JPH10230516A - Inclined rotary blade and cutting method - Google Patents

Abstract

(57) Abstract: The present invention relates to a rotary blade for cutting a workpiece such as a semiconductor wafer or an LED printer head, for example, and saves labor for replacing the rotary blade to improve work efficiency. . A rotating blade (20) mounted on a spindle (8) of a precision cutting device such as a dicing device, the direction in which a cutting blade (15) of the rotating blade extends slightly with respect to a vertical direction of a rotation axis (19). That is, an inclined rotating blade is used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotary blade for cutting a workpiece such as a semiconductor wafer or an LED printer head, and a cutting method using the rotary blade.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 13, a precision cutting apparatus 1 is used for cutting (dicing) a workpiece such as a semiconductor wafer or an LED printer head into a sinusoidal shape. The apparatus 1 is equipped with a chuck table 5 that can move a semiconductor wafer 4 supported on a ring-shaped frame 2 via a semiconductor processing sheet 3 via a semiconductor processing sheet 3 and can move in the X-axis direction, and a rotary blade 6 for cutting. Cutting means 7 for dicing the wafer and alignment means 9 for detecting a street of the semiconductor wafer 4 mounted on the chuck table and held by suction are provided.

The semiconductor wafer 4 is diced by the precision cutting device 1 having the above-described configuration as follows.
The semiconductor wafer 4 is removed from the cassette 10 which is mounted on the cassette mounting area A and contains a plurality of semiconductor wafers 4.
The semiconductor wafer 4 is carried out to the standby area B by the carrying-in / out means 11, the semiconductor wafer 4 is carried to the chuck table 5 by the carrying means 12 having the rotating arm, and the semiconductor wafer 4 is sucked and held. After the semiconductor wafer 4 is positioned just below the alignment means 9 and aligned, the semiconductor wafer 4 is moved to a cutting means 7 having a rotating blade 6 which rotates at high speed, and the semiconductor wafer 4 is diced.

The rotating blade 6 has a blade thickness of 15 μm.
m to about 100 μm, the outer shape of which is disk-shaped, and there are two types. As shown in FIGS. 14 to 15, a hub type in which the cutting blade 13 and the base 14 are integrally formed. The nut 1 is formed by the rotating blade 6a and the cutting blade 15, and is clamped by the flange of the base 16 and the holding plate 17.
There is a rotating blade 6b of a washer type that is used by screwing the spindle 8 into a thread groove of the head of the spindle 8. A rotary blade 6 of this type is mounted on a spindle 8 of a cutting means 7 such as a dicing device to perform dicing of the semiconductor wafer 4.

[0005]

However, as shown in FIG. 16, the cutting is performed by applying the rotating blade 6 vertically to the semiconductor wafer 4 to be processed, and the cut surface is usually at a right angle. However, in special parts, such as LED printer heads, in which the vertices on the side where a circuit is formed by arranging the cut chips must be in precise contact with each other, the vertices must be securely connected. In order to ensure contact, it is required that the cut surface of the workpiece be formed at less than 90 degrees.

In such a case, the spindle mounted on the precision cutting device is slightly tilted up and down from the horizontal state, and the cut surface of the rotating blade mounted thereon is less than 90 degrees (for example, 89 degrees to 75 degrees). Degree).

[0007] However, the precision cutting device in which the spindle is mounted at an inclined angle cannot perform the original cutting, and must be a dedicated machine for a special workpiece to be cut at an angle, which is uneconomical. There is a point.

[0008]

The gist of the present invention for solving the above-mentioned problems of the inclined rotary blade according to the present invention is a rotary blade mounted on a spindle of a precision cutting device such as a dicing device. The direction in which the cutting blade extends is slightly inclined with respect to the vertical direction of the rotation axis.

The angle of inclination of the rotating blade in the direction in which the cutting blade extends is greater than 0 degree and smaller than 15 degrees with respect to the vertical direction of the axis of rotation; the rotating blade is mounted on a base mounted on a spindle. And a cutting edge formed on the outer periphery of the base; and a direction in which a holding portion of a flange for holding the rotating blade extends is slightly different from a direction perpendicular to the rotation axis. And a washer type in which the direction in which the cutting blade extends is slightly inclined with respect to the vertical direction of the rotation axis by being sandwiched between the flanges.

[0010] The gist of the cutting method according to the present invention is that a precision cutting includes at least a chuck table for holding a plurality of workpieces having a plurality of cutting regions to be cut in parallel, and a spindle on which a rotating blade is mounted. A cutting method for cutting a workpiece by an apparatus, wherein the spindle is equipped with the inclined rotary blade according to any one of claims 1, 2, 3, and 4, and the workpiece is held on the chuck table. After the cutting area is sequentially cut, the workpiece is rotated by 180 degrees to further cut the same cutting area.

Further, the parallel cutting area to be cut is divided into an odd-numbered cutting area and an even-numbered cutting area. After cutting either one of the cutting areas, the workpiece is rotated by 180 degrees and the other is cut. Cutting a cutting region; and further, the parallel cutting region exists in each of the X-axis direction and the Y-axis direction.

According to the inclined rotating blade according to the present invention,
Oblique cutting of the cut surface of the workpiece can be achieved by replacing a normal rotating blade without inclining the rotation axis of a normal precision cutting device. Further, according to the cutting method of the present invention, a workpiece such as a semiconductor wafer or a head for an LED printer can be cut obliquely by performing cutting by mounting an inclined rotating blade on a spindle of a normal precision cutting device. Dicing can be done on the surface.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a cutting method and an inclined rotating blade according to the present invention will be described with reference to the drawings. In addition,
For easy understanding of the invention, portions corresponding to the conventional example will be described with the same reference numerals as in the conventional example.

The inclined rotary blade 20 according to the first embodiment of the present invention is a washer type blade as shown in FIG. The inclined rotating blade 20 is provided with the spindle 8
In the flange of the base 16a, a taper 16b is provided on a side peripheral surface that contacts the cutting blade 15, and a taper 17b is provided on a side peripheral surface that contacts the cutting blade 15 in the flange of the holding plate 17a.

The taper 16b of the base 16a and the holding plate 1
7a are parallel to each other, and the angle θ is, for example, 0 ° <
θ <15 °.

Then, a ring-shaped cutting blade 15 having a blade thickness of 15 μm to 100 μm is inserted into the base 16a from the tip of the spindle 8, and fitted to the hub 16c of the base 16a. The holding plate 17a is inserted from the tip of the spindle 8.

After that, the nut 18 is fitted and screwed into the thread groove at the tip of the spindle 8. Then, the taper 17b of the holding plate 17a pushes the cutting blade 15 toward the taper 16b side of the base 16a, and the cutting blade 15 is thin and slightly deformed. As shown in FIG. 2, the cutting blade 15 extends. The direction is slightly inclined following the tapers 16b and 17b. Thus, the inclined rotating blade 20 is formed.

The inclined rotary blade 21 according to the second embodiment of the present invention is a hub type blade as shown in FIG. The inclined rotary blade 21 includes a disk-shaped base 14a mounted on the spindle 8, and a cutting blade 13a fixed to and integrated with the outer periphery of the base 14a.

The outer circumference of the base 14a extends in a direction perpendicular to the rotation axis 19, and a peripheral portion to which the cutting blade 13a is fixed is formed at an angle θ with respect to the direction perpendicular to the rotation axis 19.
(0 ° <θ <15 °).

Next, the inclined rotary blade 20 according to the present invention will be described.
Alternatively, a method of dicing a workpiece such as a semiconductor wafer or a head for an LED printer using a precision cutting device equipped with the inclined rotary blade 21 will be described.

The inclined rotary blade 20 or the inclined rotary blade 21 is connected to, for example, a precision cutting device 1 shown in FIG.
In this case, the rotary blade 6 of the cutting means 7 is replaced and mounted, and cutting is performed in the same manner as in the conventional example.

As shown in FIG. 4, the inclined rotary blade 20 or 21 is fitted to the spindle 8 of the cutting means 7, and the mounting nut 22 is screwed into a thread groove at the tip of the spindle 8. Then, as shown in FIG. 5, the blade monitoring means 23 is fixed to the head 24 with bolts, and the cutting water supply nozzle 25 is fixed to the head 24 with bolts. Thus, FIG.
As shown in FIG. 2, the inclined rotating blade 20 whose cutting edge is slightly inclined with respect to the direction perpendicular to the axis of rotation 19.
Alternatively, a cutting means 7a provided with 21 is formed.

When dicing is started by the precision cutting device 1 having the cutting means 7a, the semiconductor wafer 4 is unloaded from the cassette 10 containing the semiconductor wafer 4 and suction-held on the chuck table 5 in the same manner as in the conventional example. Then, the chuck table 5 is moved in the X-axis direction, and after positioning the semiconductor wafer 4 on the chuck table 5 directly below the alignment means 9 for alignment, the cutting means 7a having the inclined rotating blade 20 or 21 which rotates at high speed. Then, the semiconductor wafer 4 is diced by the cutting edge of the inclined rotary blade.

The manner in which the semiconductor wafer 4 is diced will be described with reference to FIG. 7. For example, alignment is performed so that the center of the blade is located at the center line c of the street 26 (cutting path between circuits) in the X direction. The means 9 precisely aligns the position of the spindle 8 in the Y direction, adjusts the height of the spindle 8 in the Z direction to adjust the height of the cutting edge of the blade, and starts dicing.

The blade 15 has a cutting edge 15 whose rotation axis 1
Since the rotating blade 20 is slightly inclined with respect to the direction perpendicular to the direction 9, when the blade is cut along the center line c, for example, as shown in FIG. An inclined cutting groove A is formed at a slightly shifted position (right side in the figure).

After the semiconductor wafer 4 is precisely cut along the center line c of the street 26 in the X direction, the semiconductor wafer 4 is rotated 180 degrees by the chuck table 5,
Further, when cutting is performed along the center line c of the street 26 in the X direction, a cutting groove B is formed at a position slightly deviated from the center line c as shown in FIG.

Therefore, the first cutting method for dicing is
As shown in FIG. 8, the streets 26 (X direction) and 27 (Y direction), which are gaps between a plurality of circuits 4c formed in a lattice on the front surface side of the semiconductor wafer 4, Is rotated 180 degrees and the same street 26
Or, cutting is performed twice along the center line c in 27.

For example, in each street 26 in the X direction, the first cutting is performed by the alignment means 9 so that the blade is positioned at the center line c in FIG. Thus, the cutting groove A is formed on the right side of the street 26.

After the first cutting of the street 26 in the X direction is completed, the semiconductor wafer 4 is rotated 180 degrees by the chuck table 5. In each street 26, the second cutting is performed by the alignment means 9 so that the blade is positioned at the center line c. Then, as shown by a two-dot chain line b in FIG. 8, a cutting groove B is formed on the left side of the street 26.

With such a cutting method, cutting is performed on each street 27 in the Y direction. As a result of this cutting, as shown in FIG. 9, the semiconductor wafer 4 is firstly cut by the cutting blades 13 a or 15 slightly inclined with respect to the direction orthogonal to the rotation axis 19 on the inclined rotating blades 20 or 21. , An oblique cutting groove A is formed.

The inclination angle θ of the cutting blade 13a or 15
However, since it is as small as 0 ° <θ <15 ° (preferably 0 ° <θ ≦ 5 °) and is a thin blade, when the semiconductor wafer 4 is rotated at high speed to cut the semiconductor wafer 4, the cutting edge obliquely follows the cut groove. Of the cutting groove A.

Next, by performing the second cutting,
As shown in FIG. 10, an oblique cutting groove B is formed, and thereafter, by cutting the street 27 in the Y direction,
The semiconductor wafer 4 adhered to the semiconductor processing sheet 3 is diced into a large number of trapezoidal chips 28 having a narrow lower side (back side) and a wide upper side (front side) on which the circuit 4c is formed.

After the dicing of the semiconductor wafer 4 is completed, the processing sheet 3 is removed in a chip peeling step.
Then, the trapezoidal chips 28 are peeled off from each other, and as shown in FIG. 11, the apexes 29 of the adjacent chips 28a and 28b are brought into precise contact with each other.

The cutting surface of each chip 28 is beveled by the inclined rotating blade 20 or 21 and the upper side (surface) on which the circuit 4c is formed is widened, so that the vertices 29 of adjacent chips can be securely connected. It can be brought into contact.

As a second cutting method for dicing, for example, when cutting a material that can be used without distinguishing front and back, the street 26 in the X direction is divided into an odd-numbered cutting area and an even-numbered cutting area. After cutting the odd-numbered cutting region along the center line with the inclined rotating blade 21, the even-numbered cutting region is cut along the center line with the inclined rotating blade 21. Then, the odd-numbered and even-numbered cutting regions are similarly cut by the inclined rotary blades 21 for each of the streets 27 in the Y direction.

According to this cutting method, as shown in FIG. 12, the wafer 4 is formed every other chip having a wide upper side (surface) such as chips 28a and 28b.
It is used as shown in FIG. 11 as appropriate.

Also, chips having a narrow upper side (surface), such as a chip 28c, are formed alternately.
Used as shown in FIG.

As described above, by mounting the inclined rotating blades 20 and 21 according to the present invention on the precision cutting device 1, the cut surface of the chip can be easily inclined.

[0039]

As described above, the cutting method according to the present invention comprises a chuck table for holding a workpiece having a plurality of cutting regions to be cut in parallel, and a spindle on which a rotary blade is mounted. A cutting method for cutting a workpiece by a precision cutting device including at least, wherein the spindle is equipped with an inclined rotating blade, and after sequentially cutting the cutting area of the workpiece held on the chuck table. Since the workpiece is rotated by 180 degrees to further cut the same cutting area, by attaching an inclined rotating blade to a normal cutting device, the cut surface of the workpiece is easily cut obliquely, and the adjacent chip is cut. Are excellent in that the vertices can be accurately and reliably brought into contact with each other.

Further, the inclined rotary blade according to the present invention is
Since the direction in which the cutting edge of the rotary blade extends is slightly inclined with respect to the direction perpendicular to the axis of rotation, an excellent effect is obtained in that the cut surface of the workpiece can be cut obliquely.

[Brief description of the drawings]

FIG. 1 is an exploded explanatory view of an inclined rotating blade according to a first embodiment of the present invention.

FIG. 2 is a front view after assembling the inclined rotary blade according to the first embodiment of the present invention.

FIG. 3 is a longitudinal sectional view of an inclined rotary blade according to a second embodiment of the present invention.

FIG. 4 is an explanatory view showing a state in which the inclined rotary blade according to the present invention is attached to a spindle of a precision cutting device.

FIG. 5 is an explanatory view showing a state in which the inclined rotary blade according to the present invention is attached to a spindle of a precision cutting device, and other parts are attached.

FIG. 6 is an explanatory view showing a state in which the inclined rotating blade according to the present invention is attached to a spindle of a precision cutting device to form a cutting means 7a.

FIGS. 7A and 7B are explanatory views showing a first cutting state of a street of a semiconductor wafer with the inclined rotary blade according to the present invention, and FIG.
It is explanatory drawing (2) which shows a mode that the 2nd cutting was performed by making 0 rotation.

FIG. 8 is an explanatory diagram showing streets of a semiconductor wafer and locations cut by an inclined rotating blade.

FIG. 9 is a cross-sectional view when a first cutting is performed on a street of a semiconductor wafer.

FIG. 10 is a cross-sectional view when a second cut is performed on a street of a semiconductor wafer.

FIG. 11 is an explanatory view showing a state in which the tops of trapezoidal chips formed obliquely by the inclined rotary blade of the present invention are in contact with each other.

FIG. 12 is an explanatory diagram showing a state in which streets of a semiconductor wafer are cut into odd-numbered and even-numbered streets by the inclined rotary blade of the present invention.

FIG. 13 is an external perspective view of a precision cutting device according to a conventional example.

FIG. 14 is a sectional view of a hub-type rotary blade according to the conventional example.

FIG. 15 is an exploded view of a washer-type rotary blade according to the conventional example.

FIG. 16 is an explanatory view showing a state in which a semiconductor wafer is cut by the rotary blade according to the conventional example.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Precision cutting device, 2 frame, 3 Semiconductor processing sheet, 4 Semiconductor wafer, 4c circuit, 5 Chuck table, 6 Rotating blade, 7 Cutting means, 8 Spindle, 9 Alignment means, 10 Cassette, 1
3, 13a, 15 cutting blade, 14, 14a, 16, 16
a base, 16b taper, 17, 17a holding plate, 1
7b taper, 19 rotation axis, 20, 21 inclined rotation blade, 22 mounting nut, 23 blade monitoring means, 24 head, 25 cutting water supply nozzle, 26X
Street in direction, 27 Street in Y direction, 28
Tip, 29 Tip of the tip, A, B Diagonal cutting groove.

Claims (7)

[Claims] 1. A rotary blade mounted on a spindle of a precision cutting device such as a dicing device, wherein a direction in which a cutting blade of the rotary blade extends is slightly inclined with respect to a vertical direction of a rotation axis. A tilted rotary blade. 2. The inclination according to claim 2, wherein an inclination angle of the rotating blade in a direction in which the cutting edge extends is larger than 0 degree and smaller than 15 degrees with respect to a vertical direction of the rotation axis. Rotating blade. 3. The rotary blade according to claim 1, wherein the rotary blade is a hub type including a base mounted on the spindle and a cutting blade formed on an outer periphery of the base. Inclined rotating blade. 4. The direction in which the holding portion of the flange that holds the rotary blade extends slightly inclines with respect to the vertical direction of the rotation axis, and the cutting blade extends while being held by the flange. The inclined rotating blade according to claim 1 or 2, wherein the direction is a washer type that is slightly inclined with respect to a vertical direction of the rotation axis. 5. A work piece is cut by a precision cutting device including at least a chuck table holding a work piece having a plurality of cut areas to be cut in parallel and a spindle to which a rotating blade is mounted. A cutting method, wherein the spindle is equipped with the inclined rotary blade according to any one of claims 1, 2, 3, and 4, and the cutting area of a workpiece held on the chuck table is sequentially cut. Cutting the same workpiece by rotating the workpiece by 180 degrees later. 6. A parallel cutting area to be cut is divided into an odd-numbered cutting area and an even-numbered cutting area. After cutting either one of the cutting areas, the workpiece is rotated by 180 degrees and the other is cut. The cutting method according to claim 5, wherein the cutting area is cut. 7. The cutting method according to claim 5, wherein parallel cutting regions exist in the X-axis direction and the Y-axis direction, respectively.