JPH10279716A - Flame-resistant phenolic resin laminate - Google Patents
Flame-resistant phenolic resin laminateInfo
- Publication number
- JPH10279716A JPH10279716A JP8981397A JP8981397A JPH10279716A JP H10279716 A JPH10279716 A JP H10279716A JP 8981397 A JP8981397 A JP 8981397A JP 8981397 A JP8981397 A JP 8981397A JP H10279716 A JPH10279716 A JP H10279716A
- Authority
- JP
- Japan
- Prior art keywords
- phenolic resin
- flame
- resin
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 46
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 34
- 239000003063 flame retardant Substances 0.000 claims abstract description 21
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 229920003180 amino resin Polymers 0.000 claims abstract description 9
- 229920003986 novolac Polymers 0.000 claims abstract description 7
- -1 phosphate ester Chemical class 0.000 claims abstract description 5
- 239000011134 resol-type phenolic resin Substances 0.000 claims abstract description 5
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 4
- 239000010452 phosphate Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 2
- 238000004080 punching Methods 0.000 abstract description 11
- 229910052736 halogen Inorganic materials 0.000 abstract description 6
- 150000002367 halogens Chemical class 0.000 abstract description 6
- 238000000465 moulding Methods 0.000 abstract 1
- 238000005476 soldering Methods 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 13
- 239000000123 paper Substances 0.000 description 13
- 239000002966 varnish Substances 0.000 description 12
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical group OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 7
- 229920000877 Melamine resin Polymers 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000004640 Melamine resin Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 229920003987 resole Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- MBHRHUJRKGNOKX-UHFFFAOYSA-N [(4,6-diamino-1,3,5-triazin-2-yl)amino]methanol Chemical compound NC1=NC(N)=NC(NCO)=N1 MBHRHUJRKGNOKX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- ASMQGLCHMVWBQR-UHFFFAOYSA-M diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)([O-])OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-M 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、耐水性、打抜き加
工性の良好な難燃性フェノール樹脂積層板に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flame-retardant phenol resin laminate having good water resistance and good punching workability.
【０００２】[0002]
【従来の技術】電子機器などに搭載される印刷回路用基
板として紙基材フェノール樹脂積層板が多用されてい
る。この紙基材フェノール樹脂積層板において、紙基材
に含浸されるフェノール樹脂としては、打抜き加工性向
上のために乾性油又は半乾性油で変性したフェノール樹
脂が用いられている。更に、紙基材フェノール樹脂積層
板に難燃性を付与するために、フェノール樹脂にリン系
難燃剤、ハロゲン系難燃剤を添加する方法が知られてい
る。しかし、ハロゲン系難燃剤は公害上の問題からその
使用量の削減または不使用が求められている。一方、リ
ン系難燃剤は添加量を多くすると難燃性は向上するが、
打ち抜き加工性及び半田耐熱性が低下するという問題が
生じてくる。2. Description of the Related Art Paper-based phenolic resin laminates are frequently used as substrates for printed circuits mounted on electronic equipment and the like. In this paper-based phenolic resin laminate, as the phenolic resin impregnated in the paper-based material, a phenolic resin modified with a drying oil or a semi-drying oil is used to improve punching workability. Further, a method of adding a phosphorus-based flame retardant and a halogen-based flame retardant to a phenol resin in order to impart flame retardancy to a paper base phenol resin laminate is known. However, the use of halogen-based flame retardants is required to be reduced or not used due to pollution problems. On the other hand, as the phosphorus-based flame retardant increases, the flame retardancy improves,
A problem arises in that the punching workability and solder heat resistance are reduced.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記の事実に
鑑みてなされたもので、その目的とするところは、ハロ
ゲン系難燃剤を使用せず、難燃性、半田耐熱性及び打ち
抜き加工性が良好な難燃性紙基材フェノール樹脂積層板
を提供することである。DISCLOSURE OF THE INVENTION The present invention has been made in view of the above facts, and has as its object to eliminate the use of halogen-based flame retardants, to provide flame retardancy, solder heat resistance and punching workability. Is to provide a good flame-retardant paper-based phenolic resin laminate.
【０００４】[0004]
【課題を解決するための手段】本発明は、紙基材にフェ
ノール樹脂組成物を含浸せしめたプリプレグを積層成形
して得られる難燃性フェノール樹脂積層板において、フ
ェノール樹脂組成物が未変性レゾール型フェノール樹
脂、ノボラック型フェノール樹脂、リン酸エステル及び
アミノ樹脂からなることを特徴とする難燃性フェノール
樹脂積層板、を要旨とするものである。SUMMARY OF THE INVENTION The present invention relates to a flame-retardant phenolic resin laminate obtained by laminating a prepreg impregnated with a phenolic resin composition on a paper base, wherein the phenolic resin composition is an unmodified resol. The present invention provides a flame-retardant phenolic resin laminate comprising a phenolic resin, a novolak phenolic resin, a phosphoric ester and an amino resin.
【０００５】本発明のフェノール樹脂積層板において
は、ハロゲン系難燃剤を使用せずに難燃性が優れたもの
とするために、難燃性であり使いやすさ及び入手の容易
さの点で有利なリン酸エステル及びアミノ樹脂を使用
し、一方燃えやすい成分である乾性油を使用することな
く難燃性を維持向上させている。この場合打ち抜き加工
性の低下が起こるが、これを防止するために、ノボラッ
ク型フェノール樹脂を用いることとした。このことによ
り難燃性を良好に維持したまま打ち抜き加工性の良好な
紙基材フェノール樹脂積層板を得ることができたもので
ある。[0005] The phenolic resin laminate of the present invention is flame-retardant, easy to use, and easily available in order to provide excellent flame retardancy without using a halogen-based flame retardant. Advantageous phosphate ester and amino resin are used, and flame retardancy is maintained and improved without using a drying oil which is a flammable component. In this case, a drop in punching workability occurs, but in order to prevent this, a novolak type phenol resin is used. As a result, a paper-based phenolic resin laminate having good punching workability was obtained while maintaining good flame retardancy.
【０００６】更に詳しく本発明を説明すれば、レゾール
型フェノール樹脂としては、フェノール、クレゾール等
のフェノール類とパラホルムアルデヒド、ホルマリン水
溶液等のホルムアルデヒドと反応させたものであり、通
常はアミン類、アンモニア等の塩基性触媒によって得ら
れるレゾール型フェノール樹脂が用いられる。In more detail, the resole type phenol resin is obtained by reacting phenols such as phenol and cresol with formaldehyde such as paraformaldehyde and aqueous solution of formalin, usually amines, ammonia and the like. The resol type phenol resin obtained by the basic catalyst is used.
【０００７】本発明で用いられるノボラック型フェノー
ル樹脂は、フェノール、クレゾール等のフェノール類と
パラホルムアルデヒド、ホルマリン水溶液等のホルムア
ルデヒドと反応させたものであり、通常は塩酸またはシ
ュウ酸などの無機酸や有機酸などを触媒にして得られる
ノボラック型フェノール樹脂が用いられる。The novolak type phenolic resin used in the present invention is obtained by reacting a phenol such as phenol or cresol with a formaldehyde such as paraformaldehyde or formalin aqueous solution, and usually an inorganic acid such as hydrochloric acid or oxalic acid or an organic acid. A novolak-type phenol resin obtained using an acid or the like as a catalyst is used.
【０００８】本発明で用いられるリン酸エステルは、ト
リエチルホスフェイト、トリブチルホスフェイト、トリ
フェニルホスフェイト、トリクレジルホスフェイト、ク
レジルジフェニルホスフェイト、レゾルシルジフェニル
ホスフェイト、トリイソプロピルフェニルホスフェイト
等が挙げられ、これらは１種または２種以上の混合系と
して使用される。この中で、トリフェニルホスフェイ
ト、トリクレジルホスフェイト、クレジルジフェニルホ
スフェイトが入手のしやすさから好ましいものである。The phosphate ester used in the present invention includes triethyl phosphate, tributyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyl diphenyl phosphate, resorcil diphenyl phosphate, triisopropyl phenyl phosphate and the like. These are used as one kind or a mixture of two or more kinds. Among these, triphenyl phosphate, tricresyl phosphate, and cresyl diphenyl phosphate are preferred from the viewpoint of availability.
【０００９】本発明に用いられるアミノ樹脂は、メラミ
ン樹脂、グアナミン樹脂などであるが、難燃化の効果を
高めるためにはメラミン樹脂が好ましい。アミノ樹脂
は、メラミンやグアナミンなどのアミノ化合物とホルム
アルデヒド等のアルデヒド類との初期反応物であり、そ
れらのメチロール基の一部または全部をメタノール、ブ
タノール等の低級アルコールでエーテル化したものも含
まれる。The amino resin used in the present invention is, for example, a melamine resin or a guanamine resin, and is preferably a melamine resin in order to enhance the flame retardant effect. Amino resin is an initial reaction product of an amino compound such as melamine or guanamine and an aldehyde such as formaldehyde, and includes those obtained by etherifying some or all of the methylol groups with a lower alcohol such as methanol or butanol. .
【００１０】本発明の難燃性フェノール樹脂積層板にお
いて、好ましくは、フェノール樹脂組成物が未変性レゾ
ール型フェノール樹脂１００重量部に対して、ノボラッ
ク型フェノール樹脂５０〜１８０重量部、リン酸エステ
ル４０〜１３０重量部、及びアミノ樹脂２０〜１００重
量部からなる。In the flame-retardant phenolic resin laminate of the present invention, preferably, the phenolic resin composition is 50 to 180 parts by weight of a novolak type phenolic resin and 100 parts by weight of an unmodified resol type phenolic resin, -130 parts by weight, and 20-100 parts by weight of amino resin.
【００１１】未変性レゾール型フェノール樹脂１００重
量部に対して、ノボラック型フェノール樹脂が５０重量
部未満では打ち抜き加工性の低下が生じ好ましくなく、
１８０重量部を越えた場合でも打ち抜き性の低下が生じ
好ましくない。リン酸エステル類が４０重量部未満では
難燃性に十分な効果が得られず、１３０重量部を越える
と打抜き加工性等の低下が生じ好ましくない。アミノ樹
脂が２０重量部未満では難燃性向上に十分な効果が得ら
れず、１００重量部を越えると打抜き加工性の低下が起
こり好ましくない。If the novolak-type phenolic resin is less than 50 parts by weight with respect to 100 parts by weight of the unmodified resol-type phenolic resin, the punching processability deteriorates, which is not preferable.
If the amount exceeds 180 parts by weight, the punching property is undesirably reduced. If the amount of the phosphoric acid ester is less than 40 parts by weight, a sufficient effect on the flame retardancy cannot be obtained. When the amount of the amino resin is less than 20 parts by weight, a sufficient effect for improving the flame retardancy cannot be obtained.
【００１２】本発明に使用する紙基材としては、クラフ
ト紙、リンター紙などがあげられる。また、紙基材とし
て水溶性フェノール樹脂、メチロールメラミン樹脂等で
前もって処理したものも本発明に含まれる。The paper base material used in the present invention includes kraft paper, linter paper and the like. Further, a paper base material previously treated with a water-soluble phenol resin, a methylol melamine resin or the like is also included in the present invention.
【００１３】[0013]
【実施例】以下、本発明を実施例に基づいて詳細に説明
するが、本発明はこれに限定されるものではない。The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples.
【００１４】［未変性レゾール型フェノール樹脂（ワニ
スａ）の合成］フェノール１０００ｇ、３７％ホルムア
ルデヒド水溶液９８０ｇ、トリエチルアミン２０ｇから
なる混合物を６０℃で２時間反応させ、次に減圧下で濃
縮し、これをメタノールで希釈して樹脂分５０％のレゾ
ール型フェノール樹脂ワニスを得た。[Synthesis of unmodified resol type phenol resin (varnish a)] A mixture of 1000 g of phenol, 980 g of a 37% aqueous formaldehyde solution and 20 g of triethylamine was reacted at 60 ° C. for 2 hours, and then concentrated under reduced pressure. After dilution with methanol, a resol-type phenol resin varnish having a resin content of 50% was obtained.
【００１５】［ノボラック型フェノール樹脂（ワニス
ｂ）の合成］フェノール１０００ｇとホルマリン１１２
０ｇをシュウ酸の存在下、還流温度で１時間反応し、次
に塩酸を加えて更に３５分間縮合させる。水を１３０ｇ
添加して反応を停止させ３０分間放置後水を蒸留した
後、更に樹脂温度１１５℃で脱水する。脱水終了後、樹
脂を冷却し、メタノールに溶解させて樹脂分５０％のノ
ボラック型フェノール樹脂ワニスを得た。[Synthesis of novolak type phenol resin (varnish b)] 1000 g of phenol and formalin 112
0 g is reacted for 1 hour at reflux temperature in the presence of oxalic acid, then hydrochloric acid is added and condensation is carried out for a further 35 minutes. 130 g of water
After the addition, the reaction was stopped, the mixture was left for 30 minutes, and then water was distilled off. After the dehydration was completed, the resin was cooled and dissolved in methanol to obtain a novolak-type phenol resin varnish having a resin content of 50%.
【００１６】《実施例１》ワニスａ２００重量部、ワニ
スｂ１４０重量部、クレジルジフェニルホスフェイト１
００重量部、及びメチロール化メラミン樹脂（樹脂分５
０％）５０重量部を配合したワニスを樹脂含浸率５５％
（紙基材に対する割合）となるように紙基材を含浸させ
てプリプレグを得た。このプリプレグ８枚とその表裏両
面に接着剤つき銅箔を重ね合わせ、加熱加圧成形して厚
さ１．６ｍｍの積層板Ａを得た。Example 1 200 parts by weight of varnish a, 140 parts by weight of varnish b, cresyl diphenyl phosphate 1
00 parts by weight, and a methylolated melamine resin (resin content 5
0%) Resin impregnation rate of varnish containing 50 parts by weight is 55%
The prepreg was obtained by impregnating the paper base material so as to obtain (a ratio to the paper base material). Eight prepregs and a copper foil with an adhesive were superimposed on both front and back surfaces thereof, and heated and pressed to obtain a laminate A having a thickness of 1.6 mm.
【００１７】《実施例２》ワニスａ２００重量部、ワニ
スｂ１００重量部、クレジルジフェニルホスフェイト８
０重量部、及びメチロール化メラミン樹脂（樹脂分５０
％）５０重量部を配合したワニスを樹脂含浸率５５％
（紙基材に対する割合）となるように紙基材を含浸させ
てプリプレグを得た。このプリプレグ８枚とその表裏両
面に接着剤つき銅箔を重ね合わせ、加熱加圧成形して厚
さ１．６ｍｍの積層板Ｂを得た。Example 2 200 parts by weight of varnish a, 100 parts by weight of varnish b, cresyl diphenyl phosphate 8
0 parts by weight and a methylolated melamine resin (resin content 50
%) A resin varnish containing 50 parts by weight of resin was impregnated at 55%.
The prepreg was obtained by impregnating the paper base material so as to obtain (a ratio to the paper base material). Eight prepregs and copper foil with an adhesive were superimposed on the front and back surfaces of the prepregs, and heated and pressed to obtain a laminate B having a thickness of 1.6 mm.
【００１８】《比較例１》実施例１において、ワニスｂ
をワニスａに変更した以外は実施例１と同様の方法にて
板厚１．６ｍｍの積層板Ｃを得た。<< Comparative Example 1 >> In Example 1, varnish b
Was changed to varnish a, and a laminate C having a thickness of 1.6 mm was obtained in the same manner as in Example 1.
【００１９】以上の方法により得られたそれぞれの積層
板の特性を測定し、表１に示す結果を得た。The properties of each laminate obtained by the above method were measured, and the results shown in Table 1 were obtained.
【００２０】[0020]
【表１】 [Table 1]
【００２１】（測定方法） １．難燃性 ＵＬ規格による ２．半田耐熱性 ＪＩＳ Ｃ ６４８１による ３．打抜き加工性 ＡＳＴＭ Ｄ６１７−４４による ４．曲げ強度 ＪＩＣ Ｃ ６４８１による(Measurement method) 1. Flame retardant according to UL standard 2. Solder heat resistance According to JIS C6481. 3. Punching workability According to ASTM D617-44. Flexural strength According to JIC C6481
【００２２】[0022]
【発明の効果】本発明に従うと、ハロゲン系難燃剤を用
いることなく難燃性（ＵＬ規格、Ｖ−０）を達成した、
半田耐熱性及び打抜き性の良好な紙基材フェノール樹脂
積層板を得ることができる。According to the present invention, flame retardancy (UL standard, V-0) is achieved without using a halogen-based flame retardant.
A paper base phenolic resin laminate having good solder heat resistance and good punching properties can be obtained.
Claims (2)
しめたプリプレグを積層成形して得られる難燃性フェノ
ール樹脂積層板において、フェノール樹脂組成物が未変
性レゾール型フェノール樹脂、ノボラック型フェノール
樹脂、リン酸エステル及びアミノ樹脂からなることを特
徴とする難燃性フェノール樹脂積層板。1. A flame-retardant phenolic resin laminate obtained by laminating a prepreg impregnated with a phenolic resin composition on a paper substrate, wherein the phenolic resin composition is an unmodified resol-type phenolic resin or a novolak-type phenolic resin. A flame-retardant phenolic resin laminate, comprising: a phosphoric acid ester and an amino resin.
層板において、フェノール樹脂組成物が未変性レゾール
型フェノール樹脂１００重量部に対して、ノボラック型
フェノール樹脂５０〜１８０重量部、リン酸エステル４
０〜１３０重量部、及びアミノ樹脂２０〜１００重量部
からなることを特徴とする難燃性フェノール樹脂積層
板。2. The flame-retardant phenolic resin laminate according to claim 1, wherein the phenolic resin composition is 50 to 180 parts by weight of a novolak type phenolic resin with respect to 100 parts by weight of an unmodified resol type phenolic resin, and a phosphate ester. 4
A flame-retardant phenolic resin laminate comprising 0 to 130 parts by weight and 20 to 100 parts by weight of an amino resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981397A JPH10279716A (en) | 1997-04-08 | 1997-04-08 | Flame-resistant phenolic resin laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981397A JPH10279716A (en) | 1997-04-08 | 1997-04-08 | Flame-resistant phenolic resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10279716A true JPH10279716A (en) | 1998-10-20 |
Family
ID=13981184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8981397A Pending JPH10279716A (en) | 1997-04-08 | 1997-04-08 | Flame-resistant phenolic resin laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10279716A (en) |
-
1997
- 1997-04-08 JP JP8981397A patent/JPH10279716A/en active Pending
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