JPH10270843A - Repair method and apparatus for conductive pattern - Google Patents

Abstract

[Problem] To provide a repair method and a repair device which can efficiently and mechanically repair disconnection or loss of a conductive pattern and which is suitable for repairing a conductive pattern composed of extremely thin and thin lines. A conductive paste in which ultrafine particles of a conductive substance are uniformly dispersed in a dispersion medium is freely moved along a surface of the substrate at a repair location where a conductive pattern such as an electrode or the like formed on 2 has a disconnection 10 or a defect 11. It is supplied dropwise or linearly via the repair pen 8, and the supplied conductive paste is locally heated to form a conductive film. The repairing point is detected by the detection camera 13, and the repair pen 8, which can be moved up and down, is positioned at the repairing point, and while monitoring by the monitoring camera 14, the conductive paste is supplied to the repairing point and the heating is moved together with the repair pen The conductive paste supplied by the means 15 is locally heated to form a conductive film.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for repairing a disconnection or a defect of a conductive pattern formed on a substrate such as a glass substrate of a flat display panel.

[0002]

2. Description of the Related Art Conventionally, in the process of manufacturing a plasma display panel or a liquid crystal display panel, conductive thin wires for electrodes are formed in a pattern on a glass substrate directly or via an insulating film. Thereafter, the formed conductive pattern is inspected for disconnection or a defect that changes the resistance value, and a passed product is sent to the next step to be subjected to the next process. The conductive pattern varies depending on the use of the substrate, and a dry process, a wet process, a screen printing method, or the like is used for forming the conductive pattern depending on the dimensions of the substrate and the line width of the conductive fine wire. In the screen printing method, when the line width is larger than 100 microns, a pattern is printed using a metal organic or thick film paste, and this is sintered to form a conductive pattern. In addition, in order to form thin and narrow lines of 70 μm or less by screen printing, use a metal paste in which ultrafine metal particles such as nickel and aluminum are uniformly dispersed in a dispersion medium of alcohols having 5 or more carbon atoms. Printing a conductive pattern and sintering the conductive pattern has also been proposed (Japanese Patent Laid-Open No. Hei 3-2918).
No. 27).

[0003]

[0005] Discarding a flat display substrate of, for example, 1000 x 1350 mm, which has gone through many manufacturing steps before forming a conductive pattern and which has become defective due to the above inspection, is very expensive. Loss occurs, which causes an increase in cost. Therefore, while observing the broken or missing portion of the conductive pattern with a microscope, it was attempted to apply the thick film paste attached to the needle tip thereto and heat and repair it manually, but as recently, the line width was reduced. In the case of a conductive pattern made of a dry process that is as narrow as 70 microns or less, has a thickness of several tens of microns, and has a small resistance value, the repaired portion tends to be thick and thick, and the repair is not easy. If the thickness of the conductive pattern is partially increased as a result of the repair, it is not preferable because when the insulating film or the like is formed in the next step, the insulating film in the thick portion becomes thin and the electrical characteristics deteriorate.

SUMMARY OF THE INVENTION An object of the present invention is to provide a repair method and a repair apparatus which can efficiently and mechanically repair a disconnection or a defect in a conductive pattern, and which is suitable for repairing a conductive pattern composed of extremely thin and thin lines. is there.

[0005]

According to the present invention, in order to achieve the above object, ultrafine particles of a conductive substance are dispersed in a dispersion medium at a repaired portion where a conductive pattern such as an electrode formed on a substrate is broken or missing. A uniformly dispersed conductive paste is supplied in the form of drops or lines via a repair pen that moves freely along the surface of the substrate, and the supplied conductive paste is locally heated to form a conductive film and To repair it. The repair point is detected by a detection camera, and the repair pen, which is configured to be movable up and down, is positioned at the repair point, and the conductive paste is supplied to the repair point in a drop or linear manner while being monitored by a monitoring camera. If the conductive paste supplied by a heating means such as a lamp or a laser beam that moves together with the repair pen is locally heated to form a conductive film, the above object can be achieved more appropriately.

In the above repairing method, a movable table is provided which freely moves along a surface of a substrate having a conductive pattern to be repaired, and the movable table is provided with a detecting means for detecting a repaired portion where the conductive pattern is broken or missing. Camera, a repair pen that is raised and lowered by the lifting device toward the repair location and supplies a conductive paste in which ultrafine particles of a conductive substance are uniformly dispersed in a dispersion medium to the repair location, and a conductive pen from the repair pen. It can be accurately performed by a monitoring camera for monitoring the supply state of the paste and a repair device equipped with a heating means such as a lamp and a laser beam for locally heating the supplied conductive paste. Further, the movable base is moved by a driving device that operates based on a signal specifying the position of the repaired portion of the substrate, and the movable platform is provided with a continuity inspection device that can be moved up and down to perform a continuity inspection after the repaired portion is repaired. Is preferred.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an example of an apparatus for repairing a conductive pattern of a flat display panel used for carrying out the method of the present invention. Reference numeral 1 indicates a repair table. A glass substrate 2 constituting a flat display panel is removably mounted on the repair table 1, and a pair of parallel guide rods 3, 3 provided on opposite upper sides of the upper surface of the repair table 1 are provided. 4 are movably supported at both ends, and the horizontal rod 4 is moved along the guide rod 3 by a precision drive motor 5 such as a linear motor. Further, the horizontal rod 4 is provided with a moving table 7 which is moved by a precision drive motor 6 along a pair of guide rods 3 and 3 'in a direction orthogonal to the moving direction of the horizontal rod 4, and the precision motor 1
The repair pen 8 is attached to the movable base 7 'which moves in the vertical direction of the horizontal rod 4 along the pair of guide rods 3 ", 3" in Step 2, and the control device 19 controls the driving of the motors 5, 6, 12 by the control pen 19. Under the control, the movable table 7 'moves to a predetermined position like an XY plotter along the plate surface of the substrate 2. For example, a line width of 100 μm and an interval of 10 μm as shown in FIG.
When a conductive pattern made of a thin aluminum wire is formed at 0 μm, and a defective conduction portion such as a disconnection 10 or a defect 11 occurs in the fine wire as shown in FIG. To repair.

[0008] The repairing pen 8 is brought into close contact with a defective conduction point, that is, a repaired portion, and a conductive paste controlled by a valve is supplied from the pen tip to repair the conductivity. Nickel, aluminum, tantalum, tungsten with a particle size of 0.1 μm or less,
Indium, manganese, cobalt, chromium, silicon,
Gold, silver, copper, zinc, tin, or ultrafine particles of alloys or oxides or composite oxides or compounds containing these, dispersion media, such as rose oil, terbineol, citronellol, geraniol, nerol, phenethyl alcohol and the like A solvent containing one or more alcohols,
Or ethyl acetate, ethyl oleate, butyl acetate, glyceride, toluene, xylene, methyl ethyl ketone,
It is manufactured by uniformly dispersing in an organic dispersion medium containing at least one kind of acetone.

As shown in FIG. 1 or FIG. 3, the movable base 7 'is moved by a fine movement device 12 provided on the movable base 7,
Is mounted to be vertically movable with respect to
In addition to the repair pen 8, a solid-state detection camera 13 for detecting a repaired portion other than the repair pen 8, a monitoring solid-state imaging camera 14 for monitoring the supply state of the conductive paste from the repair pen 8, and a locally heated supply A heating means 15 comprising a laser gun for sintering the conductive paste thus obtained, and a continuity inspection device 16 for inspecting the continuity state by a stylus after repairing a repaired portion were mounted.

The repair pen 8 is provided on a movable base 7 'so as to be vertically movable by an actuator 17, and a pen control unit 18 controls a valve in synchronization with the vertical movement of the repair pen 8 so that conductive paste is applied to the repair location by high-pressure air. Supply. In the illustrated example, two monitoring solid-state imaging cameras 14 are prepared, one of which monitors a drawing state and the other monitors a supply state. The monitoring solid-state imaging camera 14 is connected to a pen control unit 18, and the unit 18 controls so as to appropriately perform a correction operation according to the monitoring information. In addition, the movement of the horizontal rod 4 in the front-rear direction, the movement of the carriage 7 in the left-right direction, and the movement of the carriage 7 ′ in the up-down direction are caused by signals specifying the position of the repaired portion of the substrate 2 to be repaired. The input drive control unit 19 is controlled to input image information captured by the detection solid-state imaging camera 13 to confirm the movement position of the drive control unit 19. Inspection information when inspecting the substrate 2 in the manufacturing process is used as the position signal of the repaired portion.

A method of repairing using the repairing apparatus having the above structure will be described. First, a substrate 2 on which a portion of a conductive pattern to be repaired is detected is placed on a repairing table 1, and a position signal of the repaired portion is obtained. Input to the drive control unit 19. Then, the precision drive motors 5 and 6 move the movable table 7 over the repair location by the movement signal output from the drive control unit 19, and are mounted on the movable table 7 'at a predetermined position recognized by the solid-state imaging camera 13 for detection. When the repair pen 8 stops, the pen control unit 18 drops the conductive paste from the repair pen 8 to the repair location. Whether the repaired part is broken or missing is previously known from the inspection information, and the drive control unit 19 is configured to give the repair pen 8 a motion suitable for repairing the fine line based on the information and the information of the solid-state imaging camera 13 for detection.
Controls the fine movement of the carriages 7, 7 'back and forth and left and right. For example, if the repair location is broken, the repair pen 8 is moved by moving the movable table 7 with the motor 5 or the motor 6 in the width direction of the thin line, and the movable table 7 ′ is moved up and down with the motor 12 to The height is fixed to the height corresponding to the thickness, and the repair pen 8 is moved up and down twice following the shape of the surface of the substrate 2 by the actuator 17, and the conductive paste is dropped 20 as shown in FIG. In some cases, the correction is performed by moving the fine line in the length direction and dripping it several times as shown in FIG. Alternatively, the repair pen 8 is lowered and moved along the repair location while supplying the conductive paste, and correction is performed by a method of drawing linearly as shown in FIG. 6 or FIG.

When the supplied conductive paste is sintered by the laser beam from the local heating means 15, the dispersion medium of the conductive paste evaporates to form a conductive film, and the disconnection or defect is repaired. The pattern returns to a conductive state or a predetermined resistance value, and the defective substrate 2 can be commercialized without being discarded. Whether or not the repaired portion is reliably conducted and the electric resistance value is at a predetermined value is inspected by applying a stylus-type continuity inspection device 16 provided on the movable base 7 'so as to be movable up and down by an actuator 17' to the repaired portion. Is done.

Since the solid component of the conductive paste used for repair is ultrafine particles having a particle size of 0.1 μm or less, a repair portion having a narrow conductive pattern can be repaired thinly. In addition, it is preferable to use a laser beam capable of concentrating heat in the heating means 15 in order to avoid heating other than the repaired portion, and to heat immediately after the repair in order to save the moving time of the movable table 7.

In the above embodiment, a solid-state imaging camera is used as a detection and monitoring camera. However, the present invention is not limited to this, and a general television camera may be used.

[0015]

As described above, according to the present invention, a conductive pattern in which ultrafine particles of a conductive substance are uniformly dispersed in a dispersion medium by a repair pen movable along the substrate is provided at a repaired portion of the conductive pattern on the substrate. The conductive paste in the form of drops or lines,
Since the supplied conductive paste is repaired by locally heating it to form a conductive film, it can repair broken or broken conductive patterns with a narrow line width without increasing the line width or thickness much. The repairing pen is detected by the detection camera, and the repair pen which can be moved up and down is positioned there, and while monitoring by the monitoring camera, the conductive paste is supplied to the repairing part and moved locally together with the repair pen. By heating the conductive paste supplied by a suitable heating means to form a conductive film, the repair can be performed automatically and accurately, and such a method can be carried out more accurately by the apparatus having the structure of claims 3 and 4. Has the effect.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is an enlarged view of a conductive pattern.

FIG. 3 is an enlarged sectional view of a main part of FIG. 1;

FIG. 4 is an explanatory diagram of a repair state of a disconnection (drop repair).

FIG. 5 is an explanatory view of a repair state of a defect (drop repair).

FIG. 6 is an explanatory view of a repair state of a disconnection (linear repair).

FIG. 7 is an explanatory view of a repair state of a defect (linear repair).

[Explanation of symbols]

Reference Signs List 1 repair table, 2 boards, 7.7 'moving table, 8 repair pen, 10 disconnection, 11 loss, 13 solid-state imaging camera for detection, 14 solid-state imaging camera for monitoring, 15 heating means, 1
6 Continuity inspection device, 17.17 'actuator,

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Masaaki Oda 516 Yokota, Sanmu-cho, Sanmu-gun, Chiba Prefecture Inside Vacuum Metallurgy Co., Ltd. In-house (72) Inventor Takahito Sakamoto 1647-2 Fujita, Wakakusa-cho, Nakakoma-gun, Yamanashi Pref.

Claims (4)

[Claims] 1. A conductive paste, in which ultrafine particles of a conductive substance are uniformly dispersed in a dispersion medium, is freely applied along a surface of a substrate at a repaired portion where a conductive pattern such as an electrode formed on the substrate is broken or broken. A method for repairing a conductive pattern, characterized in that the conductive paste is supplied in the form of a drop or a line via a repair pen that moves to a conductive film, and the supplied conductive paste is locally heated to form a conductive film. 2. The repairing point is detected by a detection camera, and the repairing pen configured to be movable up and down is positioned at the repairing point, and the conductive paste is dropped on the repairing point while being monitored by a monitoring camera. The method according to claim 1, wherein the conductive paste supplied in a linear manner and heated by a heating means such as a lamp or a laser beam that moves together with the repair pen is locally heated to form a conductive film. For repairing conductive patterns. 3. A moving table that freely moves along a surface of a substrate having a conductive pattern to be repaired, wherein the moving table includes:
A detection camera for detecting a repaired part where the conductive pattern is broken or missing, and a conductive paste which is raised and lowered by the lifting device toward the repaired part and in which ultrafine particles of a conductive substance are uniformly dispersed in a dispersion medium. A repair pen to be supplied to the repair pen, a monitoring camera for monitoring the supply status of the conductive paste from the repair pen, and a heating means such as a lamp and a laser beam for locally heating the supplied conductive paste. An apparatus for repairing a conductive pattern, comprising: 4. A continuity test which can be moved up and down to perform a continuity test after repairing the repaired portion on the movable table by moving the movable table by a driving device which operates based on a signal specifying a position of the repaired portion on the substrate. The device for repairing a conductive pattern according to claim 3, further comprising a device.