JPH10293207A - Color filter and method of manufacturing color filter - Google Patents

Abstract

(57) Abstract: To improve the transportability of a substrate in a color filter manufacturing process and a liquid crystal panel manufacturing process, and to prevent a substrate from being displaced or being damaged. Further, a color filter free from display unevenness defects due to uneven distribution of plastic beads (spacers) due to static electricity is obtained. A color filter having pixels of at least three colors on the surface of a transparent substrate, wherein the color filter has a transparent conductive film on the back side of the transparent substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a color filter for a liquid crystal display device and the like, and a liquid crystal display device. More specifically, the present invention prevents a foreign substance from adhering to the substrate surface due to electrostatic charging and prevents a substrate transport failure from occurring in a color filter manufacturing process and an active matrix type color liquid crystal display device manufacturing process. The present invention relates to a color filter provided with an antistatic property for the purpose of preventing the deterioration of the thin film transistor.

[0002]

2. Description of the Related Art Conventionally, as disclosed in JP-A-60-184202 and JP-A-61-180203,
A color filter formed by dispersing a pigment in polyimide which is a heat-resistant resin and using a pattern processing technique using a positive photoresist has heat resistance of 250 ° C. or higher, light resistance, high definition, A color filter having excellent transparency and the like can be obtained. However, in both the photolithography method and other methods, a color filter film is formed of a resin composition on a transparent substrate. In this case, however, the process cannot be controlled to a high humidity, and thus the process is electrostatically charged. In particular, the larger the size of the substrate, the easier it is to be charged. In an extreme case, the glass adheres to the temperature control plate, causing poor conveyance. Even if there is no problem in transportation, the quality of the panel assembled by using the charged substrate is such that the beads (cell gap spacers) scattered are apt to be unevenly distributed due to the electrostatic charging, and display unevenness defects appear. High percentage of defective products. In addition, electrostatic charging increases the adhesion of foreign substances, and in this regard, the yield also decreases. In extreme cases, the transistors on the opposing active matrix substrate may be degraded. In order to prevent display unevenness defects and maintain good transportability in the process, improvements such as antistatic and static elimination are very important in the production of color filters and liquid crystal display devices.

Instead of twisted nematic, which is a mode of liquid crystal of a normal liquid crystal display device, a lateral electric field driving method in which a voltage is applied in parallel to a substrate surface to rotate the liquid crystal in a plane parallel to the substrate surface has been proposed. . This method has the feature that the viewing angle can be widened, but without using an electrode on the color filter side, TF
Since the electrodes are placed only on the substrate on which the driving element such as T is formed, there is a problem that an external electric field from the color filter invades and easily affects the display. In the present invention, since a transparent conductive film is formed on the back surface of the color filter substrate, a harmful external electric field can be cut off without affecting the display. Further, there is also an effect of suppressing uneven charging of the substrate due to uneven charging of the substrate when the spacer is sprayed. Because a transparent conductive film can be formed directly on a glass substrate, the substrate temperature can be raised and there is no outgassing from the underlayer, compared to forming a transparent conductive film on a polarizing film attached to the back of a color filter substrate. This has the advantage that a transparent conductive film having low resistance and high transparency can be easily obtained.

When the black matrix constituting the color filter is made of a metal, it is equivalent to forming a conductive mesh on the surface of the color filter substrate. However, a high conductivity cannot be expected with a resin black matrix. The effect is particularly large.

[0005] On the other hand, general antistatic properties can be imparted by hydrophilizing the surface (removing the charge with a surfactant or the like) or neutralizing the charge (+- And mixing of metals (mixing of fibers and particles of conductive articles) and the like are known. However, liquid crystal displays and color filters are not suitable for treatments that increase impurity ions, adhere mist, or impair transparency, so that improvements have been made on manufacturing equipment. For example, it is conceivable to use a conductive rubber sheet or the like on the back surface of the transparent substrate for transportation. However, a material that does not have heat resistance in the color filter manufacturing process is not suitable. In Japanese Patent Application Laid-Open No. Hei 7-31878, a countermeasure is performed by placing a metal plate under a glass substrate or attaching a conductive film to prevent static electricity and eliminate static electricity.

However, this method cannot be performed in the case where an existing apparatus is used or in a step where there is no space for newly remodeling, and there is a problem that peeling-off charging may occur when the attached film is peeled off. was there.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a color filter, in particular, to ensure the transportability in the process, to maintain the light transmittance of the obtained color filter, and to use water, an alkali or an organic solvent. To provide new color filters with excellent solvent resistance and good process passability, such as using existing equipment, and providing high workability color filters without investing in new equipment. is there. Another object of the present invention is to provide a color filter with high productivity by preventing display unevenness defects in a liquid crystal panel caused by charging in a cell assembling process.

[0008]

Means for Solving the Problems To solve the above problems, the present invention comprises the following constitutions.

(1) A color filter having pixels of at least three colors on the front surface side of a transparent substrate, wherein a transparent conductive film is provided on the rear surface side of the transparent substrate.

(2) The transparent conductive film on the back side of the transparent substrate has a specific resistance of 2 kΩ · cm or less.
The color filter according to 1.

(3) The color filter according to (1), wherein the transmittance of the transparent conductive film on the back side of the transparent substrate is 96% or more.

(4) The color filter according to (1), wherein the thickness of the transparent conductive film on the rear surface side of the transparent substrate is from 10 nm to 100 nm.

(5) The color filter according to (1), wherein an overcoat is provided on the surface side of the transparent substrate.

(6) The color filter according to (1), wherein the black matrix constituting the color filter is a resin black matrix.

(7) A method for manufacturing a color filter, comprising: providing a transparent conductive film on the back side of a transparent substrate and then providing a resin black matrix and pixels on the front side. (8) A method for producing a color filter, comprising forming a metal black matrix on the front side of a transparent substrate, providing a transparent conductive film on the back side, and further providing pixels on the front side.

(9) A liquid crystal display device using the color filters described in (1) to (5).

(10) The liquid crystal display device according to (9), wherein the liquid crystal display device is of a horizontal electric field drive type.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The metal black matrix mentioned here is obtained by patterning a metal film.

The metal film may be a single layer film or
Even with a metal oxide / metal two-layer film with improved low reflection characteristics,
Alternatively or additionally, metal oxide /
A three-layer film of metal / metal oxide may be used. As metal,
Chromium, nickel and the like are preferably used.

These metal films can be patterned by etching using a photoresist and an acidic etching solution.

The resin black matrix of the present invention is:
It is obtained by patterning a resin containing a black coloring material.
As the resin, a polyimide resin, an acrylic resin, an alkyd resin, a melamine resin, a polyvinyl alcohol, a phenol resin, a polyamide resin, a polyamideimide resin, or the like can be used. As the black coloring material, carbon black, graphite, black dye, or the like can be used. Further, addition of a coloring material such as purple for adjusting the color tone is appropriately permitted.

When the transparent conductive film has a large specific resistance, unless the film thickness is increased, the glass substrate adheres to the temperature control plate due to static electricity due to static electricity.
Increasing the film thickness reduces transparency. In the present invention, 2 kΩ
The use of a transparent conductive film formed so as to have a specific resistance of less than or equal to .OMEGA.cm, preferably less than or equal to 600 .OMEGA.cm, and more preferably less than or equal to 300 .OMEGA.cm, causes no transport failure even in a 1000-sheet continuous transport test. No color filters can be obtained.

In a sample in which the thickness of the transparent conductive film is changed, if the transmittance is less than 90% when the thickness is large, the pixel transmittance in the bright field is reduced, and the contrast is disadvantageous. I understood. In particular, when a transparent conductive film (transparent electrode) is also required on the front side, the transmittance is also affected. It has been found that if the transmittance is above the above, preferably 98% or more, there is no particular problem such as the optical characteristic value.

Specific examples of the transparent conductive film include the following (1)
(4) is effective.

(1) A transparent conductive film mainly containing a metal and / or a metal oxide.

(2) A transparent conductive film mainly composed of an alloy obtained by combining several kinds of metals and / or several kinds of metal oxides.

(3) A transparent conductive film mainly containing a metal and / or a metal oxide and a vehicle.

(4) A transparent conductive film mainly composed of a vehicle and an alloy obtained by combining several kinds of metals and / or several kinds of metal oxides.

As the transparent substrate of the present invention, a plastic substrate or a glass substrate is used. In many cases, glass substrates are mainly used for color filters. The transparent conductive film of the present invention can be formed by dipping (Dip) or chemical vapor deposition (C).
VD), physical vapor deposition (PVD), vacuum deposition, sputtering, ion plating, etc., to form a film, and mainly to remove the charge on the back side of the color filter glass. Used.
As the transparent conductive film used particularly in the present invention, an excellent transparent conductive film which does not impair the suitability for color display is preferable. Specific examples of typical transparent conductive films include Al, M
o, Cr, Ta, Cu, W, Ti, Au, Ag, In,
Ge, Tb, ITO, In ₂ O ₃ , SnO ₂ , ZnO,
Known metals or metal oxides such as ZnO-Ga, NiCr and the like can be mentioned. Practically, an alloy or the like obtained by combining several kinds of the above metals or metal oxides is used.

Above all, ITO is more preferably used because it has excellent conductivity without impairing the transparency. These raw materials may be subjected to a surface treatment such as an oxidation treatment as necessary.

In the transparent conductive film of the present invention, the thickness of the transparent conductive film on the color filter is 10 nm or more and 1
00 nm or less, preferably 15 nm or more and 80 nm or less,
More preferably, 20 nm or more and 50 nm or less are suitable. If it is thicker than this, the transmittance will be too low, and if it is thinner than this, the conductivity will be insufficient and the transportability will be a problem.

Most of these transparent conductive films are affected by an etching solution used in forming a metal black matrix. Therefore, it is preferable that the metal black matrix is formed on the substrate and then patterned on the back side after the patterning. However, on the other hand, it is not affected by the developer used for forming the resin black matrix. Therefore, even if the transparent conductive film is formed on the back surface of the substrate in advance, there is no problem, but rather, the static elimination effect in the black matrix process is exhibited.

Next, specific examples of the formation of the transparent conductive film used in the present invention will be described.

(1) A conductive paste is applied to the back side of the color filter to form a cured film of, for example, an ITO paste. The coating is performed by a method such as spinner, dip coating, roll coating, and die coating, and is dried and cured by heating. Depending on the base material, drying is carried out for several hours to several seconds in the range of 60 ° C. or more and 300 ° C. using an oven, a hot plate or infrared rays.
As a temperature range that does not impair the hardness, the drying temperature is finally preferably 80 ° C. to 250 ° C., particularly preferably 100 ° C. to 200 ° C., and the heat treatment time is several hours to several minutes. If the temperature is higher than this, inconveniences such as cracks occur, and if the temperature is lower, the drying and curing become insufficient.

(2) A transparent conductive film is sputtered on the back side of the color filter to form, for example, an ITO film. For the sputtering, a commercially available apparatus is used, and a method such as a single-wafer apparatus or an in-line apparatus is applied. Heating is performed for several minutes to several seconds so that the substrate temperature is in a range of 20 ° C. or more and 300 ° C. or less, and a range in which conductivity is not impaired is preferable. Heating is performed for several seconds so that the substrate temperature is preferably in the range of 150 ° C. to 280 ° C. In particular, heating for several seconds is preferable so as to be in the range of 180 ° C. to 250 ° C. Heating for several minutes to several seconds is applied depending on the substrate temperature. If the temperature is higher than the above range, inconveniences such as generation of cracks on the color filter surface occur.

(3) A transparent conductive film is deposited on the back surface of the color filter to form, for example, an ITO film. Evaporation
Using a commercially available device, a method such as a single-wafer device is applied. Heating is performed for several minutes to several seconds so that the substrate temperature is in a range of 20 ° C. or more and 300 ° C. or less, and a range in which conductivity is not impaired is preferable. Substrate temperature is preferably 150 ° C. or higher 2
Heating is performed for several seconds so as to be in the range of 80 ° C. or less. In particular, heating for several seconds is preferable so as to be in the range of 180 ° C. to 250 ° C. Heating for several minutes to several seconds is applied depending on the substrate temperature. If the temperature is higher than the above range, inconveniences such as generation of cracks on the color filter surface occur.

[0037]

Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.

The measurement of each physical property value was performed as follows.

(1) Film thickness measurement Kosaka Laboratory Co., Ltd. (manufactured by) Co., Ltd. "Surfc"
Using order “SE-3300”, the film thickness was determined by measuring the level difference depending on the presence or absence of the transparent conductive film.

(2) Specific resistance Mitsubishi Yuka Co., Ltd. (manufactured by Mitsubishi Electric Corporation) "Lorest"
Using "a" or "Hiresta", the surface resistance (sheet resistance) was measured by a four-point probe method, and the specific resistance was determined by multiplying the film thickness.

(3) Measurement of Transmittance Microspectrophotometer “MCPD-2” manufactured by Otsuka Electronics Co., Ltd.
The measurement was performed using a 000 "C light source. JIS Z87
The Y value of the tristimulus value in the XYZ color system defined in 01-1982 represents the luminous transmittance. The transmittance of the transparent conductive film on the back side of the transparent substrate is measured using a sample in which the transparent conductive film is formed on the transparent substrate. The Y value of only the transparent conductive film calculated using the transparent substrate as a reference was defined as the transmittance.

(4) Potential measurement Kasuga Denki Co., Ltd. digital low-potential measuring instrument "KSD"
Detecting distance from sample using 01001 "10mm
Was obtained.

(5) Transportability Using a substrate washer equipped with an infrared heater, manufactured by Dainippon Screen Mfg. Co., Ltd., water washing, draining, infrared drying,
The substrate transportability after cooling with the two-stage cooling plate was evaluated.

Reference Example 1 A paste prepared by dispersing and mixing carbon black in a transparent polyimide precursor solution (Semico Fine SP-910, manufactured by Toray Industries, Inc.) was prepared. Put this dispersion mixed paste on a transparent substrate,
After coating with a spinner so that the film thickness after curing becomes 1.0 μm, semi-curing is performed at 120 ° C. for 20 minutes, and after cooling, a positive photoresist (Tokyo Ohka (PRF-800) OFPR-800)
Was applied with a spinner so that the film thickness after drying was 1.0 μm, and was semi-cured at 90 ° C. for 10 minutes. Using an ultraviolet exposure machine PLA-501F manufactured by Canon Inc., 150 m through a chromium photomask having a lattice pattern.
J / cm ² (ultraviolet light intensity of 365 nm) was exposed. After the exposure, the film was immersed in a developing solution consisting of a 2.38% aqueous solution of tetramethylammonium hydroxide to simultaneously develop the photoresist and etch the polyimide precursor coating. After the etching, the unnecessary photoresist layer was removed with acetone. After the opening was formed in this manner, the etched polyimide precursor coating film was cured at 260 ° C. for 30 minutes to be converted to polyimide, thereby forming a resin black matrix (light shielding) layer.

Reference Example 2 A chromium black matrix layer was formed from a chromium thin film (thickness: 110 nm) formed on a transparent substrate by a sputtering method using a usual photolithography method. Pattern formation is performed through the steps of photoresist coating, drying, exposure using an ultraviolet exposure machine, immersion in an alkali developer, chromic acid etching, unnecessary photoresist stripped with acetone, and surface drying And a chromium black matrix layer.

Reference Example 3 Red, green, and blue pigments were dispersed and mixed in a transparent polyimide precursor solution (Semico Fine SP-910, manufactured by Toray Industries, Inc.) using a homogenizer, and further diluted with a solvent. , R, G, and B pastes were respectively prepared.

REFERENCE EXAMPLE 4 The red pigment paste of Reference Example 3 was applied to the entire surface of the resin black matrix (light-shielding) layer obtained in Reference Example 1, semi-cured, and then striped by photolithography (same as Reference Example 1). After forming a pattern so as to fill one third of the black matrix opening, curing was performed to complete a red pixel. Next, on the transparent substrate having the black matrix and the red pixels, the green pigment paste of Reference Example 3 was applied over the entire surface in the same manner as the formation of the red pixels, and after semi-curing, the black matrix openings were formed by photolithography. Green pixels were formed in stripes for the other 1/3 and then cured to complete green pixels. Further, similarly, on a transparent substrate having a black matrix, a red pixel and a green pixel, a paste of a blue pigment is applied over the entire surface, and after semi-curing, the other one-third of the opening of the black matrix is removed by photolithography. After forming blue pixels in a stripe shape, curing was performed to complete the blue pixels. Thus, a transparent substrate having a resin black matrix and R, G, and B stripes was obtained.

Reference Example 5 A transparent substrate having a chromium black matrix and R, G, and B stripes was obtained in exactly the same manner as in Reference Example 4, except that the chromium black matrix obtained in Reference Example 2 was used.

Reference Example 6 The resin black matrix obtained in Reference Example 1 was used as a front side, and a sputtering method (a sputtering apparatus manufactured by SYNCHRON Co., Ltd., magnetron type BS) was used on a transparent substrate on the back side.
C-7033) to form an ITO layer. The evacuation time before forming the ITO layer in the sputtering apparatus is 30 minutes,
The substrate temperature during the formation of the layer was 200 ° C. Using a DC power supply, the magnetic field was 400 gauss, the oxygen partial pressure was 1%, the output was 1.4 kw, and an ITO film was formed. Then, Reference Example 4
Similarly to the above, the surface side by photolithography method,
Pixels were formed in the form of R, G, and B stripes to obtain a transparent substrate sample.

Reference Example 7 Transparent substrate samples were obtained by forming pixels in the form of R, G, and B stripes in exactly the same manner as in Reference Example 6, except that the chromium black matrix obtained in Reference Example 2 was used as the surface side. Was.

Reference Example 8 A reference example of a silane hydrolyzate is shown. 23.6 g of γ-glycidoxypropylmethoxysilane was cooled to 10 ° C., and 5.4 g of a 0.01N aqueous hydrochloric acid solution was gradually added dropwise with stirring. After the addition, stirring was continued at room temperature for another 1 hour. A hydrolyzate was obtained.

Reference Example 9 A reference example of the conductive paste coating liquid is shown. Reference Example 8
7.5 g of ethyl alcohol was added to the silane hydrolyzate obtained in
42.5 g of phenethyl alcohol and 0.05 g of a silicone surfactant were added and mixed, 0.5 g of aluminum acetylacetonate was added, and the mixture was sufficiently stirred. 20.5 g of an indium oxide / tin oxide mixed inorganic oxide of 0.05 μm was added and sufficiently dispersed to obtain a conductive paste coating liquid.

Reference Example 10 The chromium black matrix obtained in Reference Example 5 and R, G,
A commercially available acrylic protective film material is applied to the surface side of a transparent substrate having a B stripe by a spinner, and cured at 100 ° C. for 10 minutes and further at 250 ° C. for 60 minutes to form a protective film having a thickness of 1.0 μm. Formed.

Example 1 The color filter side having the resin black matrix, red pixels, green pixels and blue pixels obtained in Reference Example 4 was used as the front side, and the back side of the transparent substrate was used as a reference in the ninth embodiment by the spin coating method.
Apply the conductive paste coating liquid obtained in Step 2. The rotation speed is 400 s / min for 2 seconds, then 1000 s / min for 8 seconds.
Seconds. After that, at 80 ° C. for 10 minutes,
The mixture was heated and cured at 4 ° C. for 4 hours. In the color filter substrate obtained in this example, the thickness of the transparent conductive film was 260 n.
m. The transmittance of the green pixel was as good as 53.5%. The specific resistance of the transparent conductive film was 1.95 kΩ · cm. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability was good. Similarly, the transparent conductive film was formed on the base glass, and the transmittance of only the transparent conductive film was measured. As a result, it was 96.1%.

Example 2 In the same manner as in Example 1, the color filter side was used as the surface.
After applying a conductive paste coating liquid on the back surface of the transparent substrate by a spin coating method, a sample was obtained by changing the rotation speed. The rotation speed is 400 rpm / min for 2 seconds, then 80 rpm.
It was 8 revolutions at 0 revolutions / minute. Thereafter, heating and curing were performed in the same manner as in Example 1. The thickness of the transparent conductive film was 410 nm, and the transmittance of the green pixel was 52.9%, which was poorer than Example 1. The specific resistance of the transparent conductive film was 1.80 kΩ · cm. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability was good. Similarly, the transparent conductive film was formed on the base glass, and the transmittance of only the transparent conductive film was measured. As a result, it was 95.0%.

Example 3 In the same manner as in Example 1, the color filter side was used as the surface.
After applying a conductive paste coating liquid on the back surface of the transparent substrate by a spin coating method, a sample was obtained by changing the rotation speed. The rotation speed is 400 rpm / min for 2 seconds, then 60 rpm.
It was 8 revolutions at 0 revolutions / minute. Thereafter, heating and curing were performed in the same manner as in Example 1. The thickness of the transparent conductive film was 570 nm, and the transmittance of the green pixel was 52.2%, which was poorer than Example 1. The specific resistance of the transparent conductive film was 1.48 kΩ · cm. After passing through the substrate washer, the potential of the color filter substrate was -0.03 KV, and the transportability was good. Similarly, when the transparent conductive film was formed on the base glass and the transmittance of only the transparent conductive film was measured, it was 93.8%.

Example 4 A conductive paint having the color filter side having the resin black matrix, red pixels, green pixels, and blue pixels obtained in Reference Example 4 as the front surface and tin oxide fine particles dispersed on the back surface of the transparent substrate. ("ELCOM" P304 manufactured by Catalyst Chemical Industry Co., Ltd.)
7) was applied by a spin coating method, and dried at 110 ° C. for 5 minutes to obtain a transparent conductive film having a thickness of 1 μm. The transmittance of the green pixel was 52.3%, which was smaller than that of Example 1 and was defective. The specific resistance value of the transparent conductive film was as large as 10 ⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.1 kV, and it is difficult to peel off the glass substrate with the lift pins from the temperature control cooling plate due to static electricity, and the position may be displaced. there were. Similarly, the transparent conductive film was formed on the base glass, and the transmittance of the transparent conductive film alone was measured. As a result, the transmittance was 94%.

Example 5 A color filter having a transparent conductive film formed on the back surface was obtained in the same manner as in Example 4 except that the thickness of the transparent conductive film was changed to 3 μm. The transmittance of the green pixel of the color filter is 4
At 8%, it was smaller than that of Example 1 and was defective. The specific resistance value of the transparent conductive film was as large as 10 ⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.04
At kV, the transportability was good. Similarly, the transparent conductive film was formed on the base glass, and the transmittance of the transparent conductive film alone was measured. As a result, the transmittance was 86%.

Example 6 In the color filter having the resin black matrix, the red pixel, the green pixel, and the blue pixel obtained in Reference Example 4, on the back surface of the transparent substrate, with the side on which the pixels were formed as the front surface, by sputtering. A sample on which an ITO film was formed was obtained.
The substrate temperature during sputtering was 200 ° C. IT
The thickness of the O film is 10 nm, and the transmittance of the green pixel is 55.5%.
Met. The specific resistance of the ITO film is 6 × 10 ⁻² Ω · cm.
Met. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of only the ITO film was measured. As a result, it was 99.7%.

Example 7 In the same manner as in Example 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method was performed on the back surface of a transparent substrate with the pixel formation side as the front surface. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 15 nm.
The transmittance of the green pixel was 55.5%. The specific resistance of the ITO film was 3.15 × 10 ⁻² Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.03K
At V, the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of the ITO film alone was measured. As a result, it was 99.6%.

Example 8 In the same manner as in Example 6, in a color filter having a resin black matrix, a red pixel, a green pixel, and a blue pixel, a sputtering method was performed on the back surface of the transparent substrate with the pixel forming side as the front surface. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 21 nm.
The transmittance of the green pixel was 55.4%. The specific resistance of the ITO film was 8.61 × 10 ⁻³ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.03K
At V, the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of only the ITO film was measured. As a result, it was 99.5%.

Example 9 In the same manner as in Example 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method was performed on the back surface of a transparent substrate with the pixel formation side as the front surface. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 30 nm.
The transmittance of the green pixel was 54.0%. The specific resistance of the ITO film was 4 × 10 ⁻³ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.03 KV,
The transportability was good. In the same manner, the IT
When the O film was formed and the transmittance of only the ITO film was measured,
99.1%.

Example 10 In the same manner as in Example 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method was performed on the back side of a transparent substrate with the side on which the pixels were formed facing. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 48 nm.
The transmittance of the green pixel was 57.0%. The specific resistance of the ITO film was 9.1 × 10 ⁻⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.03 KV
And the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of only the ITO film was measured. As a result, it was 98.3%.

Embodiment 11 In the same manner as in Embodiment 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 82 nm.
The transmittance of the green pixel was 54.3%. The specific resistance of the ITO film was 5.4 × 10 ⁻⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.03 KV
And the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of the ITO film alone was measured. As a result, it was 97.4%.

Example 12 In the same manner as in Example 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method was performed on the back surface of a transparent substrate with the side on which the pixels were formed facing. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 100 nm. The transmittance of the green pixel was 54.0%. The specific resistance of the ITO film was 3.6 × 10 ⁻⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.03.
KV and transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of the ITO film alone was measured. As a result, it was 97.0%.

Example 13 In the same manner as in Example 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method was performed on the back surface of the transparent substrate with the side on which the pixels were formed facing. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 145 nm. The transmittance of the green pixel was 53.8%. The specific resistance was 2.18 × 10 ⁻⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of only the ITO film was measured. As a result, it was 96.5%.

Example 14 In the same manner as in Example 6, in a color filter having a resin black matrix, red pixels, green pixels, and blue pixels, a sputtering method was performed on the back side of a transparent substrate with the side on which the pixels were formed facing. A sample on which an ITO film was formed was obtained. However, the thickness of the ITO film was 180 nm. The transmittance of the green pixel was 53.5%. The specific resistance of the ITO film was 2.16 × 10 ⁻⁴ Ω · cm. The potential of the color filter substrate after passing through the substrate washer is -0.0
It was 3 KV and the transportability was good. Similarly, the ITO film was formed on the base glass, and the transmittance of only the ITO film was measured. As a result, it was 96.0%.

Example 15 After forming the resin black matrix obtained in Reference Example 6, but before forming the red, green and blue pixels, the thickness of the ITO film on the back surface of the color filter sample having the ITO film formed on the back surface of the transparent substrate was as follows. , 12 nm, and the transmittance of the green pixel was 55.5%. The specific resistance value of the ITO film is 5.64 × 10 ⁻² Ω ·
cm. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability was good. In the same manner, the ITO film is formed
The transmittance of the film alone was measured and found to be 99.7%.

Example 16 After forming the chromium black matrix obtained in Reference Example 7,
Before the formation of red, green and blue pixels, ITO was formed on the back of the transparent substrate.
The thickness of the ITO film of the color filter sample on which the film was formed was 12 nm, and the transmittance of the green pixel was 55.5%. The specific resistance value of the ITO film is 5.40 × 10 ^-2 Ω · cm.
Met. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability was good.
Similarly, the ITO film was formed on the base glass, and the transmittance of only the ITO film was measured. As a result, it was 99.7%.

Example 17 The chromium black matrix, the red pixel, the green pixel, and the blue pixel obtained in Reference Example 10 were formed, and an acrylic protective film was laminated thereon.
A TO film was formed. The thickness of the ITO film was 13 nm, and the transmittance of the green pixel was 55.5%. The specific resistance of the ITO film was 4.30 × 10 ⁻² Ω · cm. The potential of the color filter substrate after passing through the substrate washer was -0.03 KV, and the transportability test was good. Similarly, the ITO film was formed on the base glass, and the transmittance of the ITO film alone was measured. As a result, it was 99.6%.

Comparative Example 1 The color filter (having a resin black matrix, red pixels, green pixels, and blue pixels and having no transparent conductive film on the back surface of a transparent substrate) obtained in Reference Example 4 was tested as a comparative sample. . The potential of the sample after passing through the substrate washer was −0.0.
06 KV, which was slightly larger than that of the example. The transmittance of the green pixel was 55.7%. In the transportability test, the transportability was poor such that the glass substrate was hardly peeled off from the cooling plate by the lift pins due to static electricity, and the glass was largely bent.

Comparative Example 2 A raw glass was tested as a comparative sample. The potential of the sample after passing through the substrate washer was as large as -2.1 kV. In the transportability test, the transportability was poor such that the glass substrate was hardly peeled off from the cooling plate by the lift pins due to static electricity, and the glass was largely bent.

[0073]

The color filter having an antistatic effect by providing a transparent conductive film on the back surface of the transparent substrate with the side on which the color layer of the transparent substrate is provided as a front surface has good transportability, In addition, plastic beads (spacers) with good transparency and static electricity
A color filter free from display unevenness defects due to uneven distribution of. Further, in the liquid crystal display device of the lateral electric field driving method, the invasion of an electric field from the outside can be suppressed, and the display quality can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Transparent substrate 2 ... Back side of transparent conductive film 3 ... Front side of transparent conductive film 4 ... Pixel 5 ... Black matrix

Claims (10)

[Claims] 1. A color filter having pixels of at least three colors on the front side of a transparent substrate, comprising a transparent conductive film on the back side of the transparent substrate. 2. The color filter according to claim 1, wherein the specific resistance of the transparent conductive film on the back side of the transparent substrate is 2 kΩ · cm or less. 3. The transparent conductive film on the back side of the transparent substrate has a transmittance of 9
The color filter according to claim 1, wherein the content is 6% or more. 4. The transparent conductive film on the back side of the transparent substrate has a thickness of 10
The color filter according to claim 1, wherein the thickness of the color filter is not less than 100 nm and not more than 100 nm. 5. The color filter according to claim 1, wherein an overcoat is provided on the surface side of the transparent substrate. 6. The color filter according to claim 1, wherein the black matrix constituting the color filter is a resin black matrix. 7. After providing a transparent conductive film on the back side of the transparent substrate,
A method for producing a color filter, comprising providing a resin black matrix and pixels on the front side. 8. A method for manufacturing a color filter, comprising: forming a metal black matrix on the front side of a transparent substrate, providing a transparent conductive film on the back side, and further providing pixels on the front side. 9. A liquid crystal display device using the color filter according to claim 1. 10. The liquid crystal display device according to claim 9, wherein the liquid crystal display device is of a lateral electric field driving type.