JPH10270143A - Manufacture of base with terminal - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a base with a terminal capable of manufacturing the base with the terminal efficiently with high reliability. SOLUTION: Joining ends 16a of a terminal 16 are aligned in a state wherein they are floated on an alignment surface 33a of an alignment jig 31. Then, a wiring pattern of a base 2 is brought into contact with the joining end 16a of the aligned terminal 16. For this purpose, the base 2 is superposed on the alignment jig 31. The base 2 is heated for each of the alignment jigs 31, and a brazing material S1 interposed between the wiring pattern and the joining end 16a is melted. As a result, the wiring pattern and the terminal 16 are brazed to obtain a base 1 with a terminal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a substrate with terminals for joining a plurality of terminals to a conductor portion formed on the substrate by brazing.

[0002]

2. Description of the Related Art In recent years, there have been proposed several methods for manufacturing a terminal-equipped substrate in which a plurality of pins are joined to pads formed on one or both surfaces of the substrate by soldering.
At that time, for example, a sheet-like spacing holder in which a plurality of pins are held in an aligned state may be used. However, depending on the type of pin, there is a case where components cannot be supplied in such a state. Therefore, it is necessary to align the pins supplied in a discrete manner in some way. An example of a method for manufacturing a substrate with terminals in such a case will be described with reference to FIGS.

First, an alignment jig 81 having a plurality of recesses 83 on an alignment surface 82 is prepared. Recess 83 of this jig 81
The non-joining end 84b side of the pin 84 is inserted into the
Turn side up. Next, a substrate 87 on which a solder cream 86 is printed on a pad 85 in advance is prepared, and the substrate 87 is overlaid on a jig 81. At that time, each pad 8
5 is brought into contact with each joint end 84a. Next, the substrate 87 to which the pins 84 are temporarily fixed is transferred to a reflow jig 88, and the entire jig 88 is set in a reflow furnace.
Then, the substrate is heated to a temperature at which the solder S1 is melted, and each pad 85 and each pin 84 are soldered to produce a substrate with terminals.

[0004]

However, in the prior art, since two types of jigs 81 and 88 are used as described above, a transfer operation is required before reflow.
This has caused a reduction in work efficiency. Further, at the time of transfer, the pins 84 may be displaced, which may reduce reliability.

Further, since the pin 84 is almost buried in the jigs 81 and 88 (FIGS. 11 and 12), the solder S1 melted by reflow cannot sufficiently flow around, and an incompletely shaped fillet is formed. However, there is a problem in that the particles are easily formed. Therefore, the bonding strength between the pad 85 and the pin 84 was weakened, and it was difficult to ensure high reliability.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a method for manufacturing a terminal-equipped substrate that can efficiently manufacture a highly reliable terminal-equipped substrate. .

[0007]

In order to solve the above problems, according to the first aspect of the present invention, there is provided a substrate with terminals for joining a plurality of terminals to a conductor portion formed on the substrate by brazing. In the manufacturing method, a step of aligning the joining end of the terminal so as to float from an alignment surface of the aligning jig; and a step of aligning the conductor so as to contact the conductor portion with the joining end of the aligned terminal. A step of superposing the substrate on a tool, and melting the brazing material interposed between the conductor portion and the joining end by heating the substrate together with the alignment jig, thereby forming the conductor portion and the A gist of the present invention is a method for manufacturing a terminal-equipped substrate including a step of brazing a terminal.

According to a second aspect of the present invention, in the method of manufacturing a terminal-equipped substrate in which a plurality of terminals are joined to conductor portions formed on both surfaces of the substrate by brazing, the joining ends of the first terminals are aligned. A step of preliminarily printing a brazing material on a conductor portion of the substrate on the first surface side while aligning the conductor portion in a state of being floated from the alignment surface of the jig; Superposing the substrate on the alignment jig so as to make contact with the joined end of the first terminal, and printing a brazing material on a conductor portion on the second surface side of the substrate; Contacting the joint end of the second terminal with the conductor portion on the second surface side, and heating the substrate together with the alignment jig, so that the substrate will be interposed between the conductor portion and the joint end. By melting the material, the first The method of manufacturing a terminal-provided substrate including a said the body parts first terminal and brazing vital said second conductor portion and the step of brazing the second terminal and the gist thereof.

According to a third aspect of the present invention, in the method of manufacturing a terminal-equipped substrate in which a plurality of terminals are bonded to conductor portions formed on both surfaces of the substrate by brazing, the bonding ends of the first terminals are connected to each other. A step of preliminarily printing a brazing material on a conductor portion of the substrate on the first surface side while aligning the alignment jig in a state of being floated from an alignment surface of the alignment jig;
Superimposing the substrate on the first alignment jig so that the conductor portion on the first surface side contacts the bonding end of the aligned first terminal;
Printing a brazing material on the conductor portion on the side of the surface, aligning the joining end of the second terminal in a state of being floated from the alignment surface of the second alignment jig, Inverting the substrate together with the first alignment jig so as to bring the side conductor portion into contact with the aligned end of the second terminal, and superimposing them on the second alignment jig; Heating the substrate together with the two alignment jigs to melt the brazing material interposed between the first and second conductor portions and the joining end, so that the first conductor portion and the The gist of the present invention is a method for manufacturing a terminal-equipped substrate including a step of brazing a first terminal and a step of brazing the second conductor portion and the second terminal.

Hereinafter, the "action" of the present invention will be described. According to the first, second and third aspects of the present invention, the use of the alignment jig for aligning the terminals also as the brazing jig eliminates the necessity of transferring the jig before the brazing step. Therefore, work efficiency is improved accordingly. In addition, when the joining end of the terminal is in a state of being floated from the alignment surface of the alignment jig, the molten brazing material can sufficiently flow around without being disturbed by the alignment surface. Therefore, a completely shaped fillet is formed between the conductor portion and the terminal. Therefore,
The bonding strength between the conductor portion and the terminal is increased, and high reliability is ensured for the substrate with terminals. In addition, when the jig does not need to be transferred, there is no possibility that the terminals will be displaced, thereby improving the reliability.

According to the second and third aspects of the present invention, in addition to the above operation, the terminals are collectively brazed to the conductor portions formed on both surfaces of the substrate, so that the operations are performed one by one. Work efficiency is improved as compared with the case. Also,
Since there are many terminals on the first surface side of the substrate, the substrate is supported at so many points.
Therefore, even when the brazing material is printed on the conductor portion on the second surface side, the printing pressure is dispersed to each terminal, and as a result, the brazing material is printed uniformly. Therefore, there is no excess or deficiency in the brazing material, and it is difficult for the fillet to vary. And this has a positive effect on improving reliability.

Further, according to the invention described in claim 3,
In addition to the above effects, there is no restriction on the supply state of the terminals, so that there is more room for selecting terminals,
There are also many variations of substrates with terminals that can be manufactured.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

[First Embodiment] Hereinafter, a conversion module 1 according to a first embodiment of the present invention and a method for manufacturing the same will be described in detail with reference to FIGS.

First, the structure of the conversion module 1 as a substrate with terminals will be described. As shown in FIGS. 1 to 3, the conversion module 1 of the present embodiment, which includes only the conversion board 2, converts a PGA 21 as a semiconductor package into a signal and then mounts the PGA 21 on a motherboard MB.

Double-sided board 1 constituting a main part of conversion board 2
Numeral 4 is a rectangular and rigid one having two conductor layers on both front and back surfaces. In a first area of the double-sided board 14, a first pad 5, a second pad 4, a wiring pattern 6
And a mini via hole 8. On the other hand, in the second region of the double-sided board 14 extending in the lateral direction, rectangular pads 9 and 10 for connecting electronic components are formed, respectively. The pad 9 is for mounting a DIP (dual in-line package) 11 on the surface. Pad 1
0 is for mounting the chip resistor 12 on the surface.
The pad 10 is also formed on the lower surface side of the double-sided board 14. Both the chip resistor 12 and the DIP 11 are connected to the corresponding pads 9 and 10 via solder S1.

As shown in FIG. 3, the wiring pattern 6 on the surface of the double-sided board 14 electrically connects the first and second pads 4 and 5 and the lands of the mini-via holes 8. . In addition, some of the wiring patterns (not shown) are located between the pads 4 and 5 and the electronic components 11 and 12.
Alternatively, the electronic components 11 and 12 are electrically connected to each other.

As shown in FIG. 3, a second pad 4 as a second conductor portion is formed on the front side of the double-sided board 14, and a first pad 5 as a first conductor portion is formed on the double-sided board 1
4 is formed on the back side. Both pads 4 and 5, which are conductor portions, have a circular shape and are arranged in a staggered manner. The pads 4 and 5 are formed so as to overlap when the double-sided board 14 is projected in the thickness direction. Double-sided board 14
Is provided with a solder resist 17 having an opening 17a at a predetermined position. The pads 4 and 5 are exposed from the opening 17a except for the outer periphery. That is, the diameter D5 (1.1 mm in this embodiment) of both pads 4 and 5 is larger than the diameter D4 (1.0 mm in this embodiment) of the opening 17a. This is because the pads 4 and 5 are less likely to peel off. The pads 9 and 10 for connecting the electronic components are also exposed from the opening 17a. The lands of the wiring pattern 6 and the mini via hole 8 are not exposed from the solder resist 17 and are protected by the solder resist 17.

As shown in FIG.
A large number of female socket pins 15 as second terminals are surface-mounted on the surface side of. On the other hand, a large number of male pins 16 as first terminals are surface-mounted on the rear surface side. The number of both pins 15 and 16 is about 200 to 500 in this embodiment. The female socket-shaped pin 15 is a substantially cylindrical member, and has a through hole 1 at its distal end surface.
5a are formed. The insertion hole 15a of the female socket pin 15 has an I / O projecting from the lower surface of the PGA 21.
The pin 24 is removably inserted. A tapered portion 15b is formed at the tip of the female socket pin 15 to facilitate insertion and extraction of the I / O pin 24. The tapered portion 15b becomes wider toward the tip. The base end surface of the female socket pin 15 is soldered to the second pad 4. A complete fillet is formed by solder S1 on the peripheral surface of the base end of the female socket pin 15 and the surface of the pad 4.

As shown in FIG. 3 and the like, each male pin 1
Reference numeral 6 denotes a nail head. The reason why such a shape is adopted is that if the nail head portion 16a is provided on the base end side, the male pin 16 is prevented from coming off, so that the bonding strength is improved and, as a result, high reliability is secured. The nail head 16a is soldered to the first pad 5. As a result, a complete fillet is formed of the solder S1 on the peripheral surface of the base end of the male pin 16 and on the surface of the pad 5. The diameter D3 of the nail head 16a is preferably smaller than the diameter D4 of the opening 17a of the solder resist 17 (see FIG. 5). The reason is to obtain a high joining strength by reliably forming a complete fillet at the joining portion. In this embodiment, specifically, the diameter D3 of the nail head portion 16a is set to 0.7 m.
m, and the diameter D4 of the opening 17a is set to 1.0 mm. Further, in the male pin 16, the nail head 16
The length L4 of a is 0.2 mm, and the shaft 16b of the male pin 16
The length L5 is 5.5 mm and the diameter D2 of the shaft 16b is 0.4
The total length L1 of the male pin 16 is set to 5.7 mm. Further, the diameter of the base end of the female socket pin 15 is also set to the solder resist 17 for the same reason as described above.
Is preferably smaller than the diameter D4 of the opening 17a.

As shown in FIG. 3, the mini via hole 8 is formed so as to penetrate the front and back of the double-sided board 14. Thus, the conductor layer (such as the wiring pattern 6) on the front side of the double-sided board 14 and the conductor layer (such as the wiring pattern 6) on the back side of the double-sided board 14 are electrically connected. Here, the mini-via hole 8 has a diameter smaller than that of a normal via hole (0.4 mm to 0.8 mm in diameter) for the purpose of inserting a pin, and is intended only to conduct conduction between the front and the back. Point to. In the present embodiment, specifically, a diameter of 200 μm
A mini via hole 8 is formed.

As shown in FIG. 1, the motherboard MB
, A fixed socket 25 is fixed in advance by soldering so as not to be detachable. The fixed socket 25 has a number of female socket pins 26. In use,
The male pin 16 of the conversion module 1 is removably fitted into the insertion hole of the fixed socket 25. Note that, for the sake of convenience when performing component replacement, no soldering is performed on the connection portion.

On the other hand, PGA21 which is a semiconductor package
Is mounted on the upper surface side of the double-sided board 14. At this time, PG
I / O pin 24 of A21 is female-type socket pin 15
Is inserted in the insertion hole 15a so as to be able to be inserted and withdrawn. At this time, the PGA 21 side and the motherboard MB side are electrically connected via the conversion module 1. Therefore, signals and the like can pass between the PGA 21 and the motherboard MB. At this time, the electronic component 1 of the double-sided board 14
PGA2 by being appropriately converted by PGA2
(1) A state in which the original function is sufficiently exhibited.

Next, the structure of the alignment jig 31 used in manufacturing the conversion module 1 as described above will be described. As shown in FIG. 4, the alignment jig 31 includes a plurality of members. That is, the alignment jig 31 includes a lower jig piece 32, a middle jig piece 33, an upper jig piece 34, and a positioning and fixing jig piece 35. A middle jig piece 33 is inseparably arranged on the upper surface side of the lower jig piece 32. An upper jig piece 34 is separably arranged on the upper surface side of the middle jig piece 33.
The positioning and fixing jig piece 35 is detachably disposed on the upper surface side of the middle jig piece 33 when the upper jig piece 34 is removed.

Each of the lower jig piece 32, the middle jig piece 33, and the positioning and fixing jig piece 35 is preferably made of a heat-resistant material. The reason is that if it has heat resistance, it can be used not only as the alignment jig 31 but also as a reflow jig. Specifically, in this embodiment, a metal material such as aluminum or stainless steel is used. Note that ceramic materials such as aluminum nitride, alumina, silicon nitride, and silicon carbide may be used.

The lower jig piece 32 and the middle jig piece 33 are
Preferably, each has a cavity 36 therein. The reason for this is that the presence of the cavity 36 makes it easier to heat and cool as a whole due to a decrease in heat capacity, so that the time required for reflow can be shortened, which leads to an improvement in work efficiency.

The upper surface of the middle jig piece 33 (that is, the alignment surface 33a)
Are formed with a plurality of concave portions 37 into which the male die pins 16 are inserted. The recess 37 has, for example, a circular cross section. The inner diameter D1 of the recess 37 is set to be larger than the diameter D2 of the shaft 16b of the male pin 16 and smaller than the diameter D3 of the nail head 16a of the male pin 16. The depth L3 of the recess 37 must be shorter than the overall length L1 of the male pin 16 (5.7 mm as described above). Therefore, when the male pin 16 is inserted into the recess 37 (and there is no upper jig piece 34), the joint end side of the male pin 16 projects from the recess 37 by the length (= floating amount) L2. I do. That is, the nail head portion 16a at the joining end is in a state of floating from the alignment surface 33a.

In this case, the nail head portion 16a of each male pin 16 is held in a state of being floated from the alignment surface 33a by at least an amount L2 at which a complete fillet can be formed. The complete fillet refers to a flared fillet that is not collapsed as shown in FIG. According to the figure, the solder S1 melted by the reflow sufficiently wraps around the nail head portion 16a completely.
In the case of the present embodiment, the height from the bottom to the top of the complete fillet is about 0.5 mm. Therefore, the floating amount L2
Must be at least this value. Specifically, the floating amount L2 is preferably 0.6 mm to 5.0 mm,
1.0mm ~ 3.0mm is better, 1.5mm ~ 2.0mm
Is particularly good. However, if the floating amount L2 is too long, the depth L3 of the concave portion 37 becomes shallow, so that it is difficult to perform positioning, and there is a possibility that positional deviation is likely to occur. Therefore, in this embodiment, L2 = 1.5 mm and L3 = 4.2 mm.

A tapered through hole 38 is formed in the upper jig piece 34 at a position corresponding to the recess 37. These through holes 38 are widened toward the upper surface side, and the maximum diameter thereof is larger than the diameter D3 of the nail head portion 16a. Therefore, the male pin 16 supplied in a separated state is smoothly guided into the recess 37 by the presence of these through holes 38. At this time, the male pin 16 is in a state where the nail head portion 16a faces upward.

The positioning and fixing jig piece 35 is
This is a frame-shaped member having substantially the same size as. A cavity 36 may be provided in the positioning and fixing jig piece 35. On the inner peripheral surface side of the positioning and fixing jig piece 35, a rectangular step 3 for positioning and fixing the conversion board 2 in a fitted state is provided.
9 are formed. When the conversion board 2 is fitted to the positioning and fixing jig piece 35, the conversion board 2 is horizontally supported at a predetermined interval from the alignment surface 33a. That is, the positioning and fixing jig piece 35 has a role as a spacer.

The positioning and fixing jig piece 35 includes a guide portion 4.
0 is provided. The conversion board 2 fits while being guided by the guide section 40. As a result, the conversion board 2 cannot move in the horizontal direction, and the positioning and fixing are achieved. That is, the positioning and fixing jig piece 35 also has a role as a guide.

Next, a method of manufacturing the conversion module 1 will be described with reference to FIGS. 4 (a) to 4 (e). First, a copper-clad laminate in which copper foil is adhered to both sides of a glass epoxy insulating substrate is used as a starting material, and a copper foil is etched after forming a resist. As a result, pads 4, 5, 9, 10 and wiring pattern 6 are formed on both surfaces of the insulating substrate. Next, a through hole (about 200 μm in diameter) for forming the mini via hole 8 is formed using a drill or the like. Furthermore, the mini-via hole 8 is formed by performing electroless copper plating after providing the catalyst nucleus. Thereafter, a solder resist 17 is formed on both surfaces of the insulating substrate. Note that an insulating substrate made of glass polyimide may be selected instead of the insulating substrate made of glass epoxy.

In the subsequent first solder printing step, the cream solder 18 is printed on one side in advance on the first pad 5 on the first side by screen printing. The printing of the cream solder 18 may be performed by a method other than screen printing. As the cream solder 18, for example, eutectic solder (Pb: Sn = 37: 63,
(Melting point: 183 ° C.) An S1 powder dispersed in a vehicle is used.

In the next step, the nail head 16a of the male pin 16 as the first terminal is aligned while being floated from the alignment surface 33a of the alignment jig 31 (male pin alignment step). Specifically, the following procedure is used. First, the male pin 16 is supplied from above to the alignment jig 31 to which the upper jig piece 34 is attached in a separated state. At this time, the alignment jig 31 is preferably swung in the horizontal direction. By doing so, the shaft portion 16b of the male pin 16
Enters the recess 37, and the male pin 16 stands up (see FIG. 4A). Next, the upper jig piece 34 is removed (see FIG. 4B). Then, the nail head portion 16a of the male pin 16 rises from the alignment surface 33a of the alignment jig 31. Thereafter, the positioning and fixing jig piece 35 is arranged on the middle jig piece 33.

In the next conversion substrate superimposing step, the first pad 5 on the first surface side is placed on the alignment jig 31 so as to contact the end face of the nail head portion 16a of the aligned male pin 16. The conversion substrates 2 are overlaid (see FIG. 4 (c)). That is, the conversion board 2 is supported by the step portion 39 of the positioning fixture piece 35. At this time, the conversion board 2 fits while being guided by the guide portion 40 of the positioning fixture piece 35. Since the cream solder 18 is printed on each pad 5, the nail head 16a of the male pin 16 is temporarily fixed to the pad 5 by the adhesive force.

In the next second solder printing step, solder S1 as a brazing material is screen-printed on the second pad 5 on the second surface side of the conversion board 2 in the state of the solder cream 18 (FIG. 4). (d)). At this time, since a large number of male pins 16 are present on the first surface side of the conversion board 2, the conversion board 2 is supported at so many points. Accordingly, even when the cream solder 18 is printed on the pad 4 on the second surface side, the printing pressure is dispersed to each male pin 16, so that the printing pressure is not concentrated on one place.

In the next step, the joining end of the female socket pin 15 is brought into contact with the second pad 4 on the second surface side of the conversion board 2. In the present embodiment, the female socket-shaped pin 1 is held by a sheet-shaped and resin-made spacing member 19.
5 is supplied.

In the next double-sided batch reflow step, reflow is performed by heating the conversion substrate 2 together with the alignment jig 31 to melt the cream solder 18 (see FIG. 4E). As a result, the first pad 5 and the male pin 16 are soldered, and the second pad 4 and the female socket pin 15 are soldered.

Thereafter, the desired conversion module 1 is completed by individually soldering the electronic components 11 and 12 to the respective pads 9 and 10. The cream solder 18 may be printed on the pads 9 and 10 for connecting electronic components, and may be soldered at the same time as the female socket pins 15 and the like in the double-sided batch reflow process.

By mounting the PGA 21 mounted on the conversion module 1 thus manufactured in the fixed socket 25 of the motherboard MB, the PGA 21 can be operated at high speed.

Now, the characteristic effects of the present embodiment will be enumerated below. (A) In the conversion module 1 obtained by the manufacturing method of the present embodiment, the conversion board 2 is formed of the double-sided board 14. For this reason, the configuration is surely simplified as compared with the conventional one made of a multilayer board. Further, it is not necessary to form a normal via hole for pin insertion, and it is sufficient to form only the mini via hole 8 for front and back conduction, so that the configuration is also simplified. Therefore, the conversion module 1 can be manufactured at a low cost from the above two points. further,
By eliminating the need for forming via holes for pin insertion,
The external dimensions of the double-sided board 14 constituting the main part of the conversion board 2 can be reduced. Therefore, a compact conversion module 1 can be obtained.

(B) In the manufacturing method of this embodiment, the alignment jig 31 for aligning the male pin 16 is also used as a reflow jig for soldering. Therefore,
Since the work of transferring the jig before the soldering process is not required, the work efficiency is improved accordingly. The nail head 16a of the male pin 16 is provided with an alignment jig 31.
Are aligned while floating from the alignment surface 33a. therefore,
The molten solder S1 can sufficiently flow to the lower side of the nail head 16a without being disturbed by the alignment surface 33a. Therefore, the first pad 5 and the male pin 1
6 and a complete fillet is formed. Accordingly, the bonding strength between the first pad 5 and the male pin 16 is increased, and high reliability of the conversion module 1 can be secured. When the jig does not need to be transferred,
Since there is no possibility that the male pin 16 will be displaced, the reliability is also improved thereby.

(C) In the manufacturing method of the present embodiment, the female socket pins 15 and the male pins 16 are formed by reflowing the pads 4 and 5 formed on both surfaces of the conversion substrate 2.
Are soldered together. Therefore, the working efficiency can be further improved as compared with the case where the reflow is performed one by one. Also, since a large number of male pins 16 are present on the first surface side of the conversion board 2, the conversion board 2
It is supported in many ways. Therefore, even when the cream solder 18 is printed on the second pad 4 on the second surface side, the printing pressure is distributed to each male pin 16. As a result, the cream solder 18 is printed uniformly. Therefore, even when reflow is performed, there is no excess or deficiency in the solder S1, and it is difficult for the fillet to vary. And this has a positive effect on improving reliability. [Second Embodiment] Next, a method of manufacturing a conversion module 1 according to a second embodiment of the present invention will be described in detail with reference to FIG.

Here, the alignment jig 31 of the above embodiment is used.
In addition to the above, another point is that an alignment jig 41 is used. Hereinafter, the former will be referred to as a first alignment jig 31 and the latter will be referred to as a second alignment jig 41.

As shown in FIG. 6B and the like, the second alignment jig 41 includes a lower jig piece 42 and an upper jig piece 44. Concave portions 43 are formed at a plurality of locations on the lower jig piece 42. On the other hand, a concave portion 45 is also formed in the upper jig piece 44 at a position corresponding to the concave portion 43. Each recess 4
5 is open on the upper surface which is the alignment surface 44a. The joint end side of the female socket pin 15 is accommodated in the concave portion 43 formed in the lower jig piece 42. In the recess 45 formed in the upper jig piece 44, a female socket-shaped pin 15 is provided.
Are accommodated. Accordingly, the inner diameter of the recess 45 is formed larger than the inner diameter of the recess 43. The lower jig piece 42 and the upper jig piece 44 have the cavity 3
6 may be provided.

First, in the first step, FIGS.
According to (d), the joining end of the female socket pin 15 as the second terminal is aligned with the alignment surface 44a of the second alignment jig 41.
And line them up. More specifically, the procedure is as follows. The female socket-like pins 15 in a separated state are supplied from above the lower jig piece 42, and the non-joined end side is inserted into the recess 43 (see FIG. 6A). At this time, each female socket pin 15 is in a standing state. Next, the upper jig piece 44 is superimposed on the lower jig piece 42 (see FIG. 6B), and after inverting them (see FIG. 6C), only the lower jig piece 42 is removed. (Fig. 6 (d)
reference).

On the other hand, according to the procedure shown in the first embodiment, a first solder printing step, a male pin alignment step, a conversion board overlapping step, and a second solder printing step are performed, as shown in FIG. State.

In the next reversing step, the conversion board 2 is reversed together with the first alignment jig 31 so that the second pad 4 is brought into contact with the joint end of the female socket-shaped pin 15 and the second pad 4 is brought into contact with the second pad 4. It is superposed on the alignment jig 41 (see FIG. 6 (f)). At this time, the alignment surfaces 33a and 44a of the two alignment jigs 31 and 41 face each other. The positioning and fixing jig piece 46 of the present embodiment includes a guide portion 40 that is longer than in the first embodiment. Therefore, the upper surface of the guide portion 40 abuts on the alignment surface 44a of the second alignment jig 41, so that the conversion substrate 2 is held horizontally at a constant interval with respect to the alignment surface 44a. That is, the positioning and fixing jig piece 46 not only functions as a spacer between the conversion board 2 and the first alignment jig 31, but also functions as a spacer between the conversion board 2 and the second alignment jig 41. It also functions as a spacer between them.

The alignment jigs 31, 41 are non-separably positioned and fixed by hook-shaped positioning and fixing pieces 47 as a positioning and fixing mechanism. The positioning fixing piece 47 is provided on at least one of the alignment jigs 31 and 41. Therefore, the misalignment between the alignment jigs 31 and 41 during the reversal is prevented. Also,
At the time of inversion, the conversion board 2 itself functions as a so-called presser, and prevents the male pin 16 from falling off. In addition,
The positioning and fixing mechanism is not limited to the above-described hook structure, and may employ, for example, a fitting / removing structure by unevenness.

After such a reversing step, the conversion board 2 is heated together with the alignment jigs 31 and 41 to perform a reflow on both sides at once, and the cream solder 18 is melted. As a result, the first pad 5 and the male pin 16 are soldered, and the second pad 4 and the female socket pin 15 are soldered. Thereafter, the desired conversion module 1 is completed by individually soldering the electronic components 11 and 12 to the pads 9 and 10, respectively.

Now, the characteristic effects of the present embodiment will be listed below. (A) The manufacturing method of the present embodiment has the same basic parts as the manufacturing method of the first embodiment. Therefore, it goes without saying that the respective effects (a), (b), and (c) described in the first embodiment are exhibited.

(B) Further, in the manufacturing method of the present embodiment, the joining end of the female socket-like pin 15 is aligned while being floated from the alignment surface 44a of the second alignment jig 41, and the inversion step is performed. To convert the conversion substrate 2 into the first alignment jig 3
Each of them is inverted and they are superimposed on the second alignment jig 41. Therefore, the pin-shaped socket pins 15 supplied in a separated state can be used. In other words, since there is no restriction on the supply state of the terminals, there is more room for selecting terminals. Therefore, there is an advantage that the number of variations of the conversion module 1 that can be manufactured is surely increased. Further, there is an advantage that a fillet of a perfect shape is formed not only on the first surface side but also on the second surface side.

Note that the present invention is not limited to the above-described embodiment, but can be changed to, for example, the following forms. In another example of the alignment jig 51 shown in FIG. 7, a positioning and fixing jig piece 52 having a shape different from that of the first alignment jig 31 shown in the first embodiment is employed. The conversion board 2 is fitted to the positioning and fixing jig piece 52. Therefore, the jig piece 52 has only a role as a guide when the conversion board 2 is fitted.

◎ Another example of the alignment jig 61 shown in FIG.
Also, the first alignment jig 3 shown in the first embodiment
A jig piece 62 for positioning and fixing having a shape different from that of FIG. The conversion board 2 is placed on the upper surface of the positioning and fixing jig piece 62. Therefore, this jig piece 62
Has only a role as a spacer for maintaining a constant distance between the conversion substrate 2 and the alignment surface 33a.

The brazing is not limited to the soldering using the solder S1, but may be, for example, brazing using silver brazing or the like. The male pin 16 used in the second embodiment is not limited to a nail head, but may be a simple one, for example. However, a nail head shape is more advantageous for improving reliability as described above.

Instead of the method of Embodiments 1 and 2 in which terminals are soldered by both-side batch reflow, a method of reflowing one surface at a time may be employed. In this case, the solder S1 to be soldered first has a higher melting point than the solder S1 to be soldered later.

◎ The manufacturing method of the present invention
9A to 9D may be applied to the manufacture of the conversion modules 71, 73, 75, 77 having the structure as shown in FIG. In the conversion module 71 shown in FIG. 9A, a nail pad-shaped male pin 16 is soldered to the first pad 5, and a substantially ball-shaped bump 72 as a terminal is soldered to the second pad 4. I have. In the conversion module 73 of FIG. 9B, the substantially pad-shaped bump 7
2 is soldered, and a female socket pin 15 is soldered to the second pad 4. In the conversion module 75 of FIG. 9C, male pins 16 are both soldered to the first pad 5 and the second pad 4.
In the conversion module 77 of FIG. 9D, the first pad 5
And the second pad 4 has a female socket-like pin 1
5 is soldered. If the terminals are supplied in a state of being separated, the manufacturing method of the second embodiment is more suitable for manufacturing these conversion modules 71, 73, 75, and 77.

The manufacturing method of the present invention may of course be applied to the manufacture of substrates with terminals other than the conversion modules 1, 71... 77. Here, in addition to the technical ideas described in the claims, technical ideas grasped by the above-described embodiments are listed below together with their effects.

(1) The method according to any one of claims 1 to 3, wherein the alignment jig is made of a heat-resistant material and has a cavity therein. If it has heat resistance, it can be used not only as an alignment jig but also as a brazing jig.
Also, if there is a cavity, it becomes easier to heat and cool as a whole due to a decrease in heat capacity, so that the time required for reflow can be shortened, which leads to improvement in work efficiency.

(2) In any one of claims 1 to 3, a plurality of recesses for inserting the terminals are formed on the alignment surface of the alignment jig, and a joint end of the terminals is formed by a plurality of concave portions. A method for manufacturing a terminal-equipped substrate, wherein the substrate is held in a state of being floated at least by an amount capable of forming a complete fillet from the alignment surface. According to this method, complete fillets are reliably formed, thereby improving reliability.

(3) In claim 3, in a state where the two alignment jigs are positioned and fixed by the positioning and fixing mechanism, the substrate is inverted together with the first alignment jig, and the substrates are turned into the second alignment jig. A method for manufacturing a substrate with terminals, comprising performing a step of superimposing on a jig for use. According to this method, the misalignment between the two alignment jigs at the time of inversion is prevented.

(4) The circuit board according to any one of claims 1 to 3, wherein the substrate with terminals is a conversion module for performing signal conversion or the like when the semiconductor package is mounted on a motherboard, and the terminal is a pin-shaped terminal. Wherein the brazing is soldering using solder as the brazing material.

(5) The method for manufacturing a conversion module according to the technical concept 4, wherein the connection end of the terminal is a nail head of a pin-shaped terminal. The technical terms used in the present specification are defined as follows.

"Brazing material: Pb-Sn based solder containing lead and tin as main components, such as eutectic solder, Au, etc.
In addition to those having a low melting point, such as Pb-less solder, such as a system-based, In-based, or Bi-based, those having a high melting point, such as a silver solder, are also included. "

[0064]

As described in detail above, claims 1, 2, 3
According to the invention described in (1), it is possible to provide a method for manufacturing a substrate with terminals, which can efficiently manufacture a substrate with terminals having high reliability.

According to the second and third aspects of the present invention, in addition to the above effects, the work efficiency is improved by the double-sided brazing, and the reliability is further improved by uniformly printing the brazing material. Is achieved.

Further, according to the third aspect of the present invention,
In addition to the above-described effects, the room for selecting a terminal is expanded, so that a variety of substrates with terminals that can be manufactured can be increased.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a use state of a conversion module according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram showing the conversion module.

FIG. 3 is an enlarged sectional view of a main part of the conversion module.

FIGS. 4A to 4E are schematic cross-sectional views illustrating a method for manufacturing the conversion module using a jig.

FIG. 5 is an enlarged sectional view of a main part of the conversion module and the jig.

FIGS. 6A to 6F are schematic cross-sectional views illustrating a method for manufacturing the conversion module according to the second embodiment.

FIG. 7 is a schematic cross-sectional view showing another example of a conversion module manufacturing jig.

FIG. 8 is a schematic cross-sectional view showing another example of a jig for manufacturing a conversion module.

FIGS. 9A to 9D are schematic diagrams showing various conversion modules that can be manufactured by the jig of the present invention.

FIG. 10 is an enlarged sectional view of a main part for describing a conventional method for manufacturing a conversion module.

FIG. 11 is an enlarged sectional view of a main part for describing a conventional method of manufacturing a conversion module.

FIG. 12 is an enlarged sectional view of a main part for describing a conventional method of manufacturing a conversion module.

[Explanation of symbols]

1, 71, 73, 75, 77 ... conversion module as a board with terminals, 2 ... conversion board as a board, 4 ... second pad as a second conductor, 5 ... first as a first conductor 1 pad, 15 ... female socket pin as second terminal, 16 ... male pin as first terminal, 16a ... nail head part as joint end, 31, 5
1, 61: first alignment jig, 33a, 44a: alignment surface, 41: second alignment jig, S1: solder as brazing material.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI // H01L 23/12 H01L 23/12 P

Claims (3)

[Claims] 1. A method of manufacturing a terminal-equipped substrate for joining a plurality of terminals to a conductor portion formed on the substrate by brazing, wherein the terminal of the terminal is floated from an alignment surface of an alignment jig. Aligning; and superposing the substrate on the alignment jig so that the conductor portion contacts the bonding end of the aligned terminal; and heating the substrate together with the alignment jig. And fusing the brazing material interposed between the conductor portion and the joining end to braze the conductor portion and the terminal. 2. A method of manufacturing a terminal-equipped substrate for joining a plurality of terminals to conductor portions formed on both surfaces of the substrate by brazing, wherein a joining end of the first terminal is moved from an alignment surface of an alignment jig. A step of pre-printing a brazing material on a conductor portion on the first surface side of the substrate in advance while aligning the conductor portions in a floating state; and connecting the conductor portion on the first surface side to the aligned first terminal. A step of superimposing the substrate on the alignment jig so as to make contact with a joining end; a step of printing a brazing material on a conductor portion of the substrate on a second surface side; and a conductor on the second surface side. Contacting the joining end of the second terminal to the portion, and melting the brazing material interposed between the conductor portion and the joining end by heating the substrate together with the alignment jig, The first conductor portion and the first end Method of manufacturing a terminal-provided substrate and a step of brazing the brazing vital said second conductor portion and a second terminal and. 3. A method for manufacturing a terminal-equipped substrate, wherein a plurality of terminals are joined to conductor portions formed on both surfaces of the substrate by brazing, wherein a joining end of the first terminal is connected to a first alignment jig. A step of preliminarily printing a brazing material on a conductor portion on the first surface side of the substrate while aligning the conductor portion in a state of floating from the alignment surface; A step of superposing the substrate on the first alignment jig so as to make contact with a joint end of the terminal, a step of printing a brazing material on a conductor portion on the second surface side of the substrate, And aligning the joining end of the second terminal with the joining end of the second terminal being floated from the alignment surface of the second alignment jig. The substrate is turned together with the first alignment jig so as to make contact therewith. And a step of superposing them on the second alignment jig, and heating the substrate together with the two alignment jigs so as to be interposed between the first and second conductor portions and the joint end. By melting the brazing material, the first conductor part and the first terminal are brazed and the second conductor part and the second terminal are brazed.
And a step of brazing the terminal.