JPH10279909A - Production of woody composite material - Google Patents
Production of woody composite materialInfo
- Publication number
- JPH10279909A JPH10279909A JP8137397A JP8137397A JPH10279909A JP H10279909 A JPH10279909 A JP H10279909A JP 8137397 A JP8137397 A JP 8137397A JP 8137397 A JP8137397 A JP 8137397A JP H10279909 A JPH10279909 A JP H10279909A
- Authority
- JP
- Japan
- Prior art keywords
- water
- resin
- composite material
- component
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000005011 phenolic resin Substances 0.000 claims abstract description 9
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims abstract description 3
- 238000002156 mixing Methods 0.000 claims abstract description 3
- 239000002023 wood Substances 0.000 claims description 17
- 239000002250 absorbent Substances 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000011120 plywood Substances 0.000 abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 6
- 239000003795 chemical substances by application Substances 0.000 abstract description 3
- 238000009472 formulation Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 229920001059 synthetic polymer Polymers 0.000 abstract description 3
- 239000011256 inorganic filler Substances 0.000 abstract description 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 2
- 239000012766 organic filler Substances 0.000 abstract description 2
- -1 preferably Polymers 0.000 abstract description 2
- 239000004035 construction material Substances 0.000 abstract 1
- 230000001737 promoting effect Effects 0.000 abstract 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 235000013312 flour Nutrition 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 235000013162 Cocos nucifera Nutrition 0.000 description 3
- 244000060011 Cocos nucifera Species 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 239000011358 absorbing material Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010903 husk Substances 0.000 description 2
- 239000003094 microcapsule Substances 0.000 description 2
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 description 2
- 241000218631 Coniferophyta Species 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000005018 casein Substances 0.000 description 1
- BECPQYXYKAMYBN-UHFFFAOYSA-N casein, tech. Chemical compound NCCCCC(C(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(CC(C)C)N=C(O)C(CCC(O)=O)N=C(O)C(CC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(C(C)O)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=N)N=C(O)C(CCC(O)=O)N=C(O)C(CCC(O)=O)N=C(O)C(COP(O)(O)=O)N=C(O)C(CCC(O)=N)N=C(O)C(N)CC1=CC=CC=C1 BECPQYXYKAMYBN-UHFFFAOYSA-N 0.000 description 1
- 235000021240 caseins Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011094 fiberboard Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 235000019645 odor Nutrition 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は熱圧成形時に水分に
よるパンクを防止し、良好な合板又はボード等の木質系
複合材を製造する方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a woody composite material such as plywood or board by preventing puncture caused by moisture during hot pressing.
【０００２】[0002]
【従来の技術】従来、合板又はボード等の木質系複合材
を接着剤を用いて加熱・加圧して成形する場合、木質部
に残存する水分及び接着剤に含有する水分が加熱時に水
蒸気となり、成形条件によってはパンクを発生して良好
な製品が出来なかった。そのため木質原料を乾燥し低水
分量又は絶乾状態としなければならず、乾燥のための熱
エネルギーと工数を必要とした。2. Description of the Related Art Conventionally, when a wood-based composite material such as plywood or board is formed by heating and pressurizing using an adhesive, the moisture remaining in the wooden part and the moisture contained in the adhesive become steam at the time of heating. Depending on the conditions, puncture occurred and a good product could not be obtained. Therefore, the woody raw material has to be dried to a low water content or an absolutely dry state, which requires heat energy and man-hours for drying.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、合板又はボ
ード等の木質系複合材を製造する際に、従来使用されて
いる接着剤成分の他に、吸水性樹脂を使用することによ
りパンクによる不良を防止するものである。DISCLOSURE OF THE INVENTION The present invention relates to a method for producing a wood-based composite material such as plywood or board by using a water-absorbent resin in addition to a conventionally used adhesive component to reduce puncture. This is to prevent defects.
【０００４】[0004]
【課題を解決するための手段】本発明は、合板又はボー
ド等の木質系複合材を製造する際に、吸水性樹脂を添加
した接着剤配合物又は接着剤配合物とは別に作成した吸
水性樹脂の非水溶液を使用して木質系複合材を製造する
方法に関するものである。SUMMARY OF THE INVENTION The present invention relates to an adhesive composition containing a water-absorbing resin or a water-absorbing material prepared separately from an adhesive composition when producing a wood-based composite material such as plywood or board. The present invention relates to a method for producing a wood-based composite material using a non-aqueous solution of a resin.
【０００５】本発明における木質系複合材としては合
板、パーティクルボード、ファイバーボード等、屋内用
又は屋外用の建築材や家具・調度用の板材等に広く使用
されるものである。これらの木質系複合材の原料である
木材は従来の良質の広葉樹を主体にしたものから近年は
針葉樹も増え、又質の悪い原木や保存条件の悪い原木を
使用せざるを得ない場合も増加している。このことから
加熱・加圧して製品化する際のパンクによる不良も増
え、その対策が重要課題となってきた。木質系複合材用
の結合剤としては、カゼインや大豆グルーなどの天然
物、酢酸ビニル樹脂等の熱可塑性樹脂、尿素樹脂、メラ
ミン樹脂、エポキシ樹脂、ウレタン樹脂、ポリエステル
樹脂、フェノール樹脂等の熱硬化性樹脂があるが、特に
熱硬化性樹脂は硬化する際に他の結合剤にくらべ高い温
度を加える必要がありパンクも起こりやすくなってい
る。The wood-based composite material in the present invention is widely used for plywood, particle board, fiber board, and other indoor or outdoor building materials and furniture / furnishing board materials. The wood that is the raw material of these wood-based composite materials is mainly made of conventional high-quality broadleaf trees, and conifers have increased in recent years.In addition, there are cases in which poor-quality logs and logs with poor storage conditions have to be used. doing. For this reason, the number of defects due to puncturing when commercializing products by heating and pressurizing has increased, and countermeasures have become an important issue. Examples of binders for wood-based composites include natural products such as casein and soy glue, thermoplastic resins such as vinyl acetate resin, urea resins, melamine resins, epoxy resins, urethane resins, polyester resins, and phenol resins. In particular, thermosetting resins require a higher temperature than other binders when they are cured, and punctures are more likely to occur.
【０００６】近年は合板・ボード等に残存するホルムア
ルデヒドからの臭気が問題視されるようになり、熱硬化
性樹脂の中でも特にホルムアルデヒド発生量の少ないフ
ェノール樹脂を使用することが多っている。フェノール
樹脂の場合他の熱硬化性樹脂にくらべ高い温度での成形
が必要となるため原木の含水量を０とすること等細心の
注意が必要であった。In recent years, odors from formaldehyde remaining on plywood, boards and the like have come to be regarded as a problem, and among thermosetting resins, phenol resins which generate particularly little formaldehyde are often used. In the case of a phenolic resin, molding at a higher temperature than that of other thermosetting resins is required, so that careful attention was required, such as setting the water content of the raw wood to zero.
【０００７】木質系複合材を製造するために木材を結合
する接着剤組成の成分としては上記樹脂の他に濡れ特性
の調節、過剰浸透の防止、及び均一な接着厚みを得るこ
となどのために小麦粉、大豆粉、クルミ殻粉、ココナッ
ツ殻粉等の有機物フィラーや炭酸カルシウム、クレー等
の無機物のフィラー又は粘度調節のための水、その他に
硬化剤、硬化促進剤等が加えられるが、これらはいずれ
も加熱成形時に発生する水蒸気によるパンク等の弊害を
防止するものではない。[0007] In addition to the above-mentioned resin, the components of the adhesive composition that binds wood to produce a wood-based composite material include adjusting the wetting characteristics, preventing excessive penetration, and obtaining a uniform bond thickness. Wheat flour, soy flour, walnut husk flour, organic fillers such as coconut husk flour, calcium carbonate, inorganic fillers such as clay or water for viscosity control, and other curing agents, curing accelerators, etc. are added. Neither method prevents harm such as puncture caused by water vapor generated during heat molding.
【０００８】本発明において加熱成形時に発生する水蒸
気によるパンク不良を防止するために添加する吸水性樹
脂としては、ポリビニルアルコール系、ポリアクリル酸
塩系、ポリアクリルアミド系、ポリオキシエチレン系等
の合成ポリマー系、デンプン系、セルロース系等があ
り、それぞれの条件下で使用され特に限定されるもので
はないが、とりわけ合成ポリマー系が本特許の目的によ
り適している。In the present invention, the water-absorbing resin to be added to prevent puncture failure due to water vapor generated at the time of thermoforming includes synthetic polymers such as polyvinyl alcohol-based, polyacrylate-based, polyacrylamide-based and polyoxyethylene-based polymers. There are a system, a starch system, a cellulosic system and the like, which are used under each condition and are not particularly limited, but in particular, a synthetic polymer system is more suitable for the purpose of the present patent.
【０００９】吸水性物質としては綿やスポンジ等がある
が、その吸水作用は毛細管現象によるものであり微圧で
水分を放出するが、吸水性樹脂は分子鎖の間に水を取り
込むもので圧力に対する保水性が高く、各種吸水材料に
使用され近年特にその使用量は増大している。本発明の
目的とする木質系複合剤の成形条件は成形温度として１
１０〜１４０℃、成形圧力として５〜１０ｋｇ／ｃｍ2
を要し、吸水性能の良好な上記吸水性樹脂にとってもき
びしく、このような条件では、その本来の性能から吸水
性能は低下し、たとえば温度に対する影響は１１０〜１
４０℃の場合カタログ値より１０〜２０％程度低下す
る。吸水性樹脂の形状としてはビーズ状又は粉末状のも
のがあるが、粉末状、特に粒径４００μｍ以下の粉末状
のものが望ましい。配合量については特に限定するもの
ではないが、接着剤液に対して０．２〜１０重量％程度
が好ましい。吸水性樹脂の吸水速度としては作業性の関
係からできれば３０秒以上（Vorutex法）が望ましい。[0009] Water-absorbing substances include cotton and sponge. The water-absorbing action is due to the capillary action and releases water under a slight pressure. It has high water retention and is used for various water-absorbing materials. The molding conditions of the wood-based composite agent intended for the present invention are as follows.
10 to 140 ° C, molding pressure 5 to 10 kg / cm 2
It is severe for the above-mentioned water-absorbent resin having good water-absorbing performance. Under such conditions, the water-absorbing performance is reduced from its original performance.
In the case of 40 ° C., it is lower by about 10 to 20% than the catalog value. The shape of the water-absorbent resin may be in the form of beads or powder, but is preferably in the form of powder, particularly powder having a particle size of 400 μm or less. The amount is not particularly limited, but is preferably about 0.2 to 10% by weight based on the adhesive liquid. The water absorption rate of the water-absorbing resin is preferably 30 seconds or more (Vorutex method) from the viewpoint of workability.
【００１０】木質系複合材の製造時に吸水性樹脂を接着
剤配合物に添加・混合する場合はすみやかに木質原料に
塗布又は混合する必要があるが、接着剤配合物とは別に
吸水性樹脂を非水系液体（溶剤、樹脂類、それらの混合
品等でも可）に分散した液状混合物を使用する場合、合
板製造においては、スプレッターロール等へ接着剤配合
物と同時に添加する方法もあるが、あらかじめ単板の表
面（接着剤塗布面に張り合わせる面）に塗布する方法は
より効果がある。合板製造の場合は吸水性樹脂と非水系
液体を混合後フイルム化し単板の間にはさんで成形する
方法もある。さらには、吸水性樹脂を非水溶性の皮膜物
質によりマイクロカプセル化することにより加熱・加圧
時にその吸水作用を発揮せしければさらにパンク防止の
効果をあげることができる。When a water-absorbent resin is added to or mixed with an adhesive composition during the production of a wood-based composite material, it must be immediately applied or mixed with the woody raw material. When using a liquid mixture dispersed in a non-aqueous liquid (solvents, resins, mixtures thereof, etc.), in the manufacture of plywood, there is a method of adding it to a spreader roll etc. at the same time as the adhesive compound. The method of applying to the surface of the veneer (the surface to be bonded to the adhesive applied surface) is more effective. In the case of plywood production, there is also a method in which a water-absorbent resin and a non-aqueous liquid are mixed together, then formed into a film, and sandwiched between veneers. Furthermore, if the water-absorbing resin is microencapsulated with a water-insoluble coating substance, the effect of preventing puncture can be further enhanced if the water-absorbing action is exerted during heating and pressurization.
【００１１】本発明において、接着剤は通常熱硬化性樹
脂が使用されるが、水性の接着剤を使用したときにパン
クによる不良の防止効果が大きい。このような樹脂とし
てはフェノール樹脂、メラミン樹脂、ユリア樹脂等があ
るが、木質系複合材製造時の成形温度が高く、パンクの
発生しやすいフェノール樹脂を使用した場合が最も効果
的である。In the present invention, a thermosetting resin is usually used as an adhesive, but when an aqueous adhesive is used, the effect of preventing defects due to puncturing is great. Examples of such a resin include a phenol resin, a melamine resin, and a urea resin, and the most effective is a phenol resin which has a high molding temperature at the time of producing a wood-based composite material and is apt to cause puncture.
【００１２】[0012]
実施例１ 下記条件で合板を作製した。 配合条件：下記の各成分を配合して接着剤組成とした。 フェノール樹脂（不揮発分４５重量％）１００ｇ＋ココ
ナッツ殻粉１０ｇ＋小麦粉５ｇ＋ポリアクリル酸ソーダ
系吸水性樹脂マイクロカプセル（吸水性樹脂５５％）５
ｇ 単板構成：１．３ｍｍラワン単板３プライ、含水率１２
〜１４％ 塗布量 ：１５０ｇ／ｍ2 （片面） 冷 圧 ：１０ｋｇ／ｃｍ2 、３０分 加熱条件：１４０℃、４０秒／ｍｍExample 1 Plywood was produced under the following conditions. Blending conditions: The following components were blended to form an adhesive composition. 100 g of phenolic resin (non-volatile content: 45% by weight) + 10 g of coconut shell powder + 5 g of flour + sodium polyacrylate water-absorbent resin microcapsules (55% of water-absorbent resin)
g Veneer configuration: 1.3 mm Lauan veneer 3 plies, moisture content 12
１４14% Coating amount: 150 g / m 2 (one side) Cold pressure: 10 kg / cm 2 , 30 minutes Heating condition: 140 ° C., 40 seconds / mm
【００１３】実施例２ 下記の通り吸水性樹脂分散液Ａ及び接着剤配合物Ｂを調
製し、接着剤配合物Ｂをスプレッダーロールにて単板に
塗布し、それに張り合わせる２枚の単板の張り合わせ面
に吸水性樹脂分散液Ａを吸水性樹脂の付着量が７ｇ／ｍ
2 （片面）となるようにスプレーにて塗布した。 吸水性樹脂分散液Ａ：ポリアクリル酸ソーダ系吸水性樹
脂をメタノールに分散し（吸水性樹脂：メタノール＝
１：３）、液状混合物とした。 接着剤配合物Ｂ：フェノール樹脂（不揮発分４５重量
％）１００ｇ＋ココナッツ殻粉１０ｇ＋小麦粉５ｇ その他の条件は実施例１と同一として合板を作製した。Example 2 A water-absorbent resin dispersion A and an adhesive composition B were prepared as follows, and the adhesive composition B was applied to a veneer with a spreader roll, and the two veneers were laminated. When the water-absorbent resin dispersion A is applied to the bonded surface, the amount of the water-absorbent resin adhered is
2 (one side) was applied by spraying. Water-absorbent resin dispersion A: A sodium polyacrylate-based water-absorbent resin is dispersed in methanol (water-absorbent resin: methanol =
1: 3) to obtain a liquid mixture. Adhesive formulation B: 100 g of phenolic resin (non-volatile content: 45% by weight) +10 g of coconut shell powder + 5 g of flour A plywood was prepared under the same conditions as in Example 1.
【００１４】比較例 上記実施例１の配合条件において吸水性樹脂マイクロカ
プセルを除いた以外は実施例１と同一条件で合板を作製
した。Comparative Example A plywood was produced under the same conditions as in Example 1 except that the water-absorbent resin microcapsules were omitted.
【００１５】[0015]
【表１】 [Table 1]
【００１６】[0016]
【発明の効果】以上の実施例からも明らかなように、本
発明は、木質系複合材の製造において、吸水性樹脂を使
用することにより、加熱成形時の水分等によるパンクを
効果的に防止することができる。As is apparent from the above examples, the present invention effectively prevents puncture caused by moisture and the like during heat molding by using a water-absorbing resin in the production of a wooden composite material. can do.
Claims (5)
物を使用することを特徴とする木質系複合材の製造方
法。1. A method for producing a wood-based composite material, comprising using an adhesive compound to which a water-absorbent resin has been added and mixed.
を非水系液体に混合分散した液状混合物を、接着剤配合
物とは別に塗布又は添加してなる木質系複合材の製造方
法。2. A method for producing a wood-based composite material, wherein a liquid mixture obtained by mixing and dispersing a water-absorbing resin in a non-aqueous liquid with a wood raw material is applied or added separately from an adhesive compound before molding.
マイクロカプセル化されている請求項１又は２記載の木
質系複合材の製造方法。3. The method according to claim 1, wherein the water-absorbent resin is microencapsulated with a water-insoluble coating material.
ある請求項１、２又は３記載の木質系複合材の製造方
法。4. The method according to claim 1, wherein the main component of the adhesive composition is a thermosetting resin.
である請求項１、２、３又は４記載の木質系複合材の製
造方法。5. The method according to claim 1, wherein the main component of the adhesive composition is a phenolic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8137397A JPH10279909A (en) | 1997-03-31 | 1997-03-31 | Production of woody composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8137397A JPH10279909A (en) | 1997-03-31 | 1997-03-31 | Production of woody composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10279909A true JPH10279909A (en) | 1998-10-20 |
Family
ID=13744514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8137397A Pending JPH10279909A (en) | 1997-03-31 | 1997-03-31 | Production of woody composite material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10279909A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002167520A (en) * | 2000-11-30 | 2002-06-11 | Sumitomo Chem Co Ltd | Resin composition containing water-absorbing resin and adhesive containing the resin composition as active ingredient |
-
1997
- 1997-03-31 JP JP8137397A patent/JPH10279909A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002167520A (en) * | 2000-11-30 | 2002-06-11 | Sumitomo Chem Co Ltd | Resin composition containing water-absorbing resin and adhesive containing the resin composition as active ingredient |
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