JPH10209097A - Substrate cleaning method and apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To sufficiently eliminate grease elements and adhesive particles adhered to the main surface of a substrate. SOLUTION: A substrate W fed from an feeding section 10 is subjected to the ultraviolet beam radiation process in an ultraviolet beam radiating section 20. The substrate W having completed the ultraviolet beam radiating process is sent to an ionization gas blowing section 30 for the purpose of ionization gas blowing process in which the ionized gas is blown. The substrate W having completed the ionization gas blowing process is subjected to the process such as brush cleaning using the pure water in the cleaning liquid processing section 40 and is then carried from the discharge section 50. The ionization air is injected from the ionization air gun 37 and the ionized particle adhered to the main surface in the upper side of the substrate W is effectively peeled from the substrate W with a repulsion force or attracting force of ion in the ionized air. Moreover, since the grease element adhering particle with preceding radiation of ultraviolet beam to the main surface of the substrate W is ashed, the particles adhered to the main surface of the substrate can easily be eliminated by the ionized air.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for cleaning a substrate such as a glass substrate for a liquid crystal display panel, a glass substrate for a plasma display, a semiconductor wafer, and a mask substrate for manufacturing semiconductors.

[0002]

2. Description of the Related Art As a conventional method for cleaning a substrate, air to which a ultrasonic wave of 30 kHz to 120 kHz is applied is blown onto the main surface of the substrate while horizontally supporting the substrate and transporting the substrate in a predetermined direction. Ultrasonic air cleaning for removing particles attached to the main surface, or removing particles attached to the main surface of the substrate by blowing ionized air onto the main surface of the substrate while transporting the substrate in the same manner as described above Ionized air cleaning is known.

The above-described ultrasonic air cleaning and ionized air cleaning are called dry cleaning, as opposed to wet cleaning in which a cleaning liquid such as pure water is supplied to the main surface of the substrate to clean the substrate. In these dry cleanings, the substrate is not cleaned by bringing a brush or the like into contact with the main surface of the substrate, but the substrate is cleaned without contacting the substrate, so that the substrate can be cleaned without damaging the main surface of the substrate. When the thin film is formed on the main surface of the substrate, the substrate can be washed without destroying the thin film.

[0004]

However, when a fat component adheres to the main surface of the substrate, the fat component or particles adhered to the surface of the fat component with a strong adhesive force are not subjected to the above-mentioned dry cleaning. A problem arises that it cannot be sufficiently removed.

In view of the above, an object of the present invention is to provide
It is an object of the present invention to provide a substrate cleaning method and apparatus capable of sufficiently removing fats and oils components and particles having strong adhesiveness adhered to a main surface of a substrate.

[0006]

According to a first aspect of the present invention, there is provided a method of cleaning a substrate, comprising: irradiating an ultraviolet ray onto a main surface of the substrate; And an ionized gas spraying step of spraying the extracted gas.

According to a second aspect of the present invention, there is provided a method for cleaning a substrate, comprising: an ultraviolet irradiation step of irradiating the main surface of the substrate with ultraviolet light; And a step.

According to a third aspect of the present invention, there is provided a method for cleaning a substrate, wherein a predetermined cleaning liquid is supplied to the substrate after the ultrasonic treatment step or the ionized gas spraying step to clean the substrate.

According to a fourth aspect of the present invention, there is provided an apparatus for cleaning a substrate, comprising: an ultraviolet irradiation section for irradiating the main surface of the substrate with ultraviolet light; and an ionized gas blowing apparatus for blowing ionized gas onto the main surface of the substrate after the ultraviolet irradiation by the ultraviolet irradiation section. And a unit.

According to a fifth aspect of the present invention, there is provided a substrate cleaning apparatus for irradiating an ultraviolet ray to the main surface of the substrate, and blowing a gas to which ultrasonic waves are applied to the main surface of the substrate after the ultraviolet irradiation by the ultraviolet irradiator. And an ultrasonic processing unit.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] FIG. 1 shows a front structure of a substrate processing apparatus according to a first embodiment of the present invention.

This apparatus has an input section 10 for inputting a substrate W taken out of a cassette (not shown) into the apparatus, an ultraviolet irradiation section 20 for irradiating the main surface of the input substrate W with ultraviolet rays, and an ultraviolet irradiation section. An ionized gas spraying unit 30 for spraying ionized gas onto the main surface of the substrate W after the cleaning, and a cleaning liquid processing unit 40 for supplying cleaning water to the main surface of the substrate W after the ionized gas spraying to brush-clean the main surface of the substrate W And a payout unit 50 for taking out the substrate W after cleaning.

The substrate W carried into the inside through the opening 11 provided in the loading section 10 is moved upward by a plurality of pusher pins 13.
Passed to. The substrate W transferred to these pusher pins 13 is moved down by the pusher pins 13.
It is delivered on a plurality of transport rollers R which are arranged in parallel in a horizontal plane and rotate synchronously. These transport rollers R
While supporting the substrate W from below and keeping the substrate W horizontal, the substrate W is driven by a drive mechanism (not shown) to rotate around its horizontal axis, and transport the substrate W in the horizontal direction along the transport path TP. .

The substrate W conveyed from the charging section 10 to the ultraviolet irradiation section 20 is conveyed by a plurality of conveying rollers R and gradually moves under the lamp house 21. Thereby, uniform ultraviolet irradiation processing is performed on the entire upper main surface of the substrate W. That is, ultraviolet light is irradiated from the lamp house 21 to the upper main surface of the substrate W, and the fat and oil components and the like attached to the upper main surface of the substrate W are ashed. In the lamp house 21, a plurality of ultraviolet lamps 23 are arranged at equal intervals in order to uniformly irradiate the upper main surface of the substrate W with ultraviolet light. Note that the lower end of the lamp house 21 is open, and the inner surface of the lamp house 21 is a reflecting mirror in order to perform efficient ultraviolet irradiation. In the ultraviolet irradiation process, the interior of the chamber of the ultraviolet irradiation unit 20 is purged with a constant flow rate of nitrogen gas or the like in order to keep the inside of the ultraviolet irradiation unit 20 clean and enhance the effect of the ultraviolet irradiation process.

The substrate W transferred from the ultraviolet irradiation section 20 to the ionized gas blowing section 30 is transported by a plurality of transfer rollers R.
While being blown by the ionized air gun 37 from the ionized air gun 37, the upper main surface is cleaned. That is, the particles on the upper main surface of the substrate W are separated by the fluid pressure of the ionized gas flow jetted in the form of an air knife from the nozzle 37a of the ionized air gun 37.
Ionized gas ejected from the ionized air gun 37 and particles separated from the substrate W are sucked by the vacuum duct 38 and discharged out of the apparatus.

FIG. 2 is a view for explaining the detailed structure of the ionized gas blowing section 30. The ionized gas blowing unit 30 includes:
It is covered by the entire cover 31. A HEPA filter 32 is provided at the upper center of the entire cover 31, and a substrate loading port 33 and a substrate loading port 34 below the entire cover 31 are provided.
, An air discharge nozzle 35 for forming an air curtain is attached.

Inside the entire cover 31, a dust removing unit cover 36 is disposed. The nozzle unit 37a of the ionized air gun 37 is inserted into the dust removing unit cover 36, and is attached to the upper main surface of the substrate W that moves on the transport roller R.
Spray ionized air at high speed. The ionized air bounced off on the upper main surface of the substrate W and the particles blown off by the ionized air form a vacuum duct 38.
Is discharged to the outside of the ionized gas blowing unit 30 through the

The ionized air gun 37 includes an air supply system for supplying a high-speed, constant flow rate of nitrogen gas to the nozzle portion 37a in a pulsed manner, and electrodes to which positive and negative high pressures are applied periodically.
From the nozzle portion 37a, ionized air, which is a nitrogen gas flow containing ions, is intermittently jetted alternately in positive and negative directions.
As a result, the ionized particles attached to the upper main surface of the substrate W are efficiently separated from the substrate W by receiving the repulsive force or the attractive force of the ions in the ionized air. Moreover,
Before exposing the main surface of the substrate W to the ionized air, the main surface of the substrate W is irradiated with ultraviolet rays in advance to ash the fat and oil components that have attached the particles. It is possible to remove the ashed fat and oil component and particles attached to the fat and oil component. Further, since the main surface of the substrate W is also activated by the irradiation of the ultraviolet light, particles that repel the ionized gas or the substrate W due to such activation are described below.
The removal from the main surface of the substrate by the ionized gas is relatively easy.

The ionized air gun 37 can move together with the vacuum duct 38 in a direction perpendicular to the transport direction of the substrate W and parallel to the upper main surface of the substrate W (ie, a direction perpendicular to the plane of the drawing). . The entire upper main surface of the substrate W is uniformly exposed to ionized air by reciprocating the ionizing air gun 37 at high speed while gradually transporting the substrate W by the transport roller R, and the entire upper main surface of the substrate W Over time, the ashed oil and fat components and particles are removed.

Returning to FIG. 1, the substrate W transported from the side of the ionized gas blowing section 30 to the cleaning liquid processing section 40 will be described later in detail, but a roll brush arranged along the transport path TP of the substrate W will be described later. And the like, and a cleaning unit provided with various cleaning tools, etc., and pure water cleaning is performed by these cleaning units.

FIG. 3 is a view for explaining the detailed structure of the cleaning liquid processing section 40. In the brush unit 41, pure water from the nozzle 411 is supplied to the upper and lower main surfaces of the substrate W, and dirt on the upper and lower main surfaces of the substrate W1 is removed by the roll brush 412. Next, in the pure water cleaning unit 43, the substrate W is subjected to high-pressure spray cleaning with high-pressure cleaning water from the high-pressure nozzle 432, and further cleaned by supplying cleaning water subjected to ultrasonic vibration from the ultrasonic cleaning device 433. Is done. Finally,
In the air knife drying section 45 which is a drying means, the nozzle 4
The pressurized air from 51 drains the upper and lower main surfaces of the substrate W.

Returning to FIG. 1 again, the substrate W transported to the lift position in the dispensing section 50 is transferred to the plurality of ascending pusher pins 53 and rises, and is lifted from the opening 51 provided in the dispensing section 50. It is carried out.

[Second Embodiment] Hereinafter, a substrate processing apparatus according to a second embodiment will be described. The substrate processing apparatus according to the second embodiment is a modification of the substrate processing apparatus according to the first embodiment. Instead of the ionized gas blowing unit 30 shown in FIG. Is provided in that an ultrasonic processing unit 130 for spraying on the upper main surface is provided.

FIG. 4 is a view for explaining the structure of the cleaner head 131 disposed in the ultrasonic processing section 130. The cleaner head 131 includes a pressure chamber 133 and a vacuum chamber 134 in a soundproof cover 132 provided with a sound absorbing material 132a inside. A slit 133a is provided below the pressure chamber 133, and ultrasonic air to which ultrasonic waves have been applied by the ultrasonic generator 135 is obliquely jetted toward the substrate W. The ultrasonic air bounced off the upper main surface of the substrate W and the blown particles are formed in a slit 134 provided in a lower portion of the vacuum chamber 134.
a and is discharged to the outside.

An ionizer 138 is disposed below the cleaner head 131 on the side of the substrate W in the direction of travel. The ionizer 138 supplies ionized air to the main surface of the substrate W charged with ultrasonic air to neutralize the main surface of the substrate W and to prevent particles from re-adhering to the main surface of the substrate W. is there.

FIG. 5 is a diagram for explaining the positional relationship between the cleaner head 131 and the substrate W. Cleaner head 131
Has a length slightly longer than the short side a of the substrate W, and is arranged parallel to the short side a of the substrate W. Cleaner head 1
31 itself is fixed, and when the substrate W is transported in the direction of the long side b, ultrasonic air is uniformly supplied to the upper main surface of the substrate W. The ashed oil and fat components and particles attached to the upper main surface of the substrate W are separated from the substrate W by being exposed to the ultrasonic air supplied from the cleaner head 131. Before exposing the main surface of the substrate W to ultrasonic air,
Since the fat and oil component adhering the particles is ashed by previously irradiating the main surface of the substrate W with ultraviolet rays, the supersonic air adheres to the ashed fat and oil component and the fat and oil component adhering to the main surface of the substrate W. Removed particles can be removed.

Although the present invention has been described with reference to the embodiment, the present invention is not limited to the above embodiment. For example, the cleaning liquid processing unit 40 is not essential,
Depending on the use, the cleaning of the substrate W may be completed only by the ultraviolet irradiation step and the ionized gas blowing step. For example, in the cleaning of a printed wiring board or a film substrate for a specific use, the cleaning degree required by the ultraviolet irradiation step and the ionized gas blowing step can be sufficiently achieved.

In the above embodiment, the substrate W is washed by passing it through the ultraviolet irradiation section 20 and the ionized gas blowing section 30 while being transported by the transport roller R. However, the transport roller R is not used. It is also possible to clean the substrate W. For example, the substrate W may be carried into the ultraviolet irradiation unit 20 by an appropriate transfer robot, and the ultraviolet irradiation may be performed while the substrate W is fixed. Further, the substrate W is carried into the ionized gas spraying unit 30 from the ultraviolet irradiation unit 20 by an appropriate transfer robot, and the ionized air gun 37 is moved and scanned while the substrate W is fixed, thereby performing the ionized gas spraying process.

Further, in the above embodiment, the cleaning process of the substrate W is performed with the main surface of the substrate W being horizontal, but the substrate W is arranged so that the main surface of the substrate W is vertical. A cleaning process can also be performed.

[0030]

According to the method for cleaning a substrate according to the first aspect, an ultraviolet irradiation step of irradiating the main surface of the substrate with ultraviolet light;
Since the method includes an ionized gas blowing step of blowing ionized gas onto the main surface of the substrate after the ultraviolet irradiation step, the fat component adhering particles to the main surface of the substrate is ashed in the ultraviolet irradiation step. For this reason, it is possible to remove the ashed fat and oil component adhering to the main surface of the substrate and particles adhering to the fat and oil component in the subsequent ionized gas blowing step. Furthermore, since the main surface of the substrate is activated in the ultraviolet irradiation step, particles that repel or are neutralized by the ionized gas are relatively easily removed from the main surface of the substrate by the ionized gas. Becomes

According to the substrate cleaning method of the second aspect, an ultraviolet irradiation step of irradiating the main surface of the substrate with ultraviolet rays and an ultrasonic treatment of blowing a gas to which ultrasonic waves have been applied to the main surface of the substrate after the ultraviolet irradiation step Therefore, in the ultraviolet irradiation step, the fat component adhering the particles to the main surface of the substrate is ashed. For this reason, it is possible to remove the ashed oil and fat component adhering to the main surface of the substrate and particles adhering to the oil and fat component in the subsequent ultrasonic treatment step.

Further, according to the substrate cleaning method of the third aspect,
The substrate is cleaned by supplying a predetermined cleaning liquid to the substrate after the ultrasonic treatment step or the ionized gas spraying step, so that the substrate can be cleaned with the cleaning liquid after sufficiently removing particles, and the substrate can be cleaned with the cleaning liquid. Will be more effective.

According to the substrate cleaning apparatus of the fourth aspect,
It has an ultraviolet irradiator that irradiates the main surface of the substrate with ultraviolet light, and an ionized gas sprayer that blows ionized gas onto the main surface of the substrate after the ultraviolet irradiation by the ultraviolet irradiator. The fat component that causes the particles to adhere to the ash is ashed. Therefore, it is possible to remove the ashed oil and fat component adhering to the main surface of the substrate and particles adhering to the oil and fat component in the later ionized gas spraying section. Further, since the main surface of the substrate is activated by the ultraviolet irradiation part, particles and the like repelled by or neutralized by the ionized gas can be relatively easily removed from the main surface of the substrate by the ionized gas. Becomes

Further, according to the substrate cleaning apparatus of claim 5,
Since it has an ultraviolet irradiation unit that irradiates ultraviolet rays to the main surface of the substrate and an ultrasonic processing unit that blows a gas to which ultrasonic waves have been applied to the main surface of the substrate after the ultraviolet irradiation by the ultraviolet irradiation unit,
In the ultraviolet irradiation part, the fat component adhering particles to the main surface of the substrate is ashed. For this reason, it is possible to remove the ashed oil and fat component adhering to the main surface of the substrate and particles adhering to the oil and fat component in the subsequent ultrasonic processing unit.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a front structure of a substrate cleaning apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating a structure of an ionized gas blowing unit in FIG.

FIG. 3 is a diagram illustrating a structure of a cleaning liquid processing unit in FIG. 1;

FIG. 4 is a diagram illustrating a main part of a substrate cleaning apparatus according to a second embodiment.

FIG. 5 is a diagram illustrating a main part of a substrate cleaning apparatus according to a second embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Input part 20 Ultraviolet irradiation part 21 Lamp house 30 Ionized gas blowing part 31 Whole cover 36 Dust removing part cover 37 Ionized air gun 38 Vacuum duct 40 Cleaning liquid processing part 50 Dispensing part 130 Ultrasonic processing part 131 Cleaner head 133 Pressure chamber 134 Vacuum chamber W Substrate R Transport roller

Claims (5)

[Claims] 1. A substrate cleaning method comprising: an ultraviolet irradiation step of irradiating a main surface of a substrate with ultraviolet rays; and an ionizing gas blowing step of blowing an ionized gas onto the main surface of the substrate after the ultraviolet irradiation step. Method. 2. An ultraviolet irradiation step of irradiating the main surface of the substrate with ultraviolet rays, and an ultrasonic treatment step of blowing a gas to which ultrasonic waves are applied to the main surface of the substrate after the ultraviolet irradiation step. Substrate cleaning method. 3. The substrate cleaning method according to claim 1, wherein a predetermined cleaning liquid is supplied to the substrate after the ultrasonic treatment step or the ionized gas spraying step to clean the substrate. . 4. An ultraviolet irradiation unit for irradiating the main surface of the substrate with ultraviolet light, and an ionized gas blowing unit for blowing ionized gas onto the main surface of the substrate after the irradiation of the ultraviolet light by the ultraviolet irradiation unit. Substrate cleaning equipment. 5. An ultraviolet irradiation unit for irradiating the main surface of the substrate with ultraviolet light, and an ultrasonic processing unit for blowing a gas to which ultrasonic waves have been applied to the main surface of the substrate after the irradiation of the ultraviolet light by the ultraviolet irradiation unit. A substrate cleaning apparatus characterized by the above-mentioned.