JPH10200251A - Circuit module manufacturing method - Google Patents

Abstract

(57) [Problem] To provide a method of manufacturing a circuit module capable of satisfactorily connecting an electronic component and a substrate using irradiation energy of a laser beam or the like. SOLUTION: A bump 2 is irradiated by irradiation of a laser beam LB.
Immediately after is melted, the air G1 is blown onto the bumps 2 to forcibly cool and solidify the melt, so that the time required for the melt to solidify can be significantly reduced as compared with the related art. It is possible to reliably prevent the electronic component 1 from moving due to its own weight or an external force after the melting of the bumps, thereby causing the electronic component 1 to be connected to the substrate 1 with high positional accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a circuit module for connecting an electronic component to a substrate by using irradiation energy of a laser beam or an electromagnetic wave.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional component connection method of this kind. In the drawing, reference numeral 1 denotes an electronic component such as an IC or LSI, 1a denotes an electrode provided on the lower surface of the electronic component 1, 2 denotes a bump, Reference numeral 3 denotes a substrate, 3a denotes an electrode (land) provided on the upper surface of the substrate 3, and LB denotes a laser beam.

The bump 2 is made of a metal material having a lower melting point than each of the electrodes 1a and 3a, for example, an Sn-Pb alloy (solder), and is formed in advance on one of the component electrode 1a and the substrate electrode 3a.

In order to electrically connect the electronic component 1 and the substrate 3, first, the electronic component 1 is aligned using a component suction tool (not shown) so that the component electrode 1a and the substrate electrode 3a coincide with each other. Then, it is placed on the substrate 3.

[0005] When the substrate 3 is made of a laser beam transmissive material, the laser beam LB is directed from the lower surface side of the substrate 3 toward the substrate electrode 3a or the bump 2 through the substrate 3 in the above-mentioned component mounted state. Irradiate (see solid arrow in the figure). In the case where a substrate that is impermeable to laser light is used as the substrate 3, a laser beam LB is irradiated from the side of the electronic component 1 toward the bump 2 in the above-described component mounting state (see the broken line arrow in the figure). .

Accordingly, at least the surface portion of the bump 2 is heated and melted by the energy of the laser beam LB, and the electrode 1a of the electronic component 1 and the electrode 3a of the substrate 3 are electrically connected via the bump 2 by solidification of the melted portion. Connected to.

[0007]

In the above-described conventional component connection method, after the bump 2 is melted by the irradiation energy of the laser beam LB, the melt is solidified by natural cooling. If the electronic component 1 moves by its own weight or an external force before it is solidified, there is a problem that the electronic component 1 is connected while being displaced.

Further, when the bump 2 is melted by the irradiation energy of the laser beam LB, a gas corresponding to the component, for example, when a solder bump is used, a contaminant gas such as a flux vapor is generated at the time of melting. There is a problem that the components 1 and the substrate 3 and peripheral devices thereof, such as the optical components of the laser beam LB, adhere to and contaminate them.

Further, since energy is applied to the bumps 2 in an oxidizing atmosphere such as air, the bumps 2 and their melted parts are oxidized when energy is applied, and the wettability is reduced due to the effect of the oxide film. Connection failure.

Furthermore, when the temperature of the bump 2 and each electrode 1a, 3a rises sharply from a normal temperature range to a high temperature range by the irradiation energy of the laser beam LB, the bump 2 and each electrode 1a, 3a are caused by this rapid temperature change. There is a problem that the connection reliability is reduced due to a problem such as generation of a solder ball or a short circuit due to strong thermal damage.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing a circuit module capable of satisfactorily connecting components using irradiation energy such as a laser beam.

[0012]

In order to achieve the above object, an object of the present invention is to provide a method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a connected portion. In addition, immediately after the connection portion is irradiated with the laser beam or the electromagnetic wave, at least the connection portion is forcibly cooled.

According to the first aspect of the present invention, immediately after the connected portion is irradiated with the laser beam or the electromagnetic wave, at least the connected portion is forcibly cooled, until the joining material melted by the irradiation energy is solidified. By shortening the time, it is possible to prevent the electronic component from moving due to its own weight or external force and causing a position shift.

According to a third aspect of the present invention, there is provided a method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a connected portion with a laser beam or an electromagnetic wave, and irradiating the connected portion with a laser beam or an electromagnetic wave. When or shortly thereafter, the contaminated gas generated in the connected portion by the energy application is forcibly exhausted.

According to the third aspect of the present invention, when the connected portion is irradiated with a laser beam or an electromagnetic wave or immediately thereafter, the contaminated gas generated in the connected portion due to the application of energy is forcibly exhausted to thereby reduce the contamination. It is possible to prevent gas from adhering to and contaminating electronic components, substrates, and the like.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a connected portion, wherein at least the connected portion is placed in an inert gas atmosphere. And irradiating the connected portion with a laser beam or an electromagnetic wave in the same state.

According to the fourth aspect of the present invention, at least the connected portion is placed in an inert gas atmosphere, and the connected portion is irradiated with a laser beam or an electromagnetic wave in the same state, so that the connected portion is provided with energy. Oxidation can be prevented, so that occurrence of connection failure due to the influence of the oxide film can be prevented.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a portion to be connected. It is characterized in that the connection part is irradiated with a laser beam or an electromagnetic wave.

According to the fifth aspect of the present invention, after at least the portion to be connected is preheated, the portion to be connected is irradiated with a laser beam or an electromagnetic wave to reduce the temperature rise of the portion to be connected when energy is applied. Thus, thermal damage to the connected portion can be reduced.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIG. 1 relates to a first embodiment of the present invention, in which 1 is an electronic component such as an IC or LSI, 1a is an electrode provided on the lower surface of the electronic component 1, and 2 is a bump. Reference numeral 3 denotes a substrate, 3a denotes an electrode provided on the upper surface of the substrate 3, 4 denotes a cap, and LB denotes a laser beam.

The component electrode 1a and the substrate electrode 3a are made of gold, silver, aluminum, copper, nickel or an alloy thereof.
The bump 2 is made of a metal material having a lower melting point than each of the electrodes 1a and 3a, for example, an Sn—Pb-based alloy (solder), and is formed in advance on one of the component electrode 1a and the substrate electrode 3a.

The substrate 3 is made of a ceramic or glass such as sapphire, zirconia, calcium fluoride, aluminum nitride, alumina, quartz, etc., which has transparency to the laser beam LB, or a resin such as polyimide, acrylic, PET, glass epoxy, or the like. .

The cap 4 is large enough to cover the electronic component 1 and has at least one vent 4a on a different side. In addition, a packing material 4b is provided along the edge of the cap 4 at the edge of the lower surface opening so that the edge is brought into airtight contact with the substrate 3.

The laser beam LB is a YAG laser or CO ₂
The light is emitted from a laser oscillator (not shown) such as a laser in an infrared region to an ultraviolet region, and is irradiated from the lower surface side of the substrate 3 toward the substrate electrode 3a or the bump 2. Incidentally, in the illustrated example, an optical system capable of simultaneously irradiating a plurality of laser beams LB according to the number of electrodes of the electronic component 1 is assembled. The wavelength, output, and irradiation time of the laser beam LB are set in advance according to the laser beam transmittance of the substrate 3, the material and size of the bump 2, and the like.

In order to electrically connect the electronic component 1 and the substrate 3, first, the electronic component 1 is aligned using a component suction tool (not shown) so that the component electrode 1a and the substrate electrode 3a coincide. And then placed on the substrate 3.

After the components are mounted, the component suction tool is retracted from the electronic component 1, the cap 4 is put on the mounted electronic component 1, and the packing material 4 b is brought into close contact with the substrate 3.

Then, a substrate electrode 3a is provided from the lower surface side of the substrate 3.
Alternatively, the laser beam LB is irradiated toward the bump 2. Thereby, at least the surface portion of the bump 2 is heated and melted by the energy of the laser beam LB transmitted through the substrate 3.

Immediately after the bump 2 is melted by the irradiation of the laser beam LB, the air G1 is blown into the internal space from one vent 4a of the cap 4 or the other vent 4a.
The air G1 flowing from one vent 4a through the internal space to the other vent 4a is formed by any method of sucking the air G1 in the internal space from the inside. As a result, the air G1 is blown onto the bumps 2 and the molten portion of the bumps 2 is forcibly cooled and solidified, and the electrodes 1a of the electronic component 1 and the electrodes 3a of the substrate 3 are electrically connected via the bumps 2. You.

According to the present embodiment, immediately after the bump 2 is melted by the irradiation of the laser beam LB, the air G1 is blown to the bump 2 to forcibly cool and solidify the melted portion. The time required for the molten component to solidify can be significantly reduced, and after the bump is melted, the electronic component 1 can be reliably prevented from moving due to its own weight or an external force, thereby causing the electronic component 1 to have high positional accuracy. Can be connected to the substrate 1.

Further, even if a contaminant gas such as a flux vapor is generated during the melting of the bumps, the contaminant gas can be forcibly exhausted by the flow of the air G1. It is possible to surely prevent the light beam LB from adhering to and contaminating the optical system components, thereby significantly improving the product quality.

In the above embodiment, the bump 2 itself is used as a bonding material. However, a bonding material layer having a lower melting point than the bump, for example, a solder layer is provided on the bump surface.
The same component connection may be performed by heating and melting only the bonding material layer, or a bonding material such as solder is provided on one of the component electrode and the substrate electrode instead of removing the bumps. You may make it connect a component electrode and a board | substrate electrode using a joining material.

In the above-described embodiment, the forced cooling and the forced exhaust are performed immediately after the laser beam irradiation. However, when the laser beam is irradiated, the same air flow as described above or a weaker air flow is formed. By doing so, it is possible to suppress the bump 2 from being melted more than necessary, and it is possible to quickly exhaust the contaminant gas simultaneously with its generation.

Further, an example in which the air G1 is used to perform the forced cooling and the forced exhaust is exemplified. However, the same operation and effect can be obtained by using a gas other than the air. If a gas having a low temperature is fed, the cooling effect can be further improved. Also,
The position of the ventilation port 4a in the case of forcibly cooling and exhausting is not limited to the illustrated example, but can be arbitrarily changed.

[Second Embodiment] FIG. 2 relates to a second embodiment of the present invention. This embodiment is different from the first embodiment in that the upper surface of the electronic component 1 is pressed inside the cap 4. In that a component supporting portion 4c is provided. The component support portion 4c has a flat surface parallel to the upper surface of the substrate 3 at its lower end, and can mainly press the center of the upper surface of the electronic component 1 with the electronic component 1 covered with the cap 4. In addition, the inclination of the electronic component 1 placed on the substrate 3 can be corrected by the flat lower end surface. The other configuration and connection method are the same as those of the first embodiment, and therefore the same reference numerals are used and the description is omitted.

According to the present embodiment, while the electronic component 1 placed on the substrate 3 is held down by the component supporting portion 4c of the cap 4, the components can be connected by laser beam irradiation. The electronic component 1 can be prevented from being displaced before, and the electronic component 1 can be connected to the substrate 3 in a stable posture. Other operations and effects are the same as those of the first embodiment.

In the present embodiment, an example in which the center of the upper surface of the electronic component 1 is mainly pressed by the component supporting portion 4c has been exemplified. However, the number of component supporting portions may be increased, or at least the lower portion of the component supporting portion. May be enlarged so that the lower surface of the component supporting portion presses the entire upper surface of the component.

Although the component supporting portion 4c is formed integrally with the cap 4 as an example, the component supporting portion 4c may be formed as a separate body and attached to the cap 4 via a spring material. The electronic component 1 can be pressed using spring pressure regardless of the component height. Of course, if the component support portion itself is formed of a material that can be elastically deformed, the same operation can be obtained without using a spring material.

[Third Embodiment] FIG. 3 relates to a third embodiment of the present invention. This embodiment is different from the first embodiment in that an insert for a component support 5 is inserted in the center of the upper surface of the cap 4. The point is that the opening 4d is provided, and the height position of each of the ventilation holes 4a is matched. The component support 5 has a flat surface parallel to the upper surface of the substrate 3 at the lower end, and can mainly press the center of the upper surface of the mounted component 1 through the insertion opening 4d. The other configuration is the same as that of the first embodiment, so the same reference numerals are used and the description is omitted.

In order to electrically connect the electronic component 1 and the substrate 3, first, the electronic component 1 is aligned using a component suction tool (not shown) so that the component electrode 1 a and the substrate electrode 3 a coincide. And then placed on the substrate 3.

After the parts are placed, as shown in FIG.
The component suction device is retracted from the electronic component 1, the cap 4 is put on the mounted electronic component 1, the packing material 4 b is brought into close contact with the substrate 3, and the component support 5 is inserted into the insertion opening 4 d of the cap 4. Then, the electronic component 1 placed on the substrate 3 is pressed by the component support 5.

Then, from the lower surface side of the substrate 3, the substrate electrode 3a
Alternatively, the laser beam LB is irradiated toward the bump 2. Thereby, at least the surface portion of the bump 2 is heated and melted by the energy of the laser beam LB transmitted through the substrate 3.

Immediately after the bump 2 is melted by the irradiation of the laser beam LB, as shown in FIG.
From the insertion opening 4d of the cap 4, and the insertion opening 4d
The air G1 flowing from the insertion port 4d through the internal space to each of the ventilation holes 4a can be controlled by either blowing the air G1 into the internal space from the inside or by suctioning the air G1 in the internal space from each of the ventilation holes 4a. Form. As a result, the air G1 is blown to the bumps 2 and the molten portion of the bumps 2 is forcibly cooled and solidified, and the electrodes 1a of the electronic component 1 are solidified.
And the electrode 3 a of the substrate 3 are electrically connected via the bump 2.

According to the present embodiment, in a state where the electronic component 1 placed on the substrate 3 is pressed by the component support 5 inserted into the insertion opening 4 d of the cap 4, component connection by laser beam irradiation is performed. Therefore, it is possible to prevent the electronic component 1 from being displaced before the irradiation of the laser beam, and to connect the electronic component 1 to the substrate 3 in a stable posture. Other operations and effects are the same as those of the first embodiment.

In the above embodiment, the flow of the air G1 that escapes from the insertion port 4d to the ventilation holes 4a through the internal space is illustrated. However, after the component support is extracted, the air G1 flows from the ventilation holes 4a to the internal space. The air flow in the opposite direction may be formed by blowing air G1 or sucking air G1 in the internal space from the insertion port 4d.

If a gap is formed between the insertion opening 4d of the cap 4 and the component support 5 as an air passage, the component support 5 is not pulled out.
Thus, an air flow similar to the above can be formed while the electronic component 1 is held down.

[0046] [Fourth Embodiment] FIG. 4 is intended according to the fourth embodiment of the present invention, when the present embodiment is different from the first embodiment, using Ar, the inert gas G2 such as N _2, The point is that the components are connected in an inert gas atmosphere.
The other configuration is the same as that of the first embodiment, so the same reference numerals are used and the description is omitted.

In order to electrically connect the electronic component 1 and the substrate, first, the electronic component 1 is connected to the electronic component 1 using a component suction tool (not shown).
Is positioned so that the component electrode 1a and the substrate electrode 3a coincide with each other, and then placed on the substrate 3.

After the parts are placed, as shown in FIG.
The component sucker is retracted from the electronic component 1, the mounted electronic component 1 is covered with the cap 4, the packing material 4b is brought into close contact with the substrate 3, and one of the caps 4 is connected via a gas supply tube (not shown). The inert gas G1 is blown into the internal space from the ventilation port 4a to fill it.

Then, as shown in FIG.
Is irradiated with the laser beam LB toward the substrate electrode 3a or the bump 2 from the lower surface side of the substrate. Thus, at least the surface portion of the bump 2 is heated and melted in an inert gas atmosphere by the energy of the laser beam LB transmitted through the substrate 3.

After the bump 2 is melted by the irradiation of the laser beam LB, the melted portion of the bump 2 is naturally cooled and solidified, and the electrode 1a of the electronic component 1 and the electrode 3a of the substrate 3 are interposed via the bump 2. Electrically connected.

According to the present embodiment, since the bump 2 can be heated and melted in an inert gas atmosphere, the bump 2 and its melted portion are prevented from being oxidized when energy is applied, and the wettability is reduced due to the effect of the oxide film. As a result, it is possible to reliably prevent the occurrence of a connection failure, thereby significantly improving the connection reliability.

In the above-described embodiment, an example in which the molten portion of the bump 2 is naturally cooled is exemplified. However, if the inert gas G2 is blown into the internal space from one of the vents 4a of the cap 4 immediately after the melting of the bump, The inert gas G2 is applied to the bump 2
, The molten content can be forcibly cooled and solidified, and the contaminant gas such as flux vapor generated at the time of melting the bump can be forcibly exhausted by the flow of the inert gas G2. Of course, air G1 may be used in place of the inert gas G2 for the above-mentioned forced cooling and forced exhaust.

Also, if the size of the cap 4 is made as small as possible to narrow the gap with the electronic component 1, the inert gas G2
And the cost can be reduced.

[Fifth Embodiment] FIG. 5 relates to a fifth embodiment of the present invention. This embodiment is different from the first embodiment in that an electric heater 6 for preheating parts is provided in a cap 4. It is in the point. The other configuration is the same as that of the first embodiment, so the same reference numerals are used and the description is omitted.

In order to electrically connect the electronic component 1 and the substrate 3, first, the electronic component 1 is aligned using a component suction tool (not shown) so that the component electrode 1 a and the substrate electrode 3 a coincide. And then placed on the substrate 3.

After the parts are placed, as shown in FIG.
The component suction tool is retracted from the electronic component 1, the mounted electronic component 1 is covered with a cap 4, the packing material 4b is brought into close contact with the substrate 3, and the electronic component 1 is heated using heater heat.
Then, the bump 2 is heated, and the bump 2 is mainly preheated to a temperature higher than the normal temperature.

Then, as shown in FIG.
Is irradiated with the laser beam LB toward the substrate electrode 3a or the bump 2 from the lower surface side of the substrate. Thereby, at least the surface portion of the bump 2 is heated and melted by the energy of the laser beam LB transmitted through the substrate 3.

Immediately after the bump 2 is melted by the irradiation of the laser beam LB, the heating by the electric heater 5 is stopped, and the air G1 is blown into the internal space from one vent 4a of the cap 4 or the other vent 4a. The air G1 flowing from one vent 4a through the internal space to the other vent 4a is formed by any method of sucking the air G1 in the internal space from the inside. As a result, the air G1 is blown onto the bumps 2 and the molten portion of the bumps 2 is forcibly cooled and solidified, and the electrodes 1a of the electronic component 1 and the electrodes 3a of the substrate 3 are electrically connected via the bumps 2. You.

According to the present embodiment, since the energy of the laser beam LB is applied to the bump 2 after the bump 2 is preheated by the heater heat, the bump 2 and the electrodes 1a, 2a at the time of the energy application are applied. By reducing the temperature rise, the thermal damage to these components can be greatly reduced, and problems such as the occurrence of solder balls and short circuits can be eliminated, thereby significantly improving the connection reliability. Other operations and effects are the same as those of the first embodiment.

In the present embodiment, an example in which the bumps 2 of the electronic component 1 are mainly preheated by using the heater heat has been exemplified. However, after the electronic component 1 is covered with the cap 4, air having a temperature higher than the normal temperature is set. When the gas G1 and the inert gas G2 are blown into the internal space from one of the vents 4a of the cap 4, the bumps 2 mainly of the electronic component 1 are similarly irradiated with the air G1 and the inert gas G2 before the laser beam irradiation. Can be preheated.

[Sixth Embodiment] FIG. 6 relates to a sixth embodiment of the present invention. This embodiment is different from the first embodiment in that ceramics, glass, and the like having transparency to a laser beam LB are used. The point that the cap 4 is formed from resin or the like;
The point is that the laser beam LB transmitted through the cap 4 is applied to the bump 2. The other configuration is the same as that of the first embodiment, so the same reference numerals are used and the description is omitted here.

In order to electrically connect the electronic component 1 and the substrate 3, first, the electronic component 1 is aligned using a component suction tool (not shown) so that the component electrode 1 a and the substrate electrode 3 a coincide. And then placed on the substrate 3.

After the components are placed, the component suction tool is retracted from the electronic component 1, the cap 4 is put on the placed electronic component 1, and the packing material 4 b is brought into close contact with the substrate 3.

Then, a laser beam LB is irradiated from outside the cap 4 toward the bump 2. Thereby, the energy of the laser beam LB transmitted through the cap 4 causes
At least the surface portion of the bump 2 is heated and melted.

Immediately after the bump 2 is melted by the irradiation of the laser beam LB, the air G1 is blown into the internal space from one vent 4a of the cap 4 or the other vent 4a.
The air G1 flowing from one vent 4a through the internal space to the other vent 4a is formed by any method of sucking the air G1 in the internal space from the inside. As a result, the air G1 is blown onto the bumps 2 and the molten portion of the bumps 2 is forcibly cooled and solidified, and the electrodes 1a of the electronic component 1 and the electrodes 3a of the substrate 3 are electrically connected via the bumps 2. You.

According to the present embodiment, the cap 4 having transparency to the laser beam LB is used, and the laser beam LB is irradiated from the outside of the cap 4 toward the bump 2. Can be similarly connected by laser beam irradiation even when does not have transparency to the laser beam LB. Other operations and effects are the same as those of the first embodiment.

As described above, in each of the above embodiments, one electronic component is covered with one cap. However, a plurality of electronic components or all the electronic components mounted on the substrate are covered with one cap. Even in this case, similar component connection can be performed.

Further, ICs, LSIs and the like have been exemplified as electronic components. However, the connection method described in each embodiment is applicable to chip-like electronic components such as chip capacitors, chip inductors, chip resistors and other electronic components. Widely applicable,
Similar functions and effects can be obtained.

Further, even if an electromagnetic wave, for example, a thermal radiation such as an infrared ray or a radio wave such as a microwave is applied to a connected portion such as a component electrode or a bump instead of the laser beam, the connection of the component is similarly performed by the irradiation energy. Can be done.

[0070]

As described above in detail, according to the first aspect of the present invention, the time required for the joining material melted by the irradiation energy to be solidified is shortened, and the electronic component moves due to its own weight or an external force. Can be prevented, whereby the electronic component can be connected to the substrate with high positional accuracy, and the electronic component can be satisfactorily connected to the substrate using the irradiation energy of a laser beam or the like.

According to the third aspect of the present invention, it is possible to prevent the contaminant gas generated in the connected portion due to the application of energy from adhering to and contaminating the electronic components, the substrate, and the like. Is significantly improved, and the connection between the electronic component and the substrate using the irradiation energy of a laser beam or the like can be favorably performed.

According to the fourth aspect of the present invention, it is possible to prevent the connected portion from being oxidized by the irradiation energy and to prevent the occurrence of a connection failure due to the influence of the oxide film, thereby improving the connection reliability. The connection between the electronic component and the substrate using the irradiation energy of a laser beam or the like can be improved satisfactorily.

According to the fifth aspect of the present invention, it is possible to reduce the temperature rise of the connected portion due to the irradiation energy and reduce the thermal damage to the connected portion, thereby greatly improving the connection reliability. Thus, the connection between the electronic component and the substrate using the irradiation energy of a laser beam or the like can be performed well.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a component connection method according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a component connection method according to a second embodiment of the present invention.

FIG. 3 is an explanatory diagram of a component connection method according to a third embodiment of the present invention.

FIG. 4 is an explanatory diagram of a component connection method according to a fourth embodiment of the present invention.

FIG. 5 is an explanatory diagram of a component connection method according to a fifth embodiment of the present invention.

FIG. 6 is an explanatory diagram of a component connection method according to a sixth embodiment of the present invention.

FIG. 7 is an explanatory view of a conventional component connection method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Component electrode, 2 ... Bump, 3 ... Substrate, 3a ... Substrate electrode, 4 ... Cap, LB ... Laser beam, G1 ... Air, G2 ... Inert gas.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tomonori Fujii 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Electric Power Co., Inc. (72) Mitsuo Ueno 6-16-20 Ueno, Taito-ku, Tokyo Taiyo (72) Inventor Iwao Fujikawa 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Co., Ltd. (72) Inventor Kazuyuki Shibuya 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Induction Den Co., Ltd.

Claims (6)

[Claims] 1. A method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a connected portion, comprising: immediately irradiating the connected portion with a laser beam or an electromagnetic wave;
A method for manufacturing a circuit module, comprising forcibly cooling at least a connected portion. 2. The method for manufacturing a circuit module according to claim 1, wherein the forced cooling is performed by blowing a gas onto at least a connected portion. 3. A method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a connected portion, wherein the laser beam or the electromagnetic wave is irradiated to the connected portion or immediately thereafter. And forcibly exhausting a contaminated gas generated in the connected portion by applying energy. 4. A method of manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a connected portion, wherein at least the connected portion is placed in an inert gas atmosphere, and A method for manufacturing a circuit module, comprising irradiating a laser beam or an electromagnetic wave to a connected portion in the method. 5. A method for manufacturing a circuit module for connecting an electronic component and a substrate by irradiating a laser beam or an electromagnetic wave to a connected portion, wherein at least the connected portion is preheated and then the laser beam is applied to the connected portion. Or irradiating an electromagnetic wave. 6. The method for manufacturing a circuit module according to claim 5, wherein the preheating of the connected portion is performed by blowing at least a gas having a temperature higher than a normal temperature to the connected portion.