JPH10277748A - Plasma processing apparatus and processing method - Google Patents

Abstract

(57) [Abstract] [Purpose] To process a workpiece with high accuracy by a plasma arc or a plasma jet. In a plasma processing apparatus provided with a plasma torch 12 for generating a plasma arc or a plasma jet, the plasma processing apparatus is disposed at a position away from the plasma torch 12,
Image enlarging means 7 for enlarging the processing point of the workpiece 6 with an eye mark, and three-dimensional position adjustment for adjusting the position of the processing point of the workpiece 6 with respect to the eye mark of the image enlarging means 7 Means for clamping the workpiece 6 and the workpiece 6, the clamping means 5 being disposed on the three-dimensional position adjusting means 4, and the three-dimensional position adjusting means 4 being mounted thereon, and the image enlarging means 7. 1st set position on the side and the 2nd side on the plasma torch 11 side
Moving means 3 capable of moving the workpiece 6 between the first set position, first stopper means 13 for determining the first set position, and second stopper means 13 for determining the second set position.
And a stopper means 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma processing apparatus suitable for processing a workpiece made of a metal material or the like with high accuracy.

In general, a laser processing machine is used for processing metal materials with high precision such as welding or fine processing. In the case of laser welding, the welding point can be enlarged with a lens or the like, and the laser beam can be easily adjusted to the enlarged welding point, and the laser beam diameter can be sufficiently reduced. is there. But,
The biggest drawback of the laser beam processing device is that the cost is high.

[0003] For this reason, a plasma arc machine is often used when not very high accuracy is required, but a plasma arc or a plasma jet cannot be converged to a predetermined position by an optical lens. As shown in FIG. 5, the plasma torch P and the workpiece W
At present, processing is performed by visually aligning the position and the position of the plasma arc or plasma jet with the processing point.

[0004]

In such a method of visually aligning a plasma arc or a plasma jet to a processing point, a positioning accuracy of about ± 0.5 mm is a limit, for example, a range of about ± 0.02 mm. At the inner,
It is impossible to visually mark or weld a predetermined processing position on a workpiece with a plasma arc or a plasma jet.

[0005] Accordingly, in the present invention, the position of the workpiece is adjusted on the movable base such that the processing point of the workpiece matches the eye mark of the optical lens previously positioned at the position corresponding to the first set position. After performing the above, the moving table is moved to stop the workpiece at a position corresponding to the second set position, and the object is to perform high-precision processing using a plasma arc or a plasma jet.

[0006]

Means for Solving the Problems In order to solve the above-mentioned problems, according to a first aspect, in a plasma processing apparatus provided with a plasma torch for generating a plasma arc or a plasma jet, a position remote from the plasma torch is provided. Image enlarging means for enlarging a processing point of a workpiece provided with an eye mark, and adjusting a position of the processing point of the workpiece with respect to the eye mark of the image enlarging means. Three-dimensional position adjusting means, for clamping the workpiece, wherein the clamping means disposed on the three-dimensional position adjusting means and the three-dimensional position adjusting means are mounted, and Moving means capable of moving between a first set position on the enlargement means side and a second set position on the plasma torch side, and first stopper means for determining the first set position; And a second stopper means for deciding the second set position.

[0007] To solve the above-mentioned problem, a second
According to the invention, in a plasma processing apparatus provided with a plasma torch for generating a plasma arc or a plasma jet, an image for disposing a processing point on a workpiece to be processed is provided at a position distant from the plasma torch and provided with an eye mark. Magnifying means, three-dimensional position adjusting means capable of adjusting the position of the processing point of the workpiece with respect to the eye mark of the image magnifying means, and for clamping the workpiece, The plasma torch includes a clamp unit disposed on the three-dimensional position adjusting unit, the plasma torch and the image enlarging unit, and moves between a first set position and a second set position to form the plasma torch and the image torch. Moving means for selectively moving the image enlarging means to just below the workpiece;
And a second stopper for determining the second set position. The present invention provides a plasma processing apparatus characterized by comprising: a first stopper for determining the set position; and a second stopper for determining the second set position.

[0008] In order to solve the above-mentioned problem, a third
In the present invention, in any one of the first and second aspects, a means for engaging the moving means and the first stopper means and / or the moving means and the second stopper means is provided. It is intended to provide a plasma processing apparatus characterized by the following.

In order to solve the above-mentioned problem, a fourth
According to the invention, the moving means is guided by a guide means and linearly reciprocates between the first stopper means and the second stopper means. It is intended to provide a plasma processing apparatus characterized by the following.

[0010] In order to solve the above-mentioned problems, a fifth
According to the invention, in any one of claims 1 and 2, the moving means rotates between the first stopper means and the second stopper means by rotating a center axis of a center shaft, and An object of the present invention is to provide a plasma processing apparatus characterized by selectively moving a plasma torch and the image enlarging means to the workpiece.

[0011] In order to solve the above-mentioned problem, the sixth
According to the invention, there is provided a plasma processing apparatus according to any one of claims 1 to 5, wherein the image enlarging means is supported by a first supporting means whose position can be adjusted. is there.

[0012] In order to solve the above-mentioned problems, a seventh
According to the invention, there is provided a plasma processing apparatus according to any one of claims 1 to 6, wherein the plasma torch is supported by a second support means capable of adjusting its position. .

[0013] To solve the above-mentioned problem, an eighth
According to the invention, in a method of processing a workpiece with high accuracy by a plasma arc or a plasma jet generated from a plasma torch of a plasma processing apparatus, a processing point of the workpiece is set at a position corresponding to a first set position. The position of the workpiece or the image enlarging means is adjusted so that the eye mark of the image enlarging means located at a position distant from the plasma torch, and then the workpiece or the plasma torch is A plasma processing method characterized by processing the workpiece by the plasma arc or the plasma jet in a state where the workpiece is stopped after being moved to a position corresponding to a second set position.

In order to solve the above-mentioned problem, a ninth
In the invention of claim 8, in claim 8, before processing the workpiece, at a position corresponding to the second set position, a mark is applied to a positioning work by a plasma arc or a plasma jet of the plasma torch, After adjusting the position of the image enlarging means so that the eye mark of the image enlarging means matches the mark of the positioning work at a position corresponding to the first set position, the image enlarging means or the image enlarging means An object of the present invention is to provide a plasma processing method characterized by fixing a position of a workpiece.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment for carrying out the present invention will be described with reference to FIG. In FIG. 1, this plasma processing apparatus mainly includes a base member 1, a guide rail 2 fixed on the base member 1, a movable base 3 capable of moving the guide rail 2 in both directions, and mounted and fixed on the movable base 3. A conventional three-dimensional position adjusting device 4, a clamp device 5 mounted on the three-dimensional position adjusting device 4 and clamping a workpiece 6, a magnifying mirror comprising a single optical lens or a combination of a plurality of optical lenses And a first bearing post 8A, and a first bearing arm 8B attached to the first bearing post 8A so as to be able to pivot within a certain angle range with respect to this post and to be able to expand and contract vertically. , First support means 8 for supporting image enlarging means 7, first support arm 8B
A position adjusting means 9 for adjusting the position of the image enlarging means 7 in the vertical direction (Z direction), a second support post 10A, and a pivot within a certain angle with respect to this post. A second support arm 10B mounted so as to be able to move up and down and expand and contract. The second support means 10 for supporting the plasma torch 11 is fixed to the tip of the second support arm 10B. A height detecting probe 12 for positioning the height of the workpiece 6 and first and second stopper means 13 and 14 for determining a stop position of the moving table 3 are provided.

The guide rail 2 and the movable base 3 can be configured using a well-known linear drive bearing device or the like. The three-dimensional position adjusting device 4 manually adjusts the adjustment handles 4A, 4B, 4C in the respective directions perpendicular to each other, thereby changing the position of the workpiece 6 clamped by the clamp device 5 in the X, Y, and Z directions. Can be adjusted. The image enlarging means 7, the plasma torch 11, the first stopper means 13, and the second stopper means 14 are each set in advance by visual observation.

First, before processing, a positioning work corresponding to the workpiece 6 is clamped by the clamp device 5,
As shown in FIG. 1B, the right side wall of the movable base 3 in the drawing is brought into contact with the second stopper means 14. At this time, if the right side wall of the movable base 3 in the drawing and the surface facing the second stopper means 14 are apart from each other, accurate positioning described later cannot be performed, so that the movable base 3 needs to be securely contacted. Therefore,
Permanent magnets may be embedded in either one of the surfaces, or permanent magnets of opposite polarity may be embedded in both surfaces. However, in this embodiment, a commercially available mechanical engagement as shown in FIG. Means A and B were used.

The first engagement means A and the second engagement means B are used in pairs, and the first engagement means A is provided with screws on the front surface and the rear surface of the movable base 3 using the screw holes A1. When being stopped, the second engagement means B is screwed to the opposing surfaces of the stopper means 13 and 14 using the screw holes B1. The first engagement means A includes balls A2 and A in the central recess a between the projections A2 and A3 from the side surfaces of the projections A2 and A3.
The top of 3 is protruding. These balls are convex A4 and A
5 by a spring (not shown) embedded in the central recess a.
When an external force acts to widen the distance between the balls A4 and A5, the balls A4 and A5 retreat, and when the external force is removed, the balls A4 and A5 again project into the central recess a.

The second engagement means B includes balls A4 and A5
Has a partially spherical convex portion B2 at the center of the rectangular plate that conforms to the shape of the central concave portion a from which the top portion protrudes. Convex part B
The top B3 of the projection B2 is flat when the first engagement means A and the second engagement means B are engaged.
3 is the bottom surface a1 of the central recess a of the first engagement means A.
Abut. The maximum width of the convex portion B2 is slightly smaller than the width of the central concave portion a.
The width is narrowed in a shape compatible with A4 and A5.

The first engaging means A having such a structure
When the second engaging means B and the second engaging means B receive an external force in a direction in which they relatively match, the convex portion B2 of the second engaging means B enters the central recess a of the first engaging means A, and B2 and ball A2 and A3
Due to the shape of the above, a force perpendicular to the traveling direction of the convex portion B2 acts on the balls A2 and A3, and the balls A2 and A3 retreat into the convex portions A2 and A3, respectively, against the force of a spring (not shown), The flat surface of the top B3 of the projection B2 of the second engagement means B abuts on the bottom surface a1 of the central recess a of the first engagement means A. In this state, the balls A4 and A4 are
5 sandwiches the base portion B4 of the projection B2 from both sides, and presses the first engagement means A in the direction of the bottom surface a1 of the central recess a. Therefore, as long as no external force is applied between the first engaging means A and the second engaging means B in the direction of separating them, the flat surface of the top B3 of the convex part B2 is on the bottom surface a1 of the central concave part a. Stay in contact.

As described above, the right side wall of the movable base 3 in the drawing is
The plasma processing apparatus is operated in a state in which the first engagement means A and the second engagement means B are engaged with each other so as to abut against the stopper means 14 of FIG. Next, by moving the second support arm 10B up and down with respect to the second support post 10A, expanding and contracting it, and turning it horizontally, the plasma torch 11 is generated in a state where a plasma arc or a plasma jet is generated. Is aligned with the positioning work clamped by the clamp device 5, and a mark is made on the positioning work by the heat of the plasma arc or plasma jet. At this time, the positioning work may not be the same as the workpiece, but using the same workpiece as the workpiece so that the plasma arc or plasma jet is visually marked near the processing point. It is more convenient to fix the second stopper means 14 and to adjust and set the position of the plasma torch 11 because not only the plasma torch 11 but also the image enlarging means 7 can be positioned by fine adjustment.

Next, the moving table 3 is moved along the guide rail 2.
Is moved to the left side in the figure, and the left side wall of the movable base 3 is engaged with the first stopper means 13 as described above. In this state, the second support arm 10B of the first support means 8 is
By pivoting and expanding and contracting the support post 10A horizontally in the horizontal direction and adjusting the height from the knob 9A of the position adjustment mechanism 9, the eye mark provided at the center of the image enlarging means 7 can be changed to a plasma torch. 11 is used to match the mark on the positioning work. By setting the image magnifying means 7 at this position, on the contrary, if the positional relationship between the movable base 3 and the stopper means 13 and 14 is as described above, the point matching the eye mark of the image magnifying means 7 is the plasma arc. Or it will match the plasma jet.

After positioning in this way, the image magnifying means 7, the plasma torch 11, and the first and second stopper means 13 and 14 must not be moved. In that state,
The workpiece 6 is clamped by the clamping means 5 mounted on the three-dimensional position adjusting device 4 on the moving table 3, and the left side wall of the moving table 3 is fixed to the first stopper means 13 as shown in FIG. To be engaged. Next, the workpiece 6 clamped by the clamping means 5 is magnified and viewed through the image enlarging means 7,
By adjusting the adjustment handles 4A, 4B, and 4C in the X, Y, and Z directions of the three-dimensional position adjustment device 4, the processing point of the workpiece 6 matches the eye mark (not shown) of the image enlarging means 7.

Thereafter, the movable table 3 is moved rightward in the drawing along the guide rail 2, and the right side wall of the movable table 3 is engaged with the second stopper means 14 as shown in FIG. In this state, the processing point of the workpiece 6 clamped by the clamping means 5 always matches the plasma arc or the plasma jet generated from the plasma torch 11, so that the plasma arc or the plasma jet is thereafter discharged from the plasma torch 11. When the workpiece 6 is generated and processed, the processing point 6a can be welded with very high accuracy as shown in FIG.

With respect to the positioning in the Z direction, that is, the height direction of the workpiece, the Z direction changes depending on the depth of focus of the lens. Therefore, the distance between the processing point 6a and the tip of the plasma torch 11 is usually 0.3. , The height detection probe 12 is provided so that the tip 12 a of the height detection probe 12 is located about 0.3 to 3 mm below the tip of the plasma torch 11 and above the guide rail 2. good. In this case, first, the height of the workpiece 6 is adjusted so that the tip of the height detection probe 12 is in contact with the tip of the height detection probe 12, and the horizontal direction of the three-dimensional position adjustment device 4 is passed through the image enlarging means 7. By adjusting the adjustment handles 4A and 4B in the X and Y directions, the processing point of the workpiece 6 is matched with the eye mark (not shown) of the image enlarging means 7. By providing the height detection probe 12 in this manner, the distance between the tip of the plasma torch 11 and the processing point of the workpiece 6 can be reliably set within a predetermined range.

In the above-described embodiment, the engaging means as shown in FIG. 2 is used. However, a suction port is provided on the stopper means side, and a structure for sucking the side wall of the moving table, or the moving table is used. Various mechanisms are conceivable for mechanically engaging such as a structure for pressing the stopper against the stopper means. Further, a sensor device that issues an alarm when the movable table is not in contact with the stopper means may be provided without such an engaging means.

Next, another embodiment will be described with reference to FIG. In the above embodiment, the moving table 3 linearly moves, whereas the moving table 3 rotates around a central shaft 16 fixed to a fixed table 15 fixed to the base member 1 with a small external force by a bearing device 17. I can do it. The rotational movement of the carriage 3 is controlled by the first and second stopper means 1.
Limited by 3 and 14. The operation and the like are the same as those in the above-described embodiment except that the movable base 3 rotates, and thus the description thereof is omitted.

Although not shown, the workpiece is moved in any of the above embodiments. However, when the entire apparatus is small, the workpiece is fixed and the image enlarging means and the plasma torch are moved. Even if it is made to function, it can function in exactly the same way. In this case, the three-dimensional position adjusting device is fixed, the clamp device is mounted thereon, and the workpiece is clamped by the clamp device. The rotatable bearing shaft is provided with two bearing arms having substantially the same length, and the image enlarging means and the plasma arc torch are respectively attached to the bearing arms, and the image enlarging means and the plasma arc torch are rotated by rotating the bearing shaft. What is necessary is just to selectively move right above a workpiece. Further, in the above embodiment, the three-dimensional position adjusting device may be fixed and the base member may be rotated.

[0029]

As described above, according to the present invention, the position is adjusted so that the processing point of the workpiece matches the eye mark of the image enlarging means positioned in advance at the position corresponding to the first set position. After performing, the plasma torch or the workpiece is stopped at the position corresponding to the second set position, and is processed by the heat of the plasma arc or the plasma jet, and thus corresponds to the first set position away from the plasma torch. High-precision processing can be performed only by positioning the workpiece at the position where the processing is performed.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a first embodiment of the present invention.

FIG. 2 shows one of mechanical engagement means for explaining the present invention.
It is a figure showing an example.

FIG. 3 is a diagram for explaining a second embodiment of the present invention.

FIG. 4 is a diagram for explaining an embodiment of the present invention.

FIG. 5 is a view for explaining conventional plasma processing.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base member, 2 ... Guide rail 3 ... Moving table 4 ... 3D position adjustment device 5 ... Clamping device, 6 ... Workpiece 7 ... Image enlargement means, 8 first support means 9 position adjustment mechanism 10 second support means 11 plasma torch 12 height detecting probe 13 first stopper means , 14 ... second
Stopper means 15 ... fixed base 16 ... center shaft 17 ... bearing device A ... first engagement means B ... second engagement means

Claims (9)

[Claims] 1. A plasma processing apparatus having a plasma torch for generating a plasma arc or a plasma jet, the plasma processing apparatus being disposed at a position distant from the plasma torch and having an eye mark for enlarging a processing point of a workpiece. Image magnifying means; three-dimensional position adjusting means capable of adjusting the position of the processing point of the workpiece with respect to the eye mark of the image magnifying means; and clamping the workpiece. A clamping unit disposed on the three-dimensional position adjusting unit; and a three-dimensional position adjusting unit, the first setting position on the image magnifying unit side and the second setting position on the plasma torch side. Moving means that can move between the first and second setting positions; first stopper means for determining the first set position; and second stopper means for setting the second set position. A plasma processing apparatus. 2. A plasma processing apparatus having a plasma torch for generating a plasma arc or a plasma jet, the plasma processing apparatus being provided at a position distant from the plasma torch and having an eye mark for enlarging a processing point of a workpiece. Image magnifying means; three-dimensional position adjusting means capable of adjusting the position of the processing point of the workpiece with respect to the eye mark of the image magnifying means; and clamping the workpiece. And a clamp unit disposed on the three-dimensional position adjusting unit; and a plasma torch and the image magnifying unit. The plasma torch moves between a first set position and a second set position. Moving means for selectively moving the image enlarging means to a position directly below the workpiece; first stopper means for determining the first set position; and second set position And a second stopper means for determining the condition. 3. The apparatus according to claim 1, further comprising: means for engaging said moving means with said first stopper means and / or engaging said moving means with said second stopper means. A plasma processing apparatus characterized by the above-mentioned. 4. The apparatus according to claim 1, wherein the moving means is guided by a guide means and linearly reciprocates between the first stopper means and the second stopper means. A plasma processing apparatus characterized by the above-mentioned. 5. The device according to claim 1, wherein the moving means rotates about a central axis of a center shaft to rotate between the first stopper means and the second stopper means. A plasma processing apparatus for selectively moving the plasma torch and the image enlarging means to the workpiece. 6. The plasma processing apparatus according to claim 1, wherein said image enlarging means is supported by first supporting means whose position can be adjusted. 7. The plasma processing apparatus according to claim 1, wherein the plasma torch is supported by a second supporting means capable of adjusting a position of the plasma torch. 8. A method for processing a workpiece with high accuracy by a plasma arc or a plasma jet generated from a plasma torch of a plasma processing apparatus, wherein the workpiece is processed at a position corresponding to a first set position. The position of the workpiece or the image enlarging means is adjusted so that a point coincides with the eye mark of the image enlarging means located at a position distant from the plasma torch. Thereafter, the workpiece or the plasma torch is adjusted. The second
And processing the workpiece by the plasma arc or the plasma jet in a state where the workpiece is stopped after being moved to a position corresponding to the set position. 9. The method according to claim 8, wherein before processing the workpiece, a mark is formed on a positioning work at a position corresponding to the second set position using a plasma arc or a plasma jet of the plasma torch. After adjusting the position of the image enlarging means so that the eye mark of the image enlarging means matches the mark of the positioning work at a position corresponding to the first set position, the image enlarging means or A plasma processing method, wherein the position of the workpiece is fixed.