JPH10200035A - Mount attachment for surface mount semiconductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mount attachment for easily mounting surface mount semiconductors on a circuit board. SOLUTION: On a circuit board 10 electrodes 12 are printed. Surface mount semiconductor 20 has leads 22. The attachment 50 has an insulative hard plastic body 52 fixed to the board 10 through setscrews 60. The body 52 has conductive springs pressing the electrodes 12 on the back surface and partition members for partitioning adjacent leads are disposed at both sides thereof.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor mounting, and more particularly to a technology effective when applied to temporary mounting of a surface-mount type semiconductor.

[0002]

2. Description of the Related Art Recently, many surface-mounted semiconductors have a small number of terminals, and there are several types of sockets for mounting the surface-mounted semiconductor, all of which are larger than the semiconductor to be mounted. Was not available for high-density mounting boards. Moreover, not all semiconductor packages have sockets.

The conventional socket employs a method in which the socket is soldered to an electrode on a substrate and then the semiconductor is mounted in the socket. However, not only was the impedance to the semiconductor high, but also the reliability of contact contact was low. For this reason, the bad effect of the contact failure due to the use of the socket has frequently occurred in trial production experiments and the like. For example, Japanese Patent Application Laid-Open No. Hei 8-50974 discloses a kind of socket.

On the other hand, with respect to a semiconductor mounted on a substrate hole with through leads, as shown in Japanese Patent Application Laid-Open No. Sho 60-177698, a technique has been proposed in which a metal pin is embedded in the substrate hole and the semiconductor is directly inserted and fixed. However, there is no such application to a surface mount type semiconductor, and in many cases, the semiconductor device is directly mounted on a substrate by soldering many times.

[0005]

The above-described surface-mount type semiconductor socket has a problem that the contact path from the substrate to the socket to the semiconductor has a very high impedance with respect to the direct mounting from the substrate to the semiconductor. I found it. Here, since the contact between the socket and the semiconductor is a contact between pressure springs, the reliability is further deteriorated.
This problem becomes significant if the semiconductor is replaced many times.

Further, since the structure of the conventional socket is complicated and large, it has been found that a considerably larger socket mounting area is required on the substrate than the semiconductor package. In recent high-density mounting boards, mounting sockets is often difficult. On the other hand, it is difficult to apply a mounting method such as a through-hole type semiconductor substrate hole pin to a surface mount semiconductor that does not use a substrate hole.

An object of the present invention is to provide a technology capable of improving the reliability of contact contact in temporary mounting of a surface-mount type semiconductor. It is another object of the present invention to provide a technique capable of improving the reliability of temporary mounting of a surface-mount type semiconductor and supporting high-density mounting.

[0008]

SUMMARY OF THE INVENTION The outline of a typical invention among the inventions in the present application will be briefly described. An attachment that directly presses and fixes semiconductor leads (terminals) on a board in mounting a surface-mount type semiconductor. A bar-shaped press (attachment) that presses and fixes semiconductor leads to board electrodes without directly soldering them ). The attachment may have a configuration in which through leads are provided at both ends for fixing the attachment through the hole in the substrate.

[0009]

According to the above-mentioned means, since the surface-mounted semiconductor can be brought into direct contact with the electrode on the substrate, the contact impedance with respect to the surface-mounted semiconductor as viewed from the substrate electrode is reduced, and the contact is made between the springs. However, reliability can be improved. At the same time, this attachment has a simple structure that holds down the leads of the surface-mount type semiconductor, so that it is possible to cope with higher-density mounting than a socket.

[0010]

FIG. 1 is an explanatory view showing an outline of a terminal mounting attachment for a surface mounting type semiconductor according to the present invention.
The circuit board 10 is made of an insulating material, and has circuit electrodes 12 printed thereon. The surface-mount type semiconductor 20 has a plurality of leads 22 on its side surface. Normally, this lead 2
2 is mounted by soldering to the electrode 12 on the substrate 10 side.

For example, in the development or experiment of a semiconductor circuit board, it is necessary to temporarily mount the surface mount semiconductor 20 on the circuit board 10. In this temporary mounting, soldering the lead 22 of the semiconductor 20 onto the substrate electrode 12 requires a lot of man-hour, and it is not possible to repeatedly peel the lead or solder the circuit electrode.

The attachment 50 according to the present invention comprises a semiconductor 2
It has a function of mechanically connecting the lead 0 to the substrate electrode 12. The attachment 50 has a long main body 52 made of an insulating material, and fixing means 60 for fixing both ends of the main body 52 on the substrate 10.

FIGS. 2A, 2B, and 2C are a top view, a bottom view, and a side view of the attachment 50. FIG. The body 52 of the attachment 50 is made of a material such as hard plastic and has a pressing member 56 that matches the pitch of the corresponding semiconductor leads. The pressing member 56 is made of a conductive material having elasticity, and a metal plastic material or the like is used.

A partition member 54 is provided on both sides of the pressing member 56.
Is configured. The partition member 54 may be formed integrally with the main body 52, and is inserted between the adjacent leads 22 of the semiconductor 20, and has a function of preventing the leads from being connected to each other. Through holes 58 are provided at both ends in the longitudinal direction of the main body 52, and the main body 52 is fixed to the circuit board 10 with screws 60. Since the screws are used as the fixing means, it is easy to replace the semiconductor 20.

FIG. 3 is a top view, a bottom view, and a side view showing an attachment according to another embodiment of the present invention. The main body 102 of the attachment 100 is made of an insulating hard plastic, and has a lead pressing member 104 on the lower surface and partition members 106 on both sides thereof. Body 102
Fixing pins 110 are attached to both ends in the longitudinal direction.

FIG. 4 shows the attachment state of the attachment 100. The fixing pins 110 of the attachment 100 are inserted into the through holes 16 provided in the
Of the pin 110 protruding from the rear surface of the
12 is formed. With this configuration, the attachment 10
0 is fixed in a state where the lead 22 of the semiconductor 20 is pressed onto the electrode 12 of the substrate 10. As described above, the attachment of the present invention is one in which a lead of a surface-mount type semiconductor is mechanically pressed against an electrode of a substrate and mounted.

In the above-described embodiment, the attachment body for pressing only the semiconductor lead is shown. However, a cover-shaped body for fixing the entire semiconductor package on the substrate together with the semiconductor lead is used. Can also.

As means for fixing the attachment on the substrate, soldering terminals may be provided on the attachment in addition to the above-mentioned screws and pins, and soldering may be performed. Good.

Further, if a semiconductor positioning shape is added to this attachment, mounting can be further simplified. Although this attachment is intended for a surface-mount type semiconductor, it is clear that the attachment can be applied to a semiconductor having a radiation type terminal, a resistor, a capacitor, and the like.

[0020]

According to the present invention, the following effects can be obtained. (1) Stabilization of terminal contact during temporary mounting of surface-mount semiconductors By reducing the contact impedance and improving the contact instability due to the simple structure of the conventional surface-mount semiconductor socket, it is almost the same as when soldering. Equivalent semiconductor evaluation is possible. (2) Reduction of mounting area The conventional surface-mount type semiconductor socket is large and requires a considerably large board area at the time of mounting. However, the present invention can save a considerable space.

(3) Simplification of Attachment Manufacture The conventional surface-mount type semiconductor socket had a complicated structure, so that when the number of semiconductor terminals changed, the mold had to be recreated. Even if the number is different, it can be easily handled. (4) Cost Reduction of Attachment Compared with the conventional surface mount type semiconductor socket, the structure is simple and the type can be shared even if the number of terminals is different, so that the cost of the attachment itself can be considerably reduced. The present invention is very effective especially for studying program ROMs and alternative parts.

The attachment invented this time has several applications for its fixing method and for holding down terminals of a surface-mount type semiconductor. As a fixing method, both ends of the attachment may be soldered or glued instead of the pins of the substrate through lead, and a conductive resin or a conductive rubber may be used for the semiconductor holder. In addition, if a semiconductor positioning shape is added to this attachment, mounting can be further simplified. Although this attachment is intended for a surface mount type semiconductor, it is clear that the attachment can be applied to a semiconductor having a radiation type terminal, a resistor and a capacitor, and the like.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a state where a semiconductor is mounted on a substrate by an attachment of the present invention.

FIG. 2 is a three-view drawing showing an embodiment of the attachment of the present invention.

FIG. 3 is a three-view drawing showing another embodiment of the attachment of the present invention.

FIG. 4 is a sectional view showing an attachment mounting structure of the embodiment of FIG. 3;

[Explanation of symbols]

10 board, 12 board electrode, 16 through hole, 20 surface mount semiconductor, 22 lead, 50
Attachment, 52 Attachment body, 5
4 partition members, 56 pressing members, 60 screws,
110 Fixing pin.

Claims (7)

[Claims] An attachment for mounting a surface-mounted semiconductor on a circuit board, the body being made of an insulating hard material for pressing semiconductor leads against electrodes on the circuit board, and the body being mounted on the circuit board. A mounting attachment for a surface-mount type semiconductor having a fixing means. 2. The mounting attachment according to claim 1, wherein the body has a shape for pressing and fixing the semiconductor package to the circuit board together with the semiconductor leads. 3. The mounting attachment for a surface-mounted semiconductor according to claim 1, wherein the main body includes an elastic member for pressing a semiconductor lead. 4. The mounting attachment according to claim 1, wherein the main body includes a partition member inserted into a gap between adjacent leads of the semiconductor. 5. The mounting attachment according to claim 1, wherein the means for fixing the main body to the circuit board is a screw. 6. The mounting attachment according to claim 1, wherein the means for fixing the main body to the circuit board are pins provided at both ends of the main body and inserted into and fixed to through holes of the circuit board. 7. The mounting attachment according to claim 1, wherein the means for fixing the main body to the circuit board is a terminal for soldering provided on the main body.