywords
ultraviolet light
substrate
ozone
copper
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1997014522A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10199846A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP1452297A priority Critical patent/JPH10199846A/ja
Priority claimed from JP1452297A external-priority patent/JPH10199846A/ja
Publication of JPH10199846A publication Critical patent/JPH10199846A/ja
Publication of JPH10199846A5 publication Critical patent/JPH10199846A5/ja
Pending legal-status Critical Current

Links

JP1452297A 1997-01-09 1997-01-09 紫外線処理方法 Pending JPH10199846A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1452297A JPH10199846A (ja) 1997-01-09 1997-01-09 紫外線処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1452297A JPH10199846A (ja) 1997-01-09 1997-01-09 紫外線処理方法

Publications (2)

Publication Number Publication Date
JPH10199846A JPH10199846A (ja) 1998-07-31
JPH10199846A5 true JPH10199846A5 (sr) 2004-10-21

Family

ID=11863446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1452297A Pending JPH10199846A (ja) 1997-01-09 1997-01-09 紫外線処理方法

Country Status (1)

Country Link
JP (1) JPH10199846A (sr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3306512B2 (ja) * 2000-02-25 2002-07-24 独立行政法人産業技術総合研究所 半導体基板表面の気相洗浄法
SG115381A1 (en) * 2001-06-20 2005-10-28 Univ Singapore Removal of organic layers from organic electronic devices
KR20040001993A (ko) * 2002-06-29 2004-01-07 주식회사 하이닉스반도체 구리 금속 배선 형성방법 및 이를 이용한 반도체 소자의다층 배선 형성방법

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