JPH10272732A - Copper-clad laminate and printed-wiring board - Google Patents
Copper-clad laminate and printed-wiring boardInfo
- Publication number
- JPH10272732A JPH10272732A JP8003297A JP8003297A JPH10272732A JP H10272732 A JPH10272732 A JP H10272732A JP 8003297 A JP8003297 A JP 8003297A JP 8003297 A JP8003297 A JP 8003297A JP H10272732 A JPH10272732 A JP H10272732A
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- dielectric constant
- copper
- clad laminate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000012212 insulator Substances 0.000 description 12
- 239000004744 fabric Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は同一平面において誘
電率が異なる絶縁体を有する銅張積層板及びプリント配
線板に関するものである。The present invention relates to a copper-clad laminate and a printed wiring board having insulators having different dielectric constants on the same plane.
【０００２】[0002]
【従来の技術】電子機器の小型化、高密度化によりプリ
ント配線板には多層板が多く使用されるようになってき
た。この多層板の内層または外層に高誘電率の層を設け
ることにより、この層をコンデンサとして積極的に利用
し、例えば回路導体のストレーキヤパシテイによりバイ
パスコンデンサとして高周波成分をグランド層に流した
り、導体をコンデンサ（Ｃ）やインダクタンス（Ｌ）と
してさらに印刷により抵抗（Ｒ）を形成し、Ｃ，Ｌ，Ｒ
を内層表面または外層表面に形成し実装密度を向上させ
ることができる。また、多層プリント配線板の各絶縁層
の誘電率を、電子回路の使用周波数帯や実装部品の周波
数特性に含わせて、各絶縁層ごとに変えることも提案さ
れている（特開平１−１８９９９８号公報、特開平１−
１８９９９９号公報参照）。2. Description of the Related Art Due to the miniaturization and high density of electronic devices, multilayer boards have been widely used for printed wiring boards. By providing a high dielectric constant layer as an inner layer or outer layer of this multilayer board, this layer is actively used as a capacitor, for example, by flowing a high frequency component to the ground layer as a bypass capacitor due to the strake capacity of the circuit conductor, Is formed as a capacitor (C) or an inductance (L), and a resistor (R) is formed by printing.
Can be formed on the inner layer surface or the outer layer surface to improve the mounting density. It has also been proposed to change the dielectric constant of each insulating layer of the multilayer printed wiring board for each insulating layer by including the frequency band of the electronic circuit used and the frequency characteristics of the mounted components (JP-A-1-189998). JP, JP-A-1-
189999).
【０００３】[0003]
【発明が解決しようとする課題】ところが、さらにプリ
ント配線板の高密度化及び高機能化を実現させるために
は、多層プリント配線板の各絶縁層の誘電率を変えるだ
けでは不十分であり、各絶縁層の同一平面内で誘電率を
変える必要性がある。そこで、本発明は同一平面におい
て誘電率が異なる絶縁体を有する銅張積層板及びプリン
ト配線板を提案するものである。However, in order to further increase the density and function of the printed wiring board, it is not sufficient to simply change the dielectric constant of each insulating layer of the multilayer printed wiring board. It is necessary to change the dielectric constant in the same plane of each insulating layer. Therefore, the present invention proposes a copper-clad laminate and a printed wiring board having insulators having different dielectric constants on the same plane.
【０００４】[0004]
【課題を解決するための手段】本発明は銅箔とプリプレ
グを積層してなる銅張積層板において、プリプレグの一
部を除去し、その除去した部分に誘電率の異なる他のプ
リプレグを置き換え同一平面に配置し、その両側に銅箔
を配置し加熱加圧して得られる銅張積層板である。そし
て、プリプレグとして誘電率が５以下のプリプレグと誘
電率が８以上のプリプレグを同一平面に組み合わせて配
置するとより好ましいものである。また、本発明は、多
層プリント配線板用の内層板と内層板若しくは内層板と
外層板の接着用プリプレグとして、プリプレグの一部を
除去し、その除去した部分に誘電率の異なる他のプリプ
レグを置き換え同一平面に配置し、その両側に前記内層
板又は外層板を配置し加熱加圧して得られるプリント配
線板である。SUMMARY OF THE INVENTION The present invention provides a copper-clad laminate made by laminating a copper foil and a prepreg, removing a part of the prepreg and replacing the removed part with another prepreg having a different dielectric constant. This is a copper-clad laminate obtained by arranging copper foil on both sides and heating and pressing it on both sides. It is more preferable to arrange a prepreg having a dielectric constant of 5 or less and a prepreg having a dielectric constant of 8 or more on the same plane as the prepreg. Further, the present invention provides a prepreg for bonding an inner layer and an inner layer or an inner layer and an outer layer for a multilayer printed wiring board, in which a part of the prepreg is removed, and another prepreg having a different dielectric constant is applied to the removed portion. A printed wiring board obtained by disposing on the same plane, disposing the inner layer plate or the outer layer plate on both sides thereof, and applying heat and pressure.
【０００５】[0005]
【発明の実施の形態】本発明の銅張積層板は、誘電率の
異なった同一厚みのプリプレグを同一平面の任意の位置
に配置し、その両側に銅箔を配置して積層成形して得ら
れる。また、本発明のプリント配線板は、誘電率の異な
った同一厚みのプリプレグを同一平面の任意の位置に配
置し、このプリプレグを多層プリント配線板用の内層板
と内層板又は内層板と外層板の接着用に用いて積層成形
して得られる。本発明で用いられる誘電率の異なった同
一厚みのプリプレグより得られる絶縁体は、一般の積層
板及びプリント配線板に用いられる絶縁体であるものな
ら良く、特に限定はないが、このような絶縁体としては
エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂、ジ
アリルフタレート樹脂、ポリフェニレンエーテル樹脂、
シアネート樹脂、シリコーン樹脂、ポリブタジエン樹脂
等及びこれらの樹脂に高誘電率の充填剤を添加したもの
からなるプリプレグが可能である。プリプレグの積層枚
数は、銅張積層板では厚みにより調整し必要とする枚数
を使用する。また、プリント配線板の接着用プリプレグ
には、１枚以上使用する。絶縁体の誘電率としては、プ
リント配線板の電気特性の面からＬ，Ｃ，Ｒの効果を充
分に得るために誘電率が５以下の低誘電率のものと誘電
率が８以上の高誘電率のものが望ましい。中でも価格及
び作業性の面から低誘電率の絶縁体としてはガラス布基
材エポキシ樹脂プリプレグが、高誘電率の絶縁体として
はガラス布基材高誘電率充填剤添加エポキシ樹脂プリプ
レグが好適である。プリプレグは、それを多数枚重ねて
打ち抜くべき形状をした打ち抜き金型により打抜き一部
を除去して作製する。その除去した部分に誘電率の異な
るプリプレグを置き換えるために使用する部分のプリプ
レグも同様に多数枚重ねて打ち抜き金型により打ち抜き
作製する。プリプレグの一部を除去する方法として、レ
ーザー等により作製することも可能であり、この場合、
切断される端面からプリプレグの樹脂粉が発生すること
なく銅箔への打痕発生の影響を減少させることができ好
ましい。打抜金型やカッターによる切断で発生するプリ
プレグ端面の樹脂粉の発生は、硬化が極端に進行しない
程度にそのプリプレグに使用している樹脂の軟化点付近
の温度に加熱して溶融付着させることにより、その影響
を減少させることができる。 さらにプリプレグの一部
を除去した部分に、その形状の誘電率の異なるプリプレ
グを配置する場合、ラミネートにより端面同士を融着し
て１枚のプリプレグとして使用することもできる。プリ
プレグの一部を除去する部分は、１カ所とは限らず１枚
のプリプレグに多数箇所あっても良い。そして、その除
去した部分には誘電率が異なるプリプレグを数種類使用
することもできる。BEST MODE FOR CARRYING OUT THE INVENTION The copper-clad laminate of the present invention is obtained by arranging prepregs having different dielectric constants and the same thickness at arbitrary positions on the same plane, arranging copper foil on both sides thereof, and laminating and forming. Can be In the printed wiring board of the present invention, prepregs having the same thickness and different dielectric constants are arranged at arbitrary positions on the same plane, and this prepreg is used for an inner layer board and an inner layer board or an inner layer board and an outer layer board for a multilayer printed wiring board. It is obtained by lamination molding using for bonding. The insulator obtained from prepregs having the same thickness and different dielectric constants used in the present invention may be any insulator used for general laminated boards and printed wiring boards, and is not particularly limited. Epoxy resin, polyimide resin, polyester resin, diallyl phthalate resin, polyphenylene ether resin,
A prepreg comprising a cyanate resin, a silicone resin, a polybutadiene resin or the like and a resin obtained by adding a filler having a high dielectric constant to these resins can be used. The number of laminated prepregs is adjusted according to the thickness of the copper-clad laminate, and the required number is used. In addition, one or more sheets are used for the adhesive prepreg of the printed wiring board. In order to sufficiently obtain the effects of L, C, and R from the viewpoint of the electrical characteristics of the printed wiring board, the dielectric constant of the insulator is a low dielectric constant of 5 or less and a high dielectric constant of 8 or more. Rate is desirable. Among them, a glass cloth base epoxy resin prepreg is preferable as a low dielectric constant insulator, and a glass cloth base high dielectric constant filler-added epoxy resin prepreg is preferable as a high dielectric constant insulator in terms of price and workability. . The prepreg is prepared by removing a part of the prepreg by using a punching die having a shape to be punched by stacking a plurality of prepregs. Similarly, a large number of prepregs used for replacing prepregs having different dielectric constants with the removed portions are formed by punching with a punching die. As a method of removing a part of the prepreg, it is also possible to produce by a laser or the like.
This is preferable because the influence of dents on the copper foil can be reduced without generating prepreg resin powder from the cut end face. The generation of resin powder on the end face of the prepreg, which is generated by cutting with a punching die or cutter, must be heated to a temperature near the softening point of the resin used for the prepreg so that the curing does not proceed extremely, and melted and adhered. Thus, the effect can be reduced. Further, in the case where a prepreg having a different dielectric constant is disposed in a portion where a part of the prepreg is removed, the end faces can be fused together by lamination and used as one prepreg. The portion from which a part of the prepreg is removed is not limited to one location, but may be many locations in one prepreg. Then, several types of prepregs having different dielectric constants can be used for the removed portions.
【０００６】[0006]
【実施例】以下に本発明の内容を具体的に述べるため実
施例を記すが、本発明はこれらに限定されるものではな
い。 （実施例１）エポキシ樹脂（油化シェルエポキシ株式会
社製商品名、エピコート１００１）に対しジシアンジア
ミドを０．８当量加え混含し樹脂ワニスとし、厚さ０．
１５ｍｍのガラス布（日東紡績株式会社製商品名 ＷＥ
Ａ１５）に厚みが０．１５５ｍｍになるように塗布乾燥
し、プリプレグを作製した（低誘電率プリプレグ、図１
（ａ）の１）。次にエポキシ樹脂（油化シェルエポキシ
株式会社製商品名、エピコート１００１）に対しジシア
ンジアミドを０．８当量加えた樹脂ワニス（樹脂固形分
１００重量部）に対しチタン酸ストロンチウム粉末（富
士チタン工業株式会社製）を１５０重量部加え均一つに
分散するように混含し厚さ０．１ｍｍのガラス布（目東
紡績株式会社製商品名、ＷＥ１１５Ｅ）に厚みが０．１
５５ｍｍになるように塗布乾燥し、プリプレグを作製し
た（高誘電率プリプレグ、図１（ａ）の２）。図１
（ａ）の１の低誘電率プリプレグと図１（ａ）の２の高
誘電率プリプレグを図１（ｂ）のように配置し、両側に
厚さ１８μｍの銅箔を配置し１７０℃、３ＭＰａで９０
分間加熱加圧成形して、同一平面において誘電率が異な
る絶縁体を有する銅張積層板を得た。得られた銅張積層
板の図１（ａ）の１の誘電率は、４．７であり、同じく
２の誘電率は１０．２であった。EXAMPLES The present invention will be described in more detail with reference to the following Examples, but it should not be construed that the invention is limited thereto. (Example 1) A resin varnish was prepared by adding 0.8 equivalent of dicyandiamide to an epoxy resin (trade name, manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat 1001) and mixing to obtain a resin varnish having a thickness of 0.
15mm glass cloth (trade name WE, manufactured by Nitto Boseki Co., Ltd.)
A15) was applied and dried to a thickness of 0.155 mm to prepare a prepreg, and a prepreg having a low dielectric constant (FIG. 1)
(A) 1). Next, strontium titanate powder (Fuji Titanium Industry Co., Ltd.) was added to a resin varnish (100 parts by weight of resin solid content) obtained by adding 0.8 equivalents of dicyandiamide to an epoxy resin (trade name, manufactured by Yuka Shell Epoxy Co., Ltd., Epicoat 1001). Was added so as to uniformly disperse the mixture into a glass cloth (trade name, WE115E, manufactured by Meto Boseki Co., Ltd.) having a thickness of 0.1 mm.
A prepreg was prepared by coating and drying to a thickness of 55 mm (high-permittivity prepreg, 2 in FIG. 1A). FIG.
A low-permittivity prepreg of (a) and a high-permittivity prepreg of 2 in FIG. 1 (a) are arranged as shown in FIG. 1 (b), copper foil having a thickness of 18 μm is arranged on both sides, and 170 ° C., 3 MPa At 90
After being heated and pressed for minutes, a copper-clad laminate having insulators having different dielectric constants on the same plane was obtained. The dielectric constant of 1 in FIG. 1 (a) of the obtained copper-clad laminate was 4.7, and the dielectric constant of 2 in the same manner was 10.2.
【０００７】（実施例２）実施例１で作製した低誘電率
プリプレグと高誘電率プリプレグを図２のように配置
し、両側に銅箔を配置し積層成形して、同一平面におい
て誘電率が異なる絶縁体を有する積層板を得た。(Embodiment 2) The low-permittivity prepreg and the high-permittivity prepreg prepared in Embodiment 1 are arranged as shown in FIG. A laminate having different insulators was obtained.
【０００８】（実施例３）実施例１で作製した低誘電率
プリプレグと高誘電率プリプレグを図３（ａ）、（ｂ）
に示したように配置し、その両側にガラス布エポキシ両
面銅張積層板の銅箔をエッチングにより回路加工した内
層板をそれぞれ積層成形して、同一平面において誘電率
が異なる絶縁体を有するプリント配線板を得た。同一平
面において誘電率が異なる絶縁体は、その端面同士が良
く接合しお互いの成分が混じり合い誘電率が一方から他
方の誘電率に徐々に変化していた。そのため誘電率が階
段のように極端に変化することなくインピーダンス、放
射、反射等の影響を防止することができた。(Embodiment 3) The low dielectric constant prepreg and the high dielectric constant prepreg produced in Example 1 are shown in FIGS. 3 (a) and 3 (b).
Printed wiring having insulators with different dielectric constants on the same plane, each of which is formed by laminating an inner layer board on both sides of which is processed by etching a circuit board by etching a copper foil of a glass cloth epoxy double-sided copper-clad laminate. I got a board. Insulators having different dielectric constants on the same plane had their end faces joined well, their components were mixed, and the dielectric constant gradually changed from one to the other. Therefore, the influence of impedance, radiation, reflection, etc. could be prevented without the dielectric constant changing extremely like a staircase.
【０００９】[0009]
【発明の効果】本発明で得られる銅張積層板及びプリン
ト配線板は従来の多層プリント配線板では不可能であっ
た、同一平面において誘電率が異なる絶縁体を有するこ
とを可能にした。 また、本発明による積層板は通常の
ガラス布エポキシ銅張積層板等と全く同様な工程でプリ
ント配線板へ加工が可能であることから工業的に有益で
ある。According to the present invention, the copper-clad laminate and the printed wiring board obtained by the present invention can have insulators having different dielectric constants on the same plane, which is impossible with a conventional multilayer printed wiring board. Further, the laminate according to the present invention is industrially useful because it can be processed into a printed wiring board in exactly the same process as a normal glass cloth epoxy copper clad laminate or the like.
【図１】（ａ）、（ｂ）は本発明の実施例を説明するた
めの構成図。FIGS. 1A and 1B are configuration diagrams for explaining an embodiment of the present invention.
【図２】（ａ）、（ｂ）は本発明の他の実施例を説明す
るための構成図。FIGS. 2A and 2B are configuration diagrams for explaining another embodiment of the present invention.
【図３】（ａ）、（ｂ）は本発明のさらに他の実施例を
説明するための構成図。FIGS. 3A and 3B are configuration diagrams for explaining still another embodiment of the present invention.
１．低誘電率のプリプレグ ２．高誘電率のプリプレグ ３．銅箔 ４．内層板 1. 1. Low dielectric constant prepreg 2. High dielectric constant prepreg Copper foil 4. Inner layer plate
Claims (3)
層板において、プリプレグの一部を除去し、その除去し
た部分に誘電率の異なる他のプリプレグを置き換え同一
平面に配置し、その両側に銅箔を配置し加熱加圧して得
られる銅張積層板。1. A copper-clad laminate obtained by laminating a copper foil and a prepreg, a part of the prepreg is removed, another prepreg having a different dielectric constant is replaced on the removed part, and the prepreg is placed on the same plane. A copper-clad laminate obtained by placing a copper foil on a plate and applying heat and pressure.
８以上のプリプレグを同一平面に配置する請求項１に記
載の銅張積層板。2. The copper clad laminate according to claim 1, wherein a prepreg having a dielectric constant of 5 or less and a prepreg having a dielectric constant of 8 or more are arranged on the same plane.
若しくは内層板と外層板の接着用プリプレグとして、プ
リプレグの一部を除去し、その除去した部分に誘電率の
異なる他のプリプレグを置き換え同一平面に配置し、そ
の両側に前記内層板又は外層板を配置し加熱加圧して得
られるプリント配線板。3. A part of the prepreg is removed as an adhesive prepreg for an inner layer board or an inner layer board or an inner layer board and an outer layer board for a multilayer printed wiring board, and the removed part is replaced with another prepreg having a different dielectric constant. A printed wiring board obtained by arranging the inner layer plate or the outer layer plate on both sides thereof on the same plane and applying heat and pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8003297A JPH10272732A (en) | 1997-03-31 | 1997-03-31 | Copper-clad laminate and printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8003297A JPH10272732A (en) | 1997-03-31 | 1997-03-31 | Copper-clad laminate and printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10272732A true JPH10272732A (en) | 1998-10-13 |
Family
ID=13706935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8003297A Pending JPH10272732A (en) | 1997-03-31 | 1997-03-31 | Copper-clad laminate and printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10272732A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003039587A (en) * | 2001-07-26 | 2003-02-13 | Matsushita Electric Works Ltd | Laminated sheet and multilayer sheet |
| JP2009060403A (en) * | 2007-08-31 | 2009-03-19 | Fujitsu Microelectronics Ltd | Radio apparatus and antenna provided in radio apparatus |
-
1997
- 1997-03-31 JP JP8003297A patent/JPH10272732A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003039587A (en) * | 2001-07-26 | 2003-02-13 | Matsushita Electric Works Ltd | Laminated sheet and multilayer sheet |
| JP2009060403A (en) * | 2007-08-31 | 2009-03-19 | Fujitsu Microelectronics Ltd | Radio apparatus and antenna provided in radio apparatus |
| US8026855B2 (en) | 2007-08-31 | 2011-09-27 | Fujitsu Semiconductor Limited | Radio apparatus and antenna thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3051700B2 (en) | Method of manufacturing multilayer wiring board with built-in element | |
| US6673190B2 (en) | Lasable bond-ply materials for high density printed wiring boards | |
| JP3236818B2 (en) | Method for manufacturing multilayer wiring board with built-in element | |
| JPH04196195A (en) | Multilayer printed circuit board having electromagnetic shield layer and incorporating printed resistor | |
| KR20010105375A (en) | Laminate for multi-layer printed circuit | |
| US6618238B2 (en) | Parallel plate buried capacitor | |
| US20040170795A1 (en) | Lasable bond-ply materials for high density printed wiring boards | |
| JPH09289128A (en) | Manufacture of multilayer board for printed coil | |
| US20020048137A1 (en) | Two-layered embedded capacitor | |
| JP4363947B2 (en) | Multilayer wiring circuit board and method for manufacturing the same | |
| JPH10272732A (en) | Copper-clad laminate and printed-wiring board | |
| EP0528963B1 (en) | Process for the production of a multilayer printed circuit board | |
| JP2985642B2 (en) | Manufacturing method of metal-clad laminate | |
| JP2576194B2 (en) | Manufacturing method of metal composite laminate | |
| JPH02244786A (en) | Composite board for printed circuit | |
| JPH10335834A (en) | Multilayer wiring board | |
| JP2002151854A (en) | Multilayer printed wiring board and manufacturing method therefor | |
| JPH07117174A (en) | Metal-foiled laminated plate and manufacture thereof | |
| JPH0316299Y2 (en) | ||
| JP2950969B2 (en) | Manufacturing method of laminated board | |
| JPS63199635A (en) | Laminated board | |
| JPH0584214B2 (en) | ||
| JPH01244851A (en) | Manufacture of electric laminate | |
| JPH06318782A (en) | Metal-based multilayer printed wiring board and manufacturing method thereof | |
| JPH0890713A (en) | Production of metal clad laminated sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040330 |
|
| A977 | Report on retrieval |
Effective date: 20060210 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060216 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060615 |