JPH10308479A - 樹脂封止型半導体装置 - Google Patents

樹脂封止型半導体装置

Info

Publication number
JPH10308479A
JPH10308479A JP10073503A JP7350398A JPH10308479A JP H10308479 A JPH10308479 A JP H10308479A JP 10073503 A JP10073503 A JP 10073503A JP 7350398 A JP7350398 A JP 7350398A JP H10308479 A JPH10308479 A JP H10308479A
Authority
JP
Japan
Prior art keywords
resin
package
semiconductor device
semiconductor chip
mold portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10073503A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10308479A5 (2
Inventor
Kenji Kanesaka
健二 金坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UMC Japan Co Ltd
Original Assignee
Nippon Steel Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Semiconductor Corp filed Critical Nippon Steel Semiconductor Corp
Priority to JP10073503A priority Critical patent/JPH10308479A/ja
Publication of JPH10308479A publication Critical patent/JPH10308479A/ja
Publication of JPH10308479A5 publication Critical patent/JPH10308479A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP10073503A 1997-03-06 1998-03-06 樹脂封止型半導体装置 Pending JPH10308479A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10073503A JPH10308479A (ja) 1997-03-06 1998-03-06 樹脂封止型半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-69149 1997-03-06
JP6914997 1997-03-06
JP10073503A JPH10308479A (ja) 1997-03-06 1998-03-06 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPH10308479A true JPH10308479A (ja) 1998-11-17
JPH10308479A5 JPH10308479A5 (2) 2005-09-02

Family

ID=26410335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10073503A Pending JPH10308479A (ja) 1997-03-06 1998-03-06 樹脂封止型半導体装置

Country Status (1)

Country Link
JP (1) JPH10308479A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752386A (zh) * 2013-12-25 2015-07-01 天水华天科技股份有限公司 高可靠性sop封装引线框架及封装件生产方法
CN114269540A (zh) * 2019-07-02 2022-04-01 科莱克特集团公司 电气或电子构件以及制造电气或电子构件的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104752386A (zh) * 2013-12-25 2015-07-01 天水华天科技股份有限公司 高可靠性sop封装引线框架及封装件生产方法
CN114269540A (zh) * 2019-07-02 2022-04-01 科莱克特集团公司 电气或电子构件以及制造电气或电子构件的方法
CN114269540B (zh) * 2019-07-02 2024-06-11 科莱克特集团公司 电气或电子构件以及制造电气或电子构件的方法

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