JPH10270972A - Surface mount electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a more reliable surface mount type capable of performing stable sealing without sticking out of a sealing material and without tilting of a lid while securing the bonding strength between a lid and a base. Provide electronic components. SOLUTION: There is a base 1A on which an electronic component element 5A is housed and lead electrodes 3A, 4A are formed to lead the electronic component element to the outside, and the electronic component element is electromechanically bonded to the base. In a surface-mounted electronic component in which the base and the lid 6A are hermetically sealed with a sealing material, a thickness of the lid or the base is applied to a sealing material application portion of the lid or the base. Thinner and equal height projections 611A, 612A, 613
A, 614A was formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type electronic component such as a piezoelectric vibrator, and more particularly to a surface mount type electronic component using a sealing material such as glass and resin.

[0002]

2. Description of the Related Art Conventionally, when a surface mount type electronic component using a sealing material is joined to a base only by its own weight, the sealing strength is relatively weak, and when a strong external impact such as dropping is applied to the base, the lid is closed. In some cases, product defects such as detachment were caused. In addition, the height of the final product varies, for example, the lid is inclined depending on the application state of the sealing material. For this reason, a method of curing the sealing material while pressing it from above the lid at the time of sealing is generally adopted. However, when this method is used, there is a problem that the sealing material protrudes around the joint portion. To solve these problems, for example,
And a piezoelectric vibrator disclosed in JP-A-113429.
This piezoelectric vibrator has a configuration in which a notch is provided in a part of a ground portion of a lid in order to prevent a large amount of sealing material from protruding without reducing the amount of sealing material.

[0003]

However, in the above-described piezoelectric vibrator, the portion of the lid, which has been cut off, and the base are in circumferential contact with each other. When curing the sealing material in the state, it is not only difficult to control the thickness of the sealing material suitable for sealing,
Depending on how to hold down, the lid may be tilted, causing variations in the height of the final product. In order to eliminate these variations, pressing the lid with a strong pressing force without adjusting the pressing force, and bringing the lid and the base into close contact, the sealing material interposed in the thickness direction of the lid is limited to the notch portion only. As a result, there has been a problem that the joining strength between the lid and the base is significantly reduced.

The present invention provides a more reliable surface-mount type electronic component capable of performing stable sealing without sticking out of a sealing material and without tilting of a lid while securing bonding strength between a lid and a base. The purpose is to provide.

[0005]

Therefore, in order to solve the above problems, a surface mount type electronic component according to the present invention accommodates an electronic component element, and a lead electrode for leading the electronic component element to the outside. There is a formed base, and the electronic component element is electro-mechanically bonded to and mounted on the base, and the base and the lid are hermetically sealed with a sealing material. The present invention is characterized in that three or more protrusions having a thickness smaller than the thickness of the lid or the base and equal in height are formed on the sealing material application portion of the lid or the base.

[0006] With the above arrangement, the lid and the base can be brought into close contact with each other in a point-like manner with a certain space between the projections, and the projections have the same height at three or more locations. The lid and the base can be stably adhered without tilting. Then, an extra sealing material is released around the space and the protrusion to prevent the sealing material from protruding, and the sealing material is applied in a circumferential shape. For this reason, the joining strength between the lid and the base does not decrease. In addition, since the lid can be pressed down with a strong pressing force without adjusting the pressing force even at the time of sealing and the lid and the base can be brought into close contact with each other, the height dimension of the projections can be arbitrarily set, thereby sealing. It is easy to set the thickness of the sealing material suitable for stopping and the height of the final product.

In addition, there is a base on which an electronic component element is housed and a lead electrode is formed to lead the electronic component element to the outside. The electronic component element is mounted on the base by electromechanical bonding. In the surface-mounted electronic component in which the base and the lid are hermetically sealed with a sealing material, the lid or the sealing material-applied portion of the base has at least three points where the lid and the base are in point contact. It is characterized by comprising a top, wherein the space between the tops is configured so that the lid and the base gradually approach and then gradually approach.

[0008] With the above configuration, the lid and the base can be brought into close contact with each other in a point-like manner in a state where a space between the top and the top is gradually secured by a configuration between the top and the top (gradual separation and gradually approaching). Are provided at three or more places, so that the lid and the base can be stably adhered without tilting. Then, the sealing material is applied to the periphery of the space and the top portion, while the excess sealing material is escaped to prevent the sealing material from protruding. For this reason, the joining strength between the lid and the base does not decrease. Then, even at the time of sealing, with a strong pressing force without adjusting the pressing force, the lid can be pressed down, and the lid and the base can be brought into close contact with each other, so that the dimension of the configuration between the tops gradually separating and gradually approaching can be arbitrarily determined. By setting, the thickness of the sealing material suitable for sealing can be easily set, and the height of the final product can be easily set.

[0009]

Next, a first embodiment of the present invention will be described with reference to a surface mount type crystal unit using a ceramic case as an example.
This will be described with reference to the drawings. FIG. 1 is an exploded perspective view showing a first embodiment of the present invention, and FIG. 2 is a side view in a longitudinal direction (a) and a lateral direction (b) in a state where FIG. 1 is sealed.

The ceramic substrate 1A (base) is made of rectangular alumina, is processed into a thin plate, and has a notch provided with an external terminal on an end face thereof. Then, inside the ceramic substrate, the element mounting portion 2
1A and 22A are provided, and connection electrodes 3A and 4A are provided on the upper surface thereof. These connection electrodes 3A, 4A
Are provided with vias 34A and 44A (through holes and filled with a metal electrode material) for guiding connection electrodes to the back surface of the ceramic substrate 1A. This via 34A, 4
The connection electrodes 3A and 4A on the front surface are electrically connected to the back surface electrodes (not shown) by 4A. The connection electrode and the back surface electrode are formed by metallizing tungsten, for example, and plating the upper surface with nickel and gold.

The rectangular AT-cut quartz plate 5A has an excitation electrode 51A (the front surface is not shown) and connection electrodes 52A and 53A formed on the front and back surfaces by sputtering or the like. These excitation electrodes and connection electrodes have, for example, a configuration in which silver plating is performed on the upper surface of chromium plating, or a configuration in which chromium plating is further performed on the electrode configuration.

The connection electrodes 52A, 5A of the quartz plate 5A
3A and the connection electrodes 3A and 4A of the substrate 1A are mounted so as to overlap each other, and for example, a conductive bonding material (not shown) such as a silicone resin system, a polyimide system, or an epoxy system.
Provides an electrical and mechanical connection.

The cap 6A (lid) is made of the same alumina as the ceramic substrate and is formed in an inverted concave shape, and the ceramic substrate contact portion (sealing material application portion) 6 of the cap 6A is formed.
In the corner portion of 1A, the thickness is smaller than the thickness of the cap 6A,
And projections 611A, 612A, 613A having the same height,
614A are provided. These projections, for example,
It may be integrally formed using a ceramic lamination technique, or a separately provided projection may be attached later by a bonding material.

Then, the ceramic substrate is hermetically sealed by joining the ceramic substrate contact portion 61A of the cap with a sealing material G such as glass or solder.

Although the projections are shown as semicircular, they are not limited to these, but are not limited thereto, such as cylinders, polygonal (triangles, squares, etc.) columns, cones, polygons (triangles, squares, etc.). There is no particular problem even if the weight and trapezoidal shape are used. In consideration of the stability when the cap is mounted on the ceramic substrate (base), the protrusions are formed at the corners (4 places) of the cap.
It is preferable to provide the cap and the ceramic substrate (base) stably without tilting by forming three or more places other than the corners of the cap. Can be in close contact.

Next, a second embodiment of the present invention will be described with reference to the drawings, taking a surface-mount type crystal unit using a ceramic case as an example. FIG. 3 is an exploded perspective view showing a second embodiment of the present invention. FIG. 4 is a side view in the longitudinal direction (a) and the transverse direction (b) of FIG. 3 in a sealed state.
The same parts as those in the first embodiment of the present invention are denoted by the same reference numerals.

The ceramic substrate 1A (base) is made of rectangular alumina, is processed into a thin plate, and is provided with a notch serving as an external terminal at an end surface thereof. And
Inside the ceramic substrate, the element mounting portions 21A,
22A are provided, and the connection electrodes 3A,
4A is provided. These connection electrodes 3A and 4A have
Via 34 for leading connection electrode to back surface of ceramic substrate 1A
A, 44A (a through hole is provided and filled with a metal electrode material). These vias 34A and 44A
Thereby, the connection electrodes 3A and 4A on the front surface are electrically connected to the back surface electrodes (not shown). The connection electrode and the back surface electrode are formed by metallizing tungsten, for example, and plating the upper surface with nickel and gold.

The rectangular AT-cut quartz plate 5A has excitation electrodes 51A (the front surface is not shown) and connection electrodes 52A and 53A formed on the front and back surfaces by vapor deposition or the like. These excitation electrodes and connection electrodes have, for example, a configuration in which silver plating is performed on the upper surface of chromium plating, or a configuration in which chromium plating is further performed on the electrode configuration.

The connection electrodes 52A, 5A of the quartz plate 5A
3A and the connection electrodes 3A and 4A of the substrate 1A are mounted so as to overlap each other, and for example, a conductive bonding material (not shown) such as a silicone resin system, a polyimide system, or an epoxy system.
Provides an electrical and mechanical connection.

The cap 6B (lid) is made of the same alumina as the ceramic substrate and is formed in an inverted concave shape, and the ceramic substrate contact portion (sealing material application portion) 6 of the cap 6B is formed.
1B has four tops 611B, 612B, 613B, 6
14B, and the curvature is formed so that the notch gradually becomes deeper as the distance from each of these vertices increases. The curved cut is formed integrally by using, for example, a ceramic lamination technique, or formed by grinding or the like.

The ceramic substrate is hermetically sealed by joining the ceramic substrate and the ceramic substrate contact portion 61B of the cap with a sealing material G such as glass or solder.

Note that the cap is a ceramic substrate (base).
In consideration of the stability at the time of installation, the top is preferably provided at the corners (four places) of the cap (second embodiment). By forming one or more, the cap and the ceramic substrate (base) can be stably adhered without tilting.

In the first and second embodiments, the protrusion is formed only on the cap or the curvature is formed only on the contact portion of the cap with the ceramic substrate. However, in the case shown in FIG. In the cap 6C), there is no particular problem even if it is formed on both the cap and the ceramic substrate (base). In addition, a case (base 1) as shown in FIG.
D, the cap 6D) is preferably formed on the base side. Further, it goes without saying that the present invention can be applied not only to a crystal resonator but also to a crystal filter, a crystal oscillator, and the like as surface mount electronic components.

[0024]

According to the first aspect of the present invention, the lid and the base can be brought into close contact with each other in a point-like manner with a predetermined space between the projections, and the projections have the same height at three or more places. Therefore, the lid and the base can be stably adhered without tilting. Then, an extra sealing material is released around the space and the protrusion to prevent the sealing material from protruding, and the sealing material is applied in a circumferential shape. For this reason, the joining strength between the lid and the base does not decrease. In addition, since the lid can be pressed down with a strong pressing force without adjusting the pressing force even at the time of sealing and the lid and the base can be brought into close contact with each other, the height dimension of the projections can be arbitrarily set, thereby sealing. It is easy to set the thickness of the sealing material suitable for stopping and the height of the final product.

According to the second aspect of the present invention, the lid and the base are configured between the tops (gradual separation and gradually approaching).
Thus, the lid and the base can be stuck to each other in a point-like manner while securing a space at a constant interval, and the top is provided at three or more places. Then, the sealing material is applied to the periphery of the space and the top portion, while the excess sealing material is escaped to prevent the sealing material from protruding. For this reason, the joining strength between the lid and the base does not decrease.
And at the time of sealing, with a strong pressing force without adjusting the pressing force,
By pressing the lid, the lid can be in close contact with the base, by arbitrarily setting the dimensions of the configuration between the tops gradually and gradually approach, setting the thickness dimension of the sealing material suitable for sealing, The height of the final product can be easily set.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing a first embodiment of the present invention.

FIG. 2 is a side view in a longitudinal direction and a lateral direction in a state where FIG. 1 is sealed.

FIG. 3 is an exploded perspective view showing a second embodiment of the present invention.

FIG. 4 is a side view in a longitudinal direction and a lateral direction in a state where FIG. 3 is sealed.

FIG. 5 is a side view of another embodiment of the present invention.

[Explanation of symbols]

 1A, 1C, 1D: Ceramic substrate (base) 5A: Quartz plate 6A, 6B, 6C, 6D: Cap (lid)

Claims (2)

[Claims] An electronic component element is housed therein, and there is a base on which an extraction electrode is formed for leading the electronic component element to the outside. The electronic component element is mounted on the base by electromechanical bonding. In a surface-mounted electronic component in which the base and the lid are hermetically sealed by a sealing material,
A surface-mounted electronic component, wherein three or more projections having a thickness smaller than the thickness of the lid or the base and having the same height are formed on a portion of the lid or the base to which a sealing material is applied. 2. A base for receiving an electronic component element and having an extraction electrode formed therein for leading the electronic component element to the outside, wherein the electronic component element is electro-mechanically bonded and mounted on the base. In the surface-mounted electronic component in which the base and the lid are hermetically sealed with a sealing material, the lid or the sealing material-applied portion of the base has at least three points where the lid and the base are in point contact. A surface-mounted electronic component, comprising a top, wherein the lid and the base are gradually separated and then gradually approached between the tops.