JPH10202425A - Electro plated band saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To buffer propagation of a crack from a blade part surface to a main body, reduce the propagation and expansion of the crack and mitigate reaction force to the main body during working and thermal stress of a blade part and the main body by providing a buffering layer between a hard abrasive grain layer and the tool main body. SOLUTION: Copper plating 5 which is a buffering layer is a applied after covering a part except for a blade part 4 of a base metal (endless belt before electroplating) 1 which is a main body with a masking agent. Thickness of the copper plating 5 is to be 10-50μm and hard abrasive grains 6 of a grain diameter of 1/5-1/10 are suitable. Thereafter, setting and Ni plating embedding of the hard abrasive grains 6 is carried out by a standard sulfamic acid nickel bath. Embedding is to be about 60-70% of the grain diameter of the abrasive grains. In this way, an electro plated band saw is manufactured. By this buffering layer 5, propagation of a crack to the main body is buffered, and lengevity is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposited band saw used for cutting by firmly holding hard abrasive grains such as CBN and diamond on a tool body.

[0002]

2. Description of the Related Art Electroplated band saws are used to cut highly brittle materials such as ceramics, high hardness materials such as hardened steel (hardness of 50 HRc or more), and new materials such as carbon fibers. Further, with the spread of semiconductors, electrodeposited band saws have begun to be used to cut expensive materials such as silicon ingots with high efficiency and extremely thinness. The life of an electrodeposited band saw used in such an application is often due to cracks in the tool body rather than cutting accuracy, resulting in a short life and an increase in cost.

The electrodeposited band saw is processed by winding the electrodeposited band saw on a pair of pulleys or three pulleys, applying tension, running at high speed, and cutting the work material. Therefore, since the electrodeposited band saw is wound around the pulley, a tensile stress and a compressive stress are applied to the front and back of the tool body, respectively. The applied stress increases as the pulley diameter decreases and the band tension increases. Furthermore, the higher the speed, the greater the number of repetitions and the shorter the fatigue life. In particular, when processing expensive work materials such as silicon ingots, instead of reducing the thickness of the band to reduce the cutting allowance, increase the pulling force. In order to increase the stress, several times more stress is applied than in the past.

Accordingly, for example, Japanese Utility Model Publication No. 60-24510
Japanese Patent Laid-Open Publication No. 3-79219 and Japanese Patent Laid-Open Publication No. 3-79219, a saw-shaped blade is provided or set, and hard abrasive grains are electrodeposited on the blade. The unevenness of the rigidity of the electrodeposited band saw, such as the difference in thickness of the electrodeposited band (the thicker one is more susceptible to stress) and the unevenness of the blade area, is unbalanced, so cracks are easy to enter from the blade, There has been a problem that the tool body is apt to crack due to the progress.

Therefore, in Japanese Utility Model Application Laid-Open No. Sho 62-15425, hard abrasive grains are electrodeposited to improve sharpness, so that a blade portion made of abrasive grains is intermittently provided in a circumferential direction, and a circular section is provided in order to prevent cracks. Ni plating is performed over the entire circumference. The above-mentioned Japanese Utility Model Publication No. 60-24510 also discloses a technique in which plating and abrasive grains are formed over the entire circumference in the circular direction. For example, as shown in FIG. 4, a strip-shaped spring steel or stainless steel is cut out to a designated length, and both ends are welded to form an endless shape.
Then, hard abrasive grains 12 such as CBN and diamond are fixed at a high density by electroplating at an appropriate width in a direction perpendicular to the longitudinal direction from one side end. In order to increase the holding power, electroplating of an alloy or electroless Ni plating 13 is performed.

[0006]

However, even with such a construction, when it is wound around a pulley and operated, the thickness of the blade portion is increased by the amount of the abrasive layer, so that it is smaller than that of the main body. Stress concentrates on the blade part, maximum tension and maximum compression force are applied to the outermost surface.
Due to the low fatigue strength of i-plating, cracks originate at the grain boundaries of hard abrasive grains such as CBN and diamond on the cutting edge, and cracks are promoted in the abrasive layer, and the body surface There was a problem that cracks were propagated to the part and the main body was still broken. Further, since the work material is a hard and brittle material, there is a problem that cracks are generated and propagated due to high thermal stress during processing and a large reaction force during processing.

An object of the present invention is to provide such crack propagation,
An object of the present invention is to provide an electrodeposited band saw that has little progress, reduces thermal stress and reaction force, and has a long tool life.

[0008]

According to the present invention, a buffer layer is provided between a hard abrasive layer of an electrodeposited band saw fixed to a tool body and a tool body by plating hard abrasive grains with a nickel alloy or the like. Solved the above problem.

According to this configuration, cracks generated in the abrasive grain layer are buffered by the buffer layer between the hard abrasive grain layer and the tool main body and do not propagate to the main body. In particular, cracks generated in the abrasive layer are microscopically broken, but since the abrasive layer is formed from a large amount of hard abrasive particles, a substantial reduction in processing ability is small. On the other hand, since the cracks are buffered by the buffer layer, the influence of the abrasive layer on the body of the cracks is small. In addition, thermal stress and reaction force are reduced.

The thickness of the buffer layer is preferably 10 to 50 μm or 1/5 to 1/10 of the hard abrasive particle size. If the thickness is smaller than this, there is no buffering effect, and if the thickness is larger, the blade width becomes larger, which causes an increase in cutting allowance (increase in cutting resistance) and a reduction in the life of the electrodeposited band saw. The elongation of the buffer layer is 1
0% or more is preferable. More specifically, the buffer layer is preferably made of copper plating.

[0011]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of an electrodeposition band saw to which the present invention is applied, and FIG. 2 is an enlarged sectional view taken along line AA of FIG. In the electrodeposited band saw of the present invention, FIGS.
As shown in FIG. 1, a blade having an appropriate width 3 including an edge 2 at one end in a direction perpendicular to the longitudinal direction of a main body 1 formed by cutting a belt-shaped spring steel or stainless steel into a specified length and welding both ends to an endless shape. 4 and copper plating is applied as the buffer layer 5. Hard abrasive grains 6 are further fixed to the main body by Ni alloy plating 7 outside the copper plating 5.

[0012]

Next, a method and an embodiment for manufacturing such an electrodeposited band saw will be described. A portion other than the blade portion 4 of the base metal (endless band before electrodeposition treatment) 1 as a main body was covered with a masking agent, and then copper plating 5 as a buffer layer was applied. The thickness of the copper plating 5 is 10 to 50 μm or a hard abrasive 6
５〜 of the particle size (# 120 to # 170 are frequently used)
1/10 is suitable. Therefore, the hard abrasive grains 6 used in the examples were diamonds and the grain size was # 120, so the thickness of the copper plating 5 was about 10 to 20 μm. The plating solution is
A standard copper sulfate solution was used.

Next, hard abrasive grains were set and Ni plating was embedded in a standard nickel sulfamate bath. Embedding was performed at 60 to 70% of the abrasive particle size. Thus, an electrodeposited band saw was manufactured. The electrodeposited band saw had a thickness of 0.5 mm, a width of 13 mm, and a total length of 2075 m.
m, the width (height) of the blade portion is 1 mm.

The electrodeposited band saw of the present invention and the conventional electrodeposited band saw having no buffer layer made of copper plating or the like are respectively 3
It was wound around a point pulley type cutting machine, rotated idle, and the life until the electrodeposited band saw was broken was compared. FIG. 3 shows the result. As shown in FIG. 3, the conventional product breaks in one hour, whereas the time to breakage in the product of the present invention is 2.5 hours.
The service life was twice as long as the time, the propagation of cracks to the body was reduced, and the service life was improved. In the embodiments and the like, the blade portion is a linear circumferential blade. However, the present invention can be applied to a blade having a blade shape such as a saw blade.

[0015]

According to the present invention, in the electrodeposition band saw in which the hard abrasive grains are fixed to the tool body by plating with a nickel alloy or the like, since the buffer layer is provided on the base of the hard abrasive grain layer, the surface of the blade portion is moved from the surface to the main body. Buffer the propagation of cracks
The present invention has provided an electrodeposited band saw in which the propagation and progress of cracks are small and the life due to cracks can be significantly improved.

Further, the buffer layer can reduce the reaction force to the main body during processing and the thermal stress between the blade portion and the main body, and can prolong the tool life.

[Brief description of the drawings]

FIG. 1 is a schematic view of an electrodeposited band saw showing an embodiment of the present invention.

FIG. 2 is an enlarged sectional explanatory view taken along line AA of FIG.

FIG. 3 is a table showing life test conditions and results of an electrodeposited band saw of the present invention and a conventional example.

FIG. 4 is an enlarged cross-sectional explanatory view corresponding to a cross section taken along line AA of FIG. 1 of the conventional electrodeposition band saw.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Tool main body (base metal) 4 Blade part 5 Buffer layer (copper plating) 6 Hard abrasive grains 7 Plating layer of nickel alloy etc.

Claims (4)

[Claims] 1. An electrodeposited band saw having a hard abrasive grain fixed to a tool body by plating with a nickel alloy or the like, wherein a buffer layer is provided between the hard abrasive grain layer and the tool body. . 2. The electrodeposited band saw according to claim 1, wherein the buffer layer has a thickness of 10 to 50 μm or 1/5 to 1/10 of a hard abrasive particle size. 3. The electrodeposited band saw according to claim 1, wherein the elongation percentage of the buffer layer is 10% or more. 4. The electrodeposited band saw according to claim 3, wherein said buffer layer is made of copper.