JPH10209727A - Method of forming dielectric component - Google Patents

Abstract

(57) [Summary] The present invention relates to a method for forming a dielectric component used for a communication device or the like, and provides a dielectric component having high dimensional accuracy. SOLUTION: A masking tape 6 is adhered to a surface of the dielectric element 3 on which an open end face 5 is to be formed, a material to be an electrode 3 is formed on the entire surface of the dielectric element 3 in this state, and then the masking tape 6 is removed. Thus, the open end face 5 is formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for forming a dielectric component used in communication equipment and the like.

[0002]

2. Description of the Related Art Conventionally, when an open end face where a dielectric element is exposed is formed on one side of a dielectric component having an electrode formed on an outer surface of the dielectric element, an electrode is formed on the entire surface of the dielectric element. Thereafter, the surface forming the open end face is polished, and the electrode is removed to form the open end face.

[0003]

When an open end face is formed in a dielectric component in this way, a dielectric element having high dimensional accuracy, which has been molded by a mold, is once polished, and the size of the dielectric element is increased. There is a problem that accuracy is deteriorated.

Accordingly, an object of the present invention is to solve such a problem and to provide a dielectric component having high dimensional accuracy.

[0005]

According to the present invention, a masking tape is attached to a surface forming an open end face of a dielectric element, and an electrode is formed on the entire surface of the dielectric element in this state. After that, the open end face was formed by removing the masking tape.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to a dielectric element, an electrode provided on an outer surface of the dielectric element, and a dielectric element on at least one surface of the dielectric element. A method of forming a dielectric component having an open end face with an element exposed, comprising: applying a masking tape to a surface of the dielectric element forming an open end face; A method for forming a dielectric component, in which a material that becomes an electrode is formed on the entire surface of the element, and then the masking tape is removed to form an open end face.The open end face is formed by removing the masking tape. It is possible to provide a dielectric component having high dimensional accuracy.

According to a second aspect of the present invention, the dielectric component and the masking tape are separated by applying heat to the dielectric element to which the masking tape is attached. The method for forming a dielectric component described in (1) above can improve the mass productivity of the dielectric component.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a dielectric coaxial resonator 1 which is a dielectric component constituting one end of a dielectric filter used for a communication device or the like.

In this dielectric resonator 1, an electrode 4 is provided on an outer surface of a dielectric element 3 having a through hole 2 from an upper surface to a lower surface, and an open end face 5 on which the dielectric element 3 is exposed on an upper surface. Is provided.

The resonance frequency, which is the electrical characteristic of the dielectric resonator 1, is determined by the axial length of the through hole 2, the electrode 4 on the open end face 5 of the through hole 2, and the open end face 5 on the side of the dielectric element 3. It is determined by the capacitance formed by the electrode 4 on the side.

In forming the electrode 4 of such a dielectric resonator 1, the dielectric element 3 is formed using a mold,
The noble metal paste is attached to the outer surface of the dielectric element 3 to form an electrode 4 such as silver, and then the noble metal paste is dried and baked on the dielectric element 3.

In order to form the open end face 5 on the dielectric resonator 1, as shown in FIG. 2, a masking tape 6 is attached to a surface corresponding to the open end face 5 of the dielectric element 3, and the masked dielectric is formed. The entire element 3 is immersed in a noble metal paste tank, and as shown in FIG. 3, a noble metal paste 4a is attached to the entire dielectric element 3 including the masking tape 6,
The noble metal paste 4a is dried. Thereafter, the masking tape 6 is peeled off from the dielectric element 3, whereby the open end face 5 is easily formed on the dielectric element 3. As a result, the polishing step conventionally performed can be eliminated, and the dielectric resonator 1 effectively utilizing the high dimensional accuracy obtained by the mold can be provided.

The noble metal paste 4a has a low strength only in a dry state,
Is peeled off from the dielectric element 3, the force concentrates on the open end 7 of the noble metal paste 4 a, and the noble metal paste 4 a is cut off at the open end 7, so that the dielectric resonator after the printing is burned. 1, the accuracy of the electrode 4 on the open end face 5 side is also high, and the resonance frequency is stabilized during mass production.

The open end face 5 is formed in this manner, and thereafter,
By forming the dielectric resonator 1 by baking, it is possible to abolish the polishing step which has been conventionally performed, to utilize the dimensional accuracy of the dielectric element 3 formed by a mold as it is, Since only the masking tape 6 is removed, the mass productivity can be improved and the cost can be reduced.

Further, the masking tape 6 is made of a material such as polyimide. If such a material is used, the masking tape 6 can be burned out by heating it to about 500.degree. If this is used, the masking tape 6
Noble metal paste 4a without removing from the dielectric element 3
Baking, masking tape 6
And the masking tape 6 expands due to the heat generated during baking, so that the noble metal paste 4a attached to the masking tape 6 is pulled outward from the dielectric element 3, and the force is reduced by the noble metal paste 4a.
Of the precious metal paste 4 at the open end 7
Since a is divided, the precision of the open end face 5 side of the electrode 4 in the dielectric resonator 1 after burning becomes high, and the resonance frequency, which is one of the electrical characteristics during mass production, is stabilized.

In the embodiment, the electrode 4 is formed using the noble metal paste 4a such as silver. However, even when the electroless plating such as copper is used, the outside of the dielectric element may be formed. The same is true in that a material serving as an electrode is attached to the surface and then baked,
If the masked dielectric element is immersed in a plating tank, dried and baked, the same effect as described above can be obtained.

[0017]

As described above, according to the present invention, the conventional polishing step can be abolished, the dimensional accuracy of the dielectric element formed by the mold can be utilized as it is, and a dielectric part with high dimensional accuracy can be obtained. It is something that can be done.

[Brief description of the drawings]

FIG. 1 is a perspective view of a dielectric resonator according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a stage of forming the dielectric resonator.

FIG. 3 is a cross-sectional view of the same dielectric resonator at the stage of formation;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Dielectric component (dielectric resonator) 3 Dielectric element 4 Electrode 4a Material used as an electrode (noble metal paste) 5 Open end face 6 Masking tape

Claims (2)

[Claims] 1. A dielectric component comprising: a dielectric element; an electrode provided on an outer surface of the dielectric element; and an open end face on which the dielectric element is exposed on at least one surface of the dielectric element. A method of forming, wherein a masking tape is attached to a surface forming an open end surface of the dielectric element, and a material serving as an electrode is formed on the entire surface of the dielectric element while the masking tape is attached, and then the masking is performed. A method for forming a dielectric component, comprising forming an open end face by removing a tape. 2. The method for forming a dielectric component according to claim 1, wherein the dielectric component and the masking tape are separated by applying heat to the dielectric element to which the masking tape is attached.