JPH10209366A - Taping method of taping machine and taping unit device - Google Patents

Abstract

(57) [Summary] [PROBLEMS] When a tape is punched by a mold die and a punch, tape burrs generated by these clearances fall off in a tape when the tape is taped. To prevent adverse effects from adhering to the bonding surface such as an LED chip. SOLUTION: A tape punched by a die and a punch is suction-reversed, and a tape burr generated by the punching of the tape is directed to a lead frame side of the tape to be hot-press bonded to the lead frame surface. A taping method of a taping machine for hot and pressure bonding, and a taping unit thereof, wherein the tape is used to prevent a suction error of a rotor from a tape extraction part of a die to a suction head of a rotor from occurring in a suction reversal of the tape. Taping unit devices provided at both ends of the rotor where suction heads for forming a relief-shaped stepped portion in the extraction part and for sucking and reversing the tape to shorten the tape taping operation time on the lead frame surface are turned 180 degrees. .

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC chip,
Lead frames for bonding ED chips, etc.
The tape is pre-taped in order to prevent the leads from falling apart by pressing in the process of cutting the tip, down-setting, etc.This is related to the taping method and the taping unit, and the set lead frame is automatically supplied. The present invention relates to a taping method in a taping machine in which a lead frame is conveyed and subjected to taping of a lead frame, and processes such as cutting of a tip and down-setting are carried out in a predetermined guide.

[0002]

2. Description of the Related Art A conventional taping method of a taping machine and a taping unit thereof are used for setting and taping to a lead frame supplied automatically, by using a die material from a tape material having an adhesive layer directed to the lead frame side. When,
A taping method has been practiced in which a tape is punched with a punch and the punched tape is hot-pressed and bonded to a lead frame conveyed onto a thermocompression bonding section having a heater below the tape. As shown in FIG. 14, the taping unit includes a die 1A, a punch 2A, and a thermocompression bonding unit having a heater 3A. The tape 4A is punched by the die 1A and the punch 2A. Then, the punched tape 4A was bonded to the surface of the lead frame 9A conveyed to the thermocompression bonding section provided with the heater 3A by hot and pressure bonding.

[0003]

However, in the conventional taping method and the taping unit of such a taping machine, the tape 4A is punched by the die 1A and the punch 2A. The punched-out tape is hot-press bonded to the lead frame 9A conveyed to a thermo-compression unit provided with a heater 3A below the tape without causing any problem of tape burrs caused by clearance with the punch. It was.

By the way, a tape material 5A for punching a tape
Is a laminate in which an adhesive layer 6A is laminated and a protective tape 7A is laminated via the adhesive layer, and the lead frame 9A automatically supplied and transported onto the thermocompression bonding section provided with the heater 3A.
The tape material 5A having the adhesive layer laminated thereon is peeled off from the protective tape 7A, and the adhesive layer 6
A is positioned on the punching side, and a lead frame 9A is formed by punching the tape by the operation of the arrow 10A of the punching 2A.
The tape was hot-press bonded onto the surface via the adhesive layer.

[0005] Therefore, the tape 4A that is hot-pressed to the lead frame 9A is bonded to the die 1A and the punch 2 by shearing when punched by the die 1A and the punch 2A.
This means that the tape burr 8A generated by the clearance with A is bonded to the lead frame 9A by heat and pressure while keeping the upwardly directed form.

When the tape 4A having such a tape burr 8A formed upward is bonded to the lead frame 9A by heat and pressure, the tape burr 8 in a free end state is provided.
A is inadvertently dropped and adheres to a bonding surface of an IC chip, an LED chip, or the like bonded to the lead frame 9A, resulting in an adverse effect.

Accordingly, the present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a method in which a taping method of a taping machine uses a die punched by a die and a punch. The tape is turned upside down, the tape burr generated by punching the tape is directed toward the lead frame side of the tape to be thermocompressed, and the tape is automatically supplied and conveyed to be laminated on the surface of the lead frame located on the thermocompression unit having a heater. The tape is bonded by heat and pressure with an adhesive layer, and the taping portion of the taping machine has a punched portion formed by a die and a punch, and a tape punched by a punch by the die. A rotor that causes suction reversal by a suction head and directs a tape burr generated on the tape by punching by the punching section to a lead frame side; Since Pubari direction causes the thermal compression wear tape directed to the lead frame side on the lead frame surface it is made in the thermocompression bonded portions having a heater which is located the rotor downwards.

[0008] As described above, the tape punched by the punching punch is hot-pressure bonded with the tape burr direction facing the lead frame side, so that it is possible to prevent the tape burr from falling off to a small extent, thereby reducing the trouble caused by the tape burr. A taping method for such a taping machine and a taping unit device thereof are provided.

Further, in the taping section, when the punched elongated tape is sucked from the tape extracting section of the die to the suction head of the rotor for sucking and reversing, the relief-shaped step portion which does not cause tape suction failure is formed in the die. Provided is a taping section device of a taping machine which is formed in a tape extracting section of a die and is configured such that the tape is sucked without dancing by suction air when the punched elongated tape is sucked to a suction head. Is to do.

A suction head is provided at each of both ends for suction reversal of the punched tape in the taping section.
By using a rotor that reverses 0 degrees, taping operation time by double handling is reduced,
It is an object of the present invention to provide a taping section device of a taping machine capable of shortening a taping operation time capable of speeding up and speeding up.

[0011]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above-mentioned object, and a taping method of a taping machine includes a step of forming a die from a tape material having an adhesive layer directed to a punching side. The tape is punched with a punch,
The punched tape is suction-reversed, and the direction of the tape burr generated by punching the tape is directed toward the lead frame side of the tape where the tape is hot-pressed. The tape is hot-pressed with the adhesive layer.

[0012] Then, a supply / transportation unit for automatically supplying / conveying the set lead frame, a taping unit for taping a tape on the conveyed lead frame, and a press for cutting the tip and down-setting the taped lead frame. In a taping machine including a press unit for performing a process and an accumulating unit for accumulating a lead frame on which these processes are performed in a predetermined guide, a taping unit device includes a punching unit including a die and a punch. The tape punched by the die punch is sucked and reversed by the suction head, and the rotor that turns the tape burr generated on the tape by the punching part toward the lead frame side, and the tape burr direction moves to the lead frame side In order to heat and pressure bond the tape to the lead frame surface, -It consists of a thermo-compression part equipped with a heater located below, and the tape punched by the die and the punch is used to change the tape burr generated by the clearance between the die and the punch. It is made to face the lead frame side and is bonded by hot pressing.

Further, the taping section device forms a relief-shaped step in the tape withdrawing section of the die, and the tape punched by the punch with the die is used to measure the expansion of the tape caused by punching in the step. Absorbed, held by the tape extraction part of the die, and suction-reversed by the suction head of the rotor.

Further, the taping section device is provided with a rotor for inverting the punching tape by 180 degrees for suction and inversion of the punched tape, and suction heads which are pushed up and down by pistons are provided at both upper and lower ends of the rotor. When the suction head at one end adsorbs the tape punched by the punching device, the suction head at the other end adheres the tape adsorbed to the tape onto the surface of the lead frame conveyed to the thermocompression bonding section having a heater. .

A taping method of the taping machine,
And according to the taping unit device, the tape punched by the punch punch by the die is suction-reversed by the rotor,
The tape is heated and pressure-bonded to the lead frame with the direction of the tape burr generated by the punching facing the lead frame, so that it is possible to prevent the tape burr from falling off abruptly. The use of a 180-degree reversing rotor provided with a head enables speedup by double handling.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to an IC chip, an LED,
The present invention relates to a method of processing a lead frame in which a tip of a lead is cut or downset when bonding a chip or the like, and an apparatus therefor.

The lead frame 9 formed by the processing method and apparatus according to the present invention has a plurality of continuous lead frame parts as shown in FIG. Lead 11
A tape 4 pre-taped so that the leads are not displaced when the ends of the leads are cut, and an IC
Pad 13 to which chip, LED chip, etc. are attached
And a suspension lead 14 for supporting the pad 13.

As shown in FIG. 9, the lead frame 4 not subjected to taping has a large number of leads 11 whose tips are coupled together, and the coupled leads tips 12 are connected to the pads 1.
No. 3 was supported by cross-linking.

In the lead frame on which such leads 11 are formed, if the lead ends 12 are cut without taping in the pre-processing, the leads will be broken. Therefore, as shown in FIG. 8, the tip of the lead is fixed by taping with a tape 4,
The pad 13 is supported only by the suspension leads 14. In the lead frame subjected to the pressing in the step of cutting the tip, the suspension leads are set down by pressing, as shown in FIG. 10, so that bonding of IC chips, LED chips, and the like can be performed.

The tape pattern for taping the tape 4 on the lead frame 9 includes a pattern for wind-type taping of an endless window-type tape 4W as shown in FIG. 11 and a tape for X-direction tapes 4X and Y shown in FIG. There is a four-way type taping pattern that forms an endless tape by two-step taping with the directional tape 4Y.

As shown in FIGS. 3, 4 and 6, the tape 4 used for this taping is a laminated tape in which the adhesive layer 6 is protected by a protective tape 7 which is peeled off and removed at the time of use. The protective tape 7 is peeled off and the tape to be taped is made of a polyimide tape material 5 of about 0.05 mm in which an adhesive layer of about 0.02 mm is laminated.

As described above, in the taping machine using the lead frame processing method and its apparatus, the untaped lead frame 9 set by this is automatically supplied and transported by the supply transport section, and the tape 4 is taped thereon, By cutting the tip of the lead,
And a step of down-setting the suspension lead 14.

A description will now be given of a four-way taping machine according to one embodiment of the present invention with reference to FIGS. FIG. 1 shows the front of the taping machine, and FIG. 2 shows the top. FIG. 3 shows the front surface of the taping portion viewed from the lead frame transport direction,
FIG. 4 shows a side view of the taping section as viewed from the lead frame transport direction, and FIG. 5 shows a cross section of the rotor driving section of the taping section.

The taping machine 20 comprises a supply / transport section 21, a taping section 22, a press section 23, and an accumulation section 24.

In the supply / transportation section 21, untaped lead frames stacked with interphase paper interposed therebetween are stacked and set, and a vacuum suction type supply section 31 having an interphase paper discharge function is conveyed by the supply section 31. A transport section 32 is provided for transporting the lead frame supplied to the surface by gripping a roller driven by a pulse motor. The supply unit 31 has a function of detecting a suction error of the lead frame and the interleaf paper, a suction of these two sheets, and a presence or absence of the lead frame.

The taping section 22 has an X-direction tape 4X
X-direction temporary taping unit 411 for taping in two directions
And a temporary taping section 41 of a Y-direction temporary taping section 412 for taping in two directions of the Y-direction tape 4Y, and the temporarily taped X-direction tape 4X and the Y-direction tape 4Y are pressed together over the entire surface to complete It is composed of a main pressure bonding taping section 42 for performing thermal pressure bonding.

The temporary taping section 41 of the X-direction temporary taping section 411 and the Y-direction temporary taping section 412
Punching part 51 consisting of a die and a punch
And a tape supply unit 52 for supplying the tape material 5 to be punched with the adhesive layer 6 laminated thereon toward the punching direction, and a punching unit 51 for punching out the tape 4 at the punching unit 51. A rotor 53 for sucking and reversing the tape 4 so as to direct the adhesive layer side of the tape 4 and the tape burr generated by punching to the lead frame side;
A thermocompression bonding section 54 for hot-press bonding the tape 4 sucked and inverted by 3 to the surface of the lead frame 9 conveyed on a heater located below the rotor 53.

The tape supply section 52 includes a laminated tape reel 61 in which the polyimide tape material 5 on which the adhesive layer 6 is laminated is wound with the laminated tape in which the adhesive layer 6 is protected and laminated with the protective tape 7. A protective tape reel 62 in which the protective tape 7 peeled off from the laminated tape is wound, and a tape material 5 on which an adhesive layer 6 is laminated after the protective tape 7 is peeled off.
The tape 4 is punched by the punching unit 51, and a tape take-up reel 63 for winding the tape material waste after the tape 4 is punched out. The laminated tape supplied from the laminated tape reel 61 has the protective tape 7 The tape material 5 that has been peeled off is separated from the adhesive material layer 6 to be punched by the punch 2.
Side to the punching unit 51 and the die 1
The tape 4 is obtained by punching of the punch 2 by the above method, and the remaining tape material waste after the punching of the tape is wound on the waste take-up reel 63.

The rotor 53 is provided with air piston mechanisms 72 at both upper and lower ends of a main body 71 which is turned 180 degrees by a rack and pinion drive mechanism 74, and suction ends of the air piston mechanisms are sucked by suction air. A head 73 is provided, the tape 4 punched out by the punching section 51, and the tape burr direction is directed to the punching side is sucked by the suction head 73 at one end, pulled down by the air piston mechanism 72, and sucked by the suction head 73 at the other end. The tape 4 adsorbed by the above is bonded to the surface of the lead frame 9 located at the thermocompression bonding section 54 by pressing the air piston mechanism 72 under heat and pressure.

The final press taping section 42 is for completely pressing the tape 4 onto the surface of the lead frame on the thermocompression section 54 to perform complete hot-press bonding. When the tape 4 is suction-reversed and hot-pressure bonded to the lead frame 9, at least the suction hole portion of the suction head 73 does not pressure-bond the tape 4 to the lead frame 9. In this case, the final pressure bonding taping is performed in the final pressure bonding taping section 42.

The taping section 22 is composed of an X-direction temporary taping section 411, a Y-direction temporary taping section 412, and a final pressure bonding taping section 42. Taping and two-way Y
This is because it is a four-direction type taping in which temporary taping in four directions is performed in two directions separately from the direction temporary taping. Therefore, if it is recognized that a large amount of tape material residue is generated by tape punching, window-type taping is also possible, and only one temporary taping section 41 is required. In the case of a lead frame that requires only a small amount of taping, taping in only two directions is sufficient. In this case as well, one temporary taping section 41 may be used.

The operation of the taping section 22 will be further described with reference to FIG.

The tape material 5 in a state where the adhesive layer 6 formed by peeling off the protective tape 7 and being laminated by the tape supply unit 52 is directed to the punch 2 side, is conveyed to the temporary taping unit 41, and the die die in the punching unit 51. Tape 4 with 1 and punch 2
Is punched. The punching pressure at this time is 90 to 250 kg as the output of the drive cylinder in this embodiment, and the die 1 and the punch 2
, The tape burr 8 is generated in an upwardly facing form.

The tape 4 punched in the punching section 51 is
A rotor 53 which is inverted by 80 degrees has air piston mechanisms 72 disposed at both ends in the upper and lower directions, and suction heads 73 provided at respective ends of the air piston mechanisms.
The suction head 73 is pulled down by the air piston mechanism 72. This suction head 73
Is positioned below by the rotation of the rotor 53 by 180 degrees, and the tape 4 is turned over. The suction head 73 positioned above the lead frame 9 conveyed by the supply conveyance unit 21 to the thermocompression bonding unit 54 provided with the heater 3 is pressed down by the air piston mechanism 72 on the surface of the lead frame 9, and the tape is adsorbed on the suction head 73. 4 will be hot-press bonded. At the same time as the above operation, the suction head 73 at the lower end is positioned upward by 180 degrees rotation above the rotor, and like the suction head at the upper end, the tape punched by the punching unit 51. 4 is sucked and pulled down by the air piston mechanism. By alternately setting the suction heads 73 at both ends of the rotor 53, the tape can be continuously taped on the lead frame. At this time, the tape pressing pressure is 25 to 70 kg in terms of the output of the drive cylinder, the tape pressing temperature is 120 to 200 degrees Celsius, and the pressure and temperature are further changed depending on the tape material.

By the way, the suction is reversed by the rotor 53,
The tape 4 hot-pressed to the surface of the lead frame is applied to the tape 4 punched by the punching portion 51 at the time of punching by the clearance between the die 1 and the punch 2.
The tape burr 8 causes the direction of the tape burr to be directed to the lead frame side by the suction reversal of the tape, so that the tape burr 8 is adhered to the surface of the lead frame 9.
It will not adhere to the bonding surface such as the ED chip.

Next, the press section 23 of the taping machine shown in FIGS. 1 to 5 is an apparatus capable of performing four-direction type taping and performing four-direction cutting and downsetting. This press section 23 is provided with three independent presses 81, 82, 83,
A die for processing the shape of the lead tip of the lead frame, the shape of the island, and the shape of the suspension lead is set and performs a predetermined processing operation. The driving of each of these presses is performed by a servo motor driving method, and the press force, the bottom dead center position of the press, and the press working speed can be independently controlled.

The accumulating unit 24 in the taping machine includes:
An integrated system in which the materials are stacked on a pallet is used.

The drive control of the taping machine is performed by sequence control by programmable control.

The above description is directed to a taping machine in which four-direction type taping is performed. One of the reasons why the tape was not originally reversed by the suction head as shown in FIG. , Die 1 and punch 2
In the case where the tape 4 is punched in the above step, if the tape is a long and thin tape, the tape is punched and the die is held in the die 1. However, the tape is warped up by the expansion at that time due to the tape punching. However, the contact with the suction hole formed in the suction head is poor, and a suction error occurs, and the tape is danced by suction air or the like at that time, which is inconvenient.

Therefore, in order to eliminate the tape suction failure mode, the structure of the die 1 is modified as shown in FIG.

The modified mold die 1 has a stepped portion 92 having a relief shape at the short side edge of the long side end of the tape extracting portion 91.
The tape punched by the die and the punch in which the step 92 is formed absorbs the tape expansion generated at the time of punching the tape, whereby the tape is released to the relief-shaped step. It holds and prevents the tape from warping up from the tape extracting portion of the die. Therefore, the tape accommodated in the relief-shaped step portion does not warp up, so that the tape well contacts the suction hole formed in the suction head of the rotor, and is sucked by the suction head without causing a suction error.

The tape extracting section 9 in the die 1
The relief-shaped step portion 92 formed at the long edge and the short edge of one long side,
In a case where the tape 4 is punched out from a tape material of about 0.05 mm on which an adhesive layer of about 0.02 mm is laminated by using the die 1 and the punch 2, the tape 4 is removed from the tape extracting portion 91 by about 0.0
The side surface of the step portion is expanded by 3 mm, and it is 0.1 mm from the die surface.
It is preferable to use a step bottom surface that is lowered by 5 mm. The side surface of the step corresponds to the tape expansion. The actual tape expansion varies depending on the shape of the tape, the clearance of the punch and the die, etc., and is set appropriately in accordance with these.

In the above, an IC chip, L
This is a taping method and a taping unit to prevent the lead frame from bonding the ED chip etc. in the process of cutting the tip, cutting down, etc., in the pressing process. As another embodiment in which the direction of the tape burr generated by the punching of the tape is directed toward the lead frame side, there is a taping method for bonding an IC chip, an LED chip and the like to the lead frame.

Referring to FIG. 13, another embodiment will be described. A tape 40 in which an adhesive layer 6 is laminated on the surface of a tape material 5 is used. Adhesive layer 6 positioned so that it faces the tape burr direction
Is bonded to the leads of the lead frame 9 by heat and pressure, and a chip 10 such as an IC chip or an LED chip is pressure bonded to another adhesive layer. That is, the lead-on-chip method is a method in which the tape 40 on which the double-sided adhesive layer is laminated is tape-bonded to the lead frame with the burr direction directed toward the lead frame, and then the chip 10 is pressure-bonded.

[0045]

As described above, according to the taping method of the taping machine and the taping unit of the taping machine according to the present invention, the tape to be hot-pressed to the lead frame is punched by the die and the punch. The tape burrs generated by those clearances are positioned with the direction facing the lead frame side, and the tape is bonded by heat and pressure. IC chip, LED
It does not adhere to the bonding surface of the chip or the like, and therefore, it is possible to prevent the bonding between the superposed lead frames or the adverse effect on the bonding or die bonding process.

Since the tape burr direction of the tape is directed toward the lead frame, the tape punched by the die and the punch is suction-reversed by the suction head of the rotor. Since a relief-shaped step is formed in the extraction part, it does not warp due to the expansion due to the punching of the tape, causing suction error, and preventing the tape from dancing by suction air etc. It can perform suction reverse feeding.

Further, since the suction head for sucking and reversing the tape is provided at both ends of the rotor by 180-degree reversal, the tape taping operation time by double handling can be shortened and the speed can be increased.

[Brief description of the drawings]

FIG. 1 is a front view of a taping machine according to the present invention.

FIG. 2 is a top view of the taping machine.

FIG. 3 is a front view of the taping section of the taping machine viewed from a lead frame transport direction.

FIG. 4 is a side view of a taping unit.

FIG. 5 is a cross-sectional view of a rotor driving section of the taping section.

FIG. 6 is an explanatory diagram of an operation of a taping unit of the taping machine.

FIG. 7 is a structural explanatory view for preventing a suction error of a rotor to a suction head in a punching portion of a taping portion.

FIG. 8 is a view of a lead frame on which the tape of the present invention is taped.

FIG. 9 is a view showing a form of a lead frame before a tape is taped;

FIG. 10 is a view showing a state where a lead frame is down-set by a press unit by a taping machine.

FIG. 11 is a tape pattern diagram showing a window type taping in taping a tape to a lead frame.

FIG. 12 is a tape pattern diagram of four-direction taping in two-step taping of an X-direction tape and a Y-direction tape.

FIG. 13 is an embodiment view of a taping method using a tape in which an adhesive layer is laminated on both sides.

FIG. 14 is an operation explanatory view of a conventional taping unit.

FIG. 15 is a structural explanatory view for causing a suction error to a suction head in a punching section of a conventional taping section.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mold die 1A mold die 2 punch 2A punch 3 heater 3A heater 4 tape 4X X direction tape 4Y Y direction tape 4W wind type tape 40 Double-sided adhesive layer tape 5 Tape material 6 Adhesive layer 7 Protective tape 8 Tape burr 9 Lead frame 10 Chip 11 Lead 12 Lead tip 13 Pad 14 Suspended lead 20 Taping machine 21 Supply / conveyance unit 22 Taping unit 23 Press unit 24 Stacking unit 31 Supply unit 32 Transport unit 41 Temporary taping unit 411 X direction temporary taping unit 412 Y direction Temporary taping section 42 Final compression taping section 51 Punching section 52 Tape supply section 53 Rotor 54 Thermal compression section 61 Laminated tape reel 62 Protective tape reel 63 Scrap take-up reel 71 Main body 72 Air piston mechanism 73 Suction head 1-83 press 91 tape withdrawal portion 92 step portion

Claims (4)

[Claims] 1. A tape is taped on a lead frame to which a set lead frame is automatically supplied and conveyed, and
Then, presses for processes such as tip cutting and down-setting are performed, and in a taping machine that accumulates them in a predetermined guide, the tape is removed from the tape material with the adhesive layer directed to the punch side, and the die is removed. It is punched with a punch, and the punched tape is suction-reversed, and the tape burr generated by punching the tape is directed to the lead frame side where the tape is hot-pressed, and is automatically supplied and conveyed and positioned on the heater. A taping method of a taping machine which is hot-press bonded with the adhesive layer on a lead frame surface. 2. A supply / conveyance unit for automatically supplying / conveying a set lead frame, a taping unit for taping a tape on the conveyed lead frame, and a tip cutting, down-to-set, etc., on the taped lead frame. In a taping machine consisting of a press section for performing a press step and an accumulation section for accumulating lead frames on which these are performed in a predetermined guide, a punching section composed of a die and a punch, and The tape punched by the punch is reversed by suction by the suction head.The rotor that directs the tape burr generated on the punched tape by the punching section to the lead frame side, and the tape whose tape burr direction is directed to the lead frame side. Heater located below the rotor for hot-press bonding on the lead frame surface The tape is punched with a die and punch, and the tape burrs generated by the clearance between the die and punch have the direction of the tape burrs facing the lead frame. Taping unit for hot and pressure bonding. 3. A relief step is formed in a tape extracting portion of a die, and a tape punched by a punch punched by the die absorbs a tape expansion caused by punching in the die. 3. The taping unit according to claim 2, wherein the taping unit is held by the tape pull-out unit and is suction-reversed by the suction head of the rotor. 4. A rotor for reversing 180 degrees is provided for suction reversal of a punching tape. At both upper and lower ends of the rotor, suction heads which are pushed up and down by pistons are provided. When the suction head at one end sucks the removed tape, the suction head at the other end adheres the tape adsorbed thereto to the surface of the lead frame conveyed to the thermocompression bonding section having a heater by heat and pressure. The taping unit according to claim 3.