JPH1029391A - IC card - Google Patents

Abstract

(57) [Problem] To prevent loss of important data due to a failure by adopting a structure for reducing the ratio of bending stress applied to an IC card to an IC module as much as possible. To provide an IC card. A stepped recess 19 formed by a first recess 16 and a second recess 17 near the center thereof is formed at a predetermined position of a card base material 15 by cutting or the like, and an IC is formed in the recess 19. An IC card 20 in which the module 10 is fitted and bonded and fixed. In order to prevent breakage of the IC chip and disconnection of the bonding wires 26 due to bending stress applied to the IC card, a back surface of the IC substrate 21 of the IC module 10 In addition, the reinforcing plate 12 is provided around the resin mold portion 27 with the adhesive film 11 interposed therebetween, and is further fitted and fixed in the recess 19 of the card base material 15 with the adhesive film 11 interposed therebetween.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card bonded and fixed to a concave portion of a card base material, and more particularly to an IC card which protects a bending stress applied to an IC module portion by a reinforcing plate provided on the back surface of the IC module. Things.

[0002]

2. Description of the Related Art Conventionally, cards generally called magnetic cards are generally known. In recent years, the use of a card called an IC card in which an IC module formed by resin-molding an IC chip on the lower surface of an IC substrate is increasing in these magnetic cards. In this IC card, a concave portion is formed in a card base made of a vinyl chloride resin or acrylonitrile-butadiene-styrene (ABS) resin or the like, and an IC module is bonded and fixed to the concave portion. This IC card is supposed to store a large amount of important data as compared with a magnetic card or the like in particular.
Although it is most necessary to prevent the breaking of the bonding wire, the IC card is generally weak in bending stress and the load applied to the card substrate is transmitted to the IC module. That is, in general, the IC card owner stores the card in a wallet or the like and puts the wallet in a pocket such as pants, so that not only the IC module but also the IC chip itself is affected by the bending of the IC card. The problem that the function was damaged occurred. Therefore, in order to prevent such damage accidents, many methods for bonding and fixing the IC module to the concave portion of the card base material have been studied.

For example, in the IC card shown in FIG. 3, a shallow first concave portion 16 is formed at a predetermined position on a card base material 15 and a deep second concave portion 17 is cut near a central portion thereof in a stepwise manner. To form An IC card 20 in which an IC module 10 in which an IC chip 25 is resin-molded 27 at the center of the lower surface of an IC substrate 21 is adhered and fixed with an adhesive 24 or the like in the recess is known. Further, the IC card shown in FIG. 4 has a notch of the same depth as the concave portion for absorbing external bending stress inside the concave portion 19 of the card base material 15 and outside the adhesive fixing region of the IC module 10. Japanese Patent Laid-Open Publication No. 2-80299 discloses an IC card 20 in which the portions 18, 18 are provided to be narrow so that even if a bending stress is applied to the card base material, the IC card 20 is stopped at the notch portion and does not transmit to the IC module. It is proposed in the gazette.

[0004]

However, in the IC card having the structure shown in FIG. 3, when a bending stress is applied to the card base during use, a load is applied from the adhesively fixed portion of the IC module 10 to the IC module. There is a danger that the signal will be transmitted directly and the IC chip 25 will fail. FIG.
The bending stress is absorbed by the notches 18, 18, but the card base 15 in the vicinity of the notches 18, 18 withstands the bending stress applied to the notches. Problems such as reduced cutting efficiency and poor machining efficiency.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to adopt a structure in which a ratio of a bending stress applied to an IC card to an IC module is reduced as much as possible. Another object of the present invention is to provide an IC card that prevents important data from being lost due to a failure.

[0006]

In order to achieve the above object, according to a first aspect of the present invention, a first concave portion is provided at a predetermined position.
A plastic card substrate having a second recess formed near the center thereof, and an IC module or an IC chip by wire bonding formed by resin molding around bonding wires connecting the IC chip and the circuit pattern layer. An IC module is formed by flip-chip bonding in which a gold bump is formed, bonded to a substrate using a conductive adhesive, and resin-molded so as to cover the IC chip. The IC module is placed in a recessed portion of the card base material. In an IC card fixed by bonding, the IC
Around the lower surface of the substrate and around the resin mold part,
It is characterized in that a reinforcing plate is provided.

According to a second aspect of the present invention, an adhesive film, a reinforcing plate, and an adhesive film are sequentially laminated around the back surface of the IC module, and are adhered and fixed in the recessed portions of the base material.

In a third aspect of the present invention, the reinforcing plate is made of a thin metal plate having a thickness of 100 to 400 μm.

In a fourth aspect of the present invention, the reinforcing plate is made of a glass fiber reinforced plate having a thickness of 100 to 400 μm.

[0010]

Embodiments of the present invention will be described.
The IC card 20 of the present invention includes a first concave portion 16 at a predetermined position of a plastic card base 15 made of a vinyl chloride resin, an ABS resin or the like, and a second concave portion 17 near the center thereof.
The stepped concave portion 19 is formed by cutting or the like, and the IC module 10 is fitted into the concave portion 19,
The IC card 20 is bonded and fixed on the back side of the IC substrate 21 of the IC module 10 and in the resin mold portion 2 in order to prevent breakage of the IC chip and disconnection of the bonding wire 26 due to bending stress applied to the IC card.
7, a reinforcing plate 12 made of a thin metal plate or a rigid glass fiber reinforced plate is provided through an adhesive film 11, and further, is fitted into the concave portion 19 of the card base material 15 through the adhesive film 11, and is bonded and fixed. It was done.

The reinforcing plate 12 used in the present invention is not limited, but is preferably a thin metal plate such as a stainless steel plate which is resistant to corrosion such as rust and has excellent rigidity against bending stress. Is preferably about 100 μm to 400 μm.

When a thin metal plate is used for the reinforcing plate 12, the thickness of the adhesive films 11, 11 is preferably increased in order to prevent each terminal from conducting on the back surface of the IC module.

Although the IC card of the present invention has been described using an IC module by wire bonding, the present invention is not limited to this. For example, although not shown,
It is also possible to use an IC module by flip chip bonding in which a gold bump is formed on an IC chip, bonded to a substrate using a conductive adhesive, and resin-molded so as to cover the IC chip.

Hereinafter, the present invention will be described in detail with reference to the drawings. 1A and 1B show an IC card according to an embodiment of the present invention. FIG. 1A is a plan view of the IC card, and FIG.
FIG. 3 is a TT sectional view of an IC module portion of the IC card. FIG. 2 is an explanatory view showing a method of mounting an IC module in the IC card of the present invention, and showing a method of bonding and fixing components and a card base material.

As shown in FIG. 1A, an IC card 20 according to the present invention comprises a laminated or single-layer vinyl chloride resin or AB
Although not shown, a concave portion is formed at a predetermined position of a card base 15 of a magnetic card made of a plastic plate made of S resin, and the IC module 10 is fitted into and fixed to the concave portion.

FIG. 1 (b) shows the IC card of the IC card.
FIG. 4 is a sectional view of a C module 10 portion,
Is formed by cutting a shallow first concave portion 16 and a deep second concave portion 17 near the center thereof in a stepwise manner. The IC module 10 is fitted into the recess 19,
The IC card 20 is bonded and fixed. As shown in the figure,
Bending stress applied to this IC card (for example,
(Bending stress is applied to the card by actions such as carrying the C card, putting it in a pocket, carrying around, sitting down, etc.) IC
In order to prevent the breakage of the chip 25 and the breakage of the bonding wire 26, a slight gap is formed between the periphery of the IC module 10 (around the first recessed portion) and between the resin mold 27 and the periphery of the second recessed portion 17 and the bottom thereof. It is common practice to mount so as to create a space, but this alone does not completely prevent the module from being damaged because the bending stress is directly transmitted to the IC module. Therefore, the present invention further provides a reinforcing plate 1 made of a thin metal plate or a rigid glass fiber reinforced plate or the like on the back surface side of the IC substrate 21 of the IC module 10 and around the resin mold portion 27 via the adhesive film 11.
2 was provided, and was further fitted and fixed in the recess 19 of the card base material 15 via the adhesive film 11, whereby an IC card for protecting the IC module against bending stress was obtained.

The reinforcing plate 12 is preferably, but not limited to, a thin metal plate such as a stainless steel plate which is resistant to corrosion such as rust and has excellent rigidity against bending stress. Also, the thickness is preferably about 100 μm to 400 μm,
Preferably, a 100-300 μm stainless plate is used.

Further, as described above, when a thin metal plate is used for the reinforcing plate 12, the adhesive films 11, 11 are used to prevent the terminals from conducting on the back surface of the IC module.
Should be thicker. The adhesive film was a thermal adhesive film M-5205 (manufactured by Nitto Denko Corporation) and had a thickness of 0.07.
の も の 0.11 mm was used.

FIG. 2 shows an IC module 1 according to the present invention.
0 shows the method of bonding and fixing, and the order is not limited, but first, the same size as the IC module is fitted on the back side of the IC module 10 and around the resin mold portion 27. An adhesive film 11 from which a resin mold portion has been cut out is laminated, and a reinforcing plate 12 made of a stainless steel plate or a glass fiber reinforced plate having the same shape as the adhesive film is adhered thereon, and then the first substrate formed on the card base material 15 is formed. The adhesive film 11 having the same shape as the adhesive film is bonded on the concave portion 16, and the IC module provided with the reinforcing plate is fitted into the concave portion, and the bending stress is reduced by the reinforcing plate. On the other hand, an IC card which can prevent failures such as breakage of the IC module was obtained.

[0020]

According to the IC card of the present invention, when the IC card is deformed due to external bending stress, a reinforcing plate is provided on the back side of the IC module to be mounted, and a concave formed at a predetermined position of the card base material. It is fitted and fixed in the part,
This prevents failures such as breakage of the IC module,
Can be protected. Further, in the conventional IC card, a first concave portion is formed at a predetermined position on the card base material, and a concave portion for mounting an IC module by a second concave portion is formed near the center of the first concave portion, and the first concave portion is bonded on the first concave portion. It is manufactured by the procedure of bonding and fixing an IC module via a film, and requires a separate process and a separate device by forming the reinforcing plate of the present invention in a shape corresponding to the first concave portion of the card base material. Without using the same procedure and process. Further, as the adhesive film, the same adhesive film as the conventional adhesive film is used, so that it is not necessary to manufacture another film (including the shape and the like).

[Brief description of the drawings]

1A and 1B show an IC card according to an embodiment of the present invention, wherein FIG. 1A is a plan view of the IC card, and FIG.
FIG. 3 is a TT sectional view of an IC module portion of the IC card.

FIG. 2 is an explanatory view showing a method of mounting an IC module in the IC card of the present invention, and showing a method of bonding and fixing to constituent members and a card base material.

FIG. 3 is a cross-sectional view showing an example of a method of bonding and fixing an IC module in a conventional IC card.

FIG. 4 is a cross-sectional view showing another example of a method of bonding and fixing an IC module in a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... IC module 11 ... Adhesive film 12 ... Reinforcement plate 15 ... Card board 16 ... First recessed part 17 ... Second recessed part 18 ... Notch part 20 ... IC card 21 ... IC board 22 ... External terminal 23 ... Circuit pattern layer Reference numeral 24: adhesive layer 25: IC chip 26: bonding wire 27: resin mold part 28: IC chip bonding part M: magnetic recording part

Claims (4)

[Claims] 1. A plastic card base having a first recess at a predetermined location, a second recess near the center thereof, and a bonding wire connecting an IC chip and a circuit pattern layer. IC module by wire bonding formed by resin molding, or IC module by flip-chip bonding formed by forming gold bumps on an IC chip, bonding to a substrate using a conductive adhesive, and resin molding to cover the IC chip In an IC card having an IC module bonded and fixed in a concave portion of the card base material, a reinforcing plate is provided around a lower surface of the IC substrate and around a resin mold portion. IC card to do. 2. The IC module according to claim 1, wherein an adhesive film, a reinforcing plate, and an adhesive film are sequentially laminated around a back surface of the IC module, and are adhered and fixed in a concave portion of the base material.
2. The IC card according to 1. 3. The IC card according to claim 1, wherein the reinforcing plate is made of a thin metal plate having a thickness of 100 to 400 μm. 4. The IC card according to claim 1, wherein the reinforcing plate is made of a glass fiber reinforced plate having a thickness of 100 to 400 μm.