JPH1027814A - Resin-sealed semiconductor device, resin-sealing method thereof, and resin-sealing mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the yield by eliminating the voids and unfilling by making the injection speed of a resin injected into a mold cavity substantially uniform at upper and lower positions sandwiching a semiconductor element. The present invention provides a resin-sealed semiconductor device, a resin-sealing method for the same, and a resin-sealing mold. SOLUTION: There are two upper and lower molds 12 and 13 forming a mold cavity 11 in which the semiconductor element 2 for sealing is arranged by being clamped to each other, and the mold is heated and melted in the mold cavity 11. The sealing resin material 6 is filled and solidified to obtain the resin-sealed semiconductor device 1. The sealing resin material 6 injected into the mold cavity 11 is sealed on the inner surface of the lower mold 12. A convex portion 16 for controlling the speed of flowing into the lower side of the stopping semiconductor element 2 is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-sealed semiconductor device, a resin-sealing method therefor, and a resin-sealing mold.

[0002]

2. Description of the Related Art Conventionally, there is a resin-encapsulated semiconductor device in which a semiconductor element, a thin metal wire, or the like is covered with a resin material to protect it from external stress, moisture, and contamination.

FIGS. 5 and 6 show an example of a resin-sealed semiconductor device. FIG. 5 is an external perspective view of the semiconductor device, and FIG. 6 is a sectional view taken along line BB of FIG. 5 and 6, the resin-encapsulated semiconductor device 51 is a LOC (Lead On Chip).
The semiconductor element 52 is fixed to a lead frame 54 via an insulating adhesive tape 53, and the semiconductor element 52 and the lead frame 54 are connected by a thin metal wire 55. In order to protect the thin metal wire 55, the structure is sealed with an epoxy resin 56.

FIG. 7 shows a conventional mold structure for resin sealing. This mold structure includes a lower mold 62 and an upper mold 63 which are clamped to each other to form a mold cavity 61 therein, and a mold cavity 61 is provided between the lower mold 62 and the upper mold 63. Epoxy resin 56 for sealing inside
A gate 64 for injecting (see FIGS. 5 and 6) is provided. The lower mold 62 is provided with an ejector pin 65 for detaching the semiconductor device 51 from the lower mold 62 after resin sealing. This ejector pin 65
Is projected from the lower mold 62 into the mold cavity 61,
The semiconductor device 51 is ejected from the lower mold 62 by this protrusion.

When the semiconductor element 52 and the like are sealed with this mold structure, first, the semiconductor element 52 is sealed with an insulating adhesive tape 53.
And the semiconductor device 52 and the lead frame 54 are fixed with a thin metal wire 55.
In a state where the upper mold 63 and the lower mold 62 are connected to each other, the lower mold 62 and the upper mold 63 are clamped. FIG. 7 shows this state. Next, the gate 64
The molten epoxy resin 56 is injected into the mold cavity 61 through the through hole and solidified. Once solidified,
The mold clamping between the lower mold 62 and the upper mold 63 is released, and the ejector pins 65 are projected into the mold cavity 61 and discharged. Thus, a resin-sealed semiconductor device 51 sealed with the epoxy resin 56 shown in FIGS. 5 and 6 is formed.

In this semiconductor device 51, the upper and lower surfaces of the package (epoxy resin 56) are each formed in a plane. The epoxy resin 56 injected into the mold cavity 61 easily flows below the semiconductor element 52 and hardly flows above it. For this reason, the injection speed is different between the upper and lower portions, and voids that form bubbles on the surface of the molded article or inside the resin and unfilled portions are likely to occur. Therefore, it is conceivable to change the thickness of the package up and down to make the injection speed the same at the top and bottom. However, since there is a uniform standard for the thickness t of the package, it is difficult to change the thickness easily.

[0007]

As described above, in the semiconductor device 51 having the conventional structure, the epoxy resin 56 injected into the mold cavity 61 easily flows below the semiconductor element 52 and flows upward. Hateful. For this reason, the injection speed differs between the top and bottom, and voids and unfilled parts are likely to occur,
There was a problem that the yield was poor.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to make the injection speed of a resin injected into a mold cavity substantially uniform at upper and lower positions sandwiching a semiconductor element. It is an object of the present invention to provide a resin-encapsulated semiconductor device, a resin-encapsulation method, and a resin-encapsulation mold capable of eliminating voids and unfilling and improving the yield.

[0009]

In order to achieve the above object, the present invention is characterized in that a resin-sealed semiconductor device employs the following technical means. That is, in a resin-sealed semiconductor device in which a semiconductor component is sealed with a resin material,
The resin sealing portion has a surface provided with a recess for controlling the filling speed used when the resin forming the resin sealing portion is injected into the mold cavity.

[0010] In order to achieve the above object, the present invention provides
As a resin sealing method, the following technical means are employed. That is, the sealing semiconductor element is mounted and arranged in a mold cavity which is closed by closing at least two upper and lower molds, and thereafter, a sealing resin material which is melted by heating is injected into the mold cavity. In a resin sealing method of filling and solidifying to obtain a resin-sealed semiconductor device, a convex portion is provided on one of inner surfaces of an upper mold and a lower mold forming the mold cavity, and injected into the mold cavity. The speed at which the sealing resin material flows above and below the sealing semiconductor element is controlled by the convex portion.

Further, in order to achieve the above object, the present invention is characterized in that the following technical means are taken as a resin sealing method. That is, the mold cavity has at least two upper and lower molds that form a mold cavity in which a sealing semiconductor element is disposed, and the mold cavity is filled with a heat-melted sealing resin material. In the resin sealing mold that is solidified to obtain a resin-sealed semiconductor device, the sealing resin material injected into the mold cavity is sealed on one of the inner surfaces of the upper and lower molds. And a convex portion for controlling the speed of flowing into the upper and lower sides of the semiconductor device.

According to this, the convex portion provided on the upper or lower mold forming the concave portion on one surface side of the resin sealing portion,
Partially narrow the space inside the mold cavity when molding the semiconductor element, and by narrowing this space, the speed at which the sealing resin material flows into the space between the semiconductor element and the mold is reduced. It is possible to adjust the filling speed.

[0013]

2 and 3 show an embodiment of a resin-sealed semiconductor device according to the present invention. FIG.
3 is a cross-sectional view taken along line AA of FIG. 3, and FIG. 3 is an external perspective view of the device. 2 and 3, the resin-encapsulated semiconductor device 1 is of a LOC (Lead On Chip) structure type, in which a semiconductor element 2 is fixed to a lead frame 4 via an insulating adhesive tape 3 and a semiconductor element. 2 and the lead frame 4 are connected by a thin metal wire 5 and further sealed (packaged) with an epoxy resin 6 to protect the internal semiconductor element 2 and the thin metal wire 5. Further, on the lower surface of the package (epoxy resin 6) on the lower side of the semiconductor element 2, a groove-shaped concave portion 7 for adjusting the filling speed is formed at a substantially central portion thereof. This recess 7
As described later, when the epoxy resin 6 forming the package is injected into the mold cavity 11 (see FIG. 1), the speed at which the epoxy resin 6 spreads in the mold cavity 11 (see FIG. 1) That is, the filling speed is made substantially the same between the upper and lower sides of the semiconductor element 2. Therefore, the size (area) and depth of the concave portion 7 are set in consideration of the type and viscosity of the resin (the epoxy resin 6 in this embodiment) to be filled. However, preferably, the dimension t (see FIG. 2) of the resin sealing layer below the semiconductor element 2 must be provided at 0.1 mm or more.
The area is set to be equal to or smaller than the area of the semiconductor element 2.

FIG. 1 is a longitudinal sectional side view showing a state in which a mold structure for resin-sealing the resin-sealed semiconductor device shown in FIGS. 2 and 3 is clamped. In FIG.
This mold structure includes a lower mold 12 and an upper mold 13 which are clamped to each other to form a mold cavity 11 therein, and a mold cavity 1 is provided between the lower mold 12 and the upper mold 13.
A gate 14 for injecting the epoxy resin 6 for sealing is provided in 1. The lower mold 12 is provided with an ejector pin 15 for detaching the semiconductor device 1 from the lower mold 12 after resin sealing. Further, the lower mold 12 is provided with a convex portion 16 formed at a central portion thereof so as to protrude into the mold cavity 11. The convex portion 16 is for forming the concave portion 7 in the resin-sealed semiconductor device 1 shown in FIGS. 2 and 3, and corresponds to the concave portion 7.

Next, when the semiconductor element 2 and the like are sealed with a resin using the mold structure, the semiconductor element 2 is first fixed to the lead frame 4 via the insulating adhesive tape 3 and the semiconductor element 2 and the lead frame are fixed. 4 are connected between the lower mold 12 and the upper mold 13 in a state where they are connected by the thin metal wire 5, and then the lower mold 12 and the upper mold 13 are clamped.
FIG. 1 shows this state. Next, the epoxy resin 6 melted into the mold cavity 11 through the gate 14 is injected and solidified. At this time, since the convex portion 16 for adjusting the filling speed is formed in the mold cavity 11, the convex portion 16
The speed at which the epoxy resin 6 spreads, that is, the filling speed, is controlled so that the upper and lower sides of the semiconductor element 2 are substantially the same. As a result, defects such as voids and non-filling can be reduced in this resin filling. When the resin filling is completed and solidified, the mold clamping between the lower mold 12 and the upper mold 13 is released, and the ejector pin 15 is further moved to the mold cavity 11.
The semiconductor device 1 is ejected so as to protrude inside. Then, the resin-sealed semiconductor device 1 having the concave portion 7 sealed with the epoxy resin 6 as shown in FIGS. 2 and 3 is obtained.

FIG. 4 is a longitudinal sectional side view showing another embodiment of a mold structure for resin-sealing the resin-sealed semiconductor device shown in FIGS. 2 and 3 in a state where the mold is clamped. . Also,
In FIG. 4, components denoted by the same reference numerals as those in FIGS. 1 to 3 indicate the same components as those in FIGS. In FIG. 4, this mold structure is composed of a lower mold 12 and an upper mold 13 which are mutually clamped to form a mold cavity 11 therebetween. Is provided with a gate 14 for injecting the epoxy resin 6 for sealing into the mold cavity 11. Further, the lower mold 12 is provided with ejector pins 15 for detaching the semiconductor device 1 from the lower mold 12 after resin sealing.

In addition, the lower die 12 is provided with a movable member 26 having a convex portion 26a at the front end projecting into the mold cavity 11 at the center thereof. The convex portion 26a of the movable member 26 is for forming the concave portion 7 in the resin-sealed semiconductor device 1 shown in FIGS. 2 and 3, and corresponds to the concave portion 7. The movable member 26 is movable in the vertical direction with respect to the lower mold 12, and has a structure in which the depth of the concave portion 7 can be switched by changing the amount of protrusion. That is, in this structure, when the amount of protrusion is changed depending on the type and viscosity of the resin, the speed at which the epoxy resin 6 spreads in the mold cavity 11, that is, the filling speed becomes substantially the same between the upper and lower sides of the semiconductor element 2. , And defects such as voids and unfilling can be further reduced. Further, the movable member 2
A plurality 6 of different shapes such as the shape of the convex portion 26a are prepared, and these can be exchanged for the lower mold 12. By changing the movable member 26 according to the shape and size of the package, the filling speed can be controlled while forming the concave portion 7 suitable for the package. Therefore, this modified example can be used even when a package having a slightly different shape is formed, and the versatility is improved.

Next, when resin molding is performed by using the mold structure in this modification, a movable member 26 suitable for the resin molding is selected, and the convex portion 26a is projected into the mold cavity 11. It is set in the state where it was set. Next, while the semiconductor element 2 is fixed to the lead frame 4 via the insulating adhesive tape 3, and the semiconductor element 2 and the lead frame 4 are connected by the thin metal wire 5,
2 and the upper mold 13 and then the lower mold 12 and the upper mold 1
3 and clamp the mold. FIG. 4 shows this state. Thereafter, the epoxy resin 6 melted into the mold cavity 11 through the gate 14 is injected and solidified. At this time, since the convex portion 26a for adjusting the filling speed is formed in the mold cavity 11, the speed at which the epoxy resin 6 spreads in the mold cavity 11, that is, the filling speed is increased by the convex portion 26a. It is controlled so that it is substantially the same in the upper and lower sides of the two. As a result, defects such as voids and non-filling can be reduced in this resin filling. When resin filling is completed and solidified, lower mold 1
The mold clamping between the upper mold 13 and the upper mold 13 is released, and the ejector pins 15 are further projected into the mold cavity 11 so that the semiconductor device 1
To discharge. As a result, the resin-sealed semiconductor device 1 having the concave portion 7 sealed with the epoxy resin 6 as shown in FIGS. 2 and 3 is obtained.

In the above embodiment, the configuration in which the concave portion 7 for adjusting the filling speed is provided on the lower surface side of the semiconductor device 1 has been disclosed. However, the filling speed in the mold cavity 11 during molding is such that the semiconductor element 2 is sandwiched. If necessary, the recess 7 may be formed on the upper surface side of the semiconductor element 2 as long as it is controlled to be substantially the same in the upper and lower directions.

[0020]

As described above, according to the present invention,
A convex portion provided on the upper or lower mold forming a concave portion on one surface side of the resin sealing portion partially narrows a space in a mold cavity at the time of molding a semiconductor element, and narrows this space to form a sealing resin. Since the speed at which the material flows into the space between the semiconductor element and the mold is suppressed, and the filling speed is adjusted above and below the semiconductor element so as to be substantially uniform,
It is possible to expect effects such as an improvement in yield by eliminating voids and unfilling.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional side view showing one embodiment of a mold structure according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 3;

FIG. 3 is an external perspective view of a resin-sealed semiconductor device according to the present invention.

FIG. 4 is a vertical sectional side view showing a modified example of the mold structure according to the present invention.

FIG. 5 is an external perspective view of a conventional resin-encapsulated semiconductor device.

FIG. 6 is a sectional view taken along line BB of FIG. 5;

FIG. 7 is a view showing a conventional mold structure for resin sealing.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin-sealed semiconductor device 2 Semiconductor element 6 Epoxy resin (package) 7 Concave part 11 Mold cavity 12 Lower mold 13 Upper mold 16 Convex part 26 Movable member 26a Convex part

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location H01L 23/28 H01L 23/28 ZJ // B29K 105: 20

Claims (7)

[Claims] In a resin-sealed semiconductor device in which a semiconductor component is sealed with a resin material, a resin forming the resin-sealed portion is injected into a mold cavity on one surface of the resin-sealed portion. A resin-encapsulated semiconductor device provided with a concave portion for controlling a filling speed used in the semiconductor device. 2. The resin-sealed semiconductor device according to claim 1, wherein the recess is provided on a lower surface of the resin-sealed portion. 3. A sealing resin which is mounted and arranged in a mold cavity which is closed by closing at least two upper and lower molds, and thereafter, the sealing resin melted by heating in the mold cavity. In a resin sealing method of injecting and filling a material and solidifying to obtain a resin-sealed semiconductor device, a convex portion is provided on one of inner surfaces of upper and lower molds forming the mold cavity, and the mold cavity is provided. A resin sealing method, wherein the speed at which the sealing resin material injected into the semiconductor device flows into the upper and lower sides of the semiconductor device for sealing is controlled by the projections. 4. An encapsulating semiconductor element is mounted and arranged in a mold cavity which is closed by closing at least two upper and lower molds, and thereafter the encapsulating resin melted by heating in the mold cavity. In a resin sealing method of injecting and filling a material and solidifying to obtain a resin-sealed semiconductor device, a convex portion is provided on an inner surface of a lower mold forming the mold cavity, and is injected into the mold cavity. A resin sealing method, wherein the speed at which the sealing resin material flows under the sealing semiconductor element is controlled by the projections. 5. A sealing resin which has at least two upper and lower dies forming a mold cavity in which a semiconductor element for sealing is arranged by being clamped to each other, and which is heated and melted in the mold cavity. In a resin sealing mold in which a material is filled and solidified to obtain a resin-sealed semiconductor device, the sealing resin material injected into the mold cavity is provided on one of inner surfaces of the upper and lower molds. A resin-sealing mold having a convex portion for controlling a speed of flowing into the upper and lower sides of the semiconductor device for sealing. 6. A sealing resin which has at least two upper and lower molds which form a mold cavity in which a semiconductor element for sealing is arranged by being clamped to each other, and which is heated and melted in the mold cavity. In a resin-sealing mold in which a material is filled and solidified to obtain a resin-sealed semiconductor device, the sealing resin material injected into the mold cavity is provided on an inner surface of the lower mold. A resin sealing mold having a convex portion for controlling a speed of flowing into a lower side of a semiconductor element. 7. The resin sealing mold according to claim 6, wherein the projection is provided separately from the lower mold and movably.