JPH1025465A - Heat-resistant adhesive composition for film - Google Patents
Heat-resistant adhesive composition for filmInfo
- Publication number
- JPH1025465A JPH1025465A JP19964196A JP19964196A JPH1025465A JP H1025465 A JPH1025465 A JP H1025465A JP 19964196 A JP19964196 A JP 19964196A JP 19964196 A JP19964196 A JP 19964196A JP H1025465 A JPH1025465 A JP H1025465A
- Authority
- JP
- Japan
- Prior art keywords
- soluble polyimide
- resin
- epoxy
- film
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title abstract description 21
- 230000001070 adhesive effect Effects 0.000 title abstract description 21
- 239000000203 mixture Substances 0.000 title abstract description 12
- 229920001721 polyimide Polymers 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 239000004593 Epoxy Substances 0.000 claims abstract description 9
- 239000009719 polyimide resin Substances 0.000 claims abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000004033 plastic Substances 0.000 abstract description 8
- 150000000000 tetracarboxylic acids Chemical group 0.000 abstract description 5
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 abstract description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000000470 constituent Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、多層プリント配線
板、キャビティダウン構造プラスチックパッケージ（チ
ップキャビティとＩ／Ｏピンとがパッケージの同じ側に
あり、パッケージ他面が放熱などに利用できる構造）等
に使用される層間接着フィルムを構成する耐熱性樹脂組
成物に関するものであり、耐熱性、接着性、電気特性、
低フロー性に優れたものである。The present invention relates to a multilayer printed wiring board, a plastic package having a cavity-down structure (a structure in which a chip cavity and I / O pins are on the same side of a package, and the other surface of the package can be used for heat radiation, etc.). It relates to a heat-resistant resin composition constituting an interlayer adhesive film used, heat resistance, adhesion, electrical properties,
It has excellent low flow properties.
【０００２】[0002]
【従来の技術】従来、多層プリント配線板やキャビティ
ダウン構造プラスチックパッケージは、内層回路板を、
ガラスクロスに樹脂を含浸させたプリプレグを介しある
いはアクリロニトリルブタジエンゴム／エポキシ樹脂
系、アクリルゴム／エポキシ樹脂系等の接着フィルムを
介して、外層板又は銅箔と重ね合わせ、プレスにより加
熱加圧成形をして一体にしていた。2. Description of the Related Art Conventionally, a multilayer printed wiring board and a plastic package having a cavity-down structure include an inner circuit board,
Laminated with an outer layer plate or copper foil via a prepreg impregnated with resin in a glass cloth or via an adhesive film of acrylonitrile butadiene rubber / epoxy resin system, acrylic rubber / epoxy resin system, etc. I was united.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、多層プ
リント配線板の場合であって、多層接着部分と非接着部
分が混在するフレックスリジッド複合多層配線板の成形
においては、非接着部分へ樹脂が流れ込むという欠点が
あり、またキャビティダウン構造プラスチックパッケー
ジを実装する配線板の成形においては、階段状に露出さ
せた接続用端子が樹脂フローによって埋没するという欠
点があった。また後者の場合、耐熱性、電気特性が劣る
という欠点があった。However, in the case of a multilayer printed wiring board, in molding a flex-rigid composite multilayer wiring board in which a multilayer bonded portion and a non-bonded portion are mixed, resin flows into the non-bonded portion. There is a drawback, and in forming a wiring board on which a plastic package with a cavity-down structure is mounted, there is a drawback that the connection terminals exposed stepwise are buried by the resin flow. In the case of the latter, there is a disadvantage that heat resistance and electric characteristics are inferior.
【０００４】本発明の目的は、上記の欠点を解消するた
めになされたもので、樹脂フローの制御が可能で、接続
用端子などが樹脂フローによって埋没することがなく、
かつ耐熱性、電気特性に優れるキャビティダウン構造の
プラスチックパッケージ等に好適なフィルム接着剤を提
供しようとするものである。[0004] An object of the present invention is to solve the above-mentioned disadvantages, and it is possible to control the resin flow, so that connection terminals and the like are not buried by the resin flow.
Another object of the present invention is to provide a film adhesive suitable for a plastic package having a cavity-down structure having excellent heat resistance and electrical characteristics.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成しようと鋭意研究を重ねた結果、後述する可溶性
ポリイミド、エポキシ化合物および硬化剤を用いること
によって、耐熱性、接着性、電気特性、低フロー性に優
れたフィルム接着剤組成物が得られることを見いだし、
本発明を完成させたものである。Means for Solving the Problems The present inventor has made intensive studies to achieve the above object, and as a result, by using a soluble polyimide, an epoxy compound and a curing agent described later, heat resistance, adhesiveness, and electric resistance have been improved. Characteristics, it was found that a film adhesive composition excellent in low flow property can be obtained,
The present invention has been completed.
【０００６】即ち、本発明は、（Ａ）次の一般式の繰返
し単位で構成される可溶性ポリイミド樹脂、That is, the present invention provides (A) a soluble polyimide resin comprising a repeating unit represented by the following general formula:
【０００７】[0007]
【化３】 （但し、式中、Embedded image (However, in the formula,
【０００８】[0008]
【化４】 で示されるテトラカルボン酸残基を表す） （Ｂ）分子内に 2個以上のエポキシ基を有するエポキシ
化合物及び（Ｃ）硬化剤を必須成分とし、樹脂成分
［（Ａ）＋（Ｂ）＋（Ｃ）］に対して、前記（Ａ）の可
溶性ポリイミド樹脂を15〜90重量％の割合で含有してな
ることを特徴とする耐熱性フィルム接着剤組成物であ
る。Embedded image (B represents an epoxy compound having two or more epoxy groups in the molecule and (C) a curing agent as essential components, and a resin component [(A) + (B) + ( C)], wherein the soluble polyimide resin of (A) is contained at a ratio of 15 to 90% by weight.
【０００９】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
【００１０】本発明に用いる（Ａ）可溶性ポリイミド樹
脂としては、化３の一般式によって示されるもので、The soluble polyimide resin (A) used in the present invention is represented by the following general formula:
【００１１】[0011]
【化５】 で示される特定のジアミンとEmbedded image With a specific diamine represented by
【００１２】[0012]
【化６】 で示されるテトラカルボン酸とを反応させてなるもので
ある。Embedded image With a tetracarboxylic acid represented by the following formula:
【００１３】ここで用いるテトラカルボン酸は、テトラ
カルボン酸の他、その無水物及びその低級アルキルエス
テルが含まれる。これらテトラカルボン酸の具体的なも
のとして、例えば、まず 3,3′,4,4′−ベンゾフェノン
テトラカルボン酸二無水物が挙げられる。 3,3′,4,4′
−ベンゾフェノンテトラカルボン酸二無水物の他には、
可溶性の程度によって 3,3′,4,4′−ビフェニルテトラ
カルボン酸二無水物やピロメリット酸二無水物を使用す
ることができる。また、反応温度、溶媒等は適宜選定す
ることができ、特に限定されるものではない。The tetracarboxylic acid used here includes, in addition to tetracarboxylic acid, anhydrides and lower alkyl esters thereof. Specific examples of these tetracarboxylic acids include, for example, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride. 3,3 ', 4,4'
-Besides benzophenonetetracarboxylic dianhydride,
Depending on the degree of solubility, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride or pyromellitic dianhydride can be used. In addition, the reaction temperature, the solvent, and the like can be appropriately selected and are not particularly limited.
【００１４】本発明に用いる分子内に 2個以上のエポキ
シ基を有するエポキシ樹脂としては、特に制限はなく接
着剤用として用いられているものを広く使用することが
できる。具体的なものとして例えば、エピコート１００
１（油化シェルエポキシ社製、商品名）、エピコート１
００４（油化シェルエポキシ社製、商品名）等が挙げら
れ、これらは単独又は 2種以上混合して使用することが
できる。また必要に応じて次の一般式化７で示されるエ
ポキシ樹脂を併用できる。The epoxy resin having two or more epoxy groups in the molecule used in the present invention is not particularly limited, and those used for adhesives can be widely used. Specifically, for example, Epicoat 100
1 (Yukaka Epoxy Co., trade name), Epicoat 1
004 (trade name, manufactured by Yuka Shell Epoxy Co., Ltd.), and these can be used alone or as a mixture of two or more. If necessary, an epoxy resin represented by the following general formula 7 can be used in combination.
【００１５】[0015]
【化７】 Embedded image
【００１６】本発明に用いる（Ｃ）硬化剤としては、例
えばジシアンジアミド、フェノールノボラック、芳香族
ジアミン、酸無水物類等が挙げられ、これらは単独又は
2種以上混合して使用することができる。また、必要に
応じてイミダゾール類、ＢＦ3 錯体、３級アミン類、ト
リフェニルホスフィン等の促進剤を併用することができ
る。As the curing agent (C) used in the present invention, for example, dicyandiamide, phenol novolak, aromatic diamine, acid anhydrides and the like can be mentioned.
Two or more kinds can be used as a mixture. If necessary, an accelerator such as an imidazole, a BF 3 complex, a tertiary amine, or triphenylphosphine can be used in combination.
【００１７】本発明の耐熱性フィルム接着剤組成物は、
（Ａ）可溶性ポリイミド樹脂、（Ｂ）エポキシ化合物お
よび（Ｃ）硬化剤を必須成分とするが、これらの配合割
合について説明する。The heat-resistant film adhesive composition of the present invention comprises:
(A) A soluble polyimide resin, (B) an epoxy compound and (C) a curing agent are essential components, and the mixing ratio of these components will be described.
【００１８】（Ａ）可溶性ポリイミド樹脂は、樹脂成分
［（Ａ）＋（Ｂ）＋（Ｃ）］に対して15〜90重量％含有
するように配合することが望ましい。配合量が15重量％
未満ではフィルム成形性が悪くなり、また90重量％を超
えると十分な接着力が得られず好ましくない。It is desirable that the soluble polyimide resin (A) is blended in an amount of 15 to 90% by weight based on the resin component ((A) + (B) + (C)). 15% by weight
When the amount is less than 90%, the film formability deteriorates. When the amount is more than 90% by weight, sufficient adhesive strength cannot be obtained.
【００１９】本発明の耐熱性フィルム接着剤組成物は、
本発明の目的に反しない限度において、また必要に応じ
て、粘着付与剤、難燃剤、種々の添加剤、充填剤などを
適宜配合することができる。The heat-resistant film adhesive composition of the present invention comprises:
A tackifier, a flame retardant, various additives, a filler, and the like can be appropriately compounded as long as the object of the present invention is not violated, and if necessary.
【００２０】前述した各成分、すなわち、可溶性ポリイ
ミド、エポキシ化合物、硬化剤及びその他の成分を、シ
クロヘキサノン、ジメチルホルムアミド、Ｎ−メチルピ
ロリドン等の溶剤を用いて均一に溶解し、耐熱性フィル
ム接着剤組成物を容易に製造することができる。The above-mentioned components, ie, soluble polyimide, epoxy compound, curing agent and other components are uniformly dissolved using a solvent such as cyclohexanone, dimethylformamide, N-methylpyrrolidone, etc. Products can be easily manufactured.
【００２１】[0021]
【作用】本発明の耐熱性フィルム接着剤組成物は、可溶
性ポリイミド、エポキシ化合物及び硬化剤を必須成分と
したことによって、本発明の効果が得られる。すなわ
ち、可溶性ポリイミドとエポキシ樹脂の相互侵入架橋構
造により、フィルム成形性が良く、低フロー性、耐熱
性、接着性のバランスのとれたものとなった。またゴム
系の材料を使用していないため、電気特性も優れたもの
となった。The heat-resistant film adhesive composition of the present invention has the effects of the present invention by using a soluble polyimide, an epoxy compound and a curing agent as essential components. That is, due to the interpenetrating cross-linking structure of the soluble polyimide and the epoxy resin, good film formability was achieved, and low flowability, heat resistance, and adhesion were balanced. Also, since no rubber-based material was used, the electrical properties were also excellent.
【００２２】[0022]
【発明の実施の形態】次に本発明の実施例を図面を用い
て説明するが、本発明はこれらの実施例によって限定さ
れるものではない。以下の実施例及び比較例において
「部」とは「重量部」を意味する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these embodiments. In the following Examples and Comparative Examples, “parts” means “parts by weight”.
【００２３】実施例１ 化３の可溶性ポリイミドとしてマトリミド５２１８（旭
チバ社製、商品名）50部、ビスフェノールＡ型エポキシ
樹脂としてエピコート１００１（油化シェル社製、商品
名）40部、硬化剤としてジアミノジフェニルスルホン 5
部、および促進剤としてＢＦ3 モノメチルアミン錯体
0.2部を、シクロヘキサノン／ジメチルホルムアミド／
ＭＥＫ＝ 6／ 2／ 2の混合溶剤に溶解希釈し、固形分30
％の接着剤組成物を製造した。Example 1 50 parts of Matrimid 5218 (trade name, manufactured by Asahi Ciba) as a soluble polyimide of Chemical Formula 3, 40 parts of Epicoat 1001 (trade name, manufactured by Yuka Shell) as a bisphenol A type epoxy resin, and a curing agent Diaminodiphenyl sulfone 5
Part, and BF 3 monomethylamine complex as an accelerator
0.2 parts of cyclohexanone / dimethylformamide /
MEK = Dissolve and dilute in a mixed solvent of 6/2/2, solid content 30
% Of the adhesive composition was prepared.
【００２４】得られた接着剤組成物を、図１（ａ）のよ
うに、厚さ40μｍの離型剤付ポリエステルフィルムＨＡ
−６（藤森工業社製、商品名）２に、乾燥後の接着剤の
厚みが50μｍとなるようにロールコーターで塗布し、乾
燥、半硬化させてフィルム接着剤１を作成した。次い
で、図１（ｂ）のように、離型フィルム２とその上に作
成したフィルム接着剤１の所定の箇所を金型で抜き取
り、切欠部３を形成した。次いで離型フィルム２をはが
したフィルム接着剤１を、図１（ｃ）のようにルーター
で所定の箇所を切り取った回路板４の間に、切欠部３の
小さいものから順に下から複数枚重ね合わせ、層構成し
た。このように構成したものを上下の加熱プレス５に挟
み、170 ℃，90分間．製品圧40ｋｇｆ／ｃｍ2 の条件
で、加熱加圧一体に成形して、図１（ｄ）のような、キ
ャビティダウン構造のプラスチックパッケージ複合多層
プリント配線板用シールド板６を製造した。As shown in FIG. 1 (a), the obtained adhesive composition was applied to a polyester film HA with a release agent having a thickness of 40 μm.
-6 (trade name, manufactured by Fujimori Kogyo Co., Ltd.) 2 was applied by a roll coater such that the thickness of the adhesive after drying was 50 μm, and dried and semi-cured to prepare a film adhesive 1. Next, as shown in FIG. 1B, a predetermined portion of the release film 2 and the film adhesive 1 formed thereon was extracted with a die to form a cutout 3. Then, a plurality of sheets of the film adhesive 1 from which the release film 2 has been peeled are placed between the circuit boards 4 cut at predetermined positions by a router as shown in FIG. They were superposed and layered. The thus configured product is sandwiched between the upper and lower heating presses 5 at 170 ° C. for 90 minutes. Under a condition of a product pressure of 40 kgf / cm 2 , the molded product was integrally formed by heating and pressing to produce a shield plate 6 for a plastic package composite multilayer printed wiring board having a cavity-down structure as shown in FIG.
【００２５】実施例２ 実施例１において、硬化剤としてジシアンジアミド 1.5
部、促進剤としてイミダゾール２Ｅ４ＭＺ（四国化成社
製、商品名） 0.3部を用いた以外は、すべて実施例１と
同一にしてキャビティ構造の複合多層プリント配線板用
シールド板を製造した。Example 2 In Example 1, dicyandiamide 1.5 was used as a curing agent.
Except that 0.3 parts of imidazole 2E4MZ (trade name, manufactured by Shikoku Chemicals Co., Ltd.) was used as a promoter, a shield plate for a composite multilayer printed wiring board having a cavity structure was manufactured in the same manner as in Example 1.
【００２６】比較例１ 実施例１において、可溶性ポリイミドの替わりに、アク
リロニトリルブタジエンゴムのニポール１０７２（日本
ゼオン社製、商品名）を用いた以外は、実施例１と同様
にしてキャビティ構造の複合多層プリント配線板用シー
ルド板を製造した。Comparative Example 1 A composite multilayer structure having a cavity structure was prepared in the same manner as in Example 1, except that Nipol 1072 of acrylonitrile butadiene rubber (trade name, manufactured by Zeon Corporation) was used in place of the soluble polyimide. A shield plate for a printed wiring board was manufactured.
【００２７】比較例２ 実施例１において、フィルム接着剤の替わりに、打抜き
金型で所定箇所を打ち抜いたガラスエポキシプリプレグ
のＴＬＰ−５５１（東芝ケミカル社製商品名、ガラスク
ロスの厚さ30μｍ）を用いて、加熱プレスで170 ℃．90
分間，圧力40ｋｇｆ／ｃｍ2 の条件で加熱加圧一体に
成形し、キャビティ構造の複合多層プリント配線板用シ
ールド板を製造した。Comparative Example 2 In Example 1, instead of the film adhesive, a glass epoxy prepreg TLP-551 (trade name, manufactured by Toshiba Chemical Co., glass cloth thickness: 30 μm) was punched at a predetermined position by a punching die. Using a hot press at 170 ° C. 90
The molded body was integrally molded under heat and pressure under the conditions of a pressure of 40 kgf / cm 2 for one minute to produce a shield plate for a composite multilayer printed wiring board having a cavity structure.
【００２８】実施例１〜２及び比較例１〜２で製造した
フィルム接着剤のガラス転移点、実施例１〜２及び比較
例１〜２で製造した複合多層プリント配線板用シールド
板について、樹脂フロー、回路間絶縁信頼性を試験した
ので、その結果を表１に示した。本発明はいずれも優れ
た特性を示し、本発明の効果を確認することができた。The glass transition points of the film adhesives produced in Examples 1 and 2 and Comparative Examples 1 and 2, and the shielding plates for composite multilayer printed wiring boards produced in Examples 1 and 2 and Comparative Examples 1 and 2 The flow and the insulation reliability between circuits were tested, and the results are shown in Table 1. All of the present invention exhibited excellent characteristics, and the effect of the present invention could be confirmed.
【００２９】[0029]
【表１】 ＊1 ：ＤＭＡ法 ＊2 ：◎印…フロー少なく制御可、×印…フロー大きく制御不可。 ＊3 ：回路間 0.15 ｍｍに、85℃，85％ＲＨの雰囲気中、ＤＣ50Ｖ印加し、絶縁 劣化が起こるまでの時間を測定。[Table 1] * 1: DMA method * 2: ◎: small flow control possible, ×: large flow control impossible. * 3: Measured time until insulation deterioration occurs by applying 50 V DC in an atmosphere of 85 ° C and 85% RH with 0.15 mm between circuits.
【００３０】[0030]
【発明の効果】以上の説明及び表１から明らかなよう
に、本発明の樹脂組成物を用いて作成したフィルム接着
剤は、樹脂フローの制御が可能で耐熱性があり、電気特
性にも優れるため、キャビティ構造のプラスチックパッ
ケージ等の複合多層プリント配線板用に好適なものとな
った。As is clear from the above description and Table 1, the film adhesive prepared using the resin composition of the present invention can control the resin flow, has heat resistance, and has excellent electrical properties. Therefore, it has become suitable for a composite multilayer printed wiring board such as a plastic package having a cavity structure.
【図１】本発明の樹脂組成物によるフィルム接着剤を用
いて作成するキャビティ構造プラスチックパッケージ複
合多層プリント配線板の製造工程を説明する説明用断面
図である。FIG. 1 is a cross-sectional view for explaining a manufacturing process of a cavity structure plastic package composite multilayer printed wiring board prepared using a film adhesive made of a resin composition of the present invention.
１ フィルム接着剤 ２ 離型フィルム ３ 切欠部 ４ 回路板 ５ 加熱プレス ６ 複合多層プリント配線板 DESCRIPTION OF SYMBOLS 1 Film adhesive 2 Release film 3 Notch 4 Circuit board 5 Heat press 6 Composite multilayer printed wiring board
Claims (1)
れる可溶性ポリイミド樹脂、 【化１】 （但し、式中、 【化２】 で示されるテトラカルボン酸残基を表す） （Ｂ）分子内に 2個以上のエポキシ基を有するエポキシ
化合物及び（Ｃ）硬化剤を必須成分とし、樹脂成分
［（Ａ）＋（Ｂ）＋（Ｃ）］に対して、前記（Ａ）の可
溶性ポリイミド樹脂を15〜90重量％の割合で含有してな
ることを特徴とする耐熱性フィルム接着剤組成物。1. A soluble polyimide resin comprising a repeating unit represented by the following general formula: (However, in the formula, (B represents an epoxy compound having two or more epoxy groups in the molecule and (C) a curing agent as essential components, and a resin component [(A) + (B) + ( C)], wherein the soluble polyimide resin of (A) is contained at a ratio of 15 to 90% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19964196A JPH1025465A (en) | 1996-07-10 | 1996-07-10 | Heat-resistant adhesive composition for film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19964196A JPH1025465A (en) | 1996-07-10 | 1996-07-10 | Heat-resistant adhesive composition for film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1025465A true JPH1025465A (en) | 1998-01-27 |
Family
ID=16411235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19964196A Pending JPH1025465A (en) | 1996-07-10 | 1996-07-10 | Heat-resistant adhesive composition for film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1025465A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6307052B1 (en) | 1996-12-26 | 2001-10-23 | Ube Industries, Ltd. | Acid-addition salts of optically active piperidine compound and process for producing the same |
-
1996
- 1996-07-10 JP JP19964196A patent/JPH1025465A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6307052B1 (en) | 1996-12-26 | 2001-10-23 | Ube Industries, Ltd. | Acid-addition salts of optically active piperidine compound and process for producing the same |
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