JPH10200225A - Printed wiring board and component mounting position identification method for printed wiring board - Google Patents

Abstract

(57) [Summary] [PROBLEMS] When components are mounted on a printed wiring board at high density, or when the number of inserted lead wires is large, the lead wire identification numbers and lead wire identification characters are reduced, and The problem is that it is difficult to distinguish from the lead wire insertion surface because it is adjacent near the hole. SOLUTION: In an insertion mounting type printed wiring board 1, a power plug lead wire is provided as a different mark according to a power plug 2, a fan motor 3, and a neon lamp 4 at a lead wire insertion surface on a lead wire insertion surface. A silk print 8, a silk print 9 for a fan motor lead, and a silk print 10 for a neon lamp lead are attached.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a so-called insertion mounting type in which, for example, a lead wire insertion surface of a mounting component is formed on one surface, and a pattern formation surface and a lead wire soldering surface are formed on the other surface. The present invention relates to a method for identifying a component mounting position on a printed wiring board when mounting a component by inserting a lead wire into the printed wiring board by hand.

[0002]

2. Description of the Related Art FIG. 4 is a conceptual view showing a state in which components are mounted on a conventional printed wiring board via lead wires. In FIG. 4, reference numeral 1 denotes a printed wiring board of an insertion mounting type, the surface of the lead wire insertion surface on which the lead wire of the mounting component is inserted is shown on the drawing, and the back surface of the lead wire insertion surface which does not appear on the drawing. The side is the surface on which the pattern is formed and the lead wires are soldered. Reference numeral 2 denotes a power supply plug connected to the printed wiring board 1, reference numeral 3 denotes the same fan motor, and reference numeral 4 denotes the same neon lamp. These power supply plug 2, fan motor 3, and neon lamp 4 are parts mounted on the printed circuit board.

[0005] 5 is a power plug lead wire connecting the power plug 2 and the pattern of the printed wiring board 1, 6 is a fan motor lead wire connecting the fan motor 3 and the pattern of the printed wiring board 1, and 7 is neon These are neon lamp lead wires for connecting the lamp 4 and the pattern of the printed wiring board 1, and these are all lead wires for a mounted component. 11 is a lead wire identification number for identifying each lead wire, 12 is a lead wire identification character for identifying each lead wire, 13 is provided in common to all lead wires, and is a circular In the silk-screen printing with a mark, a hole is formed in the printed wiring board 1 at the center of the circular printed portion to be connected to the pattern on the back side.

FIG. 5 is a cross-sectional view of the printed wiring board 1 shown in FIG. 4. In FIG. 5, the upper side of the printed circuit board 1 has a lead wire insertion surface into which the lead wire of a mounting component is inserted, and the lower side has a pattern formed thereon. The surface on which the lead wire is to be soldered. A land of copper foil is formed around the hole on the surface to be soldered. Reference numeral 14 denotes an electronic component which is one of the mounted components, and reference numeral 15 denotes solder for fixing a lead wire penetrating from the lead wire insertion surface side to the printed wiring board 1, thereby electrically connecting the electronic component to the printed wiring board 1. Connection is fixed. The portion through which the lead wire passes is the center of the silk printing in FIG.

A description will now be given of a conventional lead wire connection operation for a printed wiring board configured as described above. A pattern is formed on one surface of the printed wiring board 1 in advance, and silk printing 13, a lead wire identification number 11, and a lead wire identification character 12 are printed on the other surface (lead wire insertion surface). Then, the lead wires (5, 6, 7) of each mounted component are manually inserted into the hole formed in the center of the silk print 13 from the lead wire insertion surface side on which the silk print 13 is applied, and printed wiring is performed. It penetrates to the back side of the substrate 1. Since the lead wire penetrating to the back side is located on a predetermined pattern, the mounted component is electrically connected to a predetermined position of the printed wiring board 1 by soldering the lead wire.

When inserting the lead wires 5, 6, and 7, an appropriate component mounting location is confirmed by referring to the lead wire identification number 11 and the lead wire identification character 12.
At the time of soldering, as shown in FIG. 4, a hole is formed in a printed wiring board, and a land in which a lead wire insertion surface and a surface to be soldered have a front-to-back relationship is used. As shown in JP-A-58-73182,
It is known that the shape of the land on the side to be soldered is changed.

Japanese Patent Application Laid-Open Nos. Hei 3-88383 and Hei 8-88383 disclose that no holes are formed in a printed wiring board and pads to be soldered to a component mounting surface are used.
As shown in JP-A-125289, JP-A-3-228392, etc., it is known that the shape of a pad is changed on a surface on which a pattern is formed and soldering is performed so that a soldered portion can be identified. Have been.

[0008]

Since the conventional printed wiring board is configured as described above, the lead wire 5,
In the case where 6, 7 are inserted, since they are determined by the lead wire identification number 11 or the lead wire identification character 12 written on the printed wiring board 1, components are mounted at a high density as shown in the configuration diagram of FIG. 6, for example. In the case where the number of lead wires to be inserted is large, the lead wire identification number 11 and the lead wire identification character 12 become small, and they are adjacent to each other near a dense hole. There was a point.

Further, since the lead wire is manually inserted from the surface on the silk printing side, even if the pattern shape or land shape is changed, it is necessary to identify the lead wire insertion when inserting the lead wire on the rear surface of the printed wiring board. Must be checked,
There was a problem that it was troublesome and workability was poor. Also, even if the pattern shape or land shape is changed, it is necessary to set the intervals and arrangement in consideration of the lead wire identification number 11 and the lead wire identification character 12 on the lead wire insertion surface side,
There is a problem that it is difficult to reduce the size of the printed wiring board because the pattern has to be taken into account due to the convenience of both sides.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and when mounting components on a printed wiring board, a printed wiring board which can easily determine a lead wire insertion position and has good assembling workability. The purpose is to gain.

[0011]

A printed wiring board according to the present invention is an insertion-mounted printed wiring board having a pattern-formed surface and a lead wire insertion surface into which a lead wire of a mounting component is inserted. A different mark is attached to the lead wire insertion portion on the lead wire insertion surface according to the type of the mounted component and the like.

[0012] Further, marks of different colors are added to the lead wire insertion portions in accordance with the type of the mounted component and the like.

[0013] Further, marks of different sizes are added to the lead wire insertion portions in accordance with the type of mounted parts and the like.

[0014] Further, different marks, each having a plurality of marks, are provided on the lead wire insertion surface in accordance with the type of the mounted component and the like.
A plurality of related marks are surrounded by a frame.

Further, the mark is provided by silk printing.

Further, the above-mentioned mark is combined with a lead wire identification number or a lead wire identification character.

In addition, ranking is made for each of the different marks.

Further, the printed wiring board is composed of a plurality according to the ranking.

Further, the pattern shape or land shape of the lead wire penetrating portion on the surface on which the pattern is formed has a different shape depending on the type of the mounted component and the like.

Further, the mark and the pattern shape or the land shape at the front and back positions through the lead wire penetrating portion are made to have the same shape.

Further, according to the method for identifying a component mounting position on a printed wiring board according to the present invention, an insertion mounting type print having a surface on which a pattern is formed and a lead wire insertion surface into which a lead wire of the mounted component is inserted. In the wiring board, different components are mounted according to different marks attached to the lead wire insertion locations on the lead wire insertion surface.

In addition, ranking is performed for each of the different marks, and components are mounted according to the order given for each of the marks.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a conceptual diagram illustrating a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a configuration diagram illustrating the printed wiring board in a manufacturing process.
Reference numeral 1 denotes an insertion mounting type printed wiring board, in which the surface that appears on the drawing is the lead wire insertion surface into which the lead wire of the mounted component is inserted, and the pattern is formed on the back side of the lead wire insertion surface that does not appear on the drawing. The surface on which the lead wire is to be soldered.

2 is a power plug connected to the printed wiring board 1, 3 is the same fan motor, 4 is the same neon lamp,
These power plug 2, fan motor 3, neon lamp 4
Is a component mounted on the printed circuit board. 5 is power plug 2
6 is a lead wire for a power plug connecting the fan motor 3 and the pattern of the printed wiring board 1, and 7 is a lead wire for a fan motor connecting the fan motor 3 and the pattern of the printed wiring board 1.
Are lead wires for the neon lamp for connecting the neon lamp 4 and the pattern of the printed wiring board 1, and these are all lead wires of the mounted parts.

Reference numeral 8 denotes silk-screen printing for a power plug lead wire with a circular mark indicating a lead wire insertion position on the lead wire insertion surface of the printed wiring board 1, and reference numeral 9 denotes a fan motor lead wire with the same triangular mark. Silk printing 10 is a silk printing for a neon lamp lead wire with the same square mark. The printed wiring board 1 at the center of each silk-printed mark is provided with a hole connected to the pattern on the back side. A land of copper foil for soldering is formed on the back surface side of the bored hole. 11 is a lead wire identification number for identifying each lead wire, and 12 is a lead wire identification character for identifying each lead wire.

Next, a description will be given of a manufacturing process and a lead wire connecting operation of the printed wiring board configured as described above. Regarding the manufacture of the substrate, first, the back surface of the untreated printed board is entirely covered with copper foil. The back surface is etched according to the design pattern to form a pattern. Next, a green film is applied to portions other than the portions to be soldered on the formed pattern. This step is generally called a solder resist. There is no solder on the green part when solder resist is applied. Finally, silk printing is applied to the surface.

As described above, a pattern is formed on one surface of the printed wiring board 1 in advance, and a silk print 8 for a power plug lead wire, a silk print 9 for a fan motor lead wire, A silk screen 10 for a neon lamp lead wire, a lead wire identification number 11, and a lead wire identification character 12 are printed. Then, the lead wires 5, 6, 7 of each mounted part were manually drilled at the center of the silk prints 8, 9, 10 from the lead wire insertion surface side on which the silk prints 8, 9, 10 were applied. It is inserted into the hole and penetrated to the back side of the printed wiring board 1.

When the lead wire is inserted, the mark formed in the hole for each mounted part is different from a circle, a triangle, or a square, so that the operator can easily identify the place where each part is mounted, and the wiring is incorrect. Components can be mounted without performing. Also,
Since these marks are provided with holes for inserting lead wires in the center, the identification means does not need to be placed at a fixed distance from the holes, and the lead wire identification number can be obtained without increasing the area occupied by the marks. 11, a mark that is relatively larger than the lead wire identification character 12, and is not restricted to a predetermined form like a character or a number. Therefore, as the printing area can be reduced, the entire substrate area can be reduced.

Since the lead wire penetrating to the back side is located on a predetermined pattern, by mounting this lead wire in the same manner as in the prior art shown in FIG. It will be electrically connected to the predetermined position. At the time of soldering, as shown in the above-mentioned Japanese Patent Application Laid-Open No. 58-73182, the shape of the pattern or land is changed on the surface on which the pattern is formed and soldering is performed, so that the soldered portion can be identified. May be enabled.

In this case, since the mark includes the hole of the printed wiring board, the mark and the occupied area can be reduced. As a result, in the conventional printed wiring board, not only the pattern but also the silk printing of the mark on the lead wire insertion surface and the information display area near the hole by the lead wire identification number 11 and the lead wire identification character 12 must be considered. However, according to the present invention, the information display area near the hole on the lead wire insertion surface side can be reduced in space, so that the size of the printed wiring board can be reduced, and the degree of freedom in patterning is improved. It is also possible. Further, the workability of assembling the mounted components on both sides of the printed wiring board is improved.

In the above-described embodiment, the marks are formed in different shapes such as a triangle and a quadrangle. However, for example, silk printing 8 for a power plug lead wire, silk printing 9 for a fan motor lead wire, The same effect can be obtained even if the neon lamp lead wire silk print 10 is all circular and classified according to colors such as black, red, and blue. In addition, in the case of color coding, the shape of the mark can be unified to the shape having the smallest occupied area, so that the substrate can be further downsized. Further, by combining different shapes and color classifications, the number of types of marks can be made as many as the number of shapes and colors as a whole, and it is possible to cope with a substrate having a higher density or a substrate having a large number of lead wires.

In the same manner, the size of each shape having a different shape may be set to a plurality of types instead of being classified by color. For example, it is conceivable to make the triangle three sizes, large, medium, and small, and to correspond to each different mounting component. In this case, the area occupied by the marks increases due to the large marks. However, since a large number of classifications can be made by printing in a single color, the cost can be reduced as compared with the case of color-coding. In addition, if the number of shapes is increased, it becomes difficult to identify a substrate with a high density.Therefore, classification based on the difference in size enables simplification of the shape and multi-classification. There is no disadvantage to it.

In addition, there is a limit to the classification based on different shapes, multiple colors, and sizes, and it is difficult to find the same mark on a substrate having a high density as shown in FIG. In such a case, as shown in the conceptual diagram of FIG.
The same marks or the same marks related to the same mounting component are surrounded by the frames 8a, 9a, and 10a, so that they can be easily searched. The frame may be surrounded by a line as shown in FIG. 3 or the inside of the frame may be color-coded. In addition, even if the same mark is used, the same mark can be used for a plurality of mounted components on the same substrate by grouping by frame and separating into a plurality of groups.

In any case, these marks are in a range applicable by silk printing similar to the conventional one. Therefore, if they are realized by silk printing, they can be easily realized without significantly reducing the manufacturing cost of the printed wiring board. be able to. Of course, the present invention is not limited to silk printing, and may be realized by other printing methods,
The marks may be indicated by irregularities on the substrate and differences in height and depth.

As shown in FIGS. 1 and 2, the lead wire identification number 11, the lead wire identification character 1
2 may be used in combination with the mark of the present invention. Conventionally, since all the marks by silk printing are common, the lead wire identification number 11 and the lead wire identification character 12 are adjacent to each other on a substrate having a high density, so that the identification may not be performed. According to the embodiment, the mark is provided with a difference corresponding to the mounting component, so that it is possible to easily identify to which of the lead wire identification number 11 and the lead wire identification character 12 the mark belongs. Therefore, such information can be effectively transmitted to the worker without misunderstanding.

For example, it is assumed that the silk print 8 for the power plug lead wire, the silk print 9 for the fan motor lead wire, and the silk print 10 for the neon lamp lead wire are assembled in this order. If the order is determined by the marks of connection and rectangular connection, the assembly order can be easily determined even on a complicated board, and the order is not mistaken, so that the workability is improved. In particular, in general, a plurality of components having the same layout are prepared on a plurality of continuous substrates as shown in FIG. 2, fine electronic components such as resistors are assembled at a time, and then divided into individual substrates. However, the manufacturing method of manually assembling the mounting parts having lead wires has been adopted.However, by unifying the steps of the assembling work on each of these individual boards by using the ranked marks, it is possible to manually assemble the parts. The assembly work can be performed efficiently. In addition, those that require an assembling order are particularly effective.

Even in the case of manufacturing different types of substrates, if the order of the marks is unified, regardless of the change in the pattern, the operator can follow the order given to the marks.
It is possible to respond flexibly, and workability and productivity are improved. Of course, ranking is not only for different shapes,
It is also applicable to color classification and size classification.

Furthermore, on the surface on which the pattern of the printed wiring board 1 is formed and where soldering or the like is performed, and on the lead wire insertion surface, individual patterns provided on the respective surfaces and lands and the like provided on the respective surfaces via holes are provided. If the shape and the individual marks marked by silk printing are the same shape, the same attached component is identified by the same code when inserting the lead wire into the printed wiring board and when soldering the lead wire Therefore, erroneous work can be reduced. This is also effective when the marks are ranked as described above. By the way, in the above embodiment, the present invention has been described with respect to the insertion of the lead wire of the mounting component, but the present invention can be applied to the mounting of other electronic components.

[0039]

As described above, according to the present invention, in an insertion mounting type printed wiring board having a surface on which a pattern is formed and a lead wire insertion surface into which a lead wire of a mounting component is inserted, A different mark is added to the lead wire insertion surface on the lead wire insertion surface according to the type of the mounted component, etc., so when mounting the mounted component, the lead wire insertion position can be easily identified, and work with fewer incorrect connections The effect of improving the performance is obtained.

Further, since marks of different colors are attached to the lead wire insertion portions in accordance with the type of the mounted component, etc., the shapes of the marks can be identified without using a different shape having a large occupying area. Accordingly, the effect that the size of the substrate can be reduced can be obtained.

Also, since the lead wire insertion points are marked with different sizes according to the type of the mounted parts, etc., many classifications can be made with the same shape without having to classify by complicated different shapes. The effect that the printed wiring board which can be easily performed can be obtained is obtained.

In addition, different marks, each having a plurality of marks, are provided on the lead wire insertion surface in accordance with the type of the component to be mounted and the like.
Since the plurality of related marks are surrounded by a frame, an effect is obtained that it is easy to find the same marks or the same marks related to the same mounting component. Further, even if the same mark is used, it is grouped by a frame and divided into a plurality of groups, so that even when the same mark is used for a plurality of mounted components on the same substrate, an effect of preventing erroneous wiring or the like can be obtained.

Further, since the above-mentioned mark is attached by silk printing, it is possible to use the same printing method as in the past.
The effect that the above-described invention can be easily realized without significantly reducing the manufacturing cost of the printed wiring board is obtained.

Further, since the mark is combined with the lead wire identification number or the lead wire identification character, it is possible to easily identify to which the lead wire identification number or the lead wire identification character corresponds from the difference between the marks. As a result, an effect is obtained in which individual information can be effectively transmitted to the worker without misunderstanding.

Further, since the ranking is made for each of the different marks, it is possible to easily determine the assembling order even on a complicated substrate, and to obtain the effect of improving the workability.

Further, since a plurality of printed wiring boards are assembled in accordance with the above-mentioned ordering, as for a printed wiring board having the same layout, the assembling process in each printed wiring board can be unified, and an assembling order is required. It is possible to prevent mistakes in the order of assembly on the board, and even in the case of manufacturing different types of printed wiring boards, if the mark order is unified regardless of the pattern change, the worker can According to the order given to the mark, it is possible to respond flexibly, and the effect of improving workability and productivity is obtained.

Further, since the pattern shape or land shape of the lead wire penetrating portion on the surface on which the pattern is formed has a different shape depending on the type of the mounted component, etc., the workability of assembling the mounted component on both sides of the printed wiring board is improved. Is obtained. Further, since the information display area of the lead wire insertion surface can be reduced in space, the size of the printed wiring board can be reduced, and the degree of freedom in patterning can be improved.

Further, since the mark and the pattern shape or the land shape at the front and back positions through the lead wire penetrating portion are made the same shape, when inserting the lead wire into the printed wiring board, the soldering of the lead wire is performed. At the time of attaching work,
Since the same mounting part can be identified by the same design, erroneous work can be reduced and the effect of improving workability can be obtained.

Also, in the method of identifying a component mounting position on an insertion mounting type printed wiring board having a surface on which a pattern is formed and a lead wire insertion surface into which a lead wire of a mounted component is inserted, the lead wire insertion surface Since different parts are mounted according to the different marks attached to the lead wire insertion points, the lead wire insertion points can be easily identified at the time of assembling each mounted part, thereby reducing erroneous connections and improving workability. The effect is obtained.

In addition, ranking is performed for each of the different marks, and components are mounted according to the order given for each of the marks.
The assembly order can be easily determined even on a complicated substrate or a different type of substrate, and the effect of improving workability can be obtained.

[Brief description of the drawings]

FIG. 1 is a conceptual diagram showing a printed wiring board according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a printed wiring board during a manufacturing process according to the embodiment of the present invention.

FIG. 3 is a conceptual diagram showing a printed wiring board according to another embodiment of the present invention.

FIG. 4 is a conceptual diagram showing a conventional printed wiring board.

FIG. 5 is a partial sectional view of FIG.

FIG. 6 is a configuration diagram showing a printed wiring board during a conventional manufacturing process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Power plug 3 Fan motor 4 Neon lamp 5 Lead wire for power plug 6 Lead wire for fan motor 7 Lead wire for neon lamp 8 Silk print for power plug lead wire 9 Silk print for fan motor lead wire 10 Neon lamp Silk printing for lead wire 11 Lead wire identification number 12 Lead wire identification character

Claims (12)

[Claims] 1. An insertion mounting type printed wiring board having a surface on which a pattern is formed and a lead wire insertion surface into which a lead wire of a mounting component is inserted, mounted on a lead wire insertion surface of the lead wire insertion surface. A printed wiring board, which is marked differently according to the type of a component or the like. 2. The printed wiring board according to claim 1, wherein a mark of a different color is attached to the place where the lead wire is inserted, depending on a type of a mounted component or the like. 3. The printed wiring board according to claim 1, wherein a mark having a different size is attached to the lead wire insertion portion according to a type of a mounted component. 4. A method according to claim 1, wherein a plurality of different marks each having a plurality of marks are provided on the lead wire insertion surface in accordance with a type of a component to be mounted, and a plurality of the related marks are surrounded by a frame. 2. The printed wiring board according to 1. 5. The printed wiring board according to claim 1, wherein the mark is provided by silk printing. 6. The printed wiring board according to claim 1, wherein the mark is combined with a lead wire identification number or a lead wire identification character. 7. The printed wiring board according to claim 1, wherein the ranking is made for each of the different marks. 8. The printed wiring board according to claim 7, wherein the printed wiring board is composed of a plurality of pieces according to the ranking. 9. The printed wiring board according to claim 1, wherein a pattern shape or a land shape of a lead wire penetrating portion on the surface on which the pattern is formed has a different shape depending on a type of a mounted component or the like. 10. The printed wiring board according to claim 9, wherein the mark and the pattern shape or the land shape located at the front and back positions via the lead wire penetrating portion have the same shape. 11. A method for identifying a component mounting position on an insertion mounting type printed wiring board having a surface on which a pattern is formed and a lead wire insertion surface into which a lead wire of a mounted component is inserted, wherein the lead wire insertion surface is provided. A component mounting position on a printed circuit board, wherein different components are mounted in accordance with different marks attached to the lead wire insertion locations. 12. The method according to claim 11, wherein the order is determined for each of the different marks, and the components are mounted according to the order given for each of the marks.